JP2007048801A - 実装構造体、電気光学装置及び電子機器 - Google Patents
実装構造体、電気光学装置及び電子機器 Download PDFInfo
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- JP2007048801A JP2007048801A JP2005229129A JP2005229129A JP2007048801A JP 2007048801 A JP2007048801 A JP 2007048801A JP 2005229129 A JP2005229129 A JP 2005229129A JP 2005229129 A JP2005229129 A JP 2005229129A JP 2007048801 A JP2007048801 A JP 2007048801A
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Abstract
【解決手段】接着材19に金属粉32を混在させて導電部材と配線としての電極用端子等との間に金属粉32を挟み込むこととしたので、導電部材、電極用端子等の接触表面に凹曲面を形成し、導電性である金属粉32を挟んだ領域も含め導電部材と電極用端子等との電気的接続面積を増加させる。
【選択図】 図5
Description
Claims (12)
- 基板と、
前記基板上に設けられた配線と、
前記基板側に突出する弾性体からなる突状部と、前記突状部の突出側表面に設けられ前記配線に電気的に接続される導電部材とを有する端子が、前記基板との実装面に備えられた電子部品と、
少なくとも一部が前記導電部材と前記配線との間に挟まれる金属粉が混在し、前記電子部品を前記基板に接続固定させる接着材と
を備え、
前記導電部材と前記配線とは、前記金属粉を挟み込むと共に前記導電部材と前記配線とが面接触してなることを特徴とする実装構造体。 - 電気光学装置用基板と、
前記電気光学装置用基板上に設けられた配線と、
前記電気光学装置用基板側に突出する弾性体からなる突状部と、前記突状部の突出側表面に設けられ前記配線に電気的に接続される導電部材とを有する端子が、前記電気光学装置用基板との実装面に備えられた電子部品と、
少なくとも一部が前記導電部材と前記配線との間に挟まれる金属粉が混在し、前記電子部品を前記電気光学装置用基板に接続固定させる接着材と
を備え、
前記導電部材と前記配線とは、前記金属粉を挟み込むと共に前記導電部材と前記配線とが面接触してなることを特徴とする電気光学装置。 - 前記金属粉は、その大きさが前記面接触となっている領域で、前記導電部材の前記突状部表面からの高さと前記配線の前記電気光学装置用基板表面からの高さとの合計より小さいことを特徴とする請求項2に記載の電気光学装置。
- 電気光学装置用基板と、
前記電気光学装置用基板に電気的に接続された回路基板と、
前記回路基板上に設けられた配線と、
前記回路基板側に突出する弾性体からなる突状部と、前記突状部の突出側表面に設けられ前記配線に電気的に接続される導電部材とを有する端子が、前記回路基板との実装面に備えられた電子部品と、
少なくとも一部が前記導電部材と前記配線との間に挟まれる金属粉が混在し、前記電子部品を前記回路基板に接続固定させる接着材と
を備え、
前記導電部材と前記配線とは、前記金属粉を挟み込むと共に前記導電部材と前記配線とが面接触してなることを特徴とする電気光学装置。 - 前記金属粉は、その大きさが前記面接触となっている領域で、前記導電部材の前記突状部表面からの高さと前記配線の前記回路基板表面からの高さとの合計より小さいことを特徴とする請求項4に記載の電気光学装置。
- 前記接着材は、前記金属粉の添加量が0.5wt%以上で30wt%以下であることを特徴とする請求項2から請求項5のうちのいずれか一項に記載の電気光学装置。
- 前記金属粉は、その硬さが前記導電部材及び配線の少なくとも一方の硬さと同じまたはそれより硬いことを特徴とする請求項2から請求項6のうちのいずれか一項に記載の電気光学装置。
- 前記金属粉は、前記導電部材と前記配線との少なくとも一方にめり込んでいることを特徴とする請求項2から請求項7のうちのいずれか一項に記載の電気光学装置。
- 前記導電部材及び配線の少なくとも一方は、その表面を覆うような酸化膜を有し、
前記酸化膜は、前記挟み込まれた金属粉により前記酸化膜の一部に開口部を有することを特徴とする請求項2から請求項8のうちのいずれか一項に記載の電気光学装置。 - 前記導電部材は、前記突状部上に設けられた第1導電部材と、その第1導電部材上に設けられた第2導電部材と、を有し、
前記第2導電部材は、金またはチタンを有することを特徴とする請求項2から請求項9のうちのいずれか一項に記載の電気光学装置。 - 前記金属粉は、その径が0.1μm以上で5μm以下であることを特徴とする請求項2から請求項10のうちのいずれか一項に記載の電気光学装置。
- 請求項2から請求項11のうちのいずれか一項に記載する電気光学装置を備えたことを特徴とする電子機器。
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JP2005229129A JP4155289B2 (ja) | 2005-08-08 | 2005-08-08 | 電気光学装置及び電子機器 |
US11/462,460 US7470986B2 (en) | 2005-08-08 | 2006-08-04 | Mounting structure, electro-optical device, and electronic apparatus |
