TWI251005B - Biaxially oriented polyester film and laminates thereof with copper - Google Patents

Biaxially oriented polyester film and laminates thereof with copper Download PDF

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Publication number
TWI251005B
TWI251005B TW92119128A TW92119128A TWI251005B TW I251005 B TWI251005 B TW I251005B TW 92119128 A TW92119128 A TW 92119128A TW 92119128 A TW92119128 A TW 92119128A TW I251005 B TWI251005 B TW I251005B
Authority
TW
Taiwan
Prior art keywords
film
residue
stretched
polyester
heat
Prior art date
Application number
TW92119128A
Other languages
Chinese (zh)
Other versions
TW200502287A (en
Inventor
Thomas Joseph Pecorini
Gary Darrel Boone
Original Assignee
Eastman Chem Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/606,070 external-priority patent/US7147927B2/en
Application filed by Eastman Chem Co filed Critical Eastman Chem Co
Publication of TW200502287A publication Critical patent/TW200502287A/en
Application granted granted Critical
Publication of TWI251005B publication Critical patent/TWI251005B/en

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C55/00Shaping by stretching, e.g. drawing through a die; Apparatus therefor
    • B29C55/02Shaping by stretching, e.g. drawing through a die; Apparatus therefor of plates or sheets
    • B29C55/10Shaping by stretching, e.g. drawing through a die; Apparatus therefor of plates or sheets multiaxial
    • B29C55/12Shaping by stretching, e.g. drawing through a die; Apparatus therefor of plates or sheets multiaxial biaxial
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C55/00Shaping by stretching, e.g. drawing through a die; Apparatus therefor
    • B29C55/02Shaping by stretching, e.g. drawing through a die; Apparatus therefor of plates or sheets
    • B29C55/10Shaping by stretching, e.g. drawing through a die; Apparatus therefor of plates or sheets multiaxial
    • B29C55/12Shaping by stretching, e.g. drawing through a die; Apparatus therefor of plates or sheets multiaxial biaxial
    • B29C55/16Shaping by stretching, e.g. drawing through a die; Apparatus therefor of plates or sheets multiaxial biaxial simultaneously
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/36Layered products comprising a layer of synthetic resin comprising polyesters
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/02Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
    • C08G63/12Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from polycarboxylic acids and polyhydroxy compounds
    • C08G63/16Dicarboxylic acids and dihydroxy compounds
    • C08G63/18Dicarboxylic acids and dihydroxy compounds the acids or hydroxy compounds containing carbocyclic rings
    • C08G63/199Acids or hydroxy compounds containing cycloaliphatic rings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/032Organic insulating material consisting of one material
    • H05K1/0326Organic insulating material consisting of one material containing O
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2067/00Use of polyesters or derivatives thereof, as moulding material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0137Materials
    • H05K2201/0145Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0271Mechanical force other than pressure, e.g. shearing or pulling
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/281Applying non-metallic protective coatings by means of a preformed insulating foil
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Shaping By String And By Release Of Stress In Plastics And The Like (AREA)
  • Laminated Bodies (AREA)

Abstract

Disclosed are biaxially oriented polyester film produced from a polyester comprising: (1) diacid residues comprising at least 90 mole percent of terephthalic acid residues, naphthalenedicarboylic acid residues or combinations thereof; and (2) diol residues comprising at least 90 mole percent of 1,4-cyclohexanedimethanol residues; wherein the polyester comprises a total of 100 mole percent diacid residues and a total of 100 mole percent diol residues; wherein a film of the polyester is stretched or oriented at stretch ratios and stretch temperatures that satisfy the equation (27*R)-(1.3*(T-Tg)) >= 27, where T is the average of the machine and transverse direction stretch temperatures in degrees Celsius, Tg is the glass transition temperature of the polymer film in degrees Celsius and R is the average of the machine and transverse direction stretch ratios and the stretched film is subsequently heat-set at an actual film temperature of from 260 DEG C to Tm, wherein Tm is the melting point of the polyester as measured by differential scanning calorimetry (DSC), while maintaining the dimensions of the stretched film.

Description

1251005 玫、發明說明: 【發明所屬之技術領域】 本發明涉及一種新穎的熱穩定聚酯薄膜;及關於一種使 用該熱穩定聚酯薄膜之聚酯層合物和銅-聚酯層合物。這些 薄膜較佳地擁有使用於可撓的電路應用時所需之想要的耐 熱性(焊接劑及尺寸穩定性)與低熱膨脹係數之組合。更特 別的是,本發明涉及一種從聚(對酞酸丨,4-環己撐二亞甲酯_ 乙二醇)或聚(1,4-萘二羧酸環己撐二亞甲酯)同或共聚酯或 其混合物所製造之熱穩定聚酯薄膜,其可經雙軸定向或拉 伸且可在某些條件下熱定型。 【先前技術】 聚(對酞酸乙二酯)(PET)薄膜已廣泛使用在多種包裝、封 裝及層合應用上。PET薄膜有時會使用在收縮包裝應用上 ,於此會將該薄膜鋪至一目標物上且加熱以便讓該薄膜繞 著該目標物收縮。在其它應用上(諸如可撓的電子電路、耐 熱包裝及烹調袋),可使用能在高溫下具有好的尺寸穩定性 及抗縮性之雙向拉伸及熱定型PET薄膜。但是,雙軸定向 的PET薄膜在溫度超過250。(:時沒用,因為其固有的熔化溫 度(Tm)為 250°C。 某些應用(諸如某些可撓電路板)需要在26〇。〇下具熱穩 定性(即,擁有好的尺寸穩定性)之薄膜。特別是,當將該 些薄膜浸入已預熱至26〇t:的焊接劑槽時,其必需不會起泡 或起皺紋。更特別的是,當將這些薄膜浸入已預熱至26〇1 的焊接劑槽i 0秒時,其必需歷經3 %或較少的收縮。將滿足 86584.doc 1251005 說,重要的是具有儘可能低的介電常數。 某些衍生自1,4-環己烷二甲醇(CHDM)的聚酯具有大於 250°C的熔點。下列參考資料討論從CHDM製備之聚酯所製 得的薄膜。但是,咸信該些專利參考資料並無特別揭示出 在2 6 0 °C處穩定之薄膜的製造。 防禦性公告(Defensive Publication) T876,001 (1970)描述 從聚(對酞酸1,4-環己撐二亞甲醋)(PCT)同聚酯及共聚酯(其 包含最高20莫耳百分比的異酞酸殘基)所製得之薄膜。 已公告的專利申請案WO 96/06125 (1996)描述從PCT聚 合物製得之雙向拉伸薄膜。 已公告的專利申請案WO 92/14771 (1992)描述具有特性 黏度(I.V.)少於0.80分升/克的PCT聚合物,其中該CHDM殘 基由75至100%的順式異構物組成。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a novel heat-stable polyester film; and to a polyester laminate and a copper-polyester laminate using the heat-stable polyester film. These films preferably have the desired combination of heat resistance (solder and dimensional stability) and low coefficient of thermal expansion required for flexible circuit applications. More particularly, the present invention relates to a poly(p-quinic ruthenate, 4-cyclohexamethylene dimethane-ethylene glycol) or poly(1,4-naphthalene dicarboxylic acid cycloheximide). A thermally stable polyester film made of the same or copolyester or a mixture thereof which can be biaxially oriented or stretched and heat set under certain conditions. [Prior Art] Poly(ethylene terephthalate) (PET) films have been widely used in a variety of packaging, packaging and lamination applications. PET films are sometimes used in shrink wrap applications where they are applied to a target and heated to shrink the film around the target. In other applications, such as flexible electronic circuits, heat-resistant packaging, and cooking bags, biaxially oriented and heat-set PET films that have good dimensional stability and shrink resistance at elevated temperatures can be used. However, the biaxially oriented PET film has a temperature exceeding 250. (:Useless because its inherent melting temperature (Tm) is 250 ° C. Some applications (such as some flexible boards) need to be at 26 〇. Thermal stability under the ( (ie, with good size) Films of stability. In particular, when the films are immersed in a solder bath that has been preheated to 26 〇t:, it must not blister or wrinkle. More specifically, when these films are immersed Preheating to 26 〇 1 of the solder bath i 0 seconds, it must pass 3% or less shrinkage. It will meet 86584.doc 1251005, it is important to have the lowest possible dielectric constant. Some derived from The polyester of 1,4-cyclohexanedimethanol (CHDM) has a melting point greater than 250 ° C. The following reference is made to discuss films made from polyesters prepared from CHDM. However, it is not known that these patent references are not available. In particular, the manufacture of films stabilized at 260 ° C is disclosed. Defensive Publication T876, 001 (1970) describes poly(p-1,4-cyclohexamethylene diacetate) (PCT) a film made with polyester and copolyester (which contains up to 20 mole percent of isodecanoic acid residues) The published patent application WO 96/06125 (1996) describes a biaxially oriented film made from a PCT polymer. The published patent application WO 92/14771 (1992) describes having an intrinsic viscosity (IV) of less than 0.80. Liters per gram of PCT polymer wherein the CHDM residue consists of from 75 to 100% of the cis isomer.

JP 1-299019 A (1989)描述從PCT聚合物(其包含最高15莫 耳百分比衍生自其它二羧酸類或其它二醇類之殘基,並具 有至少0.5分升/克的I.V.)所製得之雙向拉伸PCT薄膜。JP 2-301419 (1989)描述在JP 1-299019中所討論的雙向拉伸 PCT薄膜如何不具有抗260°C焊接浴性,且描述如何藉由照 射該在JP 1-299019中所討論之薄膜以交聯該些薄膜而獲得 抗焊接浴性。JP 2-196833 A (1990)描述一種以已金屬化的 雙向拉伸PCT薄膜為主之電絕緣材料。在此文件中並無討 論CTE、使用溫度及可撓電路板應用。 美國 4,557,982 (1985)、JP 60-069133 A (1985)、JP 91-000215 B (1991)、JP 60-085437 A (1985)及JP 90-063256 B (1990) 86584.doc 1251005 描述包含至少80莫耳百分比的對酞酸殘基及至少90莫耳百 分比的CHDM (60至100%反式異構物)殘基之PCT聚合物。 具有高雙軸定向之雙向拉伸薄膜在製造磁帶上有用。 JP 5 8-214208 A (1983)描述從PET、PCT及共聚酯所製得 之薄膜,其可有用地用做電絕緣及可撓的印刷電路基礎薄 膜。美國 5,153,302 (1992)及 JP 4-214757 A (1992)描述包含 至少97莫耳百分比的CHDM殘基及至少90莫耳百分比的對 酞酸殘基之PCT及PCT共聚酯,及使用該些聚合物來製造電 容器薄膜。美國3,284,223 (1966)描述包含最高25莫耳百分比 衍生自其它二羧酸類或其它二醇類之殘基的PCT聚合物。 【發明内容】 雖然在本發明之範圍中考慮到許多具體實施例,於此特 別闡明該些具體實施例的一些實例。 在本發明的第一個具體實施例中,其提供一種從聚酯製 造之雙向拉伸聚酯薄膜,其包含: (1) 二酸殘基,其包含至少90莫耳百分比的對酞酸殘基、 酞二羧酸殘基或其組合;及 (2) 二醇殘基,其包含至少90莫耳百分比的1,4-環己烷二甲 醇殘基;其中該聚酯包含總共100莫耳百分比的二酸殘 基及總共100莫耳百分比的二醇殘基; 其中該聚酯薄膜以滿足方程式(27*R)-(1.3*(T-Tg)) 27之拉 伸比率及拉伸溫度來拉伸或定向,其中T為機器及橫軸方向 的平均拉伸溫度(攝氏度),Tg為該聚合物薄膜的玻璃轉換 溫度(攝氏度)及R為機器及橫軸方向的平均拉伸比率;該經 86584.doc 1251005 拉伸的薄膜在從26〇°c至TnU〇實際薄膜溫度(其中Tm為該 水口物的熔點’如可藉由差示掃描量熱法⑴sc)來測量)下 煞疋型&1至12〇秒的時間(較佳為丨至⑹秒),同時維持該 I拉伸的薄膜〈尺寸。較佳的是當將該經雙向拉伸及熱定 型之㈣薄膜浸人已預熱至26Gt的焊接浴中1Q秒時,其歷 I不夕於3%的收縮,且當其在12〇至15〇。〇間測量時,其具 有10 85 ppm/ C的熱膨脹係數值。此低收縮值可較佳地與黏 ㈣及電料、統產生—層合物,以形成-可接受26代波或 /又:tr之可紅的層合物。此層合電路的基礎薄膜在焊接期間 幸乂佳地應咸不會起泡或起I纹,因為此會影響在最後應用 中的私路性此。上逑詳細指明的名稱“實際薄膜溫度,,指為 該薄膜的實際溫度,而非所加熱的空氣溫度。 本發明的第二個具體實施例為一種由聚酯製造之雙軸定 向聚酯薄膜,其包含: ⑴二酸殘基,其包含至少90莫耳百分比的對酞酸殘基、 奈一幾酸殘基或其組合;及 (2)二醇殘基,其包含至少%莫耳百分比的μ.環己燒二甲 醇殘基;纟中該聚酉旨包含總共⑽莫耳百分比的二酸殘 基及總共10 0莫耳百分比的二醇殘基; 其中當將該聚酯薄膜浸入已預熱至26(rc的坪接浴中10秒 時,其歷經不多於3%的收縮;且當其在12〇mc間測量 時,其具的熱膨脹係數值,當其在25至9〇亡 間測量時,該熱膨脹係數值較佳為10_42ppmrc。 本發明的第三個具體實施例為一種藉由對一或多種層合 86584.doc -10- 1251005 較佳為大於約270°C (例如,從約270至330°C)及更佳為約 280至 3〇〇〇c。 忒些聚酯可各易地藉由在技藝中已熟知的習知方法來製 備。例如,若必要時可使用熔化相或熔化相與固相縮聚技 術又組合。該些聚酯典型地具有約〇4至1.2的1从,較佳為 約0.5至1.1及更佳為〇.7至1.〇。當使用於本文時,Ιν·指為 在25°C下使用每1〇〇毫升的溶劑(其由6〇重量百分比的酚及 4〇重量百分比的四氯乙烷所組成)含〇 5〇克之聚合物所製 得的黏度測量值。於本文中,測量聚醋Ιν·之基本方法則 提出在ASTM方法D2857_95中。可使用任何酞二羧酸異構 物,但是1,4-、1,5-、2,7-及特別是2,6-異構物較佳。該些 聚酉旨的二酸殘基可#生自二羧酸或該二酸的衍生物,諸如 較低的烷基醋類(例如,對酞酸二甲酿)、酸函化物類(例如 ,二醯基氣類)或在某些實例中為奸類。 若必要時,該些聚酯可包含較少量的其它二羧酸類或其 它二醇類之殘基’但是此些改質的材料量應該小(例如,不 多於約10莫耳百分比),以在該聚合物中維持高程度的結晶 性及高熔點。有用的改質單體包括包含約4至約14個碳原子 之其它二羧酸類及包含約2至約12個碳原子之其它二醇類 較佳的改質酸類包括異酞酸及i,4_環己烷二羧酸。某些 較佳的改質二醇類包括乙二醇、仏丙二醇、W己二醇: 新戊二醇。 所使用的該些觸媒材料實 、4里、舞、>5夕及錯。此歧 可使用在本發明之聚酯合成中 例包括鈥、錳、鋅、鈷、銻、鎵 86584.doc -13- 1251005 觸媒系統則描述在美國專利3,907,754、3,962,189、4,010,145 、4,356,299、5,017,680、5,668,243 及 5,681,918 中,此些其 全文於此皆以參考方式併入本文。較佳的觸媒金屬包括鈦 及鐘’最佳為鈦。所使用的觸媒金屬量之範圍可從約5至1 〇〇 ppm,但是較佳為使用濃度約5至約35 ρριη的鈦觸媒,以提 供具有好顏色、熱穩定性及電性質的聚酯類。磷化合物時 常與該些觸媒金屬組合著使用,可使用任何正常使用來製 造聚酯類的磷化合物。可典型地使用最高約1〇〇 ppm的磷。 雖然非必需,但若必要時可使用其它典型存在於聚酯中 的添加劑,只要它們不阻礙使用來製備薄膜的聚酯性能。 此些添加劑可包括(但是非為限制)抗氧化劑類、紫外光及 熱安定劑類、金屬去活化劑、著色劑、顏料、衝擊改質劑 類、成核劑類、分枝劑類、阻燃劑類及其類似物。 在製造於本發明的上下文中所形成之聚酿類有用的分枝 劑可為能在該聚酯的酸單元部分或在乙二醇單元部分中提 供刀枝的4劑,或其可為一混雜體。這些分枝劑有某些已 於此描述。但是’此分枝劑的例證有多官能基酸類、多官 能基酐類、多官能基二醇類及酸/乙二醇混雜體。其實例包 括一或四焱酸類及其相符合的酐類,諸如均苯三酸、苯四 甲酸及其較低的燒基酿類及其類似物;及四醇類,諸如異 戊四醇:同樣地,在本發明之上下文中有用的有三醇類: 諸如二搜甲基丙垸;或二㈣羧酸類及幾基:賴類及衍 ^物類,諸如舰酸:甲基錢§旨;及其類似物^偏苯三 酸酑為較佳的分枝劑。 86584.doc -14- 1251005 在製備該聚醋薄膜或薄片材料之方法的第—步驟中,將 上述描述之聚酯熔融物在技藝中熟知之任何溫度下擠壓成 基本上非晶相的薄膜,例如,典型的溫度為約27〇至31代 。该未峰伸的(或纟定向的)薄膜之厚度範圍正$在⑽至 1000微米,更典型為約200至6〇〇微米。該起始的薄膜擠壓 可利用任何-般方法來進行,包括(但是非為限制)在單螺 旋槳擠壓器上擠壓出或在雙螺旋槳擠壓器上擠壓出。然後 ,將孩薄膜以滿足方程式(27*R)_(13*(T_T伽27之拉伸比 率及拉伸溫度來拉伸或定向,其中τ為機器及橫軸方向的 平均拉伸溫度(攝氏度),該聚合物薄膜的玻璃轉換溫 又(攝氏度)及R為機器及橫軸方向的平均拉伸比率。標號 、扣為拉伸比率,其為該薄膜相對於該薄膜的原始尺寸 之拉伸私度。例如,2Χ意謂著該薄膜的尺寸已拉伸至其原 ^尺寸的兩倍。該薄膜的拉伸比率較佳為在機器方向(MD) 勺2·5Χ至3Χ,及在橫軸方向(TD)上約2.5Χ至3Χ,且該拉JP 1-299019 A (1989) describes the preparation of a PCT polymer comprising residues up to 15 mole percent derived from other dicarboxylic acids or other glycols and having an IV of at least 0.5 deciliter per gram. Biaxially stretched PCT film. JP 2-301419 (1989) describes how the biaxially stretched PCT film discussed in JP 1-299019 does not have an anti-260 ° C solder bath property, and describes how to irradiate the film as discussed in JP 1-299019 The solder bath properties are obtained by crosslinking the films. JP 2-196833 A (1990) describes an electrically insulating material based on a metallized biaxially oriented PCT film. CTE, temperature of use and flexible board applications are not discussed in this document. US 4,557,982 (1985), JP 60-069133 A (1985), JP 91-000215 B (1991), JP 60-085437 A (1985) and JP 90-063256 B (1990) 86584.doc 1251005 Description contains at least 80 Mo Percent steric acid residues and PCT polymers of at least 90 mole percent CHDM (60 to 100% trans isomer) residues. Biaxially oriented films with high biaxial orientation are useful in the manufacture of magnetic tape. JP 5 8-214208 A (1983) describes films made from PET, PCT and copolyesters which can be usefully used as electrically insulating and flexible printed circuit base films. US Patent Nos. 5,153,302 (1992) and JP 4-214757 A (1992) describe PCT and PCT copolyesters comprising at least 97 mole percent CHDM residues and at least 90 mole percent para-acid residues, and the use of These polymers are used to make capacitor films. U.S. Pat. SUMMARY OF THE INVENTION While many specific embodiments are contemplated in the scope of the present invention, some examples of the specific embodiments are specifically described herein. In a first embodiment of the invention, there is provided a biaxially oriented polyester film made from a polyester comprising: (1) a diacid residue comprising at least 90 mole percent of a phthalic acid residue a base, a hydrazine dicarboxylic acid residue or a combination thereof; and (2) a diol residue comprising at least 90 mole percent of a 1,4-cyclohexanedimethanol residue; wherein the polyester comprises a total of 100 moles a percentage of diacid residues and a total of 100 mole percent of diol residues; wherein the polyester film satisfies the draw ratio and draw temperature of the equation (27*R)-(1.3*(T-Tg)) 27 To stretch or orient, where T is the average stretching temperature (degrees Celsius) in the machine direction and the transverse axis direction, Tg is the glass transition temperature (degrees Celsius) of the polymer film, and R is the average stretching ratio in the machine direction and the transverse axis direction; The film stretched by 86584.doc 1251005 is measured from 26 ° C to TnU 〇 actual film temperature (where Tm is the melting point of the nozzle as measured by differential scanning calorimetry (1) sc). Type & 1 to 12 sec (preferably 丨 to (6) sec) while maintaining the I stretched film . Preferably, when the biaxially stretched and heat set (4) film is immersed in a solder bath which has been preheated to 26 Gt for 1Q seconds, its history I lags at 3% shrinkage, and when it is at 12 〇 to 15〇. It has a coefficient of thermal expansion of 10 85 ppm/C for daytime measurements. This low shrinkage value is preferably produced in combination with the adhesive (iv) and the electrical material to form a reddish laminate which can accept 26 generation waves or /tr: tr. The base film of this laminated circuit is fortunately soldered during the soldering process without blistering or I-patterning, as this will affect the privacy of the final application. The name "actual film temperature" refers to the actual temperature of the film, rather than the heated air temperature. The second embodiment of the present invention is a biaxially oriented polyester film made of polyester. And comprising: (1) a diacid residue comprising at least 90 mole percent of a phthalic acid residue, a nacreoic acid residue or a combination thereof; and (2) a diol residue comprising at least a % molar percentage μ. Cyclohexanized dimethanol residue; the oxime contains a total of (10) mole percentage of diacid residues and a total of 100 mole percent of diol residues; wherein when the polyester film is immersed Preheating to 26 (the rc ping bath for 10 seconds, it experienced no more than 3% shrinkage; and when measured between 12 〇 mc, its thermal expansion coefficient value, when it is between 25 and 9 〇 The value of the coefficient of thermal expansion is preferably 10 - 42 ppmrc when measured in the dead. The third embodiment of the invention is preferably greater than about 270 ° C by means of one or more layers 86584.doc -10- 1251005 (e.g. , from about 270 to 330 ° C) and more preferably from about 280 to 3 ° C. These polyesters can be easily It is prepared by conventional methods well known in the art. For example, a molten phase or a molten phase may be used in combination with a solid phase polycondensation technique if necessary. The polyesters typically have a ratio of from about 4 to about 1.2. Preferably, it is from about 0.5 to 1.1 and more preferably from 〇.7 to 1. 〇. When used herein, Ιν· refers to the use of each 1 ml of solvent at 25 ° C (which is from 6 〇 by weight of phenol) And 4% by weight of tetrachloroethane consisting of a viscosity measurement of a polymer containing 5 gram of gram. In this paper, the basic method for measuring vinegar Ι ν is proposed in ASTM method D2857_95. Any of the quinone dicarboxylic acid isomers, but 1,4-, 1,5-, 2,7- and especially the 2,6-isomers are preferred. From a dicarboxylic acid or a derivative of the diacid, such as a lower alkyl vinegar (for example, dimethyl phthalate), an acid complex (for example, a dimercapto gas) or in some instances For the traitor. If necessary, the polyester may contain a smaller amount of residues of other dicarboxylic acids or other diols' but the amount of such modified materials should be (e.g., no more than about 10 mole percent) to maintain a high degree of crystallinity and high melting point in the polymer. Useful modified monomers include other dicarboxylic acids containing from about 4 to about 14 carbon atoms. And other diols comprising from about 2 to about 12 carbon atoms. Preferred modified acids include isodecanoic acid and i.4-cyclohexanedicarboxylic acid. Some preferred modified glycols include B. Glycol, mercappropanediol, W hexanediol: neopentyl glycol. The catalyst materials used are 4, hop, > 5 and wrong. This difference can be used in the polyester synthesis of the present invention. Examples include ruthenium, manganese, zinc, cobalt, ruthenium, and gallium. 86584.doc -13-1251005 Catalyst systems are described in U.S. Patents 3,907,754, 3,962,189, 4,010,145, 4,356,299, 5,017,680, 5,668,243, and 5,681,918. These are hereby incorporated by reference in their entirety. Preferred catalyst metals include titanium and clocks, which are preferably titanium. The amount of catalyst metal used can range from about 5 to about 1 ppm, but it is preferred to use a titanium catalyst having a concentration of from about 5 to about 35 ρρηη to provide a polymer having good color, thermal stability, and electrical properties. Esters. Phosphorus compounds are often used in combination with the catalyst metals, and any of the normal use can be used to produce polyester-based phosphorus compounds. Phosphorus up to about 1 〇〇 ppm can typically be used. Although not essential, other additives typically present in the polyester may be used if necessary, as long as they do not hinder the properties of the polyester used to prepare the film. Such additives may include, but are not limited to, antioxidants, ultraviolet light and heat stabilizers, metal deactivators, colorants, pigments, impact modifiers, nucleating agents, branching agents, resistance Fuels and their analogues. The branching agent useful in the manufacture of the brewer in the context of the present invention may be one which can provide a knife branch in the acid unit portion of the polyester or in the ethylene glycol unit portion, or it may be one Hybrid. Some of these branching agents are described herein. However, examples of such branching agents are polyfunctional acids, polyfunctional anhydrides, polyfunctional diols, and acid/ethylene glycol hybrids. Examples thereof include mono- or tetradecanoic acids and their equivalent anhydrides, such as trimesic acid, pyromellitic acid, and lower calcined sugars thereof and the like; and tetraols such as isovalerol: Similarly, triols useful in the context of the present invention are: trimethyl hydrazin; or di(tetra) carboxylic acids and several groups: lysines and derivatives, such as samaric acid: methyl sulphate; And its analogs, barium trimellitate, are preferred branching agents. 86584.doc -14- 1251005 In a first step of the method of making the polyester film or sheet material, the polyester melt described above is extruded into a substantially amorphous phase film at any temperature well known in the art. For example, typical temperatures range from about 27 to 31 generations. The thickness of the unpeaked (or 纟 oriented) film ranges from (10) to 1000 microns, more typically from about 200 to 6 microns. The initial film extrusion can be carried out by any conventional method including, but not limited to, extrusion on a single propeller extruder or extrusion on a twin propeller extruder. Then, the film is used to satisfy the equation (27*R)_(13*(T_T gamma 27 stretching ratio and stretching temperature for stretching or orientation, where τ is the average stretching temperature of the machine and the horizontal axis (degree Celsius) The glass transition temperature of the polymer film is again (degrees Celsius) and R is the average stretch ratio of the machine and the transverse axis direction. The label, the buckle is a stretch ratio, which is the stretch of the film relative to the original size of the film. For example, 2 means that the size of the film has been stretched to twice its original size. The stretch ratio of the film is preferably 2·5 Χ to 3 勺 in the machine direction (MD) spoon, and Approximately 2.5Χ to 3Χ in the axial direction (TD), and the pull

