CN1486341A - 聚芳基酮树脂薄膜及其金属积层板 - Google Patents

聚芳基酮树脂薄膜及其金属积层板 Download PDF

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Publication number
CN1486341A
CN1486341A CNA028038363A CN02803836A CN1486341A CN 1486341 A CN1486341 A CN 1486341A CN A028038363 A CNA028038363 A CN A028038363A CN 02803836 A CN02803836 A CN 02803836A CN 1486341 A CN1486341 A CN 1486341A
Authority
CN
China
Prior art keywords
film
resin
crystallization
peak temperature
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA028038363A
Other languages
English (en)
Chinese (zh)
Inventor
谷口浩一郎
月
山田绅月
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Chemical Corp
Original Assignee
Mitsubishi Plastics Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Plastics Industries Ltd filed Critical Mitsubishi Plastics Industries Ltd
Publication of CN1486341A publication Critical patent/CN1486341A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31725—Of polyamide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
CNA028038363A 2001-01-22 2002-01-21 聚芳基酮树脂薄膜及其金属积层板 Pending CN1486341A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001013139A JP4073631B2 (ja) 2001-01-22 2001-01-22 ポリアリールケトン系樹脂フィルム及びそれを用いてなる金属積層体
JP13139/2001 2001-01-22

Publications (1)

Publication Number Publication Date
CN1486341A true CN1486341A (zh) 2004-03-31

Family

ID=18880048

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA028038363A Pending CN1486341A (zh) 2001-01-22 2002-01-21 聚芳基酮树脂薄膜及其金属积层板

Country Status (8)

Country Link
US (1) US7033675B2 (https=)
EP (1) EP1369450B1 (https=)
JP (1) JP4073631B2 (https=)
KR (1) KR100823403B1 (https=)
CN (1) CN1486341A (https=)
DE (1) DE60237676D1 (https=)
TW (1) TWI251604B (https=)
WO (1) WO2002057343A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104796843A (zh) * 2015-03-31 2015-07-22 歌尔声学股份有限公司 结晶peek膜和振膜的形成方法以及结晶peek振膜
CN113784838A (zh) * 2019-04-19 2021-12-10 信越聚合物株式会社 树脂膜、高频电路基板及其制造方法

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004015011A1 (ja) * 2002-08-07 2004-02-19 Mitsubishi Plastics, Inc. 耐熱性フィルムおよびその金属積層体
JP2004123852A (ja) * 2002-10-01 2004-04-22 Sumitomo Bakelite Co Ltd 芳香族樹脂組成物並びにフィルム及びシート
JP4599793B2 (ja) * 2002-11-22 2010-12-15 住友ベークライト株式会社 Ｔａｂ生産工程用スペーステープ
JP4849762B2 (ja) * 2002-12-02 2012-01-11 住友ベークライト株式会社 芳香族系樹脂組成物、耐熱性シート及びフレキシブル回路基板補強用シート
US7549220B2 (en) * 2003-12-17 2009-06-23 World Properties, Inc. Method for making a multilayer circuit
JP2005330377A (ja) * 2004-05-20 2005-12-02 Mitsubishi Plastics Ind Ltd 熱可塑性樹脂フィルム及びその製造方法
JP2006044224A (ja) * 2004-07-09 2006-02-16 Mitsubishi Plastics Ind Ltd 積層体
JP4701735B2 (ja) * 2004-07-09 2011-06-15 株式会社豊田自動織機 摺動部材
KR100874080B1 (ko) 2005-01-31 2008-12-12 미쓰비시 쥬시 가부시끼가이샤 내열성 필름과 이의 금속 적층체
JP4934334B2 (ja) * 2006-03-20 2012-05-16 三菱樹脂株式会社 両面銅張板
JP2009302110A (ja) * 2008-06-10 2009-12-24 Mitsubishi Plastics Inc カバーレイフィルム
JP5237892B2 (ja) * 2009-06-29 2013-07-17 住友化学株式会社 積層体の製造方法、積層体およびｓｕｓ基板
JP5732934B2 (ja) * 2010-03-16 2015-06-10 東レ株式会社 Ｐｐｓ積層フィルム
US8618350B2 (en) 2011-02-14 2013-12-31 The Procter & Gamble Company Absorbent articles with tear resistant film
CN103503582B (zh) * 2011-04-28 2017-07-18 株式会社钟化 补强板一体型挠性印刷基板
US20140087617A1 (en) * 2012-09-27 2014-03-27 Rogers Corporation Aluminum poly(aryl ether ketone) laminate, methods of manufacture thereof, and articles comprising the same
WO2017115779A1 (ja) * 2015-12-28 2017-07-06 日本ゼオン株式会社 光学積層体及びその製造方法、偏光板及び表示装置
JP2019016782A (ja) * 2017-07-03 2019-01-31 信越ポリマー株式会社 電磁波シールドフィルム及びその製造方法、並びに電磁波シールドフィルム付きプリント配線板及びその製造方法
KR20210089704A (ko) 2018-11-08 2021-07-16 에스에이치피피 글로벌 테크놀러지스 비.브이. 열가소성 조성물, 전기 와이어 및 전기 와이어를 포함하는 물품
EP4130106A4 (en) * 2020-03-24 2023-12-13 Mitsubishi Chemical Corporation Fiber-reinforced composite material and bonded body
EP4299654A4 (en) * 2021-02-25 2024-11-27 Mitsubishi Chemical Corporation PREPREG AND PROCESS FOR PRODUCING SAME, AND MOLDED OBJECT

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0209546B1 (en) * 1985-01-04 1990-10-03 RAYCHEM CORPORATION (a Delaware corporation) Aromatic polymer compositions
JPS62149436A (ja) 1985-12-25 1987-07-03 住友ベークライト株式会社 耐熱性複合フイルム
JPH0320354A (ja) 1989-03-08 1991-01-29 Mitsui Toatsu Chem Inc 金属基板用フィルム
JP3355142B2 (ja) * 1998-01-21 2002-12-09 三菱樹脂株式会社 耐熱性積層体用フィルムとこれを用いたプリント配線基板用素板および基板の製造方法
JP3514646B2 (ja) * 1999-01-05 2004-03-31 三菱樹脂株式会社 フレキシブルプリント配線基板およびその製造方法
JP4201965B2 (ja) 2000-08-10 2008-12-24 三菱樹脂株式会社 耐熱性樹脂組成物及びこれよりなる耐熱性フィルムまたはシート並びにこれを基材とする積層板
JP4234896B2 (ja) * 2000-10-04 2009-03-04 三菱樹脂株式会社 耐熱性フィルム及びこれを基材とするプリント配線基板並びにこれらの製造方法
JP2003064202A (ja) * 2001-08-24 2003-03-05 Unitika Ltd 手切れ性に優れたポリエステルフィルムおよびその製造法
JP4294916B2 (ja) * 2002-06-21 2009-07-15 ユニチカ株式会社 易裂き性フィルム

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104796843A (zh) * 2015-03-31 2015-07-22 歌尔声学股份有限公司 结晶peek膜和振膜的形成方法以及结晶peek振膜
CN113784838A (zh) * 2019-04-19 2021-12-10 信越聚合物株式会社 树脂膜、高频电路基板及其制造方法

Also Published As

Publication number Publication date
TWI251604B (en) 2006-03-21
EP1369450A1 (en) 2003-12-10
EP1369450A4 (en) 2004-08-25
US7033675B2 (en) 2006-04-25
US20040096678A1 (en) 2004-05-20
WO2002057343A1 (fr) 2002-07-25
DE60237676D1 (de) 2010-10-28
JP2002212314A (ja) 2002-07-31
KR20030071840A (ko) 2003-09-06
EP1369450B1 (en) 2010-09-15
KR100823403B1 (ko) 2008-04-17
JP4073631B2 (ja) 2008-04-09

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