CN103013370B - 一种各向异性导电胶膜及电子装置 - Google Patents

一种各向异性导电胶膜及电子装置 Download PDF

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CN103013370B
CN103013370B CN201210546247.4A CN201210546247A CN103013370B CN 103013370 B CN103013370 B CN 103013370B CN 201210546247 A CN201210546247 A CN 201210546247A CN 103013370 B CN103013370 B CN 103013370B
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anisotropic conductive
microcapsule
conductive film
high molecular
molecular polymer
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CN103013370A (zh
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贺伟
暴军萍
李兴华
朴承翊
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BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
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Chengdu BOE Optoelectronics Technology Co Ltd
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Abstract

本发明提供一种各向异性导电胶膜及电子装置，为解决采用热固化导电胶封装连接时，高温引起的微电子器件变形导致微细连线容易出问题的问题，该各向异性导电胶膜包括基膜和微胶囊结构，微胶囊结构设置于基膜上，微胶囊结构包括金属导电粒子、包覆于所述金属导电粒子外部的能常温固化的高分子聚合物和包覆于所述高分子聚合物外部的微胶囊壁，且所述微胶囊壁外表附着有黏着胶体，由于采用金属导电粒子、能常温固化的高分子聚合物作为芯材，微胶囊结构作为壁材，使用时采用加压的方式使得微胶囊结构破坏，内部的导电粒子和常温固化高分子聚合物泄漏，泄漏后常温固化高分子聚合物得以固化，从而实现各向异性导电胶膜常温下对微电子器件的电气导通连接。

Description

一种各向异性导电胶膜及电子装置
技术领域
本发明涉及微电子封装技术领域，特别涉及一种各向异性导电胶膜及电子装置。
背景技术
近年来电子显示技术发展迅速，如液晶显示，电致发光技术，触摸屏技术等，其关键技术之一是驱动电路与玻璃上的氧化铟锡的连接。各向异性导电胶膜（Anisotropic Conductive Film，ACF）在Z轴电气导通方向与XY绝缘平面的电阻特性具有明显的差异，从而实现了精细微电子器件线路的连接。所述连接例如为液晶玻璃与柔性电路，液晶玻璃与集成电路，柔性电路与集成电路之间的连接。目前市场上的使用的主流各向异性导电胶膜都是含有热固型树脂，需要通过高温加压后才能实现对微电子器件的电气导通连接。
热固化型各向异性导电胶膜贴附工艺需要60℃~100℃的温度，压合固化温度需要达到150℃~220℃来保证器件连接质量。但高温易引起的微电子器件变形，进而导致微细连线容易错位或者短路，影响产品品质及长期使用的可靠性。
由此可见现有技术中存在下述问题：采用热固化各向异性导电胶封装连接时，高温引起的微电子器件变形导致微细连线容易出问题。
发明内容
本发明的目的是针对现有技术中存在的问题而提供一种各向异性导电胶膜及电子装置，所述现有技术中的问题即：采用热固化导电胶封装连接时，高温引起的微电子器件变形导致微细连线容易出问题。
本发明实施例提供一种各向异性导电胶膜，包括基膜和微胶囊结构，微胶囊结构设置于基膜上，微胶囊结构包括金属导电粒子、包覆于所述金属导电粒子外部的能常温固化的高分子聚合物和包覆于所述高分子聚合物外部的微胶囊壁，且所述微胶囊壁外表附着有黏着胶体。
进一步，微胶囊结构为鼓状，其中平面和基膜贴合。
进一步，基膜上设置有一层网状高分子聚合物，微胶囊结构设置于网状高分子聚合物上。
进一步，还包括覆盖于微胶囊结构上方的保护膜。
进一步，基膜的材料包括聚对苯二甲酸乙二醇酯。
进一步，金属导电粒子的材料为金、镍或铜，金属导电粒子的直径为1微米至20微米。
进一步，能常温固化的高分子聚合物的材料包括双酚-A型环氧树脂和室温快速固化剂。
进一步，微胶囊壁的材料为环氧树脂、石蜡、明胶或聚氨酯。
进一步，网状高分子聚合物的材料包括硅烷交联聚乙烯。
本发明实施例还提供一种电子装置，电子装置中的不同部件通过压合如前述的各向异性导电胶膜中的微胶囊结构而实现电连接。
由于采用金属导电粒子、能常温固化的高分子聚合物作为芯材，以微胶囊结构作为壁材，使用时采用加压的方式使得微胶囊结构破坏，内部的导电粒子和常温固化高分子聚合物泄漏，且泄漏后常温固化高分子聚合物得以固化，从而实现各向异性导电胶膜在常温下对微电子器件的电气导通连接。
附图说明
图1表示本发明实施例提供的各向异性导电胶膜剖面图；
图2表示本发明实施例提供的微胶囊结构图；
图3表示本发明实施例提供的网状高分子聚合物及其制作模具剖面图；
图4表示本发明实施例提供的微胶囊嵌入网状高分子聚合物的整体俯视图；
图5、图6、图7表示本发明实施例提供的各向异性导电胶膜粘结第一基材与第二基材的剖面图；
图8表示本发明实施例提供的鼓状微胶囊剖面图；
图9表示本发明实施例提供的鼓状微胶囊俯视图。
具体实施方式
为使本发明的实施例要解决的技术问题、技术方案和优点更加清楚，下面将结合附图及具体实施例进行详细描述。
本发明实施例提供一种各向异性导电胶膜，包括：基膜（Base Film）；微胶囊结构。
基膜部分，主要采用聚对苯二甲酸乙二醇酯（PET），因其良好的绝缘性，耐摩擦性以及良好的物理机械性能，可以保证各向异性导电胶膜的附着与相应的包装。
微胶囊结构，主要包括金属导电粒子，能常温固化的高分子聚合物，微胶囊壁和附着在微胶囊壁外表的黏着胶体。
金属导电粒子部分，可以采用Au，Ni，Cu等金属材料，其直径可以根据各向异性导电胶膜应用领域的要求设计，一般是1um~20um。
常温固化高分子聚合物，主要采用双酚-A型环氧树脂加室温快速固化剂，因其可在常温快速固化及其高强度的粘结力，可以为微电子器件与玻璃压合时提供所需的粘结力。
微胶囊壁，采用环氧树脂、石蜡、明胶或聚氨酯等作为壁材，导电粒子和常温固化的高分子聚合物作为芯材，当加压时，芯材从壁材中释放出来。
微胶囊表面黏着胶体，是一种弱粘结性胶，保证微胶囊能固定在其它部分如网状高分子聚合物上。
由于采用金属导电粒子、能常温固化的高分子聚合物作为芯材，微胶囊结壁作为壁材，使用时采用加压的方式使得微胶囊壁破坏，内部的导电粒子和常温固化高分子聚合物泄漏，泄漏后常温固化高分子聚合物得以固化，从而实现各向异性导电胶膜常温下对微电子器件的电气导通连接。
还可以包括：网状高分子聚合物结构；保护膜（Cover Film）。
网状高分子聚合物结构，采用的是由硅烷交联聚乙烯，主要是为了将微胶囊导电粒子分隔且保证单一层平铺，避免出现导电粒子堆积现象。
保护膜部分，主要是采用透明聚对苯二甲酸乙二醇酯，保护各向异性导电胶膜不被污染，便于包装和存储。
本发明实施例提供的各向异性导电胶膜还解决了现有技术中的下述问题，即，热固化型各向异性导电胶膜存储要求在低温条件下进行，一般是-5℃~10℃才能保证其活性及粘结质量，一旦脱离低温环境，因温度升高必须迅速使用完，否则影响胶膜固化活性进而影响器件连接质量。本发明实施例提供的各向异性导电胶膜可以在常温情况下存储，使用时只需要加压固化，Z轴方向的接触电阻小，XY平面采用网状结构可以保证充分绝缘，不会有粒子堆积现象，不损坏电路特性，加快了微电子线路封装或者连接时间，提高生产效率，适合大批量、流水线作业。
为了更好地阐述本发明，结合图例对本发明进行进一步阐述：
如图1所示，是本发明实施例提供的各向异性导电胶膜剖面图，该各向异性导电胶膜包括：保护膜101，微胶囊壁102，金属导电粒子103，网状高分子聚合物104，常温固化高分子聚合物105，基膜106。先制作一定直径的金属导电粒子103，然后利用微胶囊壁102将常温固化高分子聚合物105与金属导电粒子103注入其中，形成一个个独立的微胶囊结构。利用类似注塑技术，使用模具111制作网状高分子聚合物结构104，然后将具有表面粘性微胶囊结构单体嵌入网状高分子聚合物104中。将完成嵌入后的微胶囊结构与网状高分子聚合物104整体，附着在最下面的基膜106上，最后将保护膜101覆盖在最上面。
本发明实施例提供的各向异性导电胶膜，也适用于其他领域的精细微电子器件连接，只需要压力设备提供一定强度的高压破坏微胶囊结构，就可以保证微电子器件电气特性的连接及其连接强度。
如图2所示，图2是微胶囊结构的结构图，包括金属导电粒子103、能常温固化的高分子聚合物105和微胶囊壁，其中金属导电粒子103被能常温固化的高分子聚合物105包裹作为芯材，微胶囊壁102的外表附着有黏着胶体。
如图3所示，图3是网状高分子聚合物104制造的剖面图，采用带有半球状突起的网状高分子聚合物制作模具111，制造带有半球状凹槽的网状高分子聚合物104。
如图4所示，是微胶囊结构嵌入网状高分子聚合物104的整体俯视图，将多个微胶囊结构嵌入到网状高分子聚合物104中。
如图5、图6、图7所示，是本发明实施例提供的各向异性导电胶膜使用原理。本发明实施例提供的各向异性导电胶膜使用时，采用传统向异性导电胶膜贴附设备先将保护膜101去除，然后利用切刀将各向异性导电胶膜切割成需要的长度，通过常温轻压将其贴附在第一基材107上并去除基膜106，第二基材108通过对位后轻贴在各向异性导电胶膜上，然后在高压情况下，将微胶囊壁102破坏，内部的导电粒子103和常温固化高分子聚合物105泄漏，导电粒子103正常连接第一基材107与第二基材108间的电气构件，常温固化高分子聚合物固化后保持第一基材107与第二基材108间的粘结强度。本发明可以保证大批量，流水线作业。
作为替代，可以不使用网状高分子聚合物104，直接使用微胶囊，但微胶囊设计需要变化，微胶囊直接设置于基膜106上，如图8所示，微胶囊为鼓状，其中水平面和基膜106平行。
本发明实施例还提供一种电子装置，电子装置中的不同部件通过压合如前述的各向异性导电胶膜中的微胶囊结构而实现电连接。
最后应说明的是：以上实施例仅用以说明本发明的技术方案而非对其进行限制，尽管参照较佳实施例对本发明进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对本发明的技术方案进行修改或者等同替换，而这些修改或者等同替换亦不能使修改后的技术方案脱离本发明技术方案的精神和范围。

Claims (10)

1.一种各向异性导电胶膜，其特征在于，包括基膜和微胶囊结构，微胶囊结构设置于基膜上，微胶囊结构包括金属导电粒子、包覆于所述金属导电粒子外部的能常温固化的高分子聚合物和包覆于所述高分子聚合物外部的微胶囊壁，且所述微胶囊壁外表附着有黏着胶体，其中所述高分子聚合物具备高强度粘结力以适应微电子封装中的微电子器件与玻璃压合时的粘结。
2.根据权利要求1所述的各向异性导电胶膜，其特征在于，微胶囊结构为鼓状，其中平面和基膜贴合。
3.根据权利要求1所述的各向异性导电胶膜，其特征在于，基膜上设置有一层网状高分子聚合物，微胶囊结构设置于网状高分子聚合物上。
4.根据权利要求1所述的各向异性导电胶膜，其特征在于，还包括覆盖于微胶囊结构上方的保护膜。
5.根据权利要求1所述的各向异性导电胶膜，其特征在于，基膜的材料包括聚对苯二甲酸乙二醇酯。
6.根据权利要求1所述的各向异性导电胶膜，其特征在于，金属导电粒子的材料为金、镍或铜，金属导电粒子的直径为1微米至20微米。
7.根据权利要求1所述的各向异性导电胶膜，其特征在于，能常温固化的高分子聚合物的材料包括双酚-A型环氧树脂和室温快速固化剂。
8.根据权利要求1所述的各向异性导电胶膜，其特征在于，微胶囊壁的材料为环氧树脂、石蜡、明胶或聚氨酯。
9.根据权利要求3所述的各向异性导电胶膜，其特征在于，网状高分子聚合物的材料包括硅烷交联聚乙烯。
10.一种电子装置，其特征在于，电子装置中的不同部件通过压合如权利要求1-9任一权利要求所述的各向异性导电胶膜中的微胶囊结构而实现电连接。
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