TWI227911B - Anisotropically conductive adhesive, mounting method, electro-optical device module, and electronic device - Google Patents

Anisotropically conductive adhesive, mounting method, electro-optical device module, and electronic device Download PDF

Info

Publication number
TWI227911B
TWI227911B TW093111272A TW93111272A TWI227911B TW I227911 B TWI227911 B TW I227911B TW 093111272 A TW093111272 A TW 093111272A TW 93111272 A TW93111272 A TW 93111272A TW I227911 B TWI227911 B TW I227911B
Authority
TW
Taiwan
Prior art keywords
mounting
substance
conductive adhesive
anisotropic conductive
pair
Prior art date
Application number
TW093111272A
Other languages
English (en)
Other versions
TW200425250A (en
Inventor
Atsushi Saito
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of TW200425250A publication Critical patent/TW200425250A/zh
Application granted granted Critical
Publication of TWI227911B publication Critical patent/TWI227911B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04026—Bonding areas specifically adapted for layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0556—Disposition
    • H01L2224/05568—Disposition the whole external layer protruding from the surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05573—Single external layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29199—Material of the matrix
    • H01L2224/2929—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29299—Base material
    • H01L2224/2939—Base material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29399—Coating material
    • H01L2224/294—Coating material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29399—Coating material
    • H01L2224/29494—Coating material with a principal constituent of the material being a liquid not provided for in groups H01L2224/294 - H01L2224/29491
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8119—Arrangement of the bump connectors prior to mounting
    • H01L2224/81193—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83193—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01049—Indium [In]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/0665—Epoxy resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0224—Conductive particles having an insulating coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1163—Chemical reaction, e.g. heating solder by exothermic reaction
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/256—Heavy metal or aluminum or compound thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2857—Adhesive compositions including metal or compound thereof or natural rubber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2984—Microcapsule with fluid core [includes liposome]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2984—Microcapsule with fluid core [includes liposome]
    • Y10T428/2985—Solid-walled microcapsule from synthetic polymer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991—Coated
    • Y10T428/2998—Coated including synthetic resin or polymer

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Liquid Crystal (AREA)
  • Combinations Of Printed Boards (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Description

1227911 (1) 玖、發明說明 【發明所屬之技術領域】 本發明係，有關向異導電性接著劑、實裝方法、電氣 光學裝置模組及電子機器。 【先前技術】 iC等之電子零件係，被實裝於電路基板等而使用。 有關實裝此電子零件於電路基板的方法，被提案出各種各 樣的方法。在第6圖，圖示有關先前技術的實裝方法之說 明圖。在第6圖係，挾持向異導電性薄膜（a C F ) 1 9 0， 實裝I C 1 7 0於基板1 2 0。向異導電性薄膜1 9 0係，分散導 電性粒子1 95在熱固性樹脂1 92。此導電性粒子1 95爲， 進入形成於1C 170之能動面的電極接合點172、與形成於 基板1 2 0之表面的電極接合點1 2 2之間，電氣的連接兩 者。而且，由加熱硬化的熱固性樹脂1 9 2，機械的連接電 子零件170與基板120，同時保護電子零件170與基板 120之電氣的連接部。 【曰本特許文獻1】 曰本特許第2623 762號公報 【曰本特許文獻2】 曰本特開2001-176924號公報 【發明內容】 然而，一般I C 1 7 0與基板1 2 0係線膨脹係數相異。例 (2) 1227911 如：構成IC170的矽之線膨脹係數爲4.15ppm/K，構成基板 120的聚醯亞胺樹脂之線膨脹係數爲20〜60ppm/K。因 而，在加熱向異導電性薄膜190而使其硬化時，基板120 側比I C 1 7 0之膨脹大。由此，在I C 1 7 0之電極接合點1 7 2 的位置與基板120之電極接合點122的位置偏移的狀態 下，兩者有接合之虞。由此，有IC170與基板120之電氣 的連接變爲不可能的問題。尙且在近年，隨著電子零件之 小型化，硏討電極之狹間距化。但是，上述電極接合點之 位置偏移的問題係，成爲阻礙電極之狹間距化的主要原 因。 而且，在液晶顯示裝置模組係，與上述同樣的實裝 1C於可撓性基板，更通過向異導電性薄膜而實裝可撓性 基板於液晶顯示裝置之玻璃基板。一般而言，玻璃基板之 線膨脹係數係，因爲與可撓性基板相異，在兩者實裝的場 合亦有發生與上述相同的電極間之位置偏移之虞。而且， 可撓性基板與液晶面板之實裝面積大，電極間之位置偏移 容易變大。 尙且，在日本特許文獻1及日本特許文獻2係，開示 在向異導電性接著劑混入微膠囊8 〇的構成。日本特許文 獻1係，壓潰封入了硬化劑的微膠囊而使接著劑硬化，但 雖然被壓潰了的微膠囊80之近邊的接著劑硬化，但是其 他之部份之接著劑不硬化。而且，日本特許文獻2係，壓 潰封入了反應發熱材料的微膠囊而加熱接著劑、使其硬 化，但形成如此大的微膠囊是困難的。 -5- (3) (3)1227911 本發明係爲，爲了解決上述課題，目的爲提供：可確 實的電氣的連接實裝零件的向異導電性接著劑、實裝方 法、電氣光學裝置模組及電子機器。 爲了達成上述目的，有關本發明的向異導電性接著劑 係，由第1物質與第2物質反應而硬化，含有導電性粒子 的向異導電性接著劑，其特徵爲：構成封入前述第1物質 和前述導電性粒子的可壓潰的微膠囊，分散該微膠囊於前 述第2物質。 而且有關本發明的其他向異導電性接著劑係，由第1物質 與第2物質反應而硬化，含有導電性粒子的向異導電性接 著劑，其特徵爲：爲在前述導電性粒子固著封入了前述第1 物質之可壓潰的微膠囊，固著該微膠囊的前述導電性粒子 爲被分散於前述第2物質。 尙且，前述第1物質係，胺、咪唑、酸酐或酚之任一 或其之混合物，前述第2物質係未硬化的環氧樹脂爲最 佳。而且前述第1物質係未硬化的環氧樹脂，前述第2物 質係胺、咪唑、酸酐或酚之任一或其之混合物亦可。 通過如此地構成的向異導電性接著劑而如實裝一對之 實裝零件，在於各實裝零件的實裝用導電體之間，挾入微 膠囊而壓潰。由此，由微膠囊第1物質流出至第2物質 中，於被挾入至各實裝用導電體之間的導電性粒子之周 圍，兩者在常溫或1 〇〇°C以下之低溫（於以下記爲熱塑性 之微膠囊之膠囊壁不可塑化的溫度）反應而硬化。由此’ 因爲不伴隨加熱而接著劑之硬化速度快、可接合各實裝用 -6- (4) (4)1227911 導電體，即使一對之實裝零件的線膨脹係數相異，各實裝 用導電體之位置也不產生偏移。因而，可確實的電氣的連 接一對之實裝零件。 而且，前述微膠囊之膠囊壁係，最好由熱塑性樹脂形 成。而且，由加熱與前述第2物質反應而硬化的第3物質 爲，最好被混合於前述第2物質。 在通過上述地構成的向異導電性接著劑而實裝一對之 實裝零件時，在上述地各實裝用導電體之間係接著劑硬 化，但在其他之部分接著劑不硬化。此點，在如本發明構 成了的向異導電性接著劑係，經由加熱，膠囊壁爲可塑 化，而第1物質流出至第2物質，兩者反應而向異導電性 接著劑全體硬化。而且由加熱，第2物質與第3物質進行 反應，而向異導電性接著劑之全體硬化。由此，可機械的 連接一對之實裝零件。 一方面，有關本發明的實裝方法係，在一對之實裝部 品之實裝面，其特徵爲：具有塗佈上述的向異導電性接著 劑的工程、和由相互加壓前述一對之實裝零件，在於前述 一對之實裝零件的實裝用導電體之間使前述微膠囊壓潰， 在前述實裝用導電體之間挾入前述導電性粒子，相互接合 前述各實裝用導電體的工程。 若由此構成，由壓潰了的微膠囊流出第1物質至第2 物質中，於被挾入至各實裝用導電體之間的導電性粒子之 周圍’兩者在常溫或1 〇 0 °C以下之低溫反應而硬化。由 此，因爲可不伴隨加熱而接合各實裝用導電體，即使一對 (5) 1227911 之實裝零件的線膨脹係數相異’各實裝用導電體之 不產生偏移。因而，可確實的電氣的連接一對之 件。 而且，有關本發明的其他之實裝方法係，在一 裝部品之實裝面，其特徵爲：具有塗佈上述的向異 接著劑的工程、和由相互加壓前述一對之實裝零件 前述一對之實裝零件的實裝用導電體之間使前述微 潰，在前述實裝用導電體之間挾入前述導電性粒子 接合前述各實裝用導電體的工程、和由加熱前述向 性接著劑而使其硬化，相互的接合前述一對之實裝 工程。 在電氣的連接一對之實裝零件後，由加熱向異 接著劑，第2物質及第1物質或第2物質及第3物 反應，而向異導電性接著劑之全體硬化。由此，可 連接一對之實裝零件。尙且，因爲各實裝用導電體 被接合，即使加熱也不產生各實裝用導電體之位置 因而，可確實的電氣的連接一對之實裝零件。 一方面，有關本發明的電氣光學裝置模組係， 述的實裝方法而形成的電氣光學裝置模組，其特徵 述一對的實裝零件之中的一方的實裝零件係，構成 複數的顯示元件的電氣光學裝置的基板；前述一對 零件之中的另一方的實裝零件係，實裝前述各顯示 驅動用元件的基板。 一般而言，在實裝構成電氣光學裝置的基板和 位置也 實裝零 對之實 導電性 ，在於 膠囊壓 ，相互 異導電 零件的 導電性 質進行 機械的 係已經 偏移。 使用上 爲：前 具備有 的實裝 元件的 被實裝 -8 - (6) (6)1227911 驅動用元件的基板的場合係，因爲實裝面積變大而容易產 生實裝用導電體之位置偏移。即使在此場合，由使用上述 的實裝方法，也不產生實裝用導電體之位置偏移。因而， 可確實的電氣的連接兩基板。 一方面，有關本發明的電子機器係，以使用上述的實 裝方法而形成爲特徵。由此，可提供帶有上述效果的電子 機器。 【實施方式】 以下，關於本發明之實施形態，參照圖面而說明。尙 且，在用於以下之說明的各圖面係，爲了以各部材可認識 的大小，適宜的變更各部材之比例尺。 [液晶顯示裝置模組] 首先，有關關於本發明的電氣光學裝置模組之實施形 態的液晶顯示裝置模組，用第2圖及第3圖而說明。尙 且’第2圖爲液晶顯示裝置模組之分解斜視圖，第3圖爲 於第2圖之A-A線的側面斷面圖。液晶顯示裝置模組 係’主要以液晶顯不裝置1、和貫裝在該液晶顯不裝置1 的可撓性基板60、和實裝於該可撓性基板60的驅動用 IC40構成。尙且，在本實施形態以被動矩陣型之液晶顯 示裝置1爲例而說明，但亦可適用本發明於主動矩陣型之 液晶顯示裝置。而且，在第2圖及第3圖係模式的圖示液 晶顯不裝置，在實際之液晶顯不裝置形成更多的電極和端 -9- (7) (7)1227911 子。 如第2圖所示，在液晶顯示裝置1係，對向配置著由 玻璃等之透明材料構成的一對之下部基板1 0及上部基板 2 0。兩基板1 〇、2 0之間隔係，由配置在這些之間的泡狀 (b e ad s )襯墊之直徑而被規範，例如被保持在5 // m的範 圍。而且，兩基板10、20係，由自熱硬化型和紫外線硬 化基等之接著劑構成的密封材3 0，接合周緣部。在該密 封材3 0之一部中，設置著由兩基板1 〇、2 0突出至外側的 液晶注入口。然後，在由液晶注入口 3 2注入液晶至由兩 基板10、20和密封材30包圍的空間後，液晶注入口 32 由封止材3 1封止。 而且，在下部基板1 〇之下側配置係配置射入側偏光 板1 8，在上部基板20之上側配置射出側偏光板28。尙 且，射入側偏光板1 8及射出側偏光板2 8係，以各個之偏 光軸（透過軸）偏轉90 °的狀態被配置。而且，在射入側 偏光板1 8之下側係，配置背光裝置2。然後，若由背光 裝置2之光入射至射入側偏光板1 8，則僅沿著射入側偏 光板1 8之偏光軸的直線偏光透過射入側偏光板1 8。透過 了射入側偏光板1 8的直線偏光係，在透過由兩基板1 〇、 2 0而挾持的液晶層的過程，隨液晶分子的配向狀態回 轉。更且，透過了液晶層的直線偏光係，僅在其偏光軸與 射出側偏光板2 8之偏光軸一致的場合，透過射出側偏光 板28 。由透過了此射出側偏光板28的直線偏光構成影 像 -10- (8) (8)1227911 一方面，在上部基板20之內面係，由ιτο等之透明 導電材料構成的掃描電極22被形成至條紋狀。一方面， 在下部基板1 0之內面係’由ΙΤ0等之透明導電材料構成 的訊號電極1 2被形成至條紋狀。尙且掃描電極22及訊號 電極1 2係直交地被配置，該交點附近成爲液晶顯示裝置 之像素領域。然後，若供給掃描訊號至一掃描電極22、 供給資料訊號至一訊號電極1 2，則於兩電極1 2、2 2之交 點施加電壓至被挾持於兩電極12、22的液晶層。在此， 按照被施加的電壓水平（Level )控制液晶分子之配向狀 態。由此，由控制入射了液晶層的直線偏光之回轉角度， 而實施由液晶顯示裝置1的影像顯示。 第3圖爲，於第2圖之A-A線的側面斷面圖。在上 部基板20之內面的各像素領域係，形成紅（R )、綠 (G)、及藍（B)之彩色濾光層24r、24g、24b。由此， 在由液晶顯示裝置1的彩色影像之顯示變爲可能。尙且在 各彩色濾光層24r、24g、24b之間形成遮光膜25，防止 由鄰接的像素領域之光之洩漏。而且，在各彩色濾光層 2 4r、24g、24b之表面形成掃描電極22、在掃描電極22 之表面形成配向膜26。 一方面，在下部基板1 0之上側係，形成訊號電極 12。而且，在訊號電極12之表面形成被覆膜15’在被覆 膜1 5之表面形成液晶分子之配向膜1 6，由此配向膜1 6 ’ 規範於電壓無施加時的液晶分子之配向狀態。尙且’上部 基板20之配向膜26的液晶分子之配向方向、和由下部基 • 11 - (9) (9)1227911 板1 〇之配向膜1 6的液晶分子之配向方向爲，90 °偏轉地 形成各配向膜16、26。 在此，下部基板10爲向上部基板20的側邊突出而形 成，在此突出部11延長形成各訊號電極12。在該突出部 1 1之頂端係，通過有關本發明的向異導電性接著劑，而 實裝可燒性印刷電路板（Flexible Printed Circuit，以下 稱爲FPC ) 60之一方端部。尙且，在FPC60之一方端部 之下面係，形成對應了下部基板1 0之各訊號電極1 2的連 接電極62。然後，由通過有關本發明的向異導電性接著 劑71，FPC 60之連接電極62對下部基板1〇之各訊號電 極1 2電氣的連接。 而且，在FPC60之他方端部的下面係，形成爲了連 接FPC60至其他的電路基板的連接電極68。這些連接電 極62、68係，由貫穿FPC 60表裏的貫穿電極，引領至 FPC60之上面。然後，在FPC60的上面，通過有關本發 明的向異導電性接著劑7 0，實裝驅動用IC 4 0。由此驅動 用IC40，按照上述的其他之電路基板，驅動各訊號電極 12 ° [向異導電性接著劑] 接著，有關本發明的向異導電性接著劑，用第4圖而 說明。第4 ( a )圖係，被分散至向異導電性接著劑的微 膠囊的斷面圖。有關本發明的向異導電性接著劑係，在常 溫或1 0 0 °C以下之低溫反應而硬化的一對液狀體之中，封 -12- (10) 1227911 入第1液狀體至微膠囊80，而使其分散 作爲此第2液狀體，例如可使用未硬化 且，作爲第1液狀體，可使用胺和咪唑、 一或其之混合物。這些物質係，有助於第 樹脂之主鏈之架橋。 特別是，在使用了胺的場合，因爲在 脂反應而硬化，可縮短在實裝需要的時間 換使用於第1液狀體、和使用於第2液狀 如第4(a)圖所示地，在微膠囊80 入導電性粒子8 1。此導電性粒子8 1係， 3.5〜5·0μπι範圍的樹脂球 82的表面，] 83。此鍍覆金屬83係，以下襯鍍Ni及上 然後，由此鍍覆金屬8 3授與導電性粒子 且，在導電性粒子8 1之周圍係，配置第 後，成爲以第1液狀體8 5被覆由施與了 | 脂球8 2構成的導電性粒子8 1的構成。然 81及第1液狀體85爲，由膠囊壁89更爲 在此膠囊壁8 9之壁材係，採用聚醯胺和 樹脂爲理想。 在膠囊壁89之壁材爲聚醯胺的場合 界面聚合法而形成微膠囊80也可。以界 先使芯物質分散在水中。接著，在此水中 原料物質溶解。接著，將此水溶液注入油 滴分散在油相中。然後，在此分散系，注 於第2液狀體。 的環氧樹脂。而 酸酐、酚等之任 2液狀體的環氧 短時間與環氧樹 。尙且，即使改 體的物質亦可。 之中心部係，封 例如在形成直徑 拖行了鍍覆金屬 :襯鍍Au構成。 8 1導電性。而 1液狀體85。最 度覆金屬8 3的樹 後，導電性粒子 被覆而封止。 丙烯等之熱塑性 係，例如若使用 面聚合法係，首 使聚醯胺之第1 相而攪拌，使水 入聚醯胺之第2 -13- (11) Ϊ227911 原料物質。於是，水滴內之第1原料物質與油相內之第2 原料物質之反應發生在水滴與油相之界面，包圍水滴地生 成聚醯胺而形成膠囊壁。由以上地，形成微膠囊80。尙 且，亦可進行改換水相與油相。 一方面，在膠囊壁89之壁材爲丙烯樹脂的場合係， 例如若由乾式混合法而形成微膠囊8 0也可。在乾式混合 法係’首先混合心物質、和此芯物質之1成範圍大小的丙 %樹脂粒子，同時施加機械力而壓縮丙嫌樹脂粒子。於 是’被覆芯物質之表面地附著丙烯樹脂粒子而形成膠囊壁 89。由以上地，形成微膠囊 80。尙且，由重覆上述工 程’即使2層3層的形成膠囊壁亦可。 尙且，在微膠囊80之形成係，即使在上述的界面聚 合法和乾式混合法以外，可使用in-site聚合法等之化學 方法、和噴霧乾燥法等之機械方法、液中乾燥法和凝聚作 用法等之物理化學方法等。 而且，在由有多孔的壁材形成膠囊壁後，在導電性粒子 8 1與膠囊壁8 9之間注入第1液狀體，而形成微膠囊8 〇 亦可。 然後，然後，將上述地構成的微膠囊8 0，分散於由 未硬化的環氧樹脂等構成的第2液狀體之內部，構成有關 本實施形態的向異導電性接著劑。施加於此，特別由100 °C以上之加熱與第2液狀體反應而硬化的第3液狀體，混 合至第2之液狀體爲理想。具體而言，在第2液狀體爲環 氧樹脂之場合係，使用咪唑和酸酐、酚等之任一或其之混 -14· (12) (12)1227911 合物。其之物質係，在常溫使其與環氧樹脂反應需要長時 間’但在加熱的場合可使其在短時間反應。 尙且，代替上述的微膠囊80，使在第4(b)圖所示 的構造體90分散於第2液狀體亦可。此構造體90係，在 與上述同樣的形成了的導電性粒子9 1之表面，使複數之 微膠囊94固著。此微膠囊94係，在由熱塑性樹脂構成了 的膠囊壁99之內部，封入第1液狀體95而構成。尙且， 微膠囊94之形成方法與上述相同。然後，膠囊壁99之表 面之一部被可塑化，而被固著於導電性粒子9 1之表面。 尙且，上述微膠囊80、94之膠囊壁89、99係，由熱 塑性樹脂以外之有機材料、和二氧化矽（S i 02 )等之無機 材料形成亦可。在此場合係，如上述，由加熱而與第2液 狀體反應而硬化的第3液狀體，混合至第2液狀體而形成 向異導電性接著劑。 [實裝方法] 接著，有關關於本實施形態的實裝方法，用第1圖而 說明。在本實施形態係，以作爲一對之實裝部品-實裝 IC4 0至FPC60的場合爲例而說明。第1圖係，於第3圖 的IC40之實裝部分之擴大圖。 首先，如第1 ( a )圖所示，將如上述地構成了的向 異導電性接著劑70，塗佈至FPC60的上面。尙且，在 IC4〇之能動面塗佈向異導電性接著劑70亦可。向異導電 性接著劑7 0係，在由環氧樹脂等構成了的第2液狀體 -15- (13) (13)1227911 75，使在第4(a)圖所示的微膠囊80分散。在此微膠囊 8 0係，被封入著導電性粒子8 1。而且，在導電性粒子8 1 與膠囊壁89之間係，封入由胺等構成的第1液狀體85。 此向異導電性接著劑 7 0之塗佈係，由狹縫塗佈法 (slit coating )而進行。狹縫塗佈法係，一邊由設置所定 間隔而開口至所定長度的狹縫（slit )使液狀體吐出、一 邊使狹縫移動向與其長邊方向直交的方向，而塗佈前述液 狀體至平面狀的方法。由此，對IC40與FPC60之實裝 面，可有效率的塗佈向異導電性接著劑7 0。 接著’如第 1 ( b )圖所示，在 FPC60之上方配置 IC40。在此，如對向配置在FPC60的上面形成的實裝用 導電體之電極接合點62、與在IC40的能動面形成之實裝 用導電體的電極接合點42，對準兩者的位置。尙且在 IC40之電極接合點42的表面形成了凸塊（bump )上，與 FPC60之電極接合點62對向配置亦可。然後，加壓IC40 至 FPC60。此壓力係，例如爲3 92MPa ( 40kgf/mm2 )範 圍。於是，被分散至向異導電性接著劑70的微膠囊80 爲’被挾在IC40之電極接合點42與FPC60電極接合點 62之間而壓潰，膠囊壁8 9裂開。由此，露出被封入了微 膠囊80的導電性粒子81，而被挾入IC40的電極接合點 42與FPC 60的電極接合點62之間。更且，被封入微膠囊 8 0的第1液狀體8 5流出，而且在導電性粒子81的周圍 流入第2液狀體75，而第1液狀體85與第2液狀體75 進行反應。由此，導電性粒子81的周圍硬化，而接合 -16- (14) (14)1227911 IC40的電極接合點42與FPC60之電極接合點62。由以 上地，電氣的連接IC40與FPC60。 更且，爲了機械的連接IC40與FPC60，如第4(c) 圖所示，一邊繼續上述的加壓、一邊加熱向異導電性接著 劑7 0。向異導電性接著劑7 0之加熱係，例如在2 5 (TC範 圍10秒間範圍進行。尙且，由加熱IC40或FPC60，間接 的加熱向異導電性接著劑7 0亦可。 在此，在IC40的電極接合點42與FPC60的電極接 合點62之間以外的部分係，殘存未被壓潰的微膠囊80。 而且，微膠囊8 0之膠囊壁8 9係，如上述地以熱塑性樹脂 形成。因此，如加熱向異導電性接著劑70，則殘存著的 微膠囊80的膠囊壁89爲可塑化。於是，封入膠囊壁89 內部的第1液狀體85流出，擴散至第2液狀體75，而第 1液狀體85與第2液狀體75反應而硬化。尙且因爲第1 液狀體85及第2液狀體75係在常溫反應而硬化，在被加 熱的場合亦當然反應而硬化。更且，在第2液狀體75混 合了第3液狀體的場合係，第2液狀體與第3液狀體反應 而硬化。 尙且，在由熱塑性樹脂以外之壁材而形成微膠囊80 的膠囊壁89的場合係，由加熱並不可塑化膠囊壁89。在 該替代，且因爲第2液狀體75混合第3液狀體’由加熱 而兩者反應，保持第1 ( b )圖的狀態硬化向異導電性接 著劑70。由以上地，硬化向異導電性接著劑的全體’而 機械的連接IC40與FPC60。 -17- (15) (15)1227911 如以上詳述地’在有關本實施形態的實裝方法係，加 壓1C與FPC，而使被包含在向異導電性接著劑的微膠囊 壓潰，相互的接合1C電極接合點的與FPC的電極接合 點。若由此構成，因爲可不伴隨加熱而接合各電極接合 點，即使IC與F P C的線膨張係數相異，也不產生各電極 接合點的位置偏移。因而，可確實的電氣的連接1C與 F P C。在此之後，加熱向異導電性接著劑而使其硬化，機 械的連接IC與F P C。尙且，因爲各電極接合點已經被接 合，即使加熱也不產生各電極接合點的位置偏移。由以上 地，可確實的實裝1C與FPC。 在本實施形態，以實裝1C至FPC的場合爲例而說 明’但有關本發明的實裝方法係，在實裝F P C至液晶顯 示裝置的玻璃基板的場合亦可適用。特別是，比1C與 FPC之實裝面積，FPC與玻璃基板的實裝面積較大，容易 產生電極間的位置偏移。即使在此場合，由使用有關本發 明的實裝方法，不產生電極間的位置偏移。因而，可確實 的電氣的連接FPC與玻璃基板。尙且，在直接實裝1C至 玻璃基板的場合亦，可適用有關本發明的實裝方法。 尙且，在上述的實施形態係，在常溫反應而硬化的一 對的物質之中使用使用液狀體作爲第2物質，形成向異導 電性接著劑70爲糊狀，但使用固體作爲第2物質，亦可 能形成向異導電性接著劑至薄膜狀。在此場合係，代替在 FPC的表面塗佈向異導電性接著劑，若黏上薄膜狀的向異 導電性接著劑而使用亦可。 -18- (16) (16)1227911 [電子機器] 接著，關於具備了上述的電子零件模組的電子機器之 例，使用第5圖而說明。第5圖係，攜帶式電話的斜視 圖。上述電子零件模組係，被配置於攜帶式電話3 00的框 體內部。 尙且，上述電子零件模組係，在攜帶式電話以外亦可 適用各種的電子機器。例如，可適用具備液晶投影機、對 應多媒體的個人電腦（P C )及工程工作站（E W S )、呼叫 器、文書處理器、電視、觀景窗型或螢幕直視型的攝影 機、電子記事本、電子桌上型計算機、汽車衛星導航裝 置、POS終端、觸控面板的裝置等的電子機器。 尙且，本發明的技術範圍係，不被限定於上述實施形 態，在不逸脫本發明之趣旨的範圍，包含在上述實施形態 加諸各種的變更。既是，在實施形態舉出了的具體的材料 和構成等不過僅爲一例，可適宜變更。 【圖式簡單說明】 [第1圖]關於實施形態的實裝方法的說明圖。 [第2圖]液晶顯示裝置的分解斜視圖。 [第3圖]於第2圖的A - A線的側面斷面圖。 [第4圖]微膠囊的斷面圖。 [第5圖]攜帶式電話的斜視圖。 [第6圖]有關先前技術的實裝方法的說明圖。 -19- (17) (17)1227911 【符號說明】 1 液晶顯示裝置 2 背光裝置 10 下部基板 11 突出部 12 訊號電極 15 被覆膜 16 配向膜 18 射入側偏光板 20 上部基板 22 掃描電極 2 4 r彩色濾光層 2 4 g彩色濾光層 24b彩色濾光層 25 遮光層 26 配向膜 28 射出側偏光板 30 密封材 3 1 封止材
3 2 液晶注入口 40 1C 42 電極接合點 60 可撓性基板（FPC ) -20 62 1227911 62 68 70 7 1 75 80 8 1 82 83 85 89 90 9 1 94 95 99 120 122 170 172 190 192 195 電極接合點 連接電極 連接電極 向異導電性接著劑 向異導電性接著劑 第2液狀體 微膠囊 導電性粒子 樹脂球 鑛覆金屬 第1液狀體 膠囊壁 構造體 導電性粒子 微膠囊 第1液狀體 膠囊壁 基板
電極接合點 1C 電極接合點 向異導電性薄膜 熱固性樹脂 導電性粒子 -21 1227911 (19) 3 00攜帶式電話

Claims (1)

  1. (1) (1)1227911 拾、申請專利範圍 1 . 一種向異導電性接著劑，是爲第1物質與第2物 質起反應而硬化、含有導電性粒子；其特徵爲： 構成封入前述第1物質與前述導電性粒子之可壓潰的 微膠囊，該微膠囊分散到前述第2物質。 2. 一種向異導電性接著劑，是爲第1物質與第2物 質起反應而硬化、含有導電性粒子；其特徵爲： 於前述導電性粒子，使固著封入前述第1物質之可壓 潰的微膠囊；使該微膠囊固著的前述導電性粒子，分散到 前述第2物質。 3. 如申請專利範圍第1項或第2項所記載之向異導 電性接著劑，其中： 前述第1物質係，胺、咪唑、酸酐或酚之其中任一或 其之混合物；前述第2物質係未硬化的環氧樹脂。 4. 如申請專利範圍第1項或第2項所記載之向異導 電性接著劑，其中： 前述第1物質係未硬化的環氧樹脂；前述第2物質 係，胺、咪唑、酸酐或酚之其中任一或其之混合物。 5 ·如申請專利範圍第1項或第2項所記載之向異導 電性接著劑，其中： 前述微膠囊的膠囊壁係，由熱塑性樹脂所形成。 6 ·如申請專利範圍第1項或第2項所記載之向異導 電性接著劑，其中： 經由加熱與前述第2物質反應硬化的第3物質爲，使 -23- (2) (2)1227911 混合到前述第2物質。 7. —種實裝方法；其特徵爲： 具有： 於一對的實裝零件的實裝面、塗佈如申請專利範圍第 1項至第6項中任一項所記載之向裹導電性接著劑之工 程； 和經由互相加壓前述一對的實裝零件，前述一對的實 裝零件在實裝用導電體之間壓潰前述微膠囊，於前述各實 裝用導電體之間夾入前述導電性粒子，相互接合前述各實 裝用導電體之接合工程。 8. —種實裝方法；其特徵爲： 具有： 於一對的實裝零件的實裝面、塗佈如申請專利範圍第 4項或第5項所記載之向異導電性接著劑之工程； 和經由互相加壓前述一對的實裝零件，在前述一對的 實裝零件中實裝用導電體之間壓潰前述微膠囊，於前述各 實裝用導電體之間夾入前述導電性粒子，相互接合前述各 實裝用導電體之工程； 以及經由加熱前述向異導電性接著劑使之硬化，相互 接合前述一對的實裝零件之工程。 9. 一種光電裝置模組，以使用如申請專利範圍第7 項或第8項所記載之實裝方法所形成，其特徵爲： 前述一對的實裝零件之中的一方的實裝零件係，構成 具備有複數的顯示元件的光電裝置的基板； -24- (3) 1227911 前述一對的實裝零件之中的另一方的實裝零件係，實 裝前述各顯示元件的驅動用元件的基板。 10. —種電子機器，其特徵爲： 以使用如申請專利範圍第7項或第8項所記載之實裝 方法所形成。 -25-
TW093111272A 2003-05-12 2004-04-22 Anisotropically conductive adhesive, mounting method, electro-optical device module, and electronic device TWI227911B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003133020A JP2004331910A (ja) 2003-05-12 2003-05-12 異方導電性接着剤、実装方法、電気光学装置モジュールおよび電子機器

Publications (2)

Publication Number Publication Date
TW200425250A TW200425250A (en) 2004-11-16
TWI227911B true TWI227911B (en) 2005-02-11

Family

ID=33447129

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093111272A TWI227911B (en) 2003-05-12 2004-04-22 Anisotropically conductive adhesive, mounting method, electro-optical device module, and electronic device

Country Status (5)

Country Link
US (1) US7220785B2 (zh)
JP (1) JP2004331910A (zh)
KR (1) KR100655977B1 (zh)
CN (1) CN1298033C (zh)
TW (1) TWI227911B (zh)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4644469B2 (ja) * 2004-11-09 2011-03-02 富士通株式会社 半導体チップのフリップチップ実装方法およびその実装装置
JP4804774B2 (ja) * 2005-03-18 2011-11-02 コニカミノルタホールディングス株式会社 接着剤組成物、インクジェットヘッド及びインクジェットヘッドの製造方法
JP4155289B2 (ja) * 2005-08-08 2008-09-24 エプソンイメージングデバイス株式会社 電気光学装置及び電子機器
JP2007071980A (ja) * 2005-09-05 2007-03-22 Mitsubishi Electric Corp 光モジュール
KR101346241B1 (ko) * 2005-11-29 2013-12-31 가부시키가이샤 한도오따이 에네루기 켄큐쇼 안테나 및 그의 제작방법, 안테나를 가지는 반도체장치 및그의 제작방법, 및 무선통신 시스템
KR101254695B1 (ko) 2006-05-10 2013-04-23 삼성디스플레이 주식회사 터치 스크린 내장형 액정표시패널 및 이를 포함한액정표시장치
EP2174360A4 (en) 2007-06-29 2013-12-11 Artificial Muscle Inc CONVERTER WITH ELECTROACTIVE POLYMER FOR SENSOR REVIEW APPLICATIONS
CN101256998B (zh) * 2008-04-10 2010-06-16 日月光半导体制造股份有限公司 利用各向异性导电胶层的半导体装置及其制造方法
US20100123258A1 (en) * 2008-11-14 2010-05-20 Myung Jin Yim Low Temperature Board Level Assembly Using Anisotropically Conductive Materials
EP2239793A1 (de) 2009-04-11 2010-10-13 Bayer MaterialScience AG Elektrisch schaltbarer Polymerfilmaufbau und dessen Verwendung
US7972905B2 (en) * 2009-04-16 2011-07-05 Texas Instruments Incorporated Packaged electronic device having metal comprising self-healing die attach material
WO2012118916A2 (en) 2011-03-01 2012-09-07 Bayer Materialscience Ag Automated manufacturing processes for producing deformable polymer devices and films
CN103703404A (zh) 2011-03-22 2014-04-02 拜耳知识产权有限责任公司 电活化聚合物致动器双凸透镜系统
WO2013055733A1 (en) * 2011-10-10 2013-04-18 Bayer Materialscience Ag B-stageable silicone adhesives
EP2828901B1 (en) 2012-03-21 2017-01-04 Parker Hannifin Corporation Roll-to-roll manufacturing processes for producing self-healing electroactive polymer devices
KR20150031285A (ko) 2012-06-18 2015-03-23 바이엘 인텔렉쳐 프로퍼티 게엠베하 연신 공정을 위한 연신 프레임
GB201212489D0 (en) 2012-07-13 2012-08-29 Conpart As Improvements in conductive adhesives
WO2014066576A1 (en) 2012-10-24 2014-05-01 Bayer Intellectual Property Gmbh Polymer diode
CN103013370B (zh) * 2012-12-14 2014-12-10 京东方科技集团股份有限公司 一种各向异性导电胶膜及电子装置
KR101526278B1 (ko) * 2012-12-21 2015-06-05 제일모직주식회사 경화 필름과 도전 필름을 포함하는 분리형 이방 도전성 필름
US20140238342A1 (en) * 2013-01-07 2014-08-28 Agajanian Performance Products Rim fire sparking gasket
DE102013219688B3 (de) * 2013-09-30 2015-02-05 Robert Bosch Gmbh Wärmeleitfähiges Verbindungsmittel, Verbindungsanordnung und Verfahren zum Herstellen einer wärmeleitenden Verbindung
CN104910855A (zh) * 2015-05-25 2015-09-16 叶志伟 一种用于倒装led封装的导电胶
CN104821369A (zh) * 2015-05-25 2015-08-05 叶志伟 一种倒装led的封装方法
CN106356435B (zh) * 2015-07-13 2019-07-09 广东德力光电有限公司 一种倒装芯片压合机及倒装发光二极管的封装方法
KR102429873B1 (ko) * 2015-08-31 2022-08-05 삼성전자주식회사 이방성 도전 재료와 이방성 도전 재료를 포함하는 전자소자 및 그 제조방법
US10309692B2 (en) 2015-11-11 2019-06-04 International Business Machines Corporation Self-heating thermal interface material
CN105390593A (zh) * 2015-12-17 2016-03-09 叶志伟 采用异方向导电胶封装的led热压机及热压工艺
US10278284B2 (en) 2016-08-25 2019-04-30 International Business Machines Corporation Laminate materials with embedded heat-generating multi-compartment microcapsules
US9878039B1 (en) 2016-09-01 2018-01-30 International Business Machines Corporation Microcapsule having a microcapsule shell material that is rupturable via a retro-dimerization reaction
US10328535B2 (en) 2016-11-07 2019-06-25 International Business Machines Corporation Self-heating solder flux material
KR20180095410A (ko) * 2017-02-17 2018-08-27 주식회사 동진쎄미켐 도전성 접착제 조성물
CN108574158B (zh) * 2017-03-14 2020-10-09 群创光电股份有限公司 显示装置及其制造方法
US10750623B2 (en) * 2017-05-12 2020-08-18 International Business Machines Corporation Forming conductive vias using healing layer
US10575393B1 (en) * 2018-11-13 2020-02-25 International Business Machines Corporation Heat-shielding microcapsules for protecting temperature sensitive components
CN110007514A (zh) * 2019-03-26 2019-07-12 武汉华星光电技术有限公司 背光源贴合结构及显示装置
CN110473882B (zh) * 2019-08-15 2022-04-26 昆山国显光电有限公司 显示模组及其制备方法、显示面板
JP7128556B1 (ja) * 2021-12-03 2022-08-31 恵子 江俣 糊付けによる鼻美容整形方法及び鼻美容整形用糊
CN115206588B (zh) * 2022-07-20 2023-04-07 南平市延平鑫东来科技有限公司 一种导电剂及其制备方法和在碱锰电池中的应用

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2623762B2 (ja) 1988-04-28 1997-06-25 セイコーエプソン株式会社 半導体素子の実装構造
JPH0236289A (ja) * 1988-07-27 1990-02-06 Hitachi Chem Co Ltd 一液型接着剤
JPH0371570A (ja) * 1989-08-10 1991-03-27 Casio Comput Co Ltd 導電用結合剤および導電接続構造
JP2895872B2 (ja) * 1989-09-26 1999-05-24 触媒化成工業株式会社 異方導電性材料、異方導電性接着剤およびその異方導電性接着剤を使用した電極間を電気的に接続する方法並びにその方法により形成される電気回路基板
JP2906612B2 (ja) * 1990-08-10 1999-06-21 富士通株式会社 マイクロカプセル型導電性接着剤と接着方法
JP2750217B2 (ja) * 1990-11-20 1998-05-13 サンスター技研株式会社 自動車構造用一液型エポキシ系接着剤
JPH05230586A (ja) 1991-03-19 1993-09-07 Tokyo Tungsten Co Ltd Ｍｏ焼結体及びその製造方法
JPH04332404A (ja) * 1991-05-07 1992-11-19 Nec Corp 異方性導電材料及びこれを用いた集積回路素子の接続方法
JPH05235096A (ja) * 1991-07-18 1993-09-10 Oki Electric Ind Co Ltd 電子部品の基板への実装方法
JPH0547212A (ja) * 1991-08-21 1993-02-26 Oki Electric Ind Co Ltd 一液型導電性接着剤
US6406746B1 (en) * 1991-10-24 2002-06-18 Fujitsu Limited Microcapsulating conductive metal particles with polymerized monomers
JPH05320586A (ja) * 1992-05-18 1993-12-03 Asahi Optical Co Ltd 接着方法
JP3559817B2 (ja) * 1994-06-16 2004-09-02 綜研化学株式会社 異方導電性接着剤および異方導電性接着シート
JP3587859B2 (ja) * 1997-03-31 2004-11-10 日立化成工業株式会社 回路接続材料並びに回路端子の接続構造及び接続方法
JPH1129748A (ja) * 1997-05-12 1999-02-02 Fujitsu Ltd 接着剤、接着方法及び実装基板の組み立て体
EP1045437A3 (en) * 1999-04-13 2004-09-01 Matsushita Electric Industrial Co., Ltd. Mounting structure for electronic component, method of producing the same, and electrically conductive adhesive used therein
JP2001176924A (ja) 1999-12-15 2001-06-29 Seiko Epson Corp 半導体装置の接合方法、半導体装置、電子機器、接合材料
JP2001176926A (ja) * 1999-12-20 2001-06-29 Matsushita Electric Ind Co Ltd 加圧硬化型異方性導電膜とそれを用いた液晶パネルと駆動用ｉｃの接続方法
US7110163B2 (en) * 2001-07-09 2006-09-19 E Ink Corporation Electro-optic display and lamination adhesive for use therein

Also Published As

Publication number Publication date
JP2004331910A (ja) 2004-11-25
TW200425250A (en) 2004-11-16
KR100655977B1 (ko) 2006-12-08
US20040234763A1 (en) 2004-11-25
CN1298033C (zh) 2007-01-31
US7220785B2 (en) 2007-05-22
CN1551320A (zh) 2004-12-01
KR20040097921A (ko) 2004-11-18

Similar Documents

Publication Publication Date Title
TWI227911B (en) Anisotropically conductive adhesive, mounting method, electro-optical device module, and electronic device
JP3909651B2 (ja) 可撓性印刷回路基板を有する液晶表示装置
CN101574022B (zh) 电子电路装置及其制造方法以及显示装置
KR100588925B1 (ko) 전자 부품의 제조 방법, 전자 부품, 전자 부품의 실장방법 및 전자기기
US6542374B1 (en) Circuit board, method for manufacturing the circuit board, and display device and electronic equipment employing the circuit board
KR100242613B1 (ko) 액정장치, 액정장치의 제조 방법 및 전자기기
TWI557208B (zh) An anisotropic conductive film, an anisotropic conductive film manufacturing method, a method for manufacturing a connecting body, and a connecting method
JP3284262B2 (ja) 液晶表示装置及びそれを用いた電子機器
JP3933094B2 (ja) 電子部品の実装方法
CN1181526C (zh) 部件安装方法和电光装置的制造方法
JP2005181514A (ja) 液晶装置、液晶装置の製造方法、電子機器
JP4103835B2 (ja) 電子部品の製造方法
JP2004087940A (ja) 電子部品の実装基板、電気光学装置、電気光学装置の製造方法及び電子機器
JPH08311420A (ja) 異方性導電膜
JP2003273486A (ja) 実装構造体及びその製造方法、電気光学装置、並びに電子機器
JP2006171601A (ja) 実装構造体、電気光学装置の製造方法および電気光学装置並びに電子機器
JP2005241827A (ja) 液晶表示装置
JP2005235829A (ja) 電子部品の製造方法、電子部品、電子部品の実装方法および電子機器
JP2000183112A (ja) 半導体チップの実装構造、液晶装置及び電子機器
JP3617495B2 (ja) 半導体素子の接続構造、液晶表示装置及び電子機器
JP2004087939A (ja) 電気光学装置、電子機器及び電気光学装置の製造方法
JP2005077980A (ja) 液晶表示装置の製法
JP3646557B2 (ja) 電気光学装置およびその装置を搭載する電子機器
CN112213892A (zh) 显示面板以及显示面板的制造方法
JP2004004753A (ja) 液晶パネルの製造方法

Legal Events

Date Code Title Description
MK4A Expiration of patent term of an invention patent