WO2006138423A3 - Chip connector - Google Patents

Chip connector Download PDF

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Publication number
WO2006138423A3
WO2006138423A3 PCT/US2006/023246 US2006023246W WO2006138423A3 WO 2006138423 A3 WO2006138423 A3 WO 2006138423A3 US 2006023246 W US2006023246 W US 2006023246W WO 2006138423 A3 WO2006138423 A3 WO 2006138423A3
Authority
WO
WIPO (PCT)
Prior art keywords
contact
malleable
rigid
wafer
penetrate
Prior art date
Application number
PCT/US2006/023246
Other languages
French (fr)
Other versions
WO2006138423A2 (en
Inventor
John Trezza
John Callahan
Gregory Dudoff
Original Assignee
Cubic Wafer Inc
John Trezza
John Callahan
Gregory Dudoff
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/329,874 external-priority patent/US20060278966A1/en
Priority claimed from US11/422,551 external-priority patent/US7847412B2/en
Application filed by Cubic Wafer Inc, John Trezza, John Callahan, Gregory Dudoff filed Critical Cubic Wafer Inc
Priority to KR1020127008574A priority Critical patent/KR101452601B1/en
Priority to JP2008517092A priority patent/JP2008547205A/en
Priority to KR1020117027342A priority patent/KR101191523B1/en
Priority to KR1020077029392A priority patent/KR101168786B1/en
Priority to CN200680029328XA priority patent/CN101796636B/en
Publication of WO2006138423A2 publication Critical patent/WO2006138423A2/en
Publication of WO2006138423A3 publication Critical patent/WO2006138423A3/en

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Abstract

A method of electrically joining a first contact on a first wafer with a second contact on a second wafer, the first contact, a rigid material, and the second contact, a material that is malleable relative to the rigid material, such that when brought together the rigid material will penetrate the malleable material, the rigid and malleable materials both being electrically conductive involves bringing the rigid material into contact with the malleable material, applying a force to one of the first contact or the second contact so as to cause the rigid material to penetrate the malleable material, heating the rigid and malleable material so as to cause the malleable material to soften, and constraining the malleable material to within a pre-specified area.
PCT/US2006/023246 2005-06-14 2006-06-14 Chip connector WO2006138423A2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020127008574A KR101452601B1 (en) 2005-06-14 2006-06-14 Chip connector
JP2008517092A JP2008547205A (en) 2005-06-14 2006-06-14 Chip connector
KR1020117027342A KR101191523B1 (en) 2005-06-14 2006-06-14 Chip connector
KR1020077029392A KR101168786B1 (en) 2005-06-14 2006-06-14 Chip connector
CN200680029328XA CN101796636B (en) 2005-06-14 2006-06-14 Chip connection method

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
US69075905P 2005-06-14 2005-06-14
US60/690,759 2005-06-14
US11/329,874 US20060278966A1 (en) 2005-06-14 2006-01-10 Contact-based encapsulation
US11/329,875 US7969015B2 (en) 2005-06-14 2006-01-10 Inverse chip connector
US11/329,875 2006-01-10
US11/329,575 US7884483B2 (en) 2005-06-14 2006-01-10 Chip connector
US11/329,575 2006-01-10
US11/329,874 2006-01-10
US11/422,551 US7847412B2 (en) 2005-06-14 2006-06-06 Isolating chip-to-chip contact

Publications (2)

Publication Number Publication Date
WO2006138423A2 WO2006138423A2 (en) 2006-12-28
WO2006138423A3 true WO2006138423A3 (en) 2009-06-04

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/023246 WO2006138423A2 (en) 2005-06-14 2006-06-14 Chip connector

Country Status (2)

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KR (1) KR101168786B1 (en)
WO (1) WO2006138423A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7748116B2 (en) * 2007-04-05 2010-07-06 John Trezza Mobile binding in an electronic connection
JP2009055004A (en) * 2007-08-24 2009-03-12 Honda Motor Co Ltd Through-wiring structure
KR102190382B1 (en) 2012-12-20 2020-12-11 삼성전자주식회사 Semiconductor package
CN115599025B (en) * 2022-12-12 2023-03-03 南京芯驰半导体科技有限公司 Resource grouping control system, method and storage medium of chip array

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5608264A (en) * 1995-06-05 1997-03-04 Harris Corporation Surface mountable integrated circuit with conductive vias
US20040126927A1 (en) * 2001-03-05 2004-07-01 Shih-Hsiung Lin Method of assembling chips
US20050230804A1 (en) * 2004-03-24 2005-10-20 Kazumasa Tanida Manufacturing method for semiconductor device, semiconductor device and semiconductor chip

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5608264A (en) * 1995-06-05 1997-03-04 Harris Corporation Surface mountable integrated circuit with conductive vias
US20040126927A1 (en) * 2001-03-05 2004-07-01 Shih-Hsiung Lin Method of assembling chips
US20050230804A1 (en) * 2004-03-24 2005-10-20 Kazumasa Tanida Manufacturing method for semiconductor device, semiconductor device and semiconductor chip

Also Published As

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WO2006138423A2 (en) 2006-12-28
KR101168786B1 (en) 2012-07-27
KR20080019622A (en) 2008-03-04

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