CN101146885A - 各向异性导电性粘结剂及使用了该粘结剂的电极连接方法 - Google Patents

各向异性导电性粘结剂及使用了该粘结剂的电极连接方法 Download PDF

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CN101146885A
CN101146885A CNA200680007085XA CN200680007085A CN101146885A CN 101146885 A CN101146885 A CN 101146885A CN A200680007085X A CNA200680007085X A CN A200680007085XA CN 200680007085 A CN200680007085 A CN 200680007085A CN 101146885 A CN101146885 A CN 101146885A
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anisotropic conductive
binding agent
adhesive film
insulativity
foaming ingredient
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CN101146885B (zh
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小西美佐夫
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Dexerials Corp
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Sony Chemical and Information Device Corp
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Abstract

本发明提供相对于微细间距的连接端子能够确实地连接的各向异性导电性粘结剂及使用了该粘结剂的电极连接方法。本发明的各向异性导电性粘结薄膜1是在绝缘性粘结剂树脂6中分散有通过加热表现发泡性的发泡成分8和导电粒子7的粘结薄膜。该发泡成分8以形成独立状态的泡部的方式分散在绝缘性粘结剂树脂6中。作为发泡成分8使用含有将有机溶剂密封在热塑性微胶囊中的微粒子的发泡成分。

Description

各向异性导电性粘结剂及使用了该粘结剂的电极连接方法
技术领域
本发明涉及例如在显示装置和电路基板间的电连接中使用的各向异性导电性粘结剂以及使用了该粘结剂的电极连接方法。
背景技术
一直以来，作为电连接例如液晶显示装置和集成电路基板等的方法，使用各向异性导电粘结剂。
该各向异性导电粘结剂例如以粘结挠性印刷电路基板(FPC)或IC芯片端子与形成在LCD面板的玻璃基板上的ITO(氧化铟锡)电极端子的情况为代表，在粘结各种端子之间的同时进行电连接的情况中使用。
在这种各向异性导电性粘结薄膜中，近年来随着连接端子的微细间距化，产生了各种问题。
例如，具有由于热压接时基板的翘曲而发生连接故障的问题、由于液晶显示装置的窄边化而在连接部分发生短路的问题、由于连接用凸点的微小化而使导电粒子的捕获性降低等的问题。
专利文献1：日本特开平11-60899号
发明内容
发明所要解决的技术问题
本发明是为了解决这种现有技术问题而完成，其目的在于提供相对于微细间距化的连接端子能够确实连接的各向异性导电性粘结剂及使用了该粘结剂的电极连接方法。
用于解决技术问题的方法
为了达成上述目的而完成的本发明是在绝缘性粘结剂成分中分散有通过加热会表现发泡性的发泡成分、和导电粒子的各向异性导电性粘结剂。
本发明是在绝缘性粘结剂成分中分散有通过加热表现发泡性的发泡成分和导电粒子、形成为薄膜状的各向异性导电性粘结薄膜。
上述发明中，发泡成分以能够形成独立状态的泡部的方式分散在上述绝缘性粘结剂成分中。
上述发明中，上述发泡成分含有将有机溶剂密封在热塑性微胶囊中的微粒子。
本发明为上述发明中绝缘性粘结薄膜层压而成的各向异性导电性粘结薄膜。
本发明为上述发明中不含上述发泡成分的各向异性导电性粘结薄膜与含有上述发泡成分的绝缘性粘结薄膜层压而成的各向异性导电性粘结薄膜。
本发明为具有通过使具有连接用电极的多个连接构件与上述电极之间相对配置，在上述多个连接构件之间配置各向异性导电性粘结剂进行加热和加压，从而在粘结上述连接构件之间的同时将上述电极之间电连接的工序的电极连接方法，作为上述各向异性导电性粘结剂，使用在绝缘性粘结剂成分中分散有通过加热表现发泡性的发泡成分和导电粒子的粘结剂构件。
上述发明中，使用在上述绝缘性粘结剂成分中以形成独立状态的泡部的方式而分散有上述发泡成分的各向异性导电性粘结剂。
上述发明中，使用上述发泡成分含有将有机溶剂密封在热塑性微胶囊中的微粒子的各向异性导电性粘结剂。
上述发明中，作为上述各向异性导电性粘结剂使用形成为薄膜状的各向异性导电性粘结薄膜。
上述发明中，作为上述各向异性导电性粘结剂使用在上述各向异性导电性粘结薄膜上层压有绝缘性粘结薄膜的粘结剂。
上述发明中，上述各向异性导电性粘结剂使用层压了不含上述发泡成分的各向异性导电性粘结薄膜和含有上述发泡成分的绝缘性粘结薄膜的粘结剂。
本发明中，将这种各向异性导电性粘结剂配置在电极间，进行加热和加压，则表现出发泡成分的发泡性，各向异性导电性粘结剂膨胀、其体积增加。
结果，相邻电极间的导电粒子的密度降低，由此绝缘特性提高。
特别是，根据本发明，即便是厚度小于电极高度的各向异性导电性粘结剂也可以填充到连接构件之间，而且由于阻止了导电粒子流入相邻的电极间，因此可以提高微细间距的相邻电极间的绝缘性。
而且，由于与现有技术相比粘结剂中的树脂成分相对地减少，因此可以降低线膨胀系数和弹性率，由此可以减轻热压接时的连接构件的翘曲。
另一方面，在本发明中，当发泡成分例如使用将有机溶剂密封在热塑性微胶囊中的微粒子、以形成独立状态的泡部的方式而分散时，可以提供连接构件之间的粘结力高、且没有水分等的浸入、导通可靠性高的各向异性导电性粘结剂。
而且，如果使用在本发明的各向异性导电性粘结薄膜上层压有绝缘性粘结薄膜的产物作为各向异性导电性粘结剂，则可以减少与电连接无关的导电粒子的数量，因此可以谋求导电粒子的有效利用。
如果使用将不含发泡成分的各向异性导电性粘结薄膜和含有发泡成分的绝缘性粘结薄膜层压所得的产物作为各向异性导电性粘结剂，则不仅可以谋求导电粒子的有效利用，还可以使含有发泡成分的层变薄，因此在相对的连接构件的电极间夹入发泡成分的可能性降低，结果可以拓宽热压接条件的自由度。
发明效果
通过本发明，可以提供能够确实地连接于微细间距的连接端子的各向异性导电性粘结剂及使用了该粘结剂的电极连接方法。
附图说明
图1(a)～(c)为使用了本发明的电极连接方法实施方式的示意图。
图2(a)(b)为热压接时本发明的各向异性导电性粘结剂状态的示意图。
图3(a)(b)为使用了本发明其它实施方式的电极连接方法的示意图。
图4(a)(b)为使用了本发明另一个其它实施方式的电极连接方法的示意图。
符号说明
1各向异性导电性粘结薄膜
