JP4155289B2 - 電気光学装置及び電子機器 - Google Patents
電気光学装置及び電子機器 Download PDFInfo
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- JP4155289B2 JP4155289B2 JP2005229129A JP2005229129A JP4155289B2 JP 4155289 B2 JP4155289 B2 JP 4155289B2 JP 2005229129 A JP2005229129 A JP 2005229129A JP 2005229129 A JP2005229129 A JP 2005229129A JP 4155289 B2 JP4155289 B2 JP 4155289B2
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- conductive member
- wiring
- metal powder
- substrate
- liquid crystal
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Description
金属粉は、その硬さが導電部材及び配線の少なくとも一方の硬さと同じまたはそれより硬いことを特徴としているので、間に配置された金属粉が潰れてしまい導電部材や配線に凹部を十分形成することができないことを防ぐことができる。
また、導電部材と配線との少なくとも一方は、金属粉によって、凹部を形成していることを特徴としているので、導電部材と配線との電気的接続面積を増加させることが可能となる。
また、「電子部品」とは、例えば液晶駆動用IC等の半導体装置や半導体素子、抵抗、コンデンサー等のことである。また、「配線」とは、例えばガラス基板に形成された電気配線や電子部品の端子であるバンプと電気的に接続される端子等を含む。更に「前記導電部材と前記配線とは面接触」とは、導電部材と配線とが直接接している場合の他、例えば導電部材及び配線の少なくともいずれか一方に生成された酸化膜を介して導電部材と配線とが接している場合も含むものとする。
また、本発明の一の形態によれば、前記基板は、電気光学装置用基板に電気的に接続された回路基板であることを特徴とする。
Claims (8)
- 基板と、
前記基板上に設けられた配線と、
前記基板側に突出して設けられた弾性体と、該弾性体の前記基板側表面に設けられた導電部材と、からなる端子を有する電子部品と、
前記導電部材と前記配線との間に配置され、前記導電部材と前記配線とに接触されてなるとともに、前記導電部材と前記配線との少なくともどちらか一方の硬さと同じ、若しくはそれよりも硬い金属粉を含む、前記基板と前記電子部品とを接続固定させる接着材と、を備え、
前記金属粉と前記導電部材、及び前記金属粉と前記配線との接触領域の少なくともどちらか一方側は、前記金属粉によって凹部が形成されてなるとともに、前記金属粉どうしの間の前記導電部材と前記配線とが面接触していることを特徴とする電気光学装置。 - 前記凹部は、前記導電部材側に形成されていることを特徴とする請求項1に記載の電気光学装置。
- 前記金属粉の大きさは、前記面接触となっている領域で、前記導電部材の厚みと前記配線の厚みとの合計より小さいことを特徴とする請求項1又は2に記載の電気光学装置。
- 前記基板は、電気光学装置用基板であることを特徴とする請求項1乃至3のいずれか一項に記載の電気光学装置。
- 前記基板は、電気光学装置用基板に電気的に接続された回路基板であることを特徴とする請求項1乃至3のいずれか一項に記載の電気光学装置。
- 前記接着材は、前記金属粉の添加量が0.5wt%以上で30wt%以下であることを特徴とする請求項1乃至5のいずれか一項に記載の電気光学装置。
- 前記導電部材及び配線の少なくとも一方は、その表面を覆うような酸化膜を有し、
前記酸化膜は、前記導電部材と前記配線とに接触して配置された金属粉により前記酸化膜の一部に開口部が形成されていることを特徴とする請求項1乃至6のいずれか一項に記載の電気光学装置。 - 請求項1乃至7のいずれか一項に記載する電気光学装置を備えたことを特徴とする電子機器。
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JP2005229129A JP4155289B2 (ja) | 2005-08-08 | 2005-08-08 | 電気光学装置及び電子機器 |
US11/462,460 US7470986B2 (en) | 2005-08-08 | 2006-08-04 | Mounting structure, electro-optical device, and electronic apparatus |
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JP2005229129A JP4155289B2 (ja) | 2005-08-08 | 2005-08-08 | 電気光学装置及び電子機器 |
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JP2008235556A (ja) * | 2007-03-20 | 2008-10-02 | Sumitomo Electric Ind Ltd | 配線板モジュール及び該配線板モジュールの製造方法 |
JP4525734B2 (ja) * | 2007-11-02 | 2010-08-18 | セイコーエプソン株式会社 | 電子部品の実装構造 |
JP2009186707A (ja) | 2008-02-06 | 2009-08-20 | Seiko Epson Corp | 電気光学装置の製造方法、電気光学装置 |
JP5263485B2 (ja) * | 2008-03-06 | 2013-08-14 | セイコーエプソン株式会社 | 半導体モジュールの製造方法 |
JP2010239022A (ja) * | 2009-03-31 | 2010-10-21 | Mitsui Mining & Smelting Co Ltd | フレキシブルプリント配線基板及びこれを用いた半導体装置 |
US8461532B2 (en) * | 2009-11-05 | 2013-06-11 | The Aerospace Corporation | Refraction assisted illumination for imaging |
US8138476B2 (en) | 2009-11-05 | 2012-03-20 | The Aerospace Corporation | Refraction assisted illumination for imaging |
US8450688B2 (en) | 2009-11-05 | 2013-05-28 | The Aerospace Corporation | Refraction assisted illumination for imaging |
US9007454B2 (en) | 2012-10-31 | 2015-04-14 | The Aerospace Corporation | Optimized illumination for imaging |
KR101526278B1 (ko) * | 2012-12-21 | 2015-06-05 | 제일모직주식회사 | 경화 필름과 도전 필름을 포함하는 분리형 이방 도전성 필름 |
CN106257975A (zh) * | 2015-06-18 | 2016-12-28 | 三星电机株式会社 | 用于屏蔽电磁波的片和无线充电装置 |
KR102405414B1 (ko) * | 2015-10-13 | 2022-06-07 | 주식회사 위츠 | 자기장 차폐 시트 및 이를 포함하는 무선 충전 장치 |
JP6769034B2 (ja) * | 2016-01-20 | 2020-10-14 | セイコーエプソン株式会社 | Memsデバイス、液体噴射ヘッド、および液体噴射装置 |
JP6834289B2 (ja) * | 2016-09-21 | 2021-02-24 | セイコーエプソン株式会社 | 実装構造体、超音波デバイス、超音波探触子、超音波装置、及び電子機器 |
CN112071819B (zh) * | 2019-06-11 | 2023-05-16 | 群创光电股份有限公司 | 电子装置 |
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US5001542A (en) * | 1988-12-05 | 1991-03-19 | Hitachi Chemical Company | Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips |
US5578527A (en) | 1995-06-23 | 1996-11-26 | Industrial Technology Research Institute | Connection construction and method of manufacturing the same |
US5749997A (en) | 1995-12-27 | 1998-05-12 | Industrial Technology Research Institute | Composite bump tape automated bonding method and bonded structure |
US5783465A (en) | 1997-04-03 | 1998-07-21 | Lucent Technologies Inc. | Compliant bump technology |
JP2001110831A (ja) | 1999-10-07 | 2001-04-20 | Seiko Epson Corp | 外部接続突起およびその形成方法、半導体チップ、回路基板ならびに電子機器 |
TW486721B (en) * | 2000-08-30 | 2002-05-11 | Acer Display Tech Inc | Plasma display having auxiliary bonding pad |
DE10163799B4 (de) | 2000-12-28 | 2006-11-23 | Matsushita Electric Works, Ltd., Kadoma | Halbleiterchip-Aufbausubstrat und Verfahren zum Herstellen eines solchen Aufbausubstrates |
JP3832334B2 (ja) | 2000-12-28 | 2006-10-11 | 松下電工株式会社 | 半導体チップ実装基板およびその製造方法 |
JP2004331910A (ja) * | 2003-05-12 | 2004-11-25 | Seiko Epson Corp | 異方導電性接着剤、実装方法、電気光学装置モジュールおよび電子機器 |
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