KR100823403B1 - 폴리아릴케톤수지 필름과 그 금속적층체 - Google Patents

폴리아릴케톤수지 필름과 그 금속적층체 Download PDF

Info

Publication number
KR100823403B1
KR100823403B1 KR1020037009625A KR20037009625A KR100823403B1 KR 100823403 B1 KR100823403 B1 KR 100823403B1 KR 1020037009625 A KR1020037009625 A KR 1020037009625A KR 20037009625 A KR20037009625 A KR 20037009625A KR 100823403 B1 KR100823403 B1 KR 100823403B1
Authority
KR
South Korea
Prior art keywords
film
resin
weight
metal
crystallization
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020037009625A
Other languages
English (en)
Korean (ko)
Other versions
KR20030071840A (ko
Inventor
다니구치고이치로
야마다신게츠
Original Assignee
미쓰비시 쥬시 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미쓰비시 쥬시 가부시끼가이샤 filed Critical 미쓰비시 쥬시 가부시끼가이샤
Publication of KR20030071840A publication Critical patent/KR20030071840A/ko
Application granted granted Critical
Publication of KR100823403B1 publication Critical patent/KR100823403B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31725—Of polyamide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
KR1020037009625A 2001-01-22 2002-01-21 폴리아릴케톤수지 필름과 그 금속적층체 Expired - Fee Related KR100823403B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001013139A JP4073631B2 (ja) 2001-01-22 2001-01-22 ポリアリールケトン系樹脂フィルム及びそれを用いてなる金属積層体
JPJP-P-2001-00013139 2001-01-22
PCT/JP2002/000392 WO2002057343A1 (fr) 2001-01-22 2002-01-21 Film en resine polyarylcetone et stratifies dudit film comportant du metal

Publications (2)

Publication Number Publication Date
KR20030071840A KR20030071840A (ko) 2003-09-06
KR100823403B1 true KR100823403B1 (ko) 2008-04-17

Family

ID=18880048

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020037009625A Expired - Fee Related KR100823403B1 (ko) 2001-01-22 2002-01-21 폴리아릴케톤수지 필름과 그 금속적층체

Country Status (8)

Country Link
US (1) US7033675B2 (https=)
EP (1) EP1369450B1 (https=)
JP (1) JP4073631B2 (https=)
KR (1) KR100823403B1 (https=)
CN (1) CN1486341A (https=)
DE (1) DE60237676D1 (https=)
TW (1) TWI251604B (https=)
WO (1) WO2002057343A1 (https=)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004015011A1 (ja) * 2002-08-07 2004-02-19 Mitsubishi Plastics, Inc. 耐熱性フィルムおよびその金属積層体
JP2004123852A (ja) * 2002-10-01 2004-04-22 Sumitomo Bakelite Co Ltd 芳香族樹脂組成物並びにフィルム及びシート
JP4599793B2 (ja) * 2002-11-22 2010-12-15 住友ベークライト株式会社 Ｔａｂ生産工程用スペーステープ
JP4849762B2 (ja) * 2002-12-02 2012-01-11 住友ベークライト株式会社 芳香族系樹脂組成物、耐熱性シート及びフレキシブル回路基板補強用シート
US7549220B2 (en) * 2003-12-17 2009-06-23 World Properties, Inc. Method for making a multilayer circuit
JP2005330377A (ja) * 2004-05-20 2005-12-02 Mitsubishi Plastics Ind Ltd 熱可塑性樹脂フィルム及びその製造方法
JP2006044224A (ja) * 2004-07-09 2006-02-16 Mitsubishi Plastics Ind Ltd 積層体
JP4701735B2 (ja) * 2004-07-09 2011-06-15 株式会社豊田自動織機 摺動部材
KR100874080B1 (ko) 2005-01-31 2008-12-12 미쓰비시 쥬시 가부시끼가이샤 내열성 필름과 이의 금속 적층체
JP4934334B2 (ja) * 2006-03-20 2012-05-16 三菱樹脂株式会社 両面銅張板
JP2009302110A (ja) * 2008-06-10 2009-12-24 Mitsubishi Plastics Inc カバーレイフィルム
JP5237892B2 (ja) * 2009-06-29 2013-07-17 住友化学株式会社 積層体の製造方法、積層体およびｓｕｓ基板
JP5732934B2 (ja) * 2010-03-16 2015-06-10 東レ株式会社 Ｐｐｓ積層フィルム
US8618350B2 (en) 2011-02-14 2013-12-31 The Procter & Gamble Company Absorbent articles with tear resistant film
CN103503582B (zh) * 2011-04-28 2017-07-18 株式会社钟化 补强板一体型挠性印刷基板
US20140087617A1 (en) * 2012-09-27 2014-03-27 Rogers Corporation Aluminum poly(aryl ether ketone) laminate, methods of manufacture thereof, and articles comprising the same
CN104796843A (zh) * 2015-03-31 2015-07-22 歌尔声学股份有限公司 结晶peek膜和振膜的形成方法以及结晶peek振膜
WO2017115779A1 (ja) * 2015-12-28 2017-07-06 日本ゼオン株式会社 光学積層体及びその製造方法、偏光板及び表示装置
JP2019016782A (ja) * 2017-07-03 2019-01-31 信越ポリマー株式会社 電磁波シールドフィルム及びその製造方法、並びに電磁波シールドフィルム付きプリント配線板及びその製造方法
KR20210089704A (ko) 2018-11-08 2021-07-16 에스에이치피피 글로벌 테크놀러지스 비.브이. 열가소성 조성물, 전기 와이어 및 전기 와이어를 포함하는 물품
KR20220005466A (ko) * 2019-04-19 2022-01-13 신에츠 폴리머 가부시키가이샤 수지 필름, 고주파 회로 기판 및 그 제조 방법
EP4130106A4 (en) * 2020-03-24 2023-12-13 Mitsubishi Chemical Corporation Fiber-reinforced composite material and bonded body
EP4299654A4 (en) * 2021-02-25 2024-11-27 Mitsubishi Chemical Corporation PREPREG AND PROCESS FOR PRODUCING SAME, AND MOLDED OBJECT

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1986004073A1 (en) 1985-01-04 1986-07-17 Raychem Corporation Aromatic polymer compositions
WO1999037704A1 (en) 1998-01-21 1999-07-29 Mitsubishi Plastics, Inc. Heat-resistant insulating film, raw substrate for printed wiring board using the same and method for producing the substrate
JP2000200950A (ja) * 1999-01-05 2000-07-18 Mitsubishi Plastics Ind Ltd フレキシブルプリント配線基板およびその製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62149436A (ja) 1985-12-25 1987-07-03 住友ベークライト株式会社 耐熱性複合フイルム
JPH0320354A (ja) 1989-03-08 1991-01-29 Mitsui Toatsu Chem Inc 金属基板用フィルム
JP4201965B2 (ja) 2000-08-10 2008-12-24 三菱樹脂株式会社 耐熱性樹脂組成物及びこれよりなる耐熱性フィルムまたはシート並びにこれを基材とする積層板
JP4234896B2 (ja) * 2000-10-04 2009-03-04 三菱樹脂株式会社 耐熱性フィルム及びこれを基材とするプリント配線基板並びにこれらの製造方法
JP2003064202A (ja) * 2001-08-24 2003-03-05 Unitika Ltd 手切れ性に優れたポリエステルフィルムおよびその製造法
JP4294916B2 (ja) * 2002-06-21 2009-07-15 ユニチカ株式会社 易裂き性フィルム

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1986004073A1 (en) 1985-01-04 1986-07-17 Raychem Corporation Aromatic polymer compositions
WO1999037704A1 (en) 1998-01-21 1999-07-29 Mitsubishi Plastics, Inc. Heat-resistant insulating film, raw substrate for printed wiring board using the same and method for producing the substrate
JP2000200950A (ja) * 1999-01-05 2000-07-18 Mitsubishi Plastics Ind Ltd フレキシブルプリント配線基板およびその製造方法

Also Published As

Publication number Publication date
TWI251604B (en) 2006-03-21
EP1369450A1 (en) 2003-12-10
EP1369450A4 (en) 2004-08-25
US7033675B2 (en) 2006-04-25
US20040096678A1 (en) 2004-05-20
WO2002057343A1 (fr) 2002-07-25
DE60237676D1 (de) 2010-10-28
JP2002212314A (ja) 2002-07-31
CN1486341A (zh) 2004-03-31
KR20030071840A (ko) 2003-09-06
EP1369450B1 (en) 2010-09-15
JP4073631B2 (ja) 2008-04-09

Similar Documents

Publication Publication Date Title
KR100823403B1 (ko) 폴리아릴케톤수지 필름과 그 금속적층체
KR100747402B1 (ko) 내열성 수지 조성물, 이의 내열성 필름 또는 시트, 및 기재로서 상기 필름 또는 시트를 포함하는 적층판
US6228467B1 (en) Heat-resistant insulating film, raw substrate for printed wiring board using the same and method for producing the substrate
KR101494936B1 (ko) 금속박 적층 폴리이미드 수지 기판
JP4234896B2 (ja) 耐熱性フィルム及びこれを基材とするプリント配線基板並びにこれらの製造方法
US7498086B2 (en) Heat resistant film and metal laminate thereof
JP4094211B2 (ja) 金属箔積層板の製造方法
JP3714876B2 (ja) 耐熱性フィルム
JP7708694B2 (ja) 積層板及びその製造方法
JP3803241B2 (ja) 耐熱性樹脂成形体と金属体との接合方法及びその接合体
JP3766263B2 (ja) 耐熱性フィルム及びこれを基材とするフレキシブルプリント配線基板
KR100874080B1 (ko) 내열성 필름과 이의 금속 적층체
JP2003053921A (ja) ポリイミド系積層フィルム及びそれを用いてなる金属積層体並びに金属積層体の製造方法
JP7780545B2 (ja) 積層体、及び該積層体を有する金属張積層板
JP2006249443A (ja) ポリアリールケトン系樹脂フィルム
HK1062023A (en) Polyaryl ketone resin film and laminates thereof with metal

Legal Events

Date Code Title Description
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

FPAY Annual fee payment

Payment date: 20120322

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20130412

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20130412

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000