CN105390593A - 采用异方向导电胶封装的led热压机及热压工艺 - Google Patents

采用异方向导电胶封装的led热压机及热压工艺 Download PDF

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CN105390593A
CN105390593A CN201510955529.3A CN201510955529A CN105390593A CN 105390593 A CN105390593 A CN 105390593A CN 201510955529 A CN201510955529 A CN 201510955529A CN 105390593 A CN105390593 A CN 105390593A
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叶志伟
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    • H01L2224/481—Disposition
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
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Abstract

采用异方向导电胶封装的LED热压机，包括台架，台架上设置有垫板，垫板上方设置升降装置，升降装置下方连接有压板，压板下方一侧为与垫板配合的压合面，压板和/或垫板内设置有加热装置。本发明使得采用异方向导电胶应用于LED封装得以实现，采用本发明进行LED封装可以取代现有LED封装工艺中的焊线或超声波共晶设备，具有生产设备价格低廉，工艺简单，生产效率高，产品良率高和产品成本低等优点。

Description

采用异方向导电胶封装的LED热压机及热压工艺
技术领域
本发明涉及一种LED封装设备及其工艺，特别涉及一种采用异方向导电胶封装的LED热压机及其热压工艺。
背景技术
现有主流LED包括正装芯片和倒装芯片。正装芯片LED结构如图1所示，其封装工艺是先在LED支架01上固定芯片02，再在用焊线03将芯片正负极电极021分别与支架上的正负极电路011电连接，最后用环氧树脂密封。该工艺需要用到材料为金的导线和焊线工艺，焊线机是需要精确控制的设备，设备成本高，工艺复杂，产品制造成本高。倒装芯片LED结构如图2所示，其封装工艺是，先将芯片02倒装固定在支架01上，在采用超声波将芯片电极03与支架电路011熔合。该工艺也需要用到固晶和超声波熔合工序，设备成本高昂，工艺复杂。
本发明人之前发明了一种特殊的异方向导电胶，详见CN104910855A,利用该导电胶可以实现在固定芯片的同时实现芯片电极与支架电极垂直方向的电连接，而电极的平行方向保持电绝缘，该异方向导电胶让业界看到了改善现有封装工艺问题的曙光。
发明内容
为了克服现有技术的不足，本发明提供一种采用倒采用异方向导电胶封装的LED热压机。
本发明解决其技术问题所采用的技术手段是：采用异方向导电胶封装的LED热压机，包括台架，台架上设置有垫板，垫板上方设置升降装置，升降装置下方连接有压板，压板下方一侧为与垫板配合的压合面，压板和/或垫板内设置有加热装置。
本发明的有益效果是：本发明使得采用异方向导电胶应用于LED封装得以实现，采用本发明进行LED封装可以取代现有LED封装工艺中的焊线或超声波共晶设备，具有生产设备价格低廉，工艺简单，生产效率高，产品良率高和产品成本低等优点。
本发明还提供一种采用上述LED热压机的热压工艺:包括如下步骤：
1.将LED支架模组放置在所述垫板上；
2.将异方向导电胶滴在LED支架的正负电极上；
3.将芯片放置在异方向导电胶上，芯片正负电极分别与支架正负极电路对齐；
4.启动液压装置，将压板压迫芯片，直至芯片正负极与支架正负极电路电接触；
5.压板加热至200～270℃，定位板加热至60～80℃；
6.压板的保压时间与压板温度的关系为：250～270℃/30秒,220～250℃/60秒,200～220℃/120秒。
附图说明
图1为现有技术正装芯片LED结构示意图。
图2为现有技术倒装芯片LED结构示意图。
图3为本发明热压机总体结构结构示意图。
图4为本发明压板和垫板内加热结构示意图。
图5为本发明压板压合面结构示意图。
图6为LED支架模块结构示意图。
图7为本发明热压机压合状态示意图。
图8为图7A-A方向剖视图之一。
图9为图7A-A方向剖视图之二。
具体实施方式
下面结合附图和实施例对本发明作进一步详细的说明。
参考图3，采用异方向导电胶封装的LED热压机，其下部结构为台架1，台架1由三面正交的围板构成支撑部11，一面留空为操作者的作业空间，支撑部11上横跨有平板作为工作台12。工作台12中央设置垫板2，垫板2中央为外形与LED支架模块相适应的内凹状定位区21，便于LED支架模块00定位。沿工作台12外边缘向上竖立设置有主机支撑架3，主机支撑架3内安装有液压升降装置4。液压升降装置4包括有机体41，机体41与支撑架3固定，机体41下方连接有升降套筒42，升降套筒42由机体41内的液压设备驱动可以产生上下伸缩运动。为节约成本，所述液压升降装置4也可以采用手摇式升降装置。升降套筒42下连接有安装板43，安装板43内镶嵌压板5，压板5上侧为与安装板43连接的安装面51，压板5下侧为与垫板2配合的压合面52。对应于COB型的LED,压板5的压合面52可以采用光滑的平面。对应与SMD型的LED,由于SMD型LED具有内凹结构的杯碗012，故压板5的压合面52需要设置多个对应的凸起521，如图5所示。如图4所示，压板5和垫板2内设置有电热丝或电热棒作为加热装置6。也可以仅在压板5或垫板2内设置加热装置6。
此外，本发明采用异方向导电胶封装的LED热压机，还包括一控制系统7。控制系统7可以通过操作者的设定，对液压升降装置4进行自动控制，具体包括控制压板5的升降行程，升降时间，压力和保压时间等。控制系统7还可以通过操作者的设定，对加热装置6进行自动控制，具体包括压板5和垫板2的加热时间、温度控制和保温时间时间等。利用该控制系统7使得本发明可以实现连续自动生产。
以下再结合本发明的结构特点对发明的使用和生产工艺进行说明。
以SMD型的LED为例。如图6所示，其支架模块00中包括有多个SMD支架01和连结各SMD支架的框架001，支架01内包括有电路011和杯碗012。由于SMD型LED具有内凹结构的杯碗012，压板5的压合面52需要设置多个对应的凸起521。如图7和图8所示，首先将支架模块00放置在垫板2的定位区21上定位，然后将异方向导电胶04滴在支架01的正负极电路011上。再将芯片02放置在异方向导电胶04上，芯片正负电极021分别与支架正负极电路011对齐。启动液压装置4，压板5向下运动，直至压板5压合面52上的凸起521接触芯片2，进而压迫芯2，直至被夹持在芯片电极021和支架正负极电路011之间的导电粒子041破裂，导电粉体被释放出来，导通芯片电极021与支架电路011，压板5停止下压运动，此时，处于芯片电极021与支架电路011之外的导电粒子依然保持完好，保持绝缘状态，不会导致芯片02正负电极短路。压板5下压运动停止点的控制可以通过行程控制，也可以通过检查芯片电极021与支架电路011之间是否电导通来控制。然后，启动加热装置6对压板5和定位板2进行加热，使异方向导电胶04固化，固定芯片02。压板5温度控制在200～270℃；定位板2的温度控制在60～80℃,其中最佳温度为70℃。通过对压板5和定位板2同时但有区别的加热，可以提高生产效率和产品良率。最后压板5的保压时间与压板温度的关系为：250～270℃/30秒,220～250℃/60秒,200～220℃/120秒。
COB型LED的热压工艺与SMD相似，其不同之处在于压板5的形状。参照图9，由于COB型LED支架不具有内凹状的杯碗，其压板5的压合面52为光滑平面，压板5向下运动时，压合面52直接压迫在芯片02的表面上。

Claims (8)

1.采用异方向导电胶封装的LED热压机，其特征在于：包括台架，台架上设置有垫板，垫板上方设置升降装置，升降装置下方连接有压板，压板下方一侧为与垫板配合的压合面，压板和/或垫板内设置有加热装置。
2.根据权利要求1所述的采用异方向导电胶封装的LED热压机，其特征在于：所述压合面上设置有多个凸起。
3.根据权利要求1所述的采用异方向导电胶封装的LED热压机，其特征在于：所述升降装置为液压升降装置，所述液压升降装置通过升降套筒与压板连接。
4.根据权利要求3所述的采用异方向导电胶封装的LED热压机，其特征在于：所述液压升降装置连接有可控制压板压合时间和升降行程自动控制系统。
5.根据权利要求1所述的采用异方向导电胶封装的LED热压机，其特征在于：所述加热装置连接有自动控制系统，控制加热温和加热时间。
6.根据权利要求1所述的采用异方向导电胶封装的LED热压机，其特征在于：所述加热装置为电热棒或电热丝。
7.根据权利要求1所述的采用异方向导电胶封装的LED热压机，其特征在于：所述压合面为光滑平面。
8.采用权利要求1所述热压机的LED热压工艺，其特征在于包括如下步骤：
(1)将LED支架模组放置在所述垫板上；
(2)将异方向导电胶滴在LED支架的正负电极上；
(3)将芯片放置在异方向导电胶上，芯片正负电极分别与支架正负极电路对齐；
(4)启动液压装置，将压板压迫芯片，直至芯片正负极与支架正负极电路导通；
(5)压板加热至200～270℃，定位板加热至60～80℃；
(6)压板的保压时间与压板温度的关系为：250～270℃/30秒,220～250℃/60秒,200～220℃/120秒。
CN201510955529.3A 2015-12-17 2015-12-17 采用异方向导电胶封装的led热压机及热压工艺 Pending CN105390593A (zh)

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