CN111584470A - 一种led封装结构及其封装方法 - Google Patents
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Abstract
本发明提供了一种LED封装结构及其封装方法,本发明的密封树脂直接从所述LED芯片的背光面进行密封所述LED芯片和焊球,使得LED芯片底部也被密封树脂完全填充,不会留有空隙,并且利用弹性围坝的弹性,使得焊球的高度变大,焊球的纵宽比变大。本发明的制造方法简单易行,成本也较低。
Description
技术领域
本发明涉及半导体器件封装领域,具体为一种LED封装方法,属于H01L33/00分类号下。
背景技术
LED封装是LED芯片使用所必经的步骤。如图1所示,现有技术中的LED封装结构往往包括COB基板1、围坝2、LED芯片3和荧光树脂5,其中COB基板1往往是一种线路板或者具有布线图案的绝缘基板,围坝2通过模塑或者注塑的方式形成于COB基板1的周边区域,LED芯片3通过焊球4倒装于所示COB基板1上,最后用荧光树脂5密封所述LED芯片3,以防止水汽的侵蚀。然而,该种倒装方式,随着芯片尺寸的逐渐缩小,焊球4之间的间距也将逐渐缩小,防止焊球4之间的短路是亟需解决的技术问题,此外,荧光树脂5从LED芯片3的上方进行填充,该填充方式不能完全填充到所述LED芯片3的底部位置,形成空隙6,这种空隙6的存在对于封装是不利的。
发明内容
基于解决上述问题,本发明提供了一种LED封装方法,其包括以下步骤:
1)提供一刚性的透明载板,其上支撑粘合一荧光玻璃,并在该荧光玻璃上黏贴一透明粘合层;
2)将多个LED芯片通过所述透明粘合层固定于所述荧光玻璃上,并使得所述LED芯片的出光面朝向所述荧光玻璃;
3)在所述多个LED芯片的电极上形成固化的焊球,所述焊球的高度为d1,得到荧光玻璃上LED芯片结构;
4)在透明结合层上形成弹性围坝,所述弹性围坝围绕所述LED芯片以围成一空腔,且该弹性围坝具有一高度h1,该高度h1大致等于所述LED芯片厚度加焊球的高度的总和;
5)在所述空腔内灌注密封树脂,所述密封树脂的顶面呈弧面状,且其高度高于所述弹性围坝的高度h1,得到荧光玻璃上弹性围坝结构;
6)将封装基板接合至上述荧光玻璃上弹性围坝结构,其中,所述封装基板上的线路层与所述焊球对准;
7)向所述封装基板上施加一压力F1,并同时加热使得所述焊球熔化,使得所述弹性围坝高度降低至h2,所述焊球的高度变为d2,此时h2<h1,d2<d1;
8)施加一力F2使得所述临时载板剥离,该力F2使得所述弹性围坝的高度变为h3,且使得所述焊球的高度变为d3,其中,h3>h2,d3>d2;
9)停止加热冷却至常温,使得所述焊球和密封树脂固化,得到最终的LED封装结构。
2、根据权利要求1所述的LED封装方法,其特征在于:所述弹性围坝的材料为橡胶材料、金属橡胶、高弹性塑料等。
3、根据权利要求1所述的LED封装方法,其特征在于:所述荧光玻璃上设置有第一对准标记,所述封装基板上设置有第二对准标记,通过对准第一对准标记和第二对准标记实现焊球与所述线路层的对准。
4、根据权利要求3所述的LED封装方法,其特征在于:所述弹性围坝至少包括一溢流口,在步骤7)中,所述溢流口实现多余的密封树脂的向外溢流,且在步骤8)中,所述溢流口实现密封树脂回流入空腔。
本发明的优点如下:密封树脂直接从所述LED芯片的背光面进行密封所述LED芯片和焊球,使得LED芯片底部也被密封树脂完全填充,不会留有空隙,并且利用弹性围坝的弹性,使得焊球的高度变大,焊球的纵宽比变大。本发明的制造方法简单易行,成本也较低。
附图说明
图1为现有技术的LED封装结构的剖视图;
图2-10为本发明的LED封装方法的剖视示意图;
图11为图10去除封装基板的仰视图。
具体实施方式
本发明构思在于设计一种防止LED芯片的焊球间短路以及能完整填充树脂的LED封装结构,具体的实施例将在下述内容中说明。
本发明采用在荧光玻璃上形成树脂,然后倒贴于封装的COB基板,以实现完整的树脂填充和较大的焊球纵宽比(高度和宽度的比值)。
参见图2,提供一刚性的临时载板10,该临时载板10为透明基板,优选为玻璃基板,原因在后续内容会详细说明,其上支撑粘合一荧光玻璃板11,并在该荧光玻璃板11上黏贴一透明粘合层12。该荧光玻璃11可采用现有的荧光玻璃制备方法得到,具体可以是例如玻璃中掺杂荧光物质形成,其形成方式和具体材料不做具体限定。作为优选的,该荧光玻璃11为红光荧光玻璃,厚度为100-200μm。该透明粘合层12可以是常规的具有一定粘性的透明材料,例如环氧树脂、硅树脂等。
参见图3,多个LED芯片13通过上述透明粘合层12固定于所述荧光玻璃11上,并且所述LED芯片13的出光面朝向所述荧光玻璃11。该多个LED芯片13的布置位置应当与封装基板的布线相对应,以实现后面的倒装,该对应通过荧光玻璃11上的对准标记实现。
参见图4、7,在所述多个LED芯片13的电极上形成焊球14,该焊球14是固化的,其使用焊料植球技术实现。其中,所述焊球具有高度d1。
