TW200507947A - Coating nozzle and coating apparatus - Google Patents

Coating nozzle and coating apparatus

Info

Publication number
TW200507947A
TW200507947A TW093119639A TW93119639A TW200507947A TW 200507947 A TW200507947 A TW 200507947A TW 093119639 A TW093119639 A TW 093119639A TW 93119639 A TW93119639 A TW 93119639A TW 200507947 A TW200507947 A TW 200507947A
Authority
TW
Taiwan
Prior art keywords
nozzle
coating
section
difference
resist
Prior art date
Application number
TW093119639A
Other languages
Chinese (zh)
Other versions
TWI293579B (en
Inventor
Yukihiro Kawano
Shinobu Tanaka
Kiyohisa Tateyama
Kazuhito Miyazaki
Tsuyoshi Yamasaki
Yoshihiro Kawaguchi
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200507947A publication Critical patent/TW200507947A/en
Application granted granted Critical
Publication of TWI293579B publication Critical patent/TWI293579B/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

Film thickness being fixed on the processing substrate by using the long type coating nozzle or the coating apparatus, form the coating film which is constant and does not have coating unevenness. In nozzle section 156, scan direction(X-direction) the rear or opposite side on the surface i.e., rear 160 which faces horizontality or the difference in level section 162 which extends to the straight line is formed in nozzle longitudinal direction. During coating processing and on substrate G the resist liquid R which is spat out gets wet and coming in contact with the rear 160 of the nozzle section 156 of the resist nozzle 120with phenomenon, spreads to height direction, the top position in difference in level section 162 is stabilized or is locked. In this way, top line i.e., wet line WL of the resist liquid R which soaks the rear 160 of the nozzle section 156 of the resist nozzle 120 it is decided meaningfully by difference in level section 162.
TW093119639A 2003-08-12 2004-06-30 Coating nozzle and coating apparatus TWI293579B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003292546A JP4247890B2 (en) 2003-08-12 2003-08-12 Coating nozzle and coating device

Publications (2)

Publication Number Publication Date
TW200507947A true TW200507947A (en) 2005-03-01
TWI293579B TWI293579B (en) 2008-02-21

Family

ID=34369860

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093119639A TWI293579B (en) 2003-08-12 2004-06-30 Coating nozzle and coating apparatus

Country Status (3)

Country Link
JP (1) JP4247890B2 (en)
KR (1) KR101076152B1 (en)
TW (1) TWI293579B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI394989B (en) * 2005-03-28 2013-05-01 Ntn Toyo Bearing Co Ltd Pasting needle, pasting mechanism utilizing the pasting needle, defection correction device, pasting method, and method for correcting defection of color filter for liquid crystal display panel
US9162246B2 (en) 2012-11-11 2015-10-20 Hirata Corporation Coating liquid filling method, slit nozzle, discharge outlet closing member, and slit nozzle unit

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI333132B (en) * 2006-09-28 2010-11-11 Au Optronics Corp Coating-drying apparatus capable of adjusting air flow path
JP4989370B2 (en) 2006-10-13 2012-08-01 大日本スクリーン製造株式会社 Nozzle and substrate processing apparatus having the same
KR100926174B1 (en) * 2007-09-06 2009-11-10 박병주 Wet method for producing organic semiconductor device utilizing surface tension
WO2009081804A1 (en) * 2007-12-21 2009-07-02 Toray Engineering Co., Ltd. Application device, and application method
JP5711961B2 (en) * 2010-12-27 2015-05-07 東京応化工業株式会社 Coating apparatus and coating method
JP5321643B2 (en) * 2011-05-25 2013-10-23 パナソニック株式会社 Coating device
KR101353714B1 (en) * 2012-08-13 2014-01-21 하이디스 테크놀로지 주식회사 Apparatus of dispensing sealant
KR102156740B1 (en) * 2013-11-25 2020-09-16 세메스 주식회사 Nozzle and apparatus for treating substrates having the same
KR102354893B1 (en) * 2017-05-31 2022-01-25 도시바 미쓰비시덴키 산교시스템 가부시키가이샤 The application head of the mist application|coating film-forming apparatus, and its maintenance method
KR102631793B1 (en) * 2018-11-08 2024-02-01 삼성전자주식회사 Chemical supply structure and a developing apparatus having the same
JP6867357B2 (en) * 2018-11-09 2021-04-28 本田技研工業株式会社 How to measure the amount of coating
JP7316717B2 (en) * 2019-05-14 2023-07-28 Ａｉメカテック株式会社 Shims, nozzles and applicators
WO2021246336A1 (en) * 2020-06-01 2021-12-09 富士フイルム株式会社 Die head

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09173934A (en) * 1995-12-28 1997-07-08 Bando Chem Ind Ltd Adhesive coater
JPH11169769A (en) * 1997-12-08 1999-06-29 Toray Ind Inc Coating apparatus, coating method, apparatus and method for producing color filter
JP4645926B2 (en) * 2000-03-09 2011-03-09 東レ株式会社 Coating head cleaning method and cleaning apparatus, and color filter manufacturing method and manufacturing apparatus using them
JP2002248399A (en) * 2001-02-27 2002-09-03 Toray Ind Inc Method and apparatus for manufacturing coating member
JP4068821B2 (en) * 2001-07-13 2008-03-26 武蔵エンジニアリング株式会社 Coating drawing line measuring method and apparatus
JP2003033712A (en) * 2001-07-25 2003-02-04 Toppan Printing Co Ltd Painting head cleaning device and cleaning method of the same
JP2003136003A (en) * 2001-11-05 2003-05-13 Konica Corp Wipe-off cleaning device for periphery of coater outlet
JP2004216298A (en) * 2003-01-16 2004-08-05 Mitsubishi Chemicals Corp Coating method and slit die nozzle

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI394989B (en) * 2005-03-28 2013-05-01 Ntn Toyo Bearing Co Ltd Pasting needle, pasting mechanism utilizing the pasting needle, defection correction device, pasting method, and method for correcting defection of color filter for liquid crystal display panel
US9162246B2 (en) 2012-11-11 2015-10-20 Hirata Corporation Coating liquid filling method, slit nozzle, discharge outlet closing member, and slit nozzle unit
TWI508784B (en) * 2012-11-11 2015-11-21 Hirata Spinning Coating method

Also Published As

Publication number Publication date
KR20050017588A (en) 2005-02-22
KR101076152B1 (en) 2011-10-21
JP4247890B2 (en) 2009-04-02
JP2005058913A (en) 2005-03-10
TWI293579B (en) 2008-02-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees