TWI251604B - Polyarylketone resin film and metal laminate thereof - Google Patents
Polyarylketone resin film and metal laminate thereof Download PDFInfo
- Publication number
- TWI251604B TWI251604B TW091100859A TW91100859A TWI251604B TW I251604 B TWI251604 B TW I251604B TW 091100859 A TW091100859 A TW 091100859A TW 91100859 A TW91100859 A TW 91100859A TW I251604 B TWI251604 B TW I251604B
- Authority
- TW
- Taiwan
- Prior art keywords
- film
- resin
- crystallization
- metal
- patent application
- Prior art date
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 85
- 239000011347 resin Substances 0.000 title claims abstract description 85
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 47
- 239000002184 metal Substances 0.000 title claims abstract description 47
- 239000000945 filler Substances 0.000 claims abstract description 13
- 238000010438 heat treatment Methods 0.000 claims abstract description 13
- 239000000178 monomer Substances 0.000 claims abstract description 11
- 239000011342 resin composition Substances 0.000 claims abstract description 8
- 230000009477 glass transition Effects 0.000 claims abstract description 7
- 238000002425 crystallisation Methods 0.000 claims description 49
- 230000008025 crystallization Effects 0.000 claims description 45
- 238000000034 method Methods 0.000 claims description 38
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 35
- 229920000570 polyether Polymers 0.000 claims description 35
- 150000002576 ketones Chemical class 0.000 claims description 27
- -1 fluorene imine Chemical class 0.000 claims description 23
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N o-biphenylenemethane Natural products C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 claims description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 16
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 13
- 229920002530 polyetherether ketone Polymers 0.000 claims description 13
- 238000002156 mixing Methods 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- 239000010410 layer Substances 0.000 claims description 9
- 230000008569 process Effects 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 238000000113 differential scanning calorimetry Methods 0.000 claims description 5
- 239000012790 adhesive layer Substances 0.000 claims description 4
- 239000011256 inorganic filler Substances 0.000 claims description 4
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 4
- 239000010935 stainless steel Substances 0.000 claims description 4
- 229910001220 stainless steel Inorganic materials 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 3
- 230000004927 fusion Effects 0.000 claims description 2
- 150000002466 imines Chemical class 0.000 claims description 2
- 230000002441 reversible effect Effects 0.000 claims description 2
- LNOLJFCCYQZFBQ-BUHFOSPRSA-N (ne)-n-[(4-nitrophenyl)-phenylmethylidene]hydroxylamine Chemical compound C=1C=C([N+]([O-])=O)C=CC=1C(=N/O)/C1=CC=CC=C1 LNOLJFCCYQZFBQ-BUHFOSPRSA-N 0.000 claims 3
- 238000000646 scanning calorimetry Methods 0.000 claims 1
- 239000002689 soil Substances 0.000 claims 1
- 239000004697 Polyetherimide Substances 0.000 abstract 2
- 238000005259 measurement Methods 0.000 abstract 2
- 229920001601 polyetherimide Polymers 0.000 abstract 2
- 239000000203 mixture Substances 0.000 description 20
- 239000000758 substrate Substances 0.000 description 19
- 238000011156 evaluation Methods 0.000 description 9
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 7
- 239000011889 copper foil Substances 0.000 description 7
- 238000005266 casting Methods 0.000 description 6
- 239000013078 crystal Substances 0.000 description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000001125 extrusion Methods 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 239000010445 mica Substances 0.000 description 4
- 229910052618 mica group Inorganic materials 0.000 description 4