参见图5、7,在透明粘合层12上形成弹性围坝16,该弹性围坝16区别于现有技术中的刚性围坝,现有技术的围坝多采用树脂材料或金属材料形成,而本申请的弹性围坝16选取具有一定弹性的材料,例如橡胶材料、金属橡胶、高弹性塑料等。该弹性围坝16具有一高度h1,该高度h1大致等于所述LED芯片13厚度加焊球的高度的总和。所述弹性围坝16环绕于所述荧光玻璃11的周边,以围成一空腔17,该空腔17用于容纳LED芯片13。
参见图6,在空腔17内灌注密封树脂18,该密封树脂18内没有荧光粉材料,密封树脂18的顶面呈弧面状,且其高度高于所述弹性围坝17的高度h1。
参见图7,准备一封装基板15,该封装基板15具有一线路层,使得该线路层朝向所述焊球14,并进行对准操作。
参见图8,加热所述焊球14,使得焊球熔化键合至所述封装基板15的线路层上,向所述封装基板16施加一压力,使得弹性围坝16的高度由h1变为h2,使得所述焊球14的高度由d1变为d2,其中,h1<h1,d1<d2。
参见图9,施加一力F2使得所述临时载板10剥离,该提力F2使得所述弹性围坝16的高度变为h3,且使得所述焊球14的高度变为d3,其中,h3>h2,d3>d2,由此,焊球14的高度得到提升,其纵宽比较大,防止了焊球间的短路。
参见图10,停止加热至常温,使得所述焊球14和密封树脂18固化,得到最终的封装结构。
另外参见图11,本发明的封装基板上可具有一对准标记,该荧光玻璃11上具有与其对准的另一对准标记19,该对准标记19用于通过临时载板10和荧光玻璃与封装基板15上的对准标记进行对准,以实现焊球14对准于封装基板10上的线路层。在该处,必须使得临时载板10为透明基板,以便于从临时载板10侧进行对准。并且,所述弹性围坝16至少包括一溢流口20,所述溢流口20用于在图8的加压操作中,实现多余的密封树脂18的向外溢流。此外,该溢流口20还能够在施加力F2时,实现密封树脂18回流入空腔17。
在如以上那样的LED封装方法中,密封树脂直接从所述LED芯片的背光面进行密封所述LED芯片和焊球,使得LED芯片底部也被密封树脂完全填充,不会留有空隙,并且利用弹性围坝的弹性,使得焊球的高度变大,焊球的纵宽比变大。本发明的制造方法简单易行,成本也较低。
最后应说明的是:显然,上述实施例仅仅是为清楚地说明本发明所作的举例,而并非对实施方式的限定。对于所属领域的普通技术人员来说,在上述说明的基础上还可以做出其它不同形式的变化或变动。这里无需也无法对所有的实施方式予以穷举。而由此所引申出的显而易见的变化或变动仍处于本发明的保护范围之中。
Claims (4)
1.一种LED封装方法,其包括以下步骤:
1)提供一刚性的透明载板,其上支撑粘合一荧光玻璃,并在该荧光玻璃上黏贴一透明粘合层;
2)将多个LED芯片通过所述透明粘合层固定于所述荧光玻璃上,并使得所述LED芯片的出光面朝向所述荧光玻璃;
3)在所述多个LED芯片的电极上形成固化的焊球,所述焊球的高度为d1,得到荧光玻璃上LED芯片结构;
4)在透明结合层上形成弹性围坝,所述弹性围坝围绕所述LED芯片以围成一空腔,且该弹性围坝具有一高度h1,该高度h1大致等于所述LED芯片厚度加焊球的高度的总和;
5)在所述空腔内灌注密封树脂,所述密封树脂的顶面呈弧面状,且其高度高于所述弹性围坝的高度h1,得到荧光玻璃上弹性围坝结构;
6)将封装基板接合至上述荧光玻璃上弹性围坝结构,其中,所述封装基板上的线路层与所述焊球对准;
7)向所述封装基板上施加一压力F1,并同时加热使得所述焊球熔化,使得所述弹性围坝高度降低至h2,所述焊球的高度变为d2,此时h2<h1,d2<d1;
8)施加一力F2使得所述临时载板剥离,该力F2使得所述弹性围坝的高度变为h3,且使得所述焊球的高度变为d3,其中,h3>h2,d3>d2;
9)停止加热冷却至常温,使得所述焊球和密封树脂固化,得到最终的LED封装结构。
2.根据权利要求1所述的LED封装方法,其特征在于:所述弹性围坝的材料为橡胶材料、金属橡胶、高弹性塑料等。
3.根据权利要求1所述的LED封装方法,其特征在于:所述荧光玻璃上设置有第一对准标记,所述封装基板上设置有第二对准标记,通过对准第一对准标记和第二对准标记实现焊球与所述线路层的对准。
4.根据权利要求3所述的LED封装方法,其特征在于:所述弹性围坝至少包括一溢流口,在步骤7)中,所述溢流口实现多余的密封树脂的向外溢流,且在步骤8)中,所述溢流口实现密封树脂回流入空腔。
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CN114220897A (zh) * | 2021-12-22 | 2022-03-22 | 鸿利智汇集团股份有限公司 | 一种led及封装方法 |
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CN114220897A (zh) * | 2021-12-22 | 2022-03-22 | 鸿利智汇集团股份有限公司 | 一种led及封装方法 |
CN114220897B (zh) * | 2021-12-22 | 2022-09-20 | 鸿利智汇集团股份有限公司 | 一种led及封装方法 |
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