2电路基板
3电极
4  IC芯片
5凸点(电极)
6绝缘性粘结剂树脂
7导电粒子
8发泡成分
9气泡
具体实施方式
以下参照附图详细地说明本发明的各向异性导电性粘结剂及使用了该粘结剂的电极连接方法的优选实施方式。
需要说明的是，本发明还可以适用于浆状或薄膜状的各向异性导电性粘结剂的任一种。
图1(a)～(c)是使用了本发明的电极连接方法实施方式的示意图，图2(a)(b)为热压接时本发明的各向异性导电性粘结剂状态的示意图。
如图1(a)和图2(a)所示，本发明的各向异性导电性粘结薄膜1例如用于电路基板(连接构件)2的电极3与IC芯片(连接构件)4的凸点(电极)5的电连接，因此在薄膜状的绝缘性粘结剂树脂6中分散有导电粒子7。
本发明的情况下可以使用以往公知的各种物质作为导电粒子7。
另一方面，绝缘性粘结剂树脂6没有特别限定，但从提高连接可靠性的观点出发，优选使用含有环氧树脂和苯氧树脂和固化剂的组合物、含有(甲基)丙烯酸单体和引发剂的组合物。
而且，本发明的各向异性导电性粘结薄膜1在绝缘性粘结剂树脂6中分散有通过加热膨胀表现发泡性的发泡成分8。
本发明中，从提高导通可靠性的观点出发，优选以形成独立状态的泡部的方式分散发泡成分8。
由此观点出发，在本发明中，可以优选使用含有将有机溶剂密封在热塑性微胶囊中的微粒子的各向异性导电性粘结薄膜。
另外，通过加热表现发泡性的发泡成分8的混合量没有特别限定，从充分地发挥本发明效果而降低粘结强度的观点出发，优选在绝缘性粘结剂树脂6中含有2～20重量％、更优选5～20重量％的通过加热表现发泡性的发泡成分8。
使用本实施方式的各向异性导电性粘结薄膜1连接电路基板2的电极3和IC芯片4的凸点5时，如图1(a)所示，将电路基板2的电极3与IC芯片4的凸点5相对配置，在其间配置各向异性导电性粘结薄膜1。然后，如图1(b)所示，使用热压接头10向电路基板2挤压IC芯片4，进行预压接。
在该预压接工序中，例如优选在绝缘性粘结剂树脂6发生某种程度软化的温度(例如40～70℃)下进行加热。
如图2(a)所示，此时上述发泡成分8并未发生变化。
然后，使用热压接头10在规定温度(例如90～180℃)下进行对绝缘性粘结剂树脂6进行加热，从而进行正式压接。
此时，利用热压接头10进行加压和加热，直至IC芯片4的凸点5和电路基板2的电极3附近的绝缘性粘结剂树脂6发生固化、电极3和凸点5被电连接，确实地粘结上。
之后，如图1(c)所示，解除利用热压接头10的加压，从而如图2(b)所示，电极3和凸点5附近以外的发泡成分8膨胀发泡，在绝缘性粘结剂树脂6中产生分别独立状态的气泡9。
由于该气泡9的产生，绝缘性粘结剂树脂6的体积增加，在电路基板2和IC芯片4之间填充各向异性导电性粘结薄膜1，由此IC芯片4完全地粘结在电路基板2上。
根据以上说明的本实施方式，由于在热压接时各向异性导电性粘结薄膜1膨胀，其体积增加，因此相邻电极3和凸点5之间的导电粒子7的密度降低，由此可以提高绝缘特性。
另外，根据本实施方式，即便是厚度小于凸点5高度的各向异性导电性粘结薄膜1也可以填充到电路基板2和IC芯片4之间，而且阻止了导电粒子7流入相邻的电极3和凸点5之间，因而可以提高相邻电极3和凸点5之间的绝缘性。
而且，由于与现有技术相比绝缘性粘结剂树脂6中的树脂成分相对地减少，因此可以降低线膨胀系数和弹性率，由此可以减轻热压接时的电路基板2的翘曲。
另外，在本实施方式中，由于使用将有机溶剂密封在热塑性微胶囊的微粒子、以形成独立状态的泡部的方式而分散发泡成分，因此可以提供粘结力高、且不会有水分等的浸入、导通可靠性高的各向异性导电性粘结薄膜1。