- AZQWKYJCGOJGHM-UHFFFAOYSA-N para-benzoquinone Natural products O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- NOWKCMXCCJGMRR-UHFFFAOYSA-N Aziridine Chemical compound C1CN1 NOWKCMXCCJGMRR-UHFFFAOYSA-N 0.000 description 3
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- XKJCHHZQLQNZHY-UHFFFAOYSA-N phthalimide Chemical compound C1=CC=C2C(=O)NC(=O)C2=C1 XKJCHHZQLQNZHY-UHFFFAOYSA-N 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 239000004594 Masterbatch (MB) Substances 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 229910052797 bismuth Inorganic materials 0.000 description 2
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920001643 poly(ether ketone) Polymers 0.000 description 2
- 150000004060 quinone imines Chemical class 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N 1,4a-dimethyl-7-propan-2-yl-2,3,4,4b,5,6,10,10a-octahydrophenanthrene-1-carboxylic acid Chemical compound C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- MXPYJVUYLVNEBB-UHFFFAOYSA-N 2-[2-(2-carboxybenzoyl)oxycarbonylbenzoyl]oxycarbonylbenzoic acid Chemical compound OC(=O)C1=CC=CC=C1C(=O)OC(=O)C1=CC=CC=C1C(=O)OC(=O)C1=CC=CC=C1C(O)=O MXPYJVUYLVNEBB-UHFFFAOYSA-N 0.000 description 1
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 1
- 241000283973 Oryctolagus cuniculus Species 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000003723 Smelting Methods 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229920004695 VICTREX™ PEEK Polymers 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000008430 aromatic amides Chemical class 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- BCZWPKDRLPGFFZ-UHFFFAOYSA-N azanylidynecerium Chemical compound [Ce]#N BCZWPKDRLPGFFZ-UHFFFAOYSA-N 0.000 description 1
- 229920005601 base polymer Polymers 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000003484 crystal nucleating agent Substances 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 238000006471 dimerization reaction Methods 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 125000000654 isopropylidene group Chemical group C(C)(C)=* 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 229940018564 m-phenylenediamine Drugs 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000005121 nitriding Methods 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000412 polyarylene Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 238000001757 thermogravimetry curve Methods 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31721—Of polyimide
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31725—Of polyamide
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001013139A JP4073631B2 (ja) | 2001-01-22 | 2001-01-22 | ポリアリールケトン系樹脂フィルム及びそれを用いてなる金属積層体 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWI251604B true TWI251604B (en) | 2006-03-21 |
Family
ID=18880048
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW091100859A TWI251604B (en) | 2001-01-22 | 2002-01-21 | Polyarylketone resin film and metal laminate thereof |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US7033675B2 (https=) |
| EP (1) | EP1369450B1 (https=) |
| JP (1) | JP4073631B2 (https=) |
| KR (1) | KR100823403B1 (https=) |
| CN (1) | CN1486341A (https=) |
| DE (1) | DE60237676D1 (https=) |
| TW (1) | TWI251604B (https=) |
| WO (1) | WO2002057343A1 (https=) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004015011A1 (ja) * | 2002-08-07 | 2004-02-19 | Mitsubishi Plastics, Inc. | 耐熱性フィルムおよびその金属積層体 |
| JP2004123852A (ja) * | 2002-10-01 | 2004-04-22 | Sumitomo Bakelite Co Ltd | 芳香族樹脂組成物並びにフィルム及びシート |
| JP4599793B2 (ja) * | 2002-11-22 | 2010-12-15 | 住友ベークライト株式会社 | Ｔａｂ生産工程用スペーステープ |
| JP4849762B2 (ja) * | 2002-12-02 | 2012-01-11 | 住友ベークライト株式会社 | 芳香族系樹脂組成物、耐熱性シート及びフレキシブル回路基板補強用シート |
| US7549220B2 (en) * | 2003-12-17 | 2009-06-23 | World Properties, Inc. | Method for making a multilayer circuit |
| JP2005330377A (ja) * | 2004-05-20 | 2005-12-02 | Mitsubishi Plastics Ind Ltd | 熱可塑性樹脂フィルム及びその製造方法 |
| JP2006044224A (ja) * | 2004-07-09 | 2006-02-16 | Mitsubishi Plastics Ind Ltd | 積層体 |
| JP4701735B2 (ja) * | 2004-07-09 | 2011-06-15 | 株式会社豊田自動織機 | 摺動部材 |
| KR100874080B1 (ko) | 2005-01-31 | 2008-12-12 | 미쓰비시 쥬시 가부시끼가이샤 | 내열성 필름과 이의 금속 적층체 |
| JP4934334B2 (ja) * | 2006-03-20 | 2012-05-16 | 三菱樹脂株式会社 | 両面銅張板 |
| JP2009302110A (ja) * | 2008-06-10 | 2009-12-24 | Mitsubishi Plastics Inc | カバーレイフィルム |
| JP5237892B2 (ja) * | 2009-06-29 | 2013-07-17 | 住友化学株式会社 | 積層体の製造方法、積層体およびｓｕｓ基板 |
| JP5732934B2 (ja) * | 2010-03-16 | 2015-06-10 | 東レ株式会社 | Ｐｐｓ積層フィルム |
| US8618350B2 (en) | 2011-02-14 | 2013-12-31 | The Procter & Gamble Company | Absorbent articles with tear resistant film |
| CN103503582B (zh) * | 2011-04-28 | 2017-07-18 | 株式会社钟化 | 补强板一体型挠性印刷基板 |
| US20140087617A1 (en) * | 2012-09-27 | 2014-03-27 | Rogers Corporation | Aluminum poly(aryl ether ketone) laminate, methods of manufacture thereof, and articles comprising the same |
| CN104796843A (zh) * | 2015-03-31 | 2015-07-22 | 歌尔声学股份有限公司 | 结晶peek膜和振膜的形成方法以及结晶peek振膜 |
| WO2017115779A1 (ja) * | 2015-12-28 | 2017-07-06 | 日本ゼオン株式会社 | 光学積層体及びその製造方法、偏光板及び表示装置 |
| JP2019016782A (ja) * | 2017-07-03 | 2019-01-31 | 信越ポリマー株式会社 | 電磁波シールドフィルム及びその製造方法、並びに電磁波シールドフィルム付きプリント配線板及びその製造方法 |
| KR20210089704A (ko) | 2018-11-08 | 2021-07-16 | 에스에이치피피 글로벌 테크놀러지스 비.브이. | 열가소성 조성물, 전기 와이어 및 전기 와이어를 포함하는 물품 |
| KR20220005466A (ko) * | 2019-04-19 | 2022-01-13 | 신에츠 폴리머 가부시키가이샤 | 수지 필름, 고주파 회로 기판 및 그 제조 방법 |
| EP4130106A4 (en) * | 2020-03-24 | 2023-12-13 | Mitsubishi Chemical Corporation | Fiber-reinforced composite material and bonded body |
| EP4299654A4 (en) * | 2021-02-25 | 2024-11-27 | Mitsubishi Chemical Corporation | PREPREG AND PROCESS FOR PRODUCING SAME, AND MOLDED OBJECT |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0209546B1 (en) * | 1985-01-04 | 1990-10-03 | RAYCHEM CORPORATION (a Delaware corporation) | Aromatic polymer compositions |
| JPS62149436A (ja) | 1985-12-25 | 1987-07-03 | 住友ベークライト株式会社 | 耐熱性複合フイルム |
| JPH0320354A (ja) | 1989-03-08 | 1991-01-29 | Mitsui Toatsu Chem Inc | 金属基板用フィルム |
| JP3355142B2 (ja) * | 1998-01-21 | 2002-12-09 | 三菱樹脂株式会社 | 耐熱性積層体用フィルムとこれを用いたプリント配線基板用素板および基板の製造方法 |
| JP3514646B2 (ja) * | 1999-01-05 | 2004-03-31 | 三菱樹脂株式会社 | フレキシブルプリント配線基板およびその製造方法 |
| JP4201965B2 (ja) | 2000-08-10 | 2008-12-24 | 三菱樹脂株式会社 | 耐熱性樹脂組成物及びこれよりなる耐熱性フィルムまたはシート並びにこれを基材とする積層板 |
| JP4234896B2 (ja) * | 2000-10-04 | 2009-03-04 | 三菱樹脂株式会社 | 耐熱性フィルム及びこれを基材とするプリント配線基板並びにこれらの製造方法 |
| JP2003064202A (ja) * | 2001-08-24 | 2003-03-05 | Unitika Ltd | 手切れ性に優れたポリエステルフィルムおよびその製造法 |
| JP4294916B2 (ja) * | 2002-06-21 | 2009-07-15 | ユニチカ株式会社 | 易裂き性フィルム |
-
2001
- 2001-01-22 JP JP2001013139A patent/JP4073631B2/ja not_active Expired - Fee Related
-
2002
- 2002-01-21 KR KR1020037009625A patent/KR100823403B1/ko not_active Expired - Fee Related
- 2002-01-21 TW TW091100859A patent/TWI251604B/zh not_active IP Right Cessation
- 2002-01-21 CN CNA028038363A patent/CN1486341A/zh active Pending
- 2002-01-21 WO PCT/JP2002/000392 patent/WO2002057343A1/ja not_active Ceased
- 2002-01-21 EP EP02715853A patent/EP1369450B1/en not_active Expired - Lifetime
- 2002-01-21 DE DE60237676T patent/DE60237676D1/de not_active Expired - Lifetime
- 2002-01-21 US US10/470,141 patent/US7033675B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP1369450A1 (en) | 2003-12-10 |
| EP1369450A4 (en) | 2004-08-25 |
| US7033675B2 (en) | 2006-04-25 |
| US20040096678A1 (en) | 2004-05-20 |
| WO2002057343A1 (fr) | 2002-07-25 |
| DE60237676D1 (de) | 2010-10-28 |
| JP2002212314A (ja) | 2002-07-31 |
| CN1486341A (zh) | 2004-03-31 |
| KR20030071840A (ko) | 2003-09-06 |
| EP1369450B1 (en) | 2010-09-15 |
| KR100823403B1 (ko) | 2008-04-17 |
| JP4073631B2 (ja) | 2008-04-09 |
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