USD709538S1 - Focusing ring - Google Patents

Focusing ring Download PDF

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Publication number
USD709538S1
USD709538S1 US29/417,077 US201229417077F USD709538S US D709538 S1 USD709538 S1 US D709538S1 US 201229417077 F US201229417077 F US 201229417077F US D709538 S USD709538 S US D709538S
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United States
Prior art keywords
focusing ring
view
focusing
ring
ornamental design
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Active
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US29/417,077
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English (en)
Inventor
Shunsuke Mizukami
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Assigned to TOKYO ELECTRON LIMITED reassignment TOKYO ELECTRON LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MIZUKAMI, SHUNSUKE
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Publication of USD709538S1 publication Critical patent/USD709538S1/en
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US29/417,077 2011-09-30 2012-03-29 Focusing ring Active USD709538S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPD2011-022451 2011-09-30
JP2011022451 2011-09-30

Publications (1)

Publication Number Publication Date
USD709538S1 true USD709538S1 (en) 2014-07-22

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ID=51178372

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Application Number Title Priority Date Filing Date
US29/417,077 Active USD709538S1 (en) 2011-09-30 2012-03-29 Focusing ring

Country Status (2)

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US (1) USD709538S1 (zh)
TW (1) TWD155016S (zh)

Cited By (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD741823S1 (en) * 2013-07-10 2015-10-27 Hitachi Kokusai Electric Inc. Vaporizer for substrate processing apparatus
USD766849S1 (en) * 2013-05-15 2016-09-20 Ebara Corporation Substrate retaining ring
USD770992S1 (en) 2015-06-12 2016-11-08 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD795208S1 (en) * 2015-08-18 2017-08-22 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing equipment
USD797691S1 (en) * 2016-04-14 2017-09-19 Applied Materials, Inc. Composite edge ring
USD802472S1 (en) * 2015-08-06 2017-11-14 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing equipment
USD803917S1 (en) * 2015-06-16 2017-11-28 Hitachi Kokusai Electric, Inc. Heat reflector for substrate processing apparatus
USD803802S1 (en) * 2015-08-18 2017-11-28 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing equipment
USD804556S1 (en) * 2015-06-16 2017-12-05 Hitachi Kokusai Electric Inc. Heat reflector for substrate processing apparatus
USD810705S1 (en) * 2016-04-01 2018-02-20 Veeco Instruments Inc. Self-centering wafer carrier for chemical vapor deposition
USD827592S1 (en) * 2017-01-31 2018-09-04 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD839224S1 (en) * 2016-12-12 2019-01-29 Ebara Corporation Elastic membrane for semiconductor wafer polishing
USD840364S1 (en) * 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD900176S1 (en) * 2019-03-19 2020-10-27 Makerbot Industries, Llc Spool for filament of a three-dimensional printer
USD900178S1 (en) * 2019-03-20 2020-10-27 Makerbot Industries, Llc Spool for filament of a three-dimensional printer
TWD208176S (zh) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 半導體製造用晶圓支持器
TWD208177S (zh) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 半導體製造用晶圓支持器
TWD208174S (zh) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 半導體製造用晶圓支持器
TWD208175S (zh) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 半導體製造用晶圓支持器
TWD208178S (zh) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 半導體製造用晶圓支持器之部分
USD933725S1 (en) * 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD933726S1 (en) * 2020-07-31 2021-10-19 Applied Materials, Inc. Deposition ring for a semiconductor processing chamber
USD934315S1 (en) * 2020-03-20 2021-10-26 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD943539S1 (en) * 2020-03-19 2022-02-15 Applied Materials, Inc. Confinement plate for a substrate processing chamber
US11581166B2 (en) 2020-07-31 2023-02-14 Applied Materials, Inc. Low profile deposition ring for enhanced life
USD979524S1 (en) * 2020-03-19 2023-02-28 Applied Materials, Inc. Confinement liner for a substrate processing chamber
USD1049067S1 (en) * 2022-04-04 2024-10-29 Applied Materials, Inc. Ring for an anti-rotation process kit for a substrate processing chamber

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Taiwan Office Action, Application D101301750, mailed Oct. 24, 2012.

Cited By (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD766849S1 (en) * 2013-05-15 2016-09-20 Ebara Corporation Substrate retaining ring
USD793976S1 (en) 2013-05-15 2017-08-08 Ebara Corporation Substrate retaining ring
USD741823S1 (en) * 2013-07-10 2015-10-27 Hitachi Kokusai Electric Inc. Vaporizer for substrate processing apparatus
USD770992S1 (en) 2015-06-12 2016-11-08 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD803917S1 (en) * 2015-06-16 2017-11-28 Hitachi Kokusai Electric, Inc. Heat reflector for substrate processing apparatus
USD804556S1 (en) * 2015-06-16 2017-12-05 Hitachi Kokusai Electric Inc. Heat reflector for substrate processing apparatus
USD802472S1 (en) * 2015-08-06 2017-11-14 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing equipment
USD795208S1 (en) * 2015-08-18 2017-08-22 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing equipment
USD803802S1 (en) * 2015-08-18 2017-11-28 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing equipment
USD810705S1 (en) * 2016-04-01 2018-02-20 Veeco Instruments Inc. Self-centering wafer carrier for chemical vapor deposition
USD797691S1 (en) * 2016-04-14 2017-09-19 Applied Materials, Inc. Composite edge ring
USD913977S1 (en) 2016-12-12 2021-03-23 Ebara Corporation Elastic membrane for semiconductor wafer polishing
USD839224S1 (en) * 2016-12-12 2019-01-29 Ebara Corporation Elastic membrane for semiconductor wafer polishing
USD840364S1 (en) * 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD827592S1 (en) * 2017-01-31 2018-09-04 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
TWD208178S (zh) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 半導體製造用晶圓支持器之部分
TWD208176S (zh) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 半導體製造用晶圓支持器
TWD208177S (zh) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 半導體製造用晶圓支持器
TWD208174S (zh) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 半導體製造用晶圓支持器
TWD208175S (zh) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 半導體製造用晶圓支持器
USD933725S1 (en) * 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD900176S1 (en) * 2019-03-19 2020-10-27 Makerbot Industries, Llc Spool for filament of a three-dimensional printer
USD900178S1 (en) * 2019-03-20 2020-10-27 Makerbot Industries, Llc Spool for filament of a three-dimensional printer
USD943539S1 