度在90至110C之間。在拉伸後,將該薄膜在從260°C 至Tm的實際薄膜溫度(其中Tm為該聚合物的熔點,如可利 差示掃描量熱法(Dsc)來測量)下熱定型一段大於約5秒 合勺日寺pHj 。 ^ ^ 4〉王意的是,依該烤箱的加熱來源(即,對流、輻 、等等)而走,將該薄膜加熱至最高260°C時會需要一定量 、寺間此時間最高30秒。此額外的時間不包含在本文所 之…、走沒時間’其僅指為樣品在從260°C至Tm時實際上 化賢的時間。該起始薄膜擠壓可在拉伸前立即進行(即, 串歹】)或可各別地進行。在熱定型期間,可利用拉幅機幀框 86584.doc -15- 1251005 或其它機械故備(其可在熱定型期間防止該經拉伸的薄膜 過度鬆他),將該經拉伸的薄膜維持在該薄膜之拉伸尺寸。 在熱定型期間,該薄膜可拉伸或放鬆最高1〇%,即,該薄 膜的整體尺寸會增加或減少最高1 0%。 可使用任何習知的方法來拉伸或定向本發明之任何薄膜 。例如,該經擠壓的聚酯薄膜可利用滾筒拉伸、長間距拉 伸、拉幅機拉伸、管狀拉伸或其組合來拉伸。在這些方法 的任何一種中,可做出連續雙軸拉伸、同步雙軸拉伸、單 軸拉伸或其組合。同步雙軸拉仲包括同時拉伸該薄膜的機 ,及橫軸方向。在同步雙軸拉仲中,在橫轴方向與其在機 态万向上《拉伸比率不必需相同。連續雙軸拉伸包括首先 在機器方向上拉伸(例如在滾筒對滾筒上拉伸),然後隨後 在橫軸方向上拉伸(例如,使用拉幅機幀框在連續拉伸方 法中’此二種拉伸可為在一種後立即地進行其它種(即,串 歹ο或可各別地進行。機器方向定義為該薄膜的長方向(當 =動時橫軸方向定義為該薄膜的寬度’即與機器方向 的万向。若進行連續雙軸拉伸時,在橫軸方向與其在 诗’备万向上拉伸的拉伸比率及溫度不必需相同。/、、 =拉伸或定向的聚酯薄膜可根據熟知的方法來埶定刑 膜捲連/ 發生,例如’將該經拉伸的薄 ♦栗— 次以批次的万法,例如,將該薄膜 放置在熱定型結構中且1%丨、彳€ A 1 的時間。㈣^ 置在叙型烤箱巾—段固定 Μ木、疋聖可在拉伸後立即進行 別地進杵。^U 亭列)或可各 该—可在熱定型期間放鬆或拉伸最高1〇%。 86584.doc •16- 1251005 拉伸及熱疋型步騾之次數可不同。該聚酯薄膜可接受單 一拉伸及單一熱定型通過或處理、單一拉伸及多次熱定型 通過、多次拉伸及單一熱定型通過、或多次拉伸及多次熱 足型通過。若進行多次拉伸及/或熱定型通過時,可適時地 父替使用拉伸及熱定型通過,但是亦可一次熱定型通過接 著先别的為足型通過而沒有插入拉伸通過。每次通過的條 件不必需與前次通過相同。例如,該聚酯薄膜可利用二階 段熱定型方法來熱定型,其藉由在大於拉伸溫度的任何實 際薄膜溫度下進行第一熱定型。隨後,將該薄膜在從26(rc 至Tm的貫際薄膜溫度範圍(其中Tm為該聚合物的熔點,其 可藉由DSC (差示掃描量熱法)來測量)内熱定型第二段時 間。本發明之層合物的聚酯薄膜組分正常具有約〇·⑽至Ο.〕 晕米(約0.8至8密耳)的最後厚度值(即,在經拉伸及熱定型 後)’較佳為約〇· 04至〇· 13毫米(約1 · 5至5密耳)。 本發明之雙向拉伸聚酯薄膜可從如定義於本文的聚酯來 製造;其中該聚酯薄膜以滿足方程式(27*RH1 ·3*(T_Tg)p27 的拉伸比率及拉伸溫度來拉伸或定向,其中τ為機器及橫 軸方向的平均拉伸溫度(攝氏度),Tg為該聚合物薄膜的玻 璃轉換溫度(攝氏度)及R為機器及橫軸方向的平均拉伸比 率;隨後,該經拉伸的薄膜在從26〇。(:至Tm的真實薄膜溫 度(其中Tm為該聚酯的熔點,如可藉由差示掃描量熱法 (DSC)測量)下熱定型,同時維持該經拉伸的薄膜之尺寸。 當如描述在前段中之聚酯薄膜為本發明的較佳具體實施 例時,該薄膜並不需要滿足如上述所定義之方程式。再者, 86584.doc -17- 1251005 提供一如定義於本文之從聚酯製造的雙向拉伸聚酯薄膜(其 不必需滿足在前段所描述的方程式),其中當將該聚酯薄膜 /又入已預熱至260 C的焊接浴中1 〇秒時,其歷經不多於3%的 收縮,且當其在120至15(TC間測量時,其具有1〇_85 ppm/t: 的熱膨服係數值。 對本發明之全邵具體實施例來說,當將本發明之聚酯薄 膜/又入已預熱至2 6 0 C的焊接浴中1 〇秒時,其較佳地具有少 於3%的收縮,且當其在25至9〇它間測量時,其較佳地具有 10-42 ppm/°c的CTE,及/或當在12〇至15(^c間測量時為 10-85 Ppm/°C。再者,當將該聚酯薄膜浸入已預熱至26〇c&gt;c 的焊接浴中10秒時,其較佳的是不會起泡或起皺紋。該聚 酉曰薄膜亦具有改善的抗水解性(如與從pET製備的類似薄 膜比較)及改善的介電常數(與從ρ Ε τ及聚醯亞胺製備的薄 膜比較)。本發明之聚酯薄膜可有用地用於任何需要薄膜且 需要在高溫下具有尺寸穩定性之應用。特別的最終用途(如 於本文中所提到之實例)有可撓電路板;在可撓觸控式螢幕 顯不器、液晶顯示器、電致變色顯示器、光生伏特裝置(即 ,太陽電池)、OLEDs (有機發光二極體)、微流體裝置(可 棄換式的醫療測試配套元件)及其他中的導電層薄膜。本發 明 &lt; 薄膜的特別佳最終用途為需要在26(rc及大於下具有 尺寸穩定性之薄膜。 S些新穎的層合物結構可使用由本發明所提供之任何薄 膜或聚酯,且依序可包含至少一層可熱或UV硬化或已硬化 的黏著層及至少一層雙向拉伸及熱定型聚酯層。本發明亦 86584.doc -18 - 1251005 提供一鋼/聚酯層合物,其依序包含至少一層銅層、至少一 層可熱或uv硬化的或已硬化的黏著層及至少一層雙向拉 伸及熱足型聚酯層。該銅層典型地由厚度約17至140微米(較 佳為約3〇至7〇微米)的金屬銅箔所組成。該銅箔可為經鍛造 或軋成或電解沉積的銅箔。該可熱硬化的黏著層可選自於 夕種已4知的黏著劑組成物,諸如丙婦酸、阻燃型(FR)丙 烯酸、縮丁醛酚、丙烯酸環氧樹脂、聚酯、環氧聚酯、經 改貝的ϊ哀氧樹脂及其類似物。這些黏著劑典型地可藉由在 約700至3500千帕(每平方英吋1〇〇至5〇〇磅)之壓力下,對該 黏著劑施加熱或將其曝露至熱中,將其加熱至溫度約12〇 至180 C約30分鐘至1小時而硬化。該硬化的黏著層厚度範 圍典型為約15至1〇〇微米。本發明亦提供製備包含這些層合 物結構的熱塑性物件之方法,其包括對該層合;結構ϋ 熱及壓力。本發明之層合物結構可使用在技藝中任何已熟 知或已描述於本文之用途上,但是其較佳的是使用在可換 電子電路板中。本發明之層合物可使用在單層電子電路、 二層電子電路及/或多層電子電路,例如描述在圖卜3中。 如所顯示’該熱塑性物件亦可藉由對如上所述之數層層 合物或“三明治”施加熱及壓力而獲得。在多層層合物I: 體實施例及/或“三明治,,έ士播由 ._ , „ 、 h 口〜構中,亦可在層合物間塗敷諸如 上述描述的黏者層。 在圖1_3中,本發明之聚酉旨薄膜可使用作為可换電子電路 用 &lt; 外層及/或可作為内層,不論其是否稱為聚酿基板 、聚酿覆蓋物或另-種名稱。本發明不意欲由如描述在圖 86584.doc -19- 1251005 形中的名稱“基板,,、“基材,,或“覆蓋物,,所限制。 孩薄膜樣品的線性熱膨脹係數(CTE)可根據ipc_tm_65〇 2·4·41·3使用流變儀(Rhe〇metrics) RSA 態機械熱分儀 (DMTA)裝置來測量,且進一步由下列實例來例証。 本發明可藉由其較佳具體實施例的下列實例進一步闡明 ,但是可了解的是所包含的這些實例僅有闡明之目的而不 意欲限制本發明之範圍,除非其它方面有特別指出。除非 其它方面有指出,否則全部的重量百分比皆以該聚合物組 合物的總重量為準,且全部分子量皆為重量平均分子量。 同樣地,除非其它方面有指出,否則全部的百分比皆以重 量計。 實例 下列實例進一步闡明根據本發明之聚酯薄膜及其製備。 如由本發明所定義之防焊性可根據Ipc_TM_65〇 24131, 以/里度设足在260 C的焊接浴來測量。該些在下列實例中進 行試驗的樣品未製成層合物、未經蝕刻及為裸露的(即,未 經塗敷或層合)。該薄膜收縮度可藉由在MD (機器方向)的 二個位置處及在TD (橫軸方向)的二個位置處測量尺寸5 . i 公分X 5.1公分(2 X 2英吋)之薄膜樣品而度量。然後,如於 本文所描述般,將該薄膜樣品浸入已預熱至26(rc的焊接浴 中10秒。觀察該薄膜之起泡及皺紋。然後,再次測量尺寸 。將原始尺寸減去每次浸潰後的尺寸,然後除以原始尺寸 ,以獲得收縮%。一起平均四個收縮%值(2個]^1]〇及2個丁1)) ,以獲得整體收縮%。 86584.doc -20- 1251005 如由本發明所定義之玻璃轉換溫度及熔化溫度可使用差 π掃描1熱法(DSC)根據ASTM D3418來測量。將15.0毫克 的每種樣品密封在一鋁平底鍋中,以2(rc /分鐘的速率加熱 至290 C。然後,以約32(rc/*鐘的速率將該樣品冷卻至低 於其玻璃轉換溫度,以產生一非晶相樣品。在掃描期間, 該熔化溫度(Tm)與所觀察到的吸熱波峰相符合。該薄膜樣 品如由本發明所定義之線性熱膨脹係數(CTE)則可根據 IPC-TM-650 2·4·41·3使用流變儀RSA ^動態機械熱分儀 (DMTA)裝置來測量。此程序為將一额定的2毫米寬χ 22毫米 長的薄膜樣品安置在DMTA裝置夾中。DMTA力則固定設定 在2克。將樣品冷卻至-1〇。〇,加熱至15〇。〇,再冷卻至_丨〇它, 然後再加熱至15CTC,全部以lot:/分鐘的加熱/冷卻速率。 在第二次熱掃描期間,測量該樣品的長度(如為溫度函數) 。在25-90°C及12(M50°C之溫度範圍内測量該樣品的長度_ /姐度斜率。進行二種校正··一種用以建立DMTA用之基線 及一種用來校正機器對不同標準物的靈敏度。使用具有熟 知的CTE值之銅、鋁及一些非晶相塑膠作為校正標準物。然 後,使用此校正,從其所測量的長度·溫度斜率,在25_9(rc 及120-150 C之溫度範圍内來計算未知樣品的cte。 實例1輿比較例 實例1與比較例C-1-C-3說明熱定型溫度在從PcT製備的 薄膜之收縮上的影響。於熔化相縮聚製程中,使用丨〇〇 的Ti觸媒(如為異丁氧化鈦)來製備PCT聚酯丸粒(Lv. 〇 74 ,Tm 293°C,Tg 94°C )。將該些丸粒在135°C下乾燥6小時 86584.doc -21 - 1251005 ,隨後在配備有聚g旨阻礙型式螺旋槳的戴維斯(⑽⑷標準 sJMao英对)擦壓器上,將其擠壓成2〇32毫米(8密耳) 厚的薄片。將炫化溫度與沖模溫度維持在293t。將該薄片 ‘塑到向下堆登〈2滾筒上,而t亥滾筒的溫度則i定在6代 (150°F)。然後’將該些薄膜在TM•長薄膜拉伸機器上雙向 拉伸,其以相同的拉伸比率及每秒35·56公分(14英对)的相 同速率,纟表I所指出的條件下二軸同步拉伸、然後,將該 二薄膜鉗入鋁幀框中再塞入烤箱(其定型溫度及時間則顯 不在表I)以^ ^型。將二片薄膜放置在+貞框中,並將溫度 :夾在二薄膜中間以測量實際薄膜溫度,此亦顯示在表卜 而/王忍的疋琢足型溫度高於實際薄膜溫度,且所列出的熱 足5L時間包括將樣口口加g至實㉟薄膜溫度戶斤需之時間(大 、’’勺30秒)。在熱疋型後,將該薄膜浸入已預熱至26〇它的焊 接浴中10秒所產生的收縮%則顯示在表I。實例為 比較例,其在不同的拉伸條件下製造,其說明在低於26〇它 的實際薄膜溫度下熱定型會製造出在2 6 Q t時具有高收縮 私度的薄膜。在焊接浴浸潰期間已在該些比較用薄膜中形 成九/包對本發明之層合物的製造來說,當將該薄膜使用 來製U私連接器或可撓的電路薄膜時,此高程度的收縮並 典法接文。需注意的是在與^¥〇/〇6125之實例3中所報導的 那些相同條件下’才立伸及熱定型比較例之薄膜。實例i 為根據本發明之薄膜實例,纟已在可讓薄膜具有可接受的 收鈿之Μ度下熱定型。此薄膜的匚丁£亦可接受。在表I中, i二I伸比率心為在機器及橫軸二方向上拉伸。溫度以。c提 86584.doc -22· 1251005 供y#間以秒、收縮%指為樣品薄膜在浸人已預熱至2航 y于接/谷中1後之收縮百分比、CTE值指為ppm/t及薄 膜厚度以微米提供。The degree is between 90 and 110C. After stretching, the film is heat set at a temperature greater than about 260 ° C to Tm of the actual film temperature (where Tm is the melting point of the polymer, as measured by the differential scanning calorimetry (Dsc)). 5 second spoonful of Japanese temple pHj. ^ ^ 4> Wang Yi, according to the heating source of the oven (ie, convection, radiation, etc.), the film will need to be heated up to a maximum of 260 ° C, the time between the temples up to 30 seconds . This extra time is not included in this article... It does not take time. It refers only to the time when the sample is actually in the range from 260 ° C to Tm. The initial film extrusion can be carried out immediately prior to stretching (i.e., tandem) or can be carried out separately. During heat setting, the tenter frame 86858.doc -15-1251005 or other mechanical equipment (which can prevent the stretched film from over-relaxing during heat setting) can be utilized, the stretched film Maintain the stretched size of the film. The film can be stretched or relaxed up to 1% during heat setting, i.e., the overall size of the film can be increased or decreased by up to 10%. Any of the films of the present invention can be stretched or oriented using any conventional method. For example, the extruded polyester film can be stretched by roll stretching, long pitch stretching, tenter stretching, tubular stretching, or a combination thereof. In any of these methods, continuous biaxial stretching, simultaneous biaxial stretching, uniaxial stretching, or a combination thereof can be made. Synchronous biaxial stretching involves the simultaneous stretching of the film and the transverse axis direction. In the synchronous biaxial pull, the stretch ratio is not necessarily the same in the horizontal axis direction and in the machine direction. Continuous biaxial stretching involves first stretching in the machine direction (eg, stretching on a drum against a drum) and then stretching in the direction of the horizontal axis (eg, using a tenter frame in a continuous stretching process) The two types of stretching may be performed immediately after one of the other species (i.e., string 歹 or may be performed separately. The machine direction is defined as the long direction of the film (when the = horizontal axis direction is defined as the width of the film) 'that is, the universal direction with the machine direction. If continuous biaxial stretching is performed, the stretching ratio and temperature in the direction of the horizontal axis and the stretching in the poems are not necessarily the same. /, , = stretching or orientation The polyester film can be determined according to a well-known method to determine the filming/occurrence, for example, 'the stretched thin 栗 — — - times the batch method, for example, the film is placed in a heat-set structure and 1 %丨,彳€ A 1 time. (4)^ Set in the type of oven towel - section fixed coffin, 疋 可 can be carried out immediately after stretching. ^U kiosk) or can be each - can be Relax or stretch up to 1% during heat setting. 86584.doc •16- 1251005 Stretching and The number of hot-type steps can be different. The polyester film can be subjected to single stretching and single heat setting or treatment, single stretching and multiple heat setting, multiple stretching and single heat setting, or multiple times. Stretching and multiple hot foot type pass. If multiple stretching and/or heat setting is carried out, the father can use the stretching and heat setting at the right time, but it can also be heat set by one time. The type passes through without inserting through. The conditions for each pass need not be the same as the previous pass. For example, the polyester film can be heat set using a two-stage heat setting method by any actual temperature greater than the stretching temperature. The first heat setting is carried out at film temperature. Subsequently, the film is subjected to a continuous film temperature range from 26 (rc to Tm (where Tm is the melting point of the polymer, which can be by DSC (differential scanning calorimetry) To measure) the internal heat setting for a second period of time. The polyester film component of the laminate of the present invention normally has a final thickness value of about 〇·(10) to Ο.] halo (about 0.8 to 8 mils) (ie, After stretching and heat setting)约·· 04 to 〇·13 mm (about 1.25 to 5 mils). The biaxially oriented polyester film of the present invention can be produced from a polyester as defined herein; wherein the polyester film satisfies the equation ( 27*RH1 ·3*(T_Tg)p27 stretching ratio and stretching temperature for stretching or orientation, where τ is the average stretching temperature (degrees Celsius) in the machine direction and the transverse axis direction, and Tg is the glass transition of the polymer film Temperature (degrees Celsius) and R are the average stretch ratios in the machine and transverse directions; subsequently, the stretched film is at a true film temperature from 26 〇 (: to Tm (where Tm is the melting point of the polyester, such as The heat setting can be performed by differential scanning calorimetry (DSC) while maintaining the size of the stretched film. When the polyester film as described in the preceding paragraph is a preferred embodiment of the present invention, The film does not need to satisfy the equation as defined above. Further, 86584.doc -17- 1251005 provides a biaxially oriented polyester film manufactured from polyester as defined herein (which does not necessarily satisfy the equations described in the preceding paragraph), wherein when the polyester film is When it is preheated to 260 C in a solder bath for 1 sec, it undergoes no more than 3% shrinkage, and when it is between 120 and 15 (measured between TCs, it has 1 〇 _85 ppm/t: Thermal expansion coefficient value. For the specific embodiment of the present invention, when the polyester film of the present invention is further incorporated into a solder bath that has been preheated to 260 C for 1 sec, it preferably has Less than 3% shrinkage, and preferably has a CTE of 10-42 ppm/°c when measured between 25 and 9 ,, and/or when measured between 12 〇 and 15 (^c) It is 10-85 Ppm/° C. Further, when the polyester film is immersed in a solder bath which has been preheated to 26 ° C &gt; c for 10 seconds, it is preferable that it does not foam or wrinkle. Polyfluorene films also have improved hydrolysis resistance (as compared to similar films prepared from pET) and improved dielectric constant (compared to films prepared from ρ Ε τ and poly liminimine). thin Membranes can be usefully used in any application requiring a film and requiring dimensional stability at elevated temperatures. Special end uses (as exemplified herein) have flexible circuit boards; Conductors, liquid crystal displays, electrochromic displays, photovoltaic devices (ie, solar cells), OLEDs (organic light-emitting diodes), microfluidic devices (replaceable medical test kits), and other conductive layers Films. The particularly preferred end use of the film of the present invention is that a film having dimensional stability at 26 (rc and greater) is required. Some novel laminate structures may use any of the films or polyesters provided by the present invention, and Optionally, it may comprise at least one layer of a heat or UV hardened or hardened adhesive layer and at least one layer of biaxially stretched and heat set polyester. The invention also provides a steel/polyester laminate, 86584.doc -18 - 1251005, It comprises at least one layer of copper, at least one layer of heat or uv hardened or hardened adhesive layer and at least one layer of biaxially oriented and hot foot polyester. The copper layer is typically from about 17 to 140 thick. a metal copper foil of preferably rice (preferably about 3 to 7 micrometers). The copper foil may be a forged or rolled or electrolytically deposited copper foil. The heat-curable adhesive layer may be selected from the group Adhesive compositions such as propylene glycol, flame retardant (FR) acrylic acid, butyral phenol, acrylic epoxies, polyesters, epoxy polyesters, modified bismuth oxide resins Analogs. These adhesives typically can apply heat to the adhesive or expose it to heat at a pressure of from about 700 to 3500 kPa (1 to 5 pounds per square inch). It is hardened by heating to a temperature of about 12 Torr to 180 C for about 30 minutes to 1 hour. The hardened adhesive layer typically has a thickness in the range of about 15 to 1 micron. The present invention also provides a method of making a thermoplastic article comprising these laminate structures, including lamination; structural heat and pressure. The laminate structure of the present invention can be used in any of the art which is well known in the art or has been described herein, but is preferably used in a replaceable electronic circuit board. The laminates of the present invention can be used in single layer electronic circuits, two layer electronic circuits, and/or multilayer electronic circuits, such as described in FIG. The thermoplastic article can also be obtained by applying heat and pressure to several layers of the layer or "sandwich" as described above. The adhesive layer such as described above may also be applied between the laminates in the multilayer laminate I: body embodiment and/or &quot;sandwich, gentleman's broadcast. _, „, h. In Fig. 1-3, the polyimide film of the present invention can be used as an outer layer and/or as an inner layer for a replaceable electronic circuit, whether or not it is referred to as a brewed substrate, a mulched cover or another name. The present invention is not intended to be limited by the name "substrate,", "substrate," or "cover," as described in Figure 86584.doc -19-1251005. The coefficient of linear thermal expansion (CTE) of a film sample can be The measurement is performed according to ipc_tm_65〇2·4·41·3 using a Rhe〇metrics RSA state mechanical thermal separator (DMTA) device, and is further exemplified by the following examples. The present invention can be preferably embodied by the present invention. The following examples are further clarified, but it is to be understood that the examples are included for purposes of illustration only and are not intended to limit the scope of the invention unless otherwise indicated, unless otherwise indicated The total weight of the polymer composition is based on the total weight of the polymer composition, and all molecular weights are weight average molecular weights. Likewise, all percentages are by weight unless otherwise indicated. EXAMPLES The following examples further illustrate the polyesters according to the present invention. Film and its preparation. The solder resistance as defined by the present invention can be measured in accordance with Ipc_TM_65〇24131, with a welding bath set at 260 C in /. The samples tested in the following examples were not made into laminates, unetched and bare (ie, uncoated or laminated). The film shrinkage can be achieved by MD (machine direction) The film is measured at a position and at a two position in the TD (horizontal axis direction) at a size of 5. centimeters x 5.1 cm (2 x 2 inches). Then, as described herein, the film is as described herein. The sample was immersed in a solder bath that had been preheated to 26 (rc for 10 seconds. The foaming and wrinkles of the film were observed. Then, the dimensions were measured again. The original size was subtracted from the size after each impregnation and then divided by the original size. To obtain % shrinkage. Average four shrinkage % values together (2)^1]〇 and 2 butyl 1)) to obtain the overall shrinkage %. 86584.doc -20- 1251005 Glass transition temperature as defined by the present invention And the melting temperature can be measured using differential π-scan 1 thermal method (DSC) according to ASTM D 3418. 15.0 mg of each sample is sealed in an aluminum pan and heated to 290 C at a rate of 2 (rc / min. Cool the sample below its glass transition at a rate of about 32 (rc/* clock) Degree to produce an amorphous phase sample. During the scanning, the melting temperature (Tm) is consistent with the observed endothermic peak. The film sample has a linear thermal expansion coefficient (CTE) as defined by the present invention according to IPC- TM-650 2·4·41·3 is measured using a rheometer RSA ^ Dynamic Mechanical Thermometer (DMTA) device. This procedure is to place a nominal 2 mm wide χ 22 mm long film sample in the DMTA device clamp. Medium. The DMTA force is fixed at 2 grams. The sample is cooled to -1 Torr. 〇, heated to 15 〇. Helium, cooled to _ 丨〇 it, then heated to 15 CTC, all at a heating/cooling rate of lot:/min. During the second thermal scan, the length of the sample (as a function of temperature) is measured. The length of the sample was measured at 25-90 ° C and 12 (50 ° C temperature range / / sister slope). Two corrections were made. One was used to establish the baseline for DMTA and one was used to calibrate the machine to different standards. Sensitivity of the object. Copper, aluminum and some amorphous phase plastics with well-known CTE values were used as calibration standards. Then, using this correction, the measured length and temperature slope were at 25_9 (rc and 120-150 C). The cte of the unknown sample was calculated over the temperature range. Example 1 Comparative Example Example 1 and Comparative Example C-1-C-3 illustrate the effect of the heat setting temperature on the shrinkage of the film prepared from PcT. PCT polyester pellets (Lv. 〇74, Tm 293 ° C, Tg 94 ° C) were prepared using a ruthenium Ti catalyst (such as titanium isobutoxide). The pellets were at 135 ° C. Drying for 6 hours 86584.doc -21 - 1251005, then extruding it into 2 〇 32 mm (8 mils) on a Davis ((10)(4) standard sJMao ying pair) wiper equipped with a g-blocking type propeller Ear) Thick flakes. Maintain the tempering temperature and die temperature at 293t. <2 on the drum, and the temperature of the t-roller is set at 6 generations (150 °F). Then the films are stretched biaxially on a TM•long film stretching machine with the same stretch ratio and At the same rate of 35.56 cm (14 in pairs) per second, the two axes are simultaneously stretched under the conditions indicated in Table I, and then the two films are clamped into an aluminum frame and then inserted into the oven (the setting temperature and The time is not shown in Table I). The two films are placed in the + frame, and the temperature is sandwiched between the two films to measure the actual film temperature. This is also shown in the table. The licking type temperature is higher than the actual film temperature, and the listed hot foot 5L time includes the time required to add the g to the real film temperature (large, ''spoon 30 seconds). Thereafter, the % shrinkage produced by immersing the film in a solder bath which had been preheated to 26 Torr for 10 seconds is shown in Table 1. Examples are comparative examples which were produced under different stretching conditions, which are described below 26〇The heat setting at its actual film temperature produces a film with high shrinkage at 2 6 Q t. Between the formation of the comparative film, the formation of the laminate of the present invention, when the film is used to make a U-private connector or a flexible circuit film, this high degree of shrinkage and It is noted that the film of the comparative example was developed under the same conditions as those reported in Example 3 of ^¥〇/〇6125. Example i is an example of a film according to the present invention, It has been heat set to allow the film to have an acceptable shrinkage. The film is also acceptable for the film. In Table I, the i II I stretch ratio is stretched in both the machine and the transverse axis. The temperature is. c mention 86584.doc -22· 1251005 for y# in seconds, shrinkage % refers to the shrinkage percentage of the sample film after the dip has been preheated to 2 y y in the connection / valley 1 , CTE value refers to ppm / t and The film thickness is provided in microns.

Al -___ 實例 2.5 130 250 120 236 8.0% 31 拉伸比率 拉伸溫度 熱定型溫度 熱定型時間 實際薄膜溫度 收縮% CTE(23-90°C ) CTE(120-150〇C ) 薄膜厚度 f例2-4與比較例C-4及 C-2 C-3 1 2 2 2 100 100 100 250 270 290 60 60 60 235 246 274 14.2% 9.0% 1.7% - - 34 - - 65 51 51 51 實例2-4為根據本發明之聚g旨薄膜的實例,其與比較例 C_4及C-5—起說明拉伸比率與拉伸溫度在從pcT製造的薄 膜&lt;收縮及CTE上的影響。如在先前實例中所描述般,將 pct 聚酉旨丸粒 aV.0.74,Tm 293t,Tg94t)MM_。 然後,將孩些薄膜在τ. Μ.長薄膜拉伸機器上雙向拉伸,以 相同的拉伸比率、每秒35.56公分〇4英,的相同速率,使 用在表II中所指出的條件二軸同步拉伸。錢,將該薄膜 鉗入鋁幀框並塞入烤箱中以熱定型,該烤箱在熱定型區域 86584.doc -23- 1251005 處的疋土 μ度及時間則顯示在表η。將二片薄膜放置在該 九、框中I概度计夾在二片薄膜間以測量實際薄膜溫度, 八亦員不在表II。需汪意的是該定型溫度高於實際薄膜溫度 ,且所列出的熱定型時間包括將樣品加熱至實際薄膜溫度 所需的時間(大約30秒)。將該經线型的薄膜浸人已預熱至 26CTC的烊接浴中卿,所產生的收縮%則顯示在表η。在 此表II中所包含的貫例丨為參考用。實例1 _4全部具有可接受 的收縮及CTE,且在滿足方程式(27*RML3*(T_Tg)^27之條 件下拉伸,其中T為機器及橫軸方向的平均拉伸溫度(攝氏 度),Tg為該聚合物薄膜的玻璃轉換溫度(攝氏度)及尺為機 器及橫軸方向的平均拉伸比率。這些薄膜在26〇t:或較大的 實際薄膜溫度下熱定型。比較例C-4及C-5在不符合方程式 (27*Ι^(1,3*(Τ-Τ^ρ27之條件下拉伸且具有無法接受的 CTE值。需注意的是在與WO/〇6125之實例2所報導的那些 相同條件下,拉伸及熱定型比較例C-5之薄膜。亦值得注意 的是實例3及4為可接受的,如w〇/〇6125明確地描述“PCT 行為與PET不同的是一旦該薄膜拉伸超過2·5χ,並無熱定 型的量(時間或溫度)可退火在拉伸製程期間所產生的内部 應力”。在表II中,該拉伸比率指為在機器及橫軸二方向上 的拉伸、溫度以。C提供、時間以秒、收縮%指為在將樣品 薄膜浸入已預熱至260°C的焊接浴中10秒後其收縮百分比 、CTE值指為ppm/°C及薄膜厚度以微米提供。 86584.doc -24- 1251005Al -___ Example 2.5 130 250 120 236 8.0% 31 Tensile ratio Tensile temperature Heat setting temperature Heat setting time Actual film temperature shrinkage % CTE (23-90 ° C ) CTE (120-150 〇 C ) Film thickness f Example 2 -4 and Comparative Examples C-4 and C-2 C-3 1 2 2 2 100 100 100 250 270 290 60 60 60 235 246 274 14.2% 9.0% 1.7% - - 34 - - 65 51 51 51 Examples 2-4 In the case of the film of the film according to the present invention, the effects of the stretching ratio and the stretching temperature on the film &lt; shrinkage and CTE manufactured from pcT are explained together with Comparative Examples C_4 and C-5. As described in the previous examples, pct was aggregated into av. 0.74, Tm 293t, Tg94t) MM_. Then, the children's film was stretched biaxially on a τ. Μ. long film stretching machine at the same rate of stretching, 35.56 cm per second, 4 inches, at the same rate, using the conditions indicated in Table II. The axis is stretched synchronously. Money, the film was clamped into an aluminum frame and placed in an oven for heat setting. The alumina μ and time at the heat setting area 86584.doc -23- 1251005 are shown in Table η. Two sheets of film were placed in the ninth frame, and the gauge was sandwiched between the two films to measure the actual film temperature. It is desirable that the setting temperature is higher than the actual film temperature and that the heat setting time listed includes the time (about 30 seconds) required to heat the sample to the actual film temperature. The warp-type film was immersed in a splicing bath of 26 CTC, and the % shrinkage produced was shown in Table η. The examples contained in Table II are for reference. Example 1 _4 all have acceptable shrinkage and CTE, and are stretched under the condition that the equation (27*RML3*(T_Tg)^27 is satisfied, where T is the average stretching temperature (degrees Celsius) in the machine and the horizontal axis direction, Tg The glass transition temperature (degrees Celsius) of the polymer film and the average stretch ratio of the ruler in the machine direction and the transverse axis direction. These films were heat set at 26 〇t: or a larger actual film temperature. Comparative Example C-4 and C-5 does not conform to the equation (27*Ι^(1,3*(Τ-Τ^ρ27) and has an unacceptable CTE value. It should be noted that in Example 2 with WO/〇6125 The films of Comparative Example C-5 were stretched and heat set under the same conditions as reported. It is also worth noting that Examples 3 and 4 are acceptable, as w〇/〇6125 clearly describes "PCT behavior is different from PET. Once the film has been stretched more than 2.5 χ, there is no heat setting (time or temperature) to anneal the internal stress generated during the drawing process. In Table II, the stretch ratio is referred to in the machine and The stretching in the two directions of the horizontal axis, the temperature is given by C, the time is in seconds, and the shrinkage is referred to as the sample. The film is immersed in a solder bath preheated to 260 ° C for 10 seconds after shrinkage percentage, CTE value is expressed in ppm / ° C and film thickness is provided in microns. 86584.doc -24- 1251005

表II 實例 1 2 C-4 C-5 3 4 拉伸比率 2 2.5 2 2.5 3 3.5 拉伸溫度 100 100 130 130 130 130 熱定型溫度 290 290 290 280 290 290 熱定型時間 60 60 120 120 60 60 實際薄膜溫度 274 272 279 260 276 269 收縮% 1.7% 2.5% 1.7% 1.4% 1.5% 2.7% CTE (23-90〇C ) 34 29 57 47 42 33 CTE (120-150°C ) 65 51 146 100 80 61 薄膜厚度 51 31 51 31 23 15Table II Example 1 2 C-4 C-5 3 4 Stretch ratio 2 2.5 2 2.5 3 3.5 Stretching temperature 100 100 130 130 130 130 Heat setting temperature 290 290 290 280 290 290 Heat setting time 60 60 120 120 60 60 Actual Film temperature 274 272 279 260 276 269 Shrinkage % 1.7% 2.5% 1.7% 1.4% 1.5% 2.7% CTE (23-90〇C) 34 29 57 47 42 33 CTE (120-150°C) 65 51 146 100 80 61 Film thickness 51 31 51 31 23 15

實例5_8輿比較例C_6-r_Q 實例5-8與比較例C-6_c_9說明熱定型溫度及時間在使用 連續拉伸及拉幅機方法而從Pct製得之薄膜上的收縮及 CTE之影響。在溶化相縮聚製程中,使用1〇〇 的丁丨觸媒 (如為異丁氧化鈦)來製備PCT聚酯丸粒(1.从〇74,Tm 293〇c ,Tg94°C)。將該丸粒在120°C下乾燥16小時,隨後在配備 有聚酯阻礙型式螺旋槳的戴維斯標準6.4公分(2·5英对)擠 壓器上擠壓成〇·460毫米(18密耳)厚的薄片。將熔化溫度及 沖模溫度維持在3 〇〇°C。將該些薄片鑄塑到向下堆叠之3滾筒 上’该些滾筒從頂端至底部的溫度則各別設定為49/57°C /66°C(l2〇°F/l35°F/l5〇T)。然後,在一商業拉幅機設備上 拉伸及拉張該薄膜,該設備的機器方向在滾筒堆叠上以顯 86584.doc -25- 1251005 示在表III的比率及溫度拉伸·_始 ,1思後,於顯示在表ΙΠ的條件 下,在拉幅機幀框之鉗夾間進荇 八j延仃k軸万向拉伸。將該些薄 膜立即通過一提供第一熱定型虛 土&amp;理或通過之退火區域。此 退火區域以在細中所指出的定型溫度及時間來設定該 熱定型區域。在退火區域中的鲁 乂甲的貫際薄膜溫度可藉由將一溫 度指示膠帶放置到該薄膜上而獲得。此膠帶在熟知的溫度 系列下會改變顏色’以指示出該薄膜所遭受的最大溫度。 在實例7與比較例C_m9中,第二熱定型處理之進行可藉 由將該薄賴人—_框中,然料其塞人-烤箱(並埶^ 型區域的定型溫度及時間則指出在表m)中。對這些實例來 說,將二片薄膜放置在該鴨框中,且將溫度計夹在此二片 薄膜中間以測量實際薄膜、;四泠 ,^ 、、除寿胰,皿度。在實例8中,第二熱定型處 理之進行可藉由在該熱定型區域(其定型溫度及時間指示 在表ΙΠ中)處,將該拉幅機鴨框的薄膜第二次通過該退火區 域。所列出的實際薄膜溫度為在第一與第二熱定型之紐合 期間所達到的最高溫度。需注意的是該定型溫度高於實際 薄膜溫度’且所列出的輕型時間包括將該樣品加散至實 際溥膜溫度所需之時間。因為加熱薄膜需要時間,所顧示 的實際薄膜溫度為Μ溫度與時間二者的函數。將該熱定 型薄膜浸入已預鼽至26n°r μ ϊ·曰η ν丄 …、 C的絝接浴中1〇秒,所產生的收縮 %則顯示在表m。比較例c_6_c_9顯示出低於·。c的實際 薄膜溫度如何不會在26(rc處提供足夠收縮。實例η的薄 膜具f可接受的收縮及CTE。在表m中,md拉伸比率指為 在機洛万向拉伸’ TD拉伸比率指為在橫軸方向拉伸,溫度 86584.doc -26 - 1251005 以。c提供,時間以秒、n/a意謂著不進行第二熱定型處理、 收縮%指為在將該些薄膜樣品浸入已預熱至260°C的焊接 浴中10秒後之收縮百分比、CTE值以ppm/t:指出及薄膜厚 度以微米提供。Example 5_8 舆 Comparative Example C_6-r_Q Examples 5-8 and Comparative Examples C-6_c_9 illustrate the effects of heat setting temperature and time on shrinkage and CTE on a film made from Pct using a continuous stretching and tenter method. In the melt phase polycondensation process, 1 〇〇 of butadiene catalyst (e.g., titanium isobutoxide) was used to prepare PCT polyester pellets (1. From 〇74, Tm 293〇c, Tg94 °C). The pellet was dried at 120 ° C for 16 hours and then extruded into a 〇 460 mm (18 mil) on a Davis standard 6.4 cm (2.5 liter pair) extruder equipped with a polyester barrier type propeller. Ear) thick sheet. Maintain the melting temperature and die temperature at 3 〇〇 °C. The sheets are cast onto 3 rolls stacked downwards. The temperatures from the top to the bottom of the rolls are set to 49/57 ° C / 66 ° C (l2 〇 ° F / l 35 ° F / l 5 〇 T). Then, the film is stretched and stretched on a commercial tenter apparatus, and the machine direction of the apparatus is shown on the drum stack at a ratio of 86584.doc -25 - 1251005 shown in Table III and temperature stretching. After thinking about it, under the condition of showing the watch, the k-axis is stretched between the jaws of the frame frame of the tenter frame. The films are immediately passed through an annealing zone that provides a first heat setting of the virtual soil &amp; This annealing zone sets the heat setting zone with the setting temperature and time indicated in the detail. The uniform film temperature of the ruthenium in the annealed region can be obtained by placing a temperature indicating tape on the film. This tape changes color under the well-known temperature series to indicate the maximum temperature the film is subjected to. In Example 7 and Comparative Example C_m9, the second heat setting process can be carried out by setting the thinner---box, and then setting the temperature to the oven and indicating the temperature and time of the area. In table m). For these examples, two sheets of film were placed in the duck frame, and a thermometer was placed between the two films to measure the actual film, the four sputum, the ^, the spleen, and the pan. In Example 8, the second heat setting process can be performed by passing the film of the tenter duck frame a second time through the annealing zone at the heat setting zone (the setting temperature and time are indicated in the watch). . The actual film temperatures listed are the highest temperatures reached during the first and second heat set bonding. It should be noted that the set temperature is higher than the actual film temperature&apos; and the listed light time includes the time required to add the sample to the actual film temperature. Since it takes time to heat the film, the actual film temperature considered is a function of both temperature and time. The heat-set film was immersed in a splicing bath which had been pre-twisted to 26 n° r μ ϊ·曰η ν 丄, C, and the resulting shrinkage % is shown in Table m. Comparative example c_6_c_9 shows less than ·. The actual film temperature of c does not provide sufficient shrinkage at 26 (rc). The film of Example η has acceptable shrinkage and CTE. In Table m, the md stretch ratio is referred to as the machine-wide stretched 'TD The stretching ratio refers to stretching in the horizontal axis direction, and the temperature is 86584.doc -26 - 1251005 is provided by c. The time is in seconds, n/a means that the second heat setting treatment is not performed, and the shrinkage % means that The percent shrinkage after immersion of the film samples in a solder bath preheated to 260 ° C for 10 seconds, the CTE value is indicated in ppm/t: and the film thickness is provided in microns.

表III 實例Table III Examples

Czi. C-7 5 6 C-8 C-9 7 8 MD拉伸比率 2.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5 MD溫度 91 91 91 91 91 91 91 91 TD拉伸比率 2.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5 TD溫度 99 99 99 99 99 99 99 99 第1熱定型溫度 288 304 304 304 288 288 288 288 第1熱定型時間 9 13 35 106 9 9 9 9 第2熱定型溫度 n/a n/a n/a n/a 270 290 290 299 第2熱定型時間 n/a n/a n/a n/a 60 9 60 33 實際薄膜溫度 200 245 260 267 248 200 275 271 焊接浴的收縮% 9.9% 4.9% 2.4% 0.9% 5.3% 12.6% 0.9% 1.2% CTE(23-90°C ) 24 34 37 31 30 23 33 42 CTE(120一150。〇 37 59 72 75 50 44 81 71 薄膜厚度 75 75 75 75 75 75 75 75 本發明已特別參考至其較佳的具體實施例而詳細地描述 ’但是需了解的是可在本發明之精神及範圍内達成變化及 改質。 86584.doc -27- 1251005 【圖式簡單說明】 圖1為在本發明中有用之單層可撓電子電路 圖2為在本發明中有用之雙層可撓電子電路 圖3為在本發明中有用之多層可撓電子電路 28- 86584.docCzi. C-7 5 6 C-8 C-9 7 8 MD stretch ratio 2.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5 MD temperature 91 91 91 91 91 91 91 91 TD stretch ratio 2.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5 TD Temperature 99 99 99 99 99 99 99 99 1st heat setting temperature 288 304 304 304 288 288 288 288 1st heat setting time 9 13 35 106 9 9 9 9 2nd heat setting temperature n/an/an/an/a 270 290 290 299 2nd heat setting time n/an/an/an/a 60 9 60 33 Actual film temperature 200 245 260 267 248 200 275 271 % shrinkage of solder bath 9.9% 4.9% 2.4% 0.9% 5.3% 12.6% 0.9 % 1.2% CTE (23-90 ° C) 24 34 37 31 30 23 33 42 CTE (120-150. 〇 37 59 72 75 50 44 81 71 film thickness 75 75 75 75 75 75 75 75 The present invention has been specifically referred to DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT(But it is understood that changes and modifications can be made within the spirit and scope of the present invention. 86584.doc -27- 1251005 [Simple description of the drawing] Single Layer Flexible Electronic Circuit Useful in the Invention FIG. 2 is a two-layer flexible electronic circuit useful in the present invention. FIG. 3 is a multilayer flexible electronic circuit 28 useful in the present invention. - 86584.doc

Claims (1)

鱗5¾)½修(更)正本 __092119128號,專辛申請案 争文申睛專利範圍替換本(94年7月) 拾、申請專利範圍: 其中該聚酯包含 1 · 一種從聚酯製造之雙向拉伸聚酯薄膜 比的對酞酸殘基 (1) 二酸殘基,其包含至少90莫耳百分 、秦二幾酸殘基或其組合;及 (2) 二醇殘基,其包含至少9〇莫耳 吁日刀比的1,4-環己烷二 甲醇殘基; 其中該聚自旨薄膜於啊及丨阶間之拉㈣度下,在機器 方向(MD)之拉伸比例為2.5乂至3χ、且在橫轴方向㈣ 之拉伸比例為2.5X至3X;iLM該經拉伸㈣膜隨後在 ㈣〇°C至Tm之實際薄膜溫度(其中以為藉由差示掃描 里熱法(DSC)所測得該聚酯的熔點)下熱定型,同時維持 該經拉伸的薄膜之尺寸。 2·如申請專利範圍第〗項之雙向拉伸聚酯薄膜,其中該丨,心 %己烷二甲醇殘基之反式異構物含量範圍為6〇至1〇〇%。 3 ·如申請專利範圍第丨或2項之雙向拉伸聚酯薄膜,其中該 14-環己燒二甲醇殘基之反式異構物含量範圍為6〇至 80% 〇 4 ·如申請專利範圍第1項之雙向拉伸聚酯薄膜,其中該二 酸殘基包含至少90莫耳百分比的對酞酸殘基。 5 ·如申請專利範圍第1項之雙向拉伸聚酯薄膜,其中該聚 酉旨具有至少270 °C的熔點及0.4至1.2的特性黏度(根據 ASTM方法D285 7-95,在25°C下,使用每100毫升的溶劑 (其由60重量百分比的酚與4〇重量百分比的四氯乙烷所 86584-940707.doc 1251005 組成)含〇. 5 0克之聚合物來測量),且包含·· (1) 二酸殘基,其包含至少97莫耳百分比的對酞酸殘基 、秦一幾版殘基或其組合;及 (2) 二醇殘基,其包含至少97莫耳百分比的丨,‘環己烷二 甲醇殘基。 6.如申凊專利範圍第5項之雙向拉伸聚酯薄膜,其中該聚 酉旨具有0.5至1·1的特性黏度。 如申凊專利範圍第5項之雙向拉伸聚酯薄膜,其中該聚 酯具有270至330°C的熔點及〇·5至Μ的特性黏度。 8·如申凊專利範圍第5項之雙向拉伸聚酯薄膜,其中該1,4_ %己烷一甲%殘基之反式異構物含量範圍為6〇至。 9·如申請專利範圍第5項之雙向拉伸聚酯薄膜,其中該^ %己% —甲醇殘基之反式異構物含量範固為⑼至。 10·如申請專利範圍第5项之雙向拉伸聚酿薄膜,其中該二 酸殘基包含至少97莫耳百分比的對酞酸殘基。 11·如申請專利範園第i项之雙向拉伸聚酉旨薄膜,其中該經 拉伸的薄膜在從260°C至Tm的實際薄膜溫度下熱定型— 段1至120秒的時間,同時維持該經拉伸的薄膜之尺寸。 12.如申請專利範圍第巧之雙向拉伸聚酿薄膜,其中該聚 酉旨薄膜相繼地在機器及橫軸方向上拉伸,且該經拉伸的 薄膜在從260°C至Tm的實際薄膜溫度下熱定型一段ι至 120秒的時間’同時維持該經拉伸的薄膜之尺寸。 13·如申請專利範圍第巧之雙向拉伸聚酯薄膜,其中該聚 酿薄膜在機器及橫轴方向上同步拉伸,且該經拉伸的薄 86584-940707.doc 1251005 膜在從260°C至Tm的實際薄膜溫度下熱定型一段1至120 秒的時間’同時維持該經拉伸的薄膜之尺寸。 14.如申請專利範圍第1項之雙向拉伸聚酯薄膜,其中當將 該經雙向拉伸及熱定型聚酯薄膜浸入已預熱至260°C的 焊接浴中10秒時,其會歷經不多於3%的收縮,且當其在 120 土 1 50 C間測量時,其具有1 〇_$5 ppm/°C的熱膨服係 數值,且當其在25至9(TC間測量時,其具有10-42 ppm/ C的熱膨脹係數值。 15·如申請專利範圍第丨4項之雙向拉伸聚酯薄膜,其中該聚 酉旨具有至少270°C的熔點及0.4至1.2的特性黏度(根據 ASTM方法D2857-95,在25°C下,使用每100毫升的溶劑 (其由60重量百分比的酚及4〇重量百分比的四氯乙烷所 組成)含〇 · 5 0克之聚合物來測量),且包含: (1) 二酸殘基,其包含至少97莫耳百分比的對g太酸殘基 、奈一叛酸殘基或其組合;及 (2) 二醇殘基,其包含至少97莫耳百分比的ι,4-環己環二 甲醇殘基。 1 6 ·如申請專利範圍第14項之雙向拉伸聚酯薄膜,其中該聚 酉旨薄膜相繼地在機器及橫軸方向上拉伸,且該經拉伸的 薄膜在從260°C至Tm的實際薄膜溫度下熱定型一段1直 120秒的時間,同時維持該經拉伸的薄膜之尺寸。 1 7·如申請專利範圍第14項之雙向拉伸聚酯薄膜,其中該聚 86584-940707.doc 1251005 酉旨薄膜在機器及橫轴方向上同步拉伸,且該經拉伸的薄 膜在從260UTm的實際薄膜溫度下熱定型一段丨至⑽ 秒的時間,同時維持該經拉伸的薄膜之尺寸。 18·—種含有一或多種層合物之熱塑性物件,其中該層合物 中至少一種依序包含: L 一可熱硬化的黏著劑;及 攸聚酯製造 &lt; 雙向拉伸及熱定型聚酯薄膜,其中該 聚酉旨包含: ⑴二,殘基’其包含至少9()莫耳百分比的對酜酸殘基 、奈一幾酸殘基或其組合:及 (2)二醇殘基,其包含至少9〇莫耳百分比的丨,4-環己烷二 甲醇殘基; 其中該聚酿薄膜於9(TC&amp;11(rc間之拉伸溫度下,在機器 方向(MD)之拉伸比例為2.sx至找、且在橫軸方向(td) 之拉伸比例為2.5X至3X;且其中該經拉伸的薄膜隨後在 從26(TC至Tm的實際薄膜溫度(其中Tm*藉由差示掃描 量熱法(DSC)所測得該聚合物的熔點)下熱定型,同時維 持該經拉伸的薄膜之尺寸。 19·如申請專利範圍第18項之熱塑性物件,其中該至少一種 層合物依序包含: I. 一銅層; Π.該可熱硬化的黏著劑;及 III.該雙向拉伸及熱定型聚酯薄膜。 86584-940707.doc 1251005 20·如申請專利範圍第19項之熱塑性物件,其中該銅層具有 17至140微米之厚度,及該聚酯具有至少270°C的熔點及 〇·4至1.2的特性黏度(根據ASTM方法D2857-95,在25°C 下,使用每100毫升的溶劑(其由60重量百分比的酚及40 重量百分比的四氯乙烷所組成)含0.50克之聚合物來測 量),且包含: (1) 二酸殘基,其包含至少97莫耳百分比的對酞酸殘基 、萘二羧酸殘基或其組合;及 (2) 二醇殘基,其包含至少97莫耳百分比的l,4-環己烷二 甲醇殘基。 21 ·如申請專利範圍第18項之熱塑性物件,其中當將該經雙 向拉伸及熱定型聚酯薄膜浸入已預熱至260°C的焊接浴 中10秒時,其會歷經不多於3%的收縮,且當其在120至 150°C間測量時,其具有10-85 ppm/°C的熱膨脹係數值, 且當其在25至90°C間測量時,其具有1〇_42 ppm/°C的熱 膨脹係數值。 22·如申請專利範圍第21項之熱塑性物件,其中該至少一種 層合物依序包含: I·一銅層; IL該可熱硬化的黏著劑;及 III·該雙向拉伸及熱定型聚酯薄膜。 23 ·如申請專利範圍第22項之熱塑性物件,其中該銅層具有 17至140微米之厚度,且該聚酯具有至少27(rc的熔點及 86584-940707.doc 1251005 0.4至1·2的特性黏度(根據astM方法D2857-95,在25°C 下,使用每100¾升的溶劑(其由6〇重量百分比的酚及4〇 重量百分比的四氣乙烷所組成)含〇 5〇克之聚合物來測 量),且包含: (1) 二酸殘基,其包含至少97莫耳百分比的對酞酸殘基 、莕二竣酸殘基或其組合;及 (2) 二醉殘基,其包含至少97莫耳百分比的丨,心環己環二 甲醇殘基。 24. 一種製備一含有一或多種層合物之熱塑性物件的方法 ,其中該層合物中至少一種依序包含: (a) —銅層; (b) —可熱硬化的黏著劑;及 (c) 一從聚酯製造之雙向拉伸及熱定型聚酯薄膜,其中 該聚酯包含: (1) 二酸殘基,其包含至少90莫耳百分比的對酞酸殘 基、莕二羧酸殘基或其組合;及 (2) 二醇殘基’其包含至少90莫耳百分比的丨,4_環己 烷二甲醇殘基; 其中該聚酯薄膜於90°C及ll〇°C間之拉伸溫度下,在 機器方向(MD)之拉伸比例為2.5X至3X、且在橫轴方向 (TD)之拉伸比例為2.5X至3X;且其中該經拉伸的薄膜隨 後在從260°C至Tm的實際薄膜溫度(其中Tm為藉由声厂、 掃描量熱法(DSC)所測得該聚酯的馆:點)下熱定型, * 4 w 了 86584-940707.doc 1251005 維持該經拉伸的薄膜之尺寸;及 該方法包括在壓力下以1 2 0至1 8 〇。〇之 合物一段足以硬化該可鼽减仆沾針切以、 溫度加熱該層Scale 53⁄4) 1⁄2 repair (more) original __092119128, special application for the application of the text of the scope of the patent scope replacement (94 July) Pick, patent scope: Where the polyester contains 1 · a polyester manufacturing a biaxially stretched polyester film having a para-citric acid residue (1) diacid residue comprising at least 90 mole percent, a qindanic acid residue or a combination thereof; and (2) a diol residue, a 1,4-cyclohexanedimethanol residue comprising at least 9 moles of radon ratio; wherein the pigment is stretched in the machine direction (MD) at a pull (four) degree between the film and the 丨 step The ratio is 2.5乂 to 3χ, and the stretching ratio in the horizontal axis direction (4) is 2.5X to 3X; iLM is the stretched (four) film and then the actual film temperature at (4) 〇 °C to Tm (which is considered to be by differential scanning) The heat setting of the polyester is measured by the heat of the heat (DSC) while maintaining the size of the stretched film. 2. A biaxially oriented polyester film according to the scope of claim 2, wherein the content of the trans isomer of the oxime, heart % hexane dimethanol residue ranges from 6 〇 to 1 〇〇 %. 3 · The biaxially oriented polyester film of claim No. 2 or 2, wherein the 14-cyclohexanediethanol residue has a trans isomer content ranging from 6 〇 to 80% 〇 4 · as claimed The biaxially oriented polyester film of clause 1, wherein the diacid residue comprises at least 90 mole percent of a citric acid residue. 5. The biaxially oriented polyester film of claim 1, wherein the polythene has a melting point of at least 270 ° C and an intrinsic viscosity of 0.4 to 1.2 (according to ASTM method D285 7-95 at 25 ° C Using 100 ml of solvent (composed of 60 wt% phenol and 4 wt% tetrachloroethane 86584-940707.doc 1251005) containing 0.50 g of polymer to measure), and containing ·· (1) a diacid residue comprising at least 97 mole percent of a phthalic acid residue, a hydrazine residue or a combination thereof; and (2) a diol residue comprising at least 97 mole percent bismuth , 'cyclohexane dimethanol residue. 6. The biaxially oriented polyester film of claim 5, wherein the polyenthalpy has an intrinsic viscosity of from 0.5 to 1.1. The biaxially oriented polyester film of claim 5, wherein the polyester has a melting point of 270 to 330 ° C and an intrinsic viscosity of 〇·5 to Μ. 8. The biaxially oriented polyester film of claim 5, wherein the 1,4% hexane-methyl residue has a trans isomer content ranging from 6 Å to about 10,000 Å. 9. The biaxially oriented polyester film of claim 5, wherein the content of the trans isomer of the % to % methanol residue is (9) to. 10. The biaxially oriented polymer film of claim 5, wherein the diacid residue comprises at least 97 mole percent of a citric acid residue. 11. A biaxially stretched film according to item i of the patent application, wherein the stretched film is heat set at an actual film temperature of from 260 ° C to Tm for a period of from 1 to 120 seconds while The size of the stretched film is maintained. 12. A two-way stretched blister film as claimed in the patent application, wherein the film is stretched successively in the machine and transverse directions, and the stretched film is practical from 260 ° C to Tm The film is heat set at a film temperature for a period of 1 to 120 seconds while maintaining the size of the stretched film. 13. The biaxially stretched polyester film of the patent application range, wherein the polymerized film is simultaneously stretched in the machine direction and the transverse axis direction, and the stretched thin 86584-940707.doc 1251005 film is at 260° The heat is set at a practical film temperature of C to Tm for a period of 1 to 120 seconds while maintaining the size of the stretched film. 14. The biaxially oriented polyester film of claim 1, wherein the biaxially stretched and heat set polyester film is immersed in a solder bath preheated to 260 ° C for 10 seconds, Not more than 3% shrinkage, and when measured between 120 ° 1 50 C, it has a thermal expansion coefficient value of 1 〇 _ $ 5 ppm / ° C, and when it is measured between 25 and 9 (between TC And having a coefficient of thermal expansion of 10 to 42 ppm / C. 15. The biaxially oriented polyester film of claim 4, wherein the polythene has a melting point of at least 270 ° C and a characteristic of 0.4 to 1.2 Viscosity (according to ASTM method D2857-95, at 25 ° C, using 100 ml of solvent per 100 ml of solvent (which consists of 60 wt% phenol and 4 wt% tetrachloroethane) To measure), and comprising: (1) a diacid residue comprising at least 97 mole percent of a g-acidic residue, a naphthoic acid residue or a combination thereof; and (2) a diol residue, Containing at least 97 mole percent of iota, 4-cyclohexyl cyclodimethanol residue. 