TWI293579B - Coating nozzle and coating apparatus - Google Patents

Coating nozzle and coating apparatus Download PDF

Info

Publication number
TWI293579B
TWI293579B TW093119639A TW93119639A TWI293579B TW I293579 B TWI293579 B TW I293579B TW 093119639 A TW093119639 A TW 093119639A TW 93119639 A TW93119639 A TW 93119639A TW I293579 B TWI293579 B TW I293579B
Authority
TW
Taiwan
Prior art keywords
nozzle
coating
back surface
substrate
unit
Prior art date
Application number
TW093119639A
Other languages
English (en)
Chinese (zh)
Other versions
TW200507947A (en
Inventor
Yukihiro Kawano
Shinobu Tanaka
Kiyohisa Tateyama
Kazuhito Miyazaki
Tsuyoshi Yamasaki
Yoshihiro Kawaguchi
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200507947A publication Critical patent/TW200507947A/zh
Application granted granted Critical
Publication of TWI293579B publication Critical patent/TWI293579B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
TW093119639A 2003-08-12 2004-06-30 Coating nozzle and coating apparatus TWI293579B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003292546A JP4247890B2 (ja) 2003-08-12 2003-08-12 塗布ノズル及び塗布装置

Publications (2)

Publication Number Publication Date
TW200507947A TW200507947A (en) 2005-03-01
TWI293579B true TWI293579B (en) 2008-02-21

Family

ID=34369860

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093119639A TWI293579B (en) 2003-08-12 2004-06-30 Coating nozzle and coating apparatus

Country Status (3)

Country Link
JP (1) JP4247890B2 (ja)
KR (1) KR101076152B1 (ja)
TW (1) TWI293579B (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI460023B (zh) * 2007-12-21 2014-11-11 Toray Eng Co Ltd 塗布裝置及塗布方法
TWI651132B (zh) * 2017-05-31 2019-02-21 日商東芝三菱電機產業系統股份有限公司 噴霧塗布成膜裝置的塗布頭及其維護方法

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4925644B2 (ja) * 2005-03-28 2012-05-09 Ｎｔｎ株式会社 塗布機構、欠陥修正装置、塗布方法、および液晶表示パネル用カラーフィルタの欠陥修正方法
TWI333132B (en) * 2006-09-28 2010-11-11 Au Optronics Corp Coating-drying apparatus capable of adjusting air flow path
JP4989370B2 (ja) 2006-10-13 2012-08-01 大日本スクリーン製造株式会社 ノズルおよびそれを備える基板処理装置
KR100926174B1 (ko) * 2007-09-06 2009-11-10 박병주 표면장력을 이용한 습식 유기 반도체 소자의 제조방법
JP5711961B2 (ja) * 2010-12-27 2015-05-07 東京応化工業株式会社 塗布装置及び塗布方法
JP5321643B2 (ja) * 2011-05-25 2013-10-23 パナソニック株式会社 塗布装置
KR101353714B1 (ko) * 2012-08-13 2014-01-21 하이디스 테크놀로지 주식회사 실런트 도포장치
JP6055280B2 (ja) * 2012-11-11 2016-12-27 平田機工株式会社 塗布液充填方法
KR102156740B1 (ko) * 2013-11-25 2020-09-16 세메스 주식회사 노즐 및 이를 갖는 기판 처리 장치
KR102631793B1 (ko) * 2018-11-08 2024-02-01 삼성전자주식회사 약액 공급 구조물 및 이를 구비하는 현상장치
JP6867357B2 (ja) * 2018-11-09 2021-04-28 本田技研工業株式会社 塗工量の計測方法
JP7316717B2 (ja) 2019-05-14 2023-07-28 Ａｉメカテック株式会社 シム、ノズルおよび塗布装置
CN115697573A (zh) 2020-06-01 2023-02-03 富士胶片株式会社 模头

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09173934A (ja) * 1995-12-28 1997-07-08 Bando Chem Ind Ltd 接着剤塗工装置
JPH11169769A (ja) * 1997-12-08 1999-06-29 Toray Ind Inc 塗布装置及び塗布方法並びにカラーフィルタの製造装置及び製造方法
JP4645926B2 (ja) * 2000-03-09 2011-03-09 東レ株式会社 塗布ヘッドの清浄方法および清浄装置並びにこれらを用いたカラーフィルタの製造方法および製造装置
JP2002248399A (ja) * 2001-02-27 2002-09-03 Toray Ind Inc 塗布部材の製造方法及び装置
JP4068821B2 (ja) * 2001-07-13 2008-03-26 武蔵エンジニアリング株式会社 塗布描画線の測定方法および装置
JP2003033712A (ja) * 2001-07-25 2003-02-04 Toppan Printing Co Ltd 塗布ヘッドのクリーニング装置およびクリーニング方法
JP2003136003A (ja) * 2001-11-05 2003-05-13 Konica Corp コータ吐出口周辺部の拭き取り洗浄装置
JP2004216298A (ja) * 2003-01-16 2004-08-05 Mitsubishi Chemicals Corp 塗布方法およびスリットダイノズル

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI460023B (zh) * 2007-12-21 2014-11-11 Toray Eng Co Ltd 塗布裝置及塗布方法
TWI651132B (zh) * 2017-05-31 2019-02-21 日商東芝三菱電機產業系統股份有限公司 噴霧塗布成膜裝置的塗布頭及其維護方法

Also Published As

Publication number Publication date
JP2005058913A (ja) 2005-03-10
TW200507947A (en) 2005-03-01
KR101076152B1 (ko) 2011-10-21
JP4247890B2 (ja) 2009-04-02
KR20050017588A (ko) 2005-02-22

Similar Documents

Publication Publication Date Title
TWI293579B (en) Coating nozzle and coating apparatus
TWI272657B (en) Coating method and coating apparatus
JP3894104B2 (ja) 現像方法及び現像装置及び現像液再生装置
TWI405617B (zh) 塗佈方法及塗佈裝置
TWI253098B (en) Substrate processing apparatus, substrate processing method and developing apparatus
TWI388031B (zh) 處理系統
TWI360836B (en) Substrate processing apparatus
JP2012160735A (ja) 塗布方法及び塗布装置
JP4071183B2 (ja) 塗布方法及び塗布装置
TWI234796B (en) Solution treatment method and solution treatment unit
TW569288B (en) Substrate processing apparatus, liquid processing apparatus and liquid processing method
JP3916891B2 (ja) 基板処理装置及び現像処理装置
JP2003017401A (ja) 液処理装置および液処理方法
JP4353530B2 (ja) 基板処理方法及び基板処理装置
JP3676263B2 (ja) 塗布膜形成装置及び塗布膜形成方法
JP3930278B2 (ja) 液処理装置および液処理方法
JP4328342B2 (ja) 基板処理方法及び基板処理装置
TWI313193B (en) Coating method, coating apparatus and memory medium
TW541620B (en) Development processing apparatus
JP4523402B2 (ja) 処理装置及び処理方法
JP4554303B2 (ja) 塗布装置及び塗布方法
JP4052820B2 (ja) 現像処理装置
JP4498862B2 (ja) 塗布方法及び塗布装置
JP2003092241A5 (ja)

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees