TWD155016S - 聚焦環 - Google Patents
聚焦環Info
- Publication number
- TWD155016S TWD155016S TW101301749F TW101301749F TWD155016S TW D155016 S TWD155016 S TW D155016S TW 101301749 F TW101301749 F TW 101301749F TW 101301749 F TW101301749 F TW 101301749F TW D155016 S TWD155016 S TW D155016S
- Authority
- TW
- Taiwan
- Prior art keywords
- main body
- item
- creation
- ring
- focusing ring
- Prior art date
Links
Abstract
【物品用途】;本創作的物品是聚焦環,主要由單晶矽環件所組成,設置於電漿處理裝置之腔體中,可將產生在半導體晶圓上的電漿分布擴大至本聚焦環附近。;【創作特點】;由各視圖觀之,本創作本體呈薄圓環形體,中間為中空部,本體上方內側處設有一斜面,該斜面向內側呈較大之傾斜度後向下延伸,由放大剖視圖觀之,本體外輪廓呈一方形部;由使用狀態參考圖觀之,本物品設置於腔體內並環繞於承座台上之半導體晶圓外側,且相對於電漿淋浴頭。
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011022451 | 2011-09-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWD155016S true TWD155016S (zh) | 2013-08-01 |
Family
ID=51178372
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101301749F TWD155016S (zh) | 2011-09-30 | 2012-03-30 | 聚焦環 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | USD709538S1 (zh) |
| TW (1) | TWD155016S (zh) |
Families Citing this family (40)
| Publication number | Priority date | Publication date | Assignee | Title |
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| USD766849S1 (en) * | 2013-05-15 | 2016-09-20 | Ebara Corporation | Substrate retaining ring |
| TWD169790S (zh) * | 2013-07-10 | 2015-08-11 | 日立國際電氣股份有限公司 | 基板處理裝置用氣化器之部分 |
| JP1546800S (zh) | 2015-06-12 | 2016-03-28 | ||
| JP1545406S (zh) * | 2015-06-16 | 2016-03-14 | ||
| JP1545407S (zh) * | 2015-06-16 | 2016-03-14 | ||
| JP1549880S (zh) * | 2015-08-06 | 2016-05-23 | ||
| JP1550115S (zh) * | 2015-08-18 | 2016-05-23 | ||
| JP1549882S (zh) * | 2015-08-18 | 2016-05-23 | ||
| USD810705S1 (en) * | 2016-04-01 | 2018-02-20 | Veeco Instruments Inc. | Self-centering wafer carrier for chemical vapor deposition |
| USD797691S1 (en) * | 2016-04-14 | 2017-09-19 | Applied Materials, Inc. | Composite edge ring |
| USD839224S1 (en) * | 2016-12-12 | 2019-01-29 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing |
| JP1584906S (zh) * | 2017-01-31 | 2017-08-28 | ||
| JP1584241S (zh) * | 2017-01-31 | 2017-08-21 | ||
| JP1643123S (zh) | 2018-07-25 | 2019-10-07 | ||
| JP1643124S (zh) | 2018-07-25 | 2019-10-07 | ||
| JP1643125S (zh) | 2018-07-25 | 2019-10-07 | ||
| JP1642984S (zh) | 2018-07-25 | 2019-10-07 | ||
| JP1642983S (zh) | 2018-07-25 | 2019-10-07 | ||
| USD933725S1 (en) * | 2019-02-08 | 2021-10-19 | Applied Materials, Inc. | Deposition ring for a substrate processing chamber |
| USD900176S1 (en) * | 2019-03-19 | 2020-10-27 | Makerbot Industries, Llc | Spool for filament of a three-dimensional printer |
| USD900178S1 (en) * | 2019-03-20 | 2020-10-27 | Makerbot Industries, Llc | Spool for filament of a three-dimensional printer |
| USD979524S1 (en) * | 2020-03-19 | 2023-02-28 | Applied Materials, Inc. | Confinement liner for a substrate processing chamber |
| USD943539S1 (en) | 2020-03-19 | 2022-02-15 | Applied Materials, Inc. | Confinement plate for a substrate processing chamber |
| USD934315S1 (en) * | 2020-03-20 | 2021-10-26 | Applied Materials, Inc. | Deposition ring for a substrate processing chamber |
| USD933726S1 (en) * | 2020-07-31 | 2021-10-19 | Applied Materials, Inc. | Deposition ring for a semiconductor processing chamber |
| US11581166B2 (en) | 2020-07-31 | 2023-02-14 | Applied Materials, Inc. | Low profile deposition ring for enhanced life |
| USD1049067S1 (en) * | 2022-04-04 | 2024-10-29 | Applied Materials, Inc. | Ring for an anti-rotation process kit for a substrate processing chamber |
| USD1066275S1 (en) | 2022-04-04 | 2025-03-11 | Applied Materials, Inc. | Baffle for anti-rotation process kit for substrate processing chamber |
| JP1741174S (ja) * | 2022-10-20 | 2023-04-06 | サセプタ | |
| JP1745925S (ja) * | 2022-10-20 | 2023-06-08 | サセプタカバー | |
| JP1745873S (ja) * | 2022-10-20 | 2023-06-08 | サセプタ | |
| JP1741172S (ja) * | 2022-10-20 | 2023-04-06 | サセプタカバー | |
| JP1741176S (ja) * | 2022-10-20 | 2023-04-06 | サセプタ用カバーベース | |
| JP1746406S (ja) * | 2023-01-11 | 2023-06-15 | サセプタユニット | |
| JP1746407S (ja) * | 2023-01-11 | 2023-06-15 | サセプタ | |
| JP1746405S (ja) * | 2023-01-11 | 2023-06-15 | サセプタカバー | |
| JP1746403S (ja) * | 2023-01-11 | 2023-06-15 | サセプタ | |
| JP1746408S (ja) * | 2023-01-11 | 2023-06-15 | サセプタ | |
| JP1782543S (ja) * | 2023-09-29 | 2024-10-17 | プラズマ処理装置用サセプタリング | |
| JP1782485S (ja) * | 2023-09-29 | 2024-10-17 | プラズマ処理装置用サセプタリング |
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| JP1438745S (zh) * | 2011-09-20 | 2015-04-06 | ||
| JP1438319S (zh) * | 2011-09-20 | 2015-04-06 |
-
2012
- 2012-03-29 US US29/417,077 patent/USD709538S1/en active Active
- 2012-03-30 TW TW101301749F patent/TWD155016S/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| USD709538S1 (en) | 2014-07-22 |
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