图3(a)(b)是使用了本发明其它实施方式的电极连接方法的示意图，图4(a)(b)是使用了本发明其它实施方式的电极连接方法的示意图。
本发明中，还可以将在绝缘性粘结剂树脂6中分散有上述发泡成分8的层、和在绝缘性粘结剂树脂6中未分散上述发泡成分8的层层压。
以下，对于与上述实施方式共通的部分带有相同的符号，省略其详细的说明，例如图3(a)(b)所示的各向异性导电性粘结薄膜1A层压有含有上述发泡成分8的各向异性导电性粘结薄膜10、和不含上述发泡成分8的绝缘性粘结剂薄膜11。
此时，优选将各向异性导电性粘结薄膜1A配置在电路基板2上，使得绝缘性粘结剂薄膜11与IC芯片4相对。
根据具有这种构成的本实施方式，由于特别可以减少与IC芯片4侧、即挤压侧的电连接无关的导电粒子7的数量，因此可以谋求导电粒子7的有效利用。
另一发明，图4(a)(b)所示的各向异性导电性粘结薄膜1B层压有不含上述发泡成分8的各向异性导电性粘结薄膜12、和含有上述发泡成分8的绝缘性粘结剂薄膜1 3。
此时，优选将各向异性导电性粘结薄膜1B配置在电路基板2上，使得含有发泡成分8的绝缘性粘结剂薄膜1 3与IC芯片4相对。
根据具有这种构成的本实施方式，不仅可以与上述实施方式同样地谋求导电粒子7的有效利用，而且可以使含有发泡成分8的层变薄，因此在IC芯片4的凸点5与电路基板2的电极3之间夹入发泡成分8的可能性降低，结果可以拓宽热压接条件的自由度。
本发明中，不仅为上述2层结构，还可以采用3层以上的层压结构。
对于其它的构成及作用效果，由于与上述实施方式相同，因此省略其详细说明。
实施例
以下与比较例一起详细地说明本发明的实施例。
<实施例1>
使用作为溶剂的甲苯20重量份、乙酸乙酯20重量份，利用混合机将作为绝缘性粘结剂树脂的苯氧树脂(东都化成公司生产YP50)40重量份、液状环氧树脂(日本环氧树脂公司生产EP828)30重量份、导电粒子(直径4μm、镀Ni/Au树脂粒子)20重量份、微胶囊型环氧固化剂(旭化成公司生产HX3941HP)、作为通过加热表现发泡性的发泡成分的发泡剂A(松本油脂公司生产F30VSD膨胀初始温度：约80℃该温度为通过在预压接工序中稍有发泡从而在之后的正式压接工序中促进发泡的温度。)4重量份溶解、混合。
需要说明的是，发泡剂使用通过孔径10μm的筛的筛分合格品。
在施有剥离处理的PET薄膜上涂抹上述浆，在设定为65℃的电炉中加热4分钟，制作干燥膜厚为10μm的各向异性导电性粘结薄膜的样品。
<实施例2>
作为发泡剂使用膨胀初始温度约为150℃的发泡剂B(松本油脂公司生产F80GSD)，除此之外通过与实施例1相同的方法制作样品。
<实施例3>
作为发泡剂使用膨胀初始温度约为150℃的发泡剂C(松本油脂公司生产F80VSD)，除此之外通过与实施例1相同的方法制作样品。
<实施例4>
除了将干燥膜厚调整为15μm之外，通过与实施例3相同的方法制作样品。
<比较例1>
除了不添加发泡剂之外，通过与实施例1相同的方法制作样品。
<比较例2>
除了将干燥膜厚调整为30μm之外，通过与比较例1相同的方法制作样品。
<评价>
使用实施例和比较例的样品，将IC芯片热压接在玻璃基板上使各向异性导电性粘结薄膜固化(温度190℃、时间20秒)。
此时，IC芯片的凸点的尺寸为30μm×85μm、凸点间的空间为20μm、凸点的高度为22μm。
然后从玻璃基板侧通过目视分别确认和计算各向异性导电性粘结薄膜的填充性、被捕获到凸点上的导电粒子数、堵塞在凸点间的导电粒子的状态。结果示于表1中。
表1实施例和比较例的评价结果
    发泡剂     干燥膜厚(μm)     填充性     粒子捕获数平均值(个/凸点)     凸点间粒子堵塞
  实施例1     A     10     ○     19     ○
  实施例2     B     10     ○     19.5     ○
  实施例3     C     10     Δ     20     ○
  实施例4     C     15     ○     19     ○
  比较例1     无     10     ×     19.5     Δ
  比较例2     无     30     ○     16.5     ×
[填充性]○：充分地填充×：有未填充的部分
[凸点间粒子堵塞]○：没有堵塞  Δ：没有堵塞但存在很多粒子
×：有堵塞
[评价结果]
如表1所示，实施例1～4的各向异性导电性粘结薄膜的填充性良好，也没有凸点间的导电粒子堵塞。需要说明的是，对于实施例1～4的各向异性导电性粘结薄膜，当使发泡剂的混合量为12重量份时，得到了基本相同的结果。
另一方面，当为未添加发泡剂的比较例1的各向异性导电性粘结薄膜时，产生了未填充的部分，另外，在凸点间存在很多导电粒子。
而且，对于未添加发泡剂使干燥膜厚为30μm的比较例2的各向异性导电性粘结薄膜，在凸点间发生了导电粒子的堵塞。

Claims (14)

1.一种各向异性导电性粘结剂，其中，在绝缘性粘结剂成分中分散有通过加热表现发泡性的发泡成分和导电粒子。
2.权利要求1所述的各向异性导电性粘结剂，其中，所述发泡成分以形成独立状态的泡部的方式分散在所述绝缘性粘结剂成分中。
3.权利要求1所述的各向异性导电性粘结剂，其中，所述发泡成分含有将有机溶剂密封在热塑性微胶囊中的微粒子。
4.一种各向异性导电性粘结薄膜，其中，在绝缘性粘结剂成分中分散有通过加热表现发泡性的发泡成分和导电粒子。
5.权利要求4所述的各向异性导电性粘结剂，其中，所述发泡成分以形成独立状态的泡部的方式分散在所述绝缘性粘结剂成分中。
6.权利要求4所述的各向异性导电性粘结剂，其中，所述发泡成分含有将有机溶剂密封在热塑性微胶囊中的微粒子。
7.权利要求4所述的各向异性导电性粘结薄膜，其中，层压有绝缘性粘结薄膜层压而成。
8.权利要求4所述的各向异性导电性粘结薄膜，其中，层压有不含所述发泡成分的各向异性导电性粘结薄膜、和含有所述发泡成分的绝缘性粘结薄膜。
9.一种电极连接方法，其具有使具有连接用电极的多个连接构件与所述电极之间相对配置，在所述多个连接构件之间配置各向异性导电性粘结剂进行加热和加压，从而在粘结所述连接构件之间的同时将所述电极之间电连接的工序；
作为所述各向异性导电性粘结剂，使用在绝缘性粘结剂成分中分散有通过加热表现发泡性的发泡成分和导电粒子的粘结剂。
10.权利要求9所述的电极连接方法，其使用在所述绝缘性粘结剂成分中以形成独立状态的泡部的方式分散有所述发泡成分的各向异性导电性粘结剂。
11.权利要求9所述的电极连接方法，其使用所述发泡成分含有将有机溶剂封闭在热塑性微胶囊中的微粒子的各向异性导电性粘结剂。
12.权利要求9所述的电极连接方法，其中，作为所述各向异性导电性粘结剂使用形成为薄膜状的各向异性导电性粘结薄膜。
13.权利要求12所述的电极连接方法，其中，作为所述各向异性导电性粘结剂使用在所述各向异性导电性粘结薄膜上层压有绝缘性粘结薄膜的粘结剂。
14.权利要求12所述的电极连接方法，构件作为所述各向异性导电性粘结剂使用层压有不含所述发泡成分的各向异性导电性粘结薄膜和含有所述发泡成分的绝缘性粘结薄膜的粘结剂。
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