HK1116511A1 - Anisotropic conductive adhesive and method of electrode connection therewith - Google Patents

Anisotropic conductive adhesive and method of electrode connection therewith

Info

Publication number
HK1116511A1
HK1116511A1 HK08107013.0A HK08107013A HK1116511A1 HK 1116511 A1 HK1116511 A1 HK 1116511A1 HK 08107013 A HK08107013 A HK 08107013A HK 1116511 A1 HK1116511 A1 HK 1116511A1
Authority
HK
Hong Kong
Prior art keywords
anisotropic conductive
conductive adhesive
electrode connection
connection therewith
foam component
Prior art date
Application number
HK08107013.0A
Other languages
English (en)
Inventor
Misao Konishi
Original Assignee
Sony Chem & Inf Device Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chem & Inf Device Corp filed Critical Sony Chem & Inf Device Corp
Publication of HK1116511A1 publication Critical patent/HK1116511A1/xx

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/08—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers using foamed adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/0665—Epoxy resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1163—Chemical reaction, e.g. heating solder by exothermic reaction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1178—Means for venting or for letting gases escape

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Non-Insulated Conductors (AREA)
  • Wire Bonding (AREA)
  • Conductive Materials (AREA)
  • Adhesive Tapes (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
HK08107013.0A 2005-03-04 2008-06-24 Anisotropic conductive adhesive and method of electrode connection therewith HK1116511A1 (en)

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JP2005060290 2005-03-04
PCT/JP2006/304278 WO2006093315A1 (ja) 2005-03-04 2006-03-06 異方導電性接着剤及びこれを用いた電極の接続方法

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KR (1) KR101298829B1 (zh)
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HK (1) HK1116511A1 (zh)
TW (1) TWI347348B (zh)
WO (1) WO2006093315A1 (zh)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100608533B1 (ko) 2005-05-13 2006-08-08 쓰리엠 이노베이티브 프로퍼티즈 캄파니 전기 전도성이 우수한 고분자 수지 및 그 제조방법
KR100888404B1 (ko) * 2007-06-22 2009-03-13 삼성전기주식회사 도전성 페이스트와 이를 이용한 인쇄회로기판 및 그제조방법
KR20090054198A (ko) * 2007-11-26 2009-05-29 쓰리엠 이노베이티브 프로퍼티즈 캄파니 점착 시트의 제조방법 및 이에 의한 점착 시트
JP5083076B2 (ja) * 2008-07-09 2012-11-28 株式会社デンソー 電子装置の製造方法
KR101615797B1 (ko) * 2008-07-11 2016-04-26 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름
JP5402804B2 (ja) * 2010-04-12 2014-01-29 デクセリアルズ株式会社 発光装置の製造方法
JP5695881B2 (ja) * 2010-10-28 2015-04-08 デクセリアルズ株式会社 電子部品の接続方法及び接続構造体
CN103079343B (zh) * 2011-10-26 2017-12-05 日立化成株式会社 电路零件
JPWO2013171918A1 (ja) * 2012-05-15 2016-01-07 京セラ株式会社 圧電アクチュエータ、圧電振動装置および携帯端末
WO2013180143A1 (ja) * 2012-05-30 2013-12-05 日本写真印刷株式会社 視認性と耐久性に優れた静電容量透明タッチシート
JP6151412B2 (ja) * 2012-09-18 2017-06-21 デクセリアルズ株式会社 異方性導電フィルム、異方性導電フィルムの製造方法、接続体の製造方法、及び接続方法
JP5972844B2 (ja) * 2012-09-18 2016-08-17 デクセリアルズ株式会社 異方性導電フィルム、異方性導電フィルムの製造方法、接続体の製造方法、及び接続方法
CN103013370B (zh) * 2012-12-14 2014-12-10 京东方科技集团股份有限公司 一种各向异性导电胶膜及电子装置
JP6289831B2 (ja) * 2013-07-29 2018-03-07 デクセリアルズ株式会社 導電性接着フィルムの製造方法、導電性接着フィルム、接続体の製造方法
CN204130702U (zh) * 2014-05-23 2015-01-28 西安中兴新软件有限责任公司 连接agps模块和主板的部件及无线接入终端
JP2016072239A (ja) * 2014-09-30 2016-05-09 デクセリアルズ株式会社 異方性導電フィルム、及び接続方法
DE102015112967A1 (de) * 2015-08-06 2017-02-09 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen eines optoelektronischen Bauelements und optoelektronisches Bauelement
KR102520709B1 (ko) * 2016-04-19 2023-04-12 삼성디스플레이 주식회사 인쇄회로기판용 보호테이프 및 이를 구비하는 디스플레이 장치
KR102126679B1 (ko) * 2016-08-18 2020-06-25 주식회사 엘지화학 그물구조 전도체의 제조방법
KR101800367B1 (ko) 2016-08-24 2017-11-28 한국기계연구원 마이크로 소자 전사방법 및 마이크로 소자 전사방법으로 제조된 마이크로 소자 기판
CN108574158B (zh) * 2017-03-14 2020-10-09 群创光电股份有限公司 显示装置及其制造方法
DE102017210704A1 (de) * 2017-06-26 2018-12-27 Siemens Aktiengesellschaft Elektrische Baugruppe und Verfahren zu deren Herstellung
TW201910126A (zh) * 2017-08-16 2019-03-16 日商Ｄｉｃ股份有限公司 接著帶與接著方法
JP7085919B2 (ja) * 2018-06-29 2022-06-17 リンテック株式会社 実装装置および実装方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51109936A (en) * 1975-03-25 1976-09-29 Suwa Seikosha Kk Dodenihoseiomotsu setsuchakuzai
JPS51114439A (en) * 1975-04-02 1976-10-08 Seiko Epson Corp An adhesive having anisotropic electroconductivity
JPS51135938A (en) * 1975-05-21 1976-11-25 Seiko Epson Corp Anisotropic electroconductive adhesive
DE69942824D1 (de) * 1998-08-28 2010-11-18 Panasonic Corp Leitfähige paste, diese verwendende elektrisch leitfähige struktur, elektrisches bauteil, modul, leiterplatte, verfahren zum elektrischen verbinden, verfahren zur herstellung von einer leiterplatte he
JP3650546B2 (ja) * 1998-08-28 2005-05-18 松下電器産業株式会社 導電性ペースト、およびそれを用いた導電性構造、セラミック電子部品、電子部品、実装体、回路基板、電気的接続方法、回路基板の製造方法、及びセラミック電子部品の製造方法
JP3748095B2 (ja) * 1999-03-10 2006-02-22 東洋紡績株式会社 導電性ペースト
JP2001107019A (ja) * 1999-10-07 2001-04-17 Matsushita Electric Ind Co Ltd 発泡性ペースト、電子部品実装体および電子部品剥離方法

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CN101146885A (zh) 2008-03-19
JP4891895B2 (ja) 2012-03-07
KR101298829B1 (ko) 2013-08-23
KR20070116808A (ko) 2007-12-11
TW200632068A (en) 2006-09-16
CN101146885B (zh) 2012-09-05
WO2006093315A1 (ja) 2006-09-08
JPWO2006093315A1 (ja) 2008-08-07
CN102277096A (zh) 2011-12-14
TWI347348B (en) 2011-08-21

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