1 6 · Biaxially oriented polyester film of claim 14 The film is sequentially stretched in the direction of the machine and the transverse axis, and the stretched film is heat set for a period of 120 seconds at an actual film temperature of from 260 ° C to Tm while maintaining the The size of the stretched film. 1 7 · The biaxially oriented polyester film of claim 14 of the patent application, wherein the poly 86584-940707.doc 1251005 film is simultaneously stretched in the machine direction and the horizontal axis direction, and The stretched film is heat set at a practical film temperature of 260 UTm for a period of time from 丨 to (10) seconds while maintaining the size of the stretched film. 18. A thermoplastic article containing one or more laminates, Wherein at least one of the laminates comprises: L. a heat-curable adhesive; and ruthenium-polyester manufacture &lt; biaxially oriented and heat-set polyester film, wherein the poly-ply comprises: (1) two, residues 'It contains at least 9 (%) mole percent of a citric acid residue, a naphthoic acid residue or a combination thereof: and (2) a diol residue comprising at least 9 mole percent of ruthenium, 4-ring Hexane dimethanol residue; wherein the polymerized film is at 9 (TC &amp; 11 (at the stretching temperature between rc, the stretching ratio in the machine direction (MD) is 2.sx to find, and the stretching ratio in the horizontal axis direction (td) is 2.5X to 3X; and wherein the stretching is The stretched film is then heat set at an actual film temperature of 26 (TC to Tm (where Tm* is measured by differential scanning calorimetry (DSC)) while maintaining the stretched The thermoplastic article of claim 18, wherein the at least one laminate comprises: I. a copper layer; Π. the heat-curable adhesive; and III. the two-way pull Stretch and heat set polyester film. The thermoplastic article of claim 19, wherein the copper layer has a thickness of 17 to 140 microns, and the polyester has a melting point of at least 270 ° C and a characteristic of 4·4 to 1.2. Viscosity (measured according to ASTM method D2857-95 at 25 ° C using 0.50 grams of polymer per 100 milliliters of solvent consisting of 60 weight percent phenol and 40 weight percent tetrachloroethane), And comprising: (1) a diacid residue comprising at least 97 mole percent of a phthalic acid residue, a naphthalene dicarboxylic acid residue or a combination thereof; and (2) a diol residue comprising at least 97 moles Percent of l,4-cyclohexane dimethanol residue. 21. The thermoplastic article of claim 18, wherein the biaxially stretched and heat set polyester film is immersed in a solder bath preheated to 260 ° C for 10 seconds, which will pass no more than 3 % shrinkage, and when measured between 120 and 150 ° C, it has a coefficient of thermal expansion of 10-85 ppm / ° C, and when it is measured between 25 and 90 ° C, it has 1 〇 _ 42 The coefficient of thermal expansion of ppm/°C. 22. The thermoplastic article of claim 21, wherein the at least one laminate comprises: I. a copper layer; IL the heat hardenable adhesive; and III. the biaxial stretching and heat setting polymerization Ester film. The thermoplastic article of claim 22, wherein the copper layer has a thickness of 17 to 140 microns, and the polyester has a melting point of at least 27 (rc and 86584-940707.doc 1251005 0.4 to 1.2) Viscosity (according to astM method D2857-95, at 25 ° C, using 1003⁄4 liters of solvent (which consists of 6 〇 weight percent phenol and 4 〇 weight percent tetra-ethane ethane) contains 5 gram of polymer To measure), and comprising: (1) a diacid residue comprising at least 97 mole percent of a decanoic acid residue, a decanoic acid residue or a combination thereof; and (2) a second intoxication residue comprising At least 97 mole percent of hydrazine, acyclohexane cyclodimethanol residue. 24. A method of preparing a thermoplastic article comprising one or more laminates, wherein at least one of the laminates comprises: (a) a copper layer; (b) a heat-curable adhesive; and (c) a biaxially oriented and heat-set polyester film produced from polyester, wherein the polyester comprises: (1) a diacid residue, Having at least 90 mole percent of a phthalic acid residue, a hydrazine dicarboxylic acid residue, or a combination thereof; (2) a diol residue comprising at least 90 mole percent of a ruthenium, a 4-cyclohexane dimethanol residue; wherein the polyester film is at a stretching temperature between 90 ° C and ll 〇 ° C, The machine direction (MD) has a stretch ratio of 2.5X to 3X and a draw ratio in the horizontal axis direction (TD) of 2.5X to 3X; and wherein the stretched film is subsequently from 260 ° C to Tm The actual film temperature (where Tm is heat-set by the sound factory, scanning calorimetry (DSC) of the polyester: point), * 4 w 86584-940707.doc 1251005 to maintain the stretched The size of the film; and the method comprises: 120 to 18 Torr under pressure. The yttrium compound is sufficient to harden the smear and the temperature is heated. 向拉伸聚酯薄膜,該聚酯包含: (1)二To stretch the polyester film, the polyester comprises: (1) two 、蓁二羧酸殘基或其組合;及 (2)二醇殘基,其包含至少9〇莫耳百分比的丨,4_環己烷 甲醇殘基; ,在機器 其中該聚酯薄膜於90°C及110°C間之拉伸溫度下 万向(MD)之拉伸比例為2·5Χ至3χ、且在橫軸方向(丁d) &lt;拉伸比例為2·5Χ至3X ;且其中該經拉伸的薄膜在從 260 C至Tm的貫際薄膜溫度(其中Tm為藉由差示掃描量 熱法(DSC)所測彳于该聚g旨的溶點)下熱定型,同時維持該 經拉伸的薄膜之尺寸。 26·如申請專利範圍第25項之可撓電子電路板,其中該聚酯 具有土少270 C的熔點及0.4至1 _2的特性黏度(根據 ASTM方法D2857-95,在25°C下,使用每1〇〇毫升的溶劑 (其由60重量百分比的紛及40重量百分比的四氯乙烷所 組成)含0.50克之聚合物來測量),且包含: (1) 二酸殘基’其包含至少97莫耳百分比的對酞酸殘基 、莕二羧酸殘基或其組合;及 (2) 二醇殘基,其包含至少97莫耳百分比的丨,4-環己烷二 甲醇殘基。 86584-940707.doc 1251005 27.如申請專利範圍第25項之可撓電子電路板,其包含一或 多種層合物’其中該層合物中至少一種依序包含: I·一銅層; II.一可熱硬化的黏著劑;及 ΠΙ.該雙向拉伸及熱定型聚酯薄膜。 28·如申請專利範圍第25項之可撓的電子電路板,其中當將 該經雙向拉伸及熱定型的聚酯薄膜浸入已預熱至26〇〇c 的焊接浴中10秒時,其會歷經不多於3%的收縮,且當其 在120至150°C間測量時,其具有i〇_85 ppm/t的熱膨脹 係數值,且當其在25至90°C間測量時,其具有10-42 ppm/ °C的熱膨脹係數值。 29·如申請專利範圍第28項之可撓電子電路板,其中該聚酯 具有至少270 °C的熔點及0.4至1.2的特性黏度(根據 AS TM方法D2 8 5 7-95,在25 °C下,使用每100毫升的溶劑 (其由60重量百分比的酴及40重量百分比的四氯乙燒所 組成)含0·50克之聚合物來測量),且包含·· (1) 二酸殘基,其包含至少97莫耳百分比的對献酸殘基 、茶二羧酸殘基或其組合;及 (2) 二醇殘基,其包含至少97莫耳百分比的1,4-環己環二 甲醇殘基。 3 0 ·如申請專利範圍第2 8項之可撓電子電路板,其包含一或 多種層合物,其中該層合物中至少一種依序包含: I. 一銅層; 86584-940707.doc 1251005 II. 一可熱硬化的黏著劑;及 III. 該雙向拉伸及熱定型聚酯薄膜。 86584-940707.doca ruthenium dicarboxylic acid residue or a combination thereof; and (2) a diol residue comprising at least 9 mole percent of ruthenium, 4 - cyclohexane methanol residue; in the machine wherein the polyester film is at 90 The stretching ratio of the universal direction (MD) at a stretching temperature between ° C and 110 ° C is 2·5 Χ to 3 χ, and in the horizontal axis direction (d), the stretching ratio is 2·5 Χ to 3X; Wherein the stretched film is heat set at a continuous film temperature of from 260 C to Tm (wherein Tm is a melting point determined by differential scanning calorimetry (DSC)) The size of the stretched film is maintained. 26. The flexible electronic circuit board of claim 25, wherein the polyester has a melting point of less than 270 C and an intrinsic viscosity of 0.4 to 1 _2 (according to ASTM method D2857-95, used at 25 ° C) Each 1 ml of solvent (which consists of 60 weight percent of 40 weight percent tetrachloroethane) containing 0.50 grams of polymer is measured) and comprises: (1) a diacid residue 'which contains at least 97 mole percent para-acid residues, hydrazine dicarboxylic acid residues or combinations thereof; and (2) diol residues comprising at least 97 mole percent hydrazine, 4-cyclohexane dimethanol residue. The flexible electronic circuit board of claim 25, comprising one or more laminates, wherein at least one of the laminates comprises: I. a copper layer; a heat-curable adhesive; and a biaxially stretched and heat-set polyester film. 28. The flexible electronic circuit board of claim 25, wherein the biaxially stretched and heat set polyester film is immersed in a solder bath preheated to 26 〇〇c for 10 seconds, Will experience no more than 3% shrinkage, and when measured between 120 and 150 ° C, it has a coefficient of thermal expansion coefficient of i 〇 85 ppm / t, and when it is measured between 25 and 90 ° C, It has a coefficient of thermal expansion coefficient of 10-42 ppm/ °C. 29. The flexible electronic circuit board of claim 28, wherein the polyester has a melting point of at least 270 ° C and an intrinsic viscosity of 0.4 to 1.2 (according to the AS TM method D2 8 5 7-95 at 25 ° C Next, using 100 ml of solvent (which consists of 60% by weight of ruthenium and 40% by weight of tetrachloroethylene) containing 0.50 g of polymer, and containing (1) diacid residues , comprising at least 97 mole percent of a donating acid residue, a tea dicarboxylic acid residue or a combination thereof; and (2) a diol residue comprising at least 97 mole percent of 1,4-cyclohexyl Methanol residue. The flexible electronic circuit board of claim 28, comprising one or more laminates, wherein at least one of the laminates comprises: I. a copper layer; 86584-940707.doc 1251005 II. A heat-curable adhesive; and III. The biaxially oriented and heat-set polyester film. 86584-940707.doc
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