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JP2009117476A (ja) * | 2007-11-02 | 2009-05-28 | Seiko Epson Corp | 電子部品の実装構造 |
JP2009212437A (ja) * | 2008-03-06 | 2009-09-17 | Seiko Epson Corp | 半導体モジュールの製造方法 |
US8016181B2 (en) | 2008-02-06 | 2011-09-13 | Seiko Epson Corporation | Method of producing electro-optical device using anisotropic conductive adhesive containing conductive particles to bond terminal portions and electro-optical device |
JP2018049933A (ja) * | 2016-09-21 | 2018-03-29 | セイコーエプソン株式会社 | 実装構造体、超音波デバイス、超音波探触子、超音波装置、及び電子機器 |
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JP2008235556A (ja) * | 2007-03-20 | 2008-10-02 | Sumitomo Electric Ind Ltd | 配線板モジュール及び該配線板モジュールの製造方法 |
JP2010239022A (ja) * | 2009-03-31 | 2010-10-21 | Mitsui Mining & Smelting Co Ltd | フレキシブルプリント配線基板及びこれを用いた半導体装置 |
US8461532B2 (en) * | 2009-11-05 | 2013-06-11 | The Aerospace Corporation | Refraction assisted illumination for imaging |
US8138476B2 (en) | 2009-11-05 | 2012-03-20 | The Aerospace Corporation | Refraction assisted illumination for imaging |
US8450688B2 (en) | 2009-11-05 | 2013-05-28 | The Aerospace Corporation | Refraction assisted illumination for imaging |
US9007454B2 (en) | 2012-10-31 | 2015-04-14 | The Aerospace Corporation | Optimized illumination for imaging |
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CN112071819B (zh) * | 2019-06-11 | 2023-05-16 | 群创光电股份有限公司 | 电子装置 |
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JP2009117476A (ja) * | 2007-11-02 | 2009-05-28 | Seiko Epson Corp | 電子部品の実装構造 |
JP4525734B2 (ja) * | 2007-11-02 | 2010-08-18 | セイコーエプソン株式会社 | 電子部品の実装構造 |
US8227914B2 (en) | 2007-11-02 | 2012-07-24 | Seiko Epson Corporation | Mounting structure of electronic component |
US8016181B2 (en) | 2008-02-06 | 2011-09-13 | Seiko Epson Corporation | Method of producing electro-optical device using anisotropic conductive adhesive containing conductive particles to bond terminal portions and electro-optical device |
JP2009212437A (ja) * | 2008-03-06 | 2009-09-17 | Seiko Epson Corp | 半導体モジュールの製造方法 |
JP2018049933A (ja) * | 2016-09-21 | 2018-03-29 | セイコーエプソン株式会社 | 実装構造体、超音波デバイス、超音波探触子、超音波装置、及び電子機器 |
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US7470986B2 (en) | 2008-12-30 |
JP4155289B2 (ja) | 2008-09-24 |
US20070031995A1 (en) | 2007-02-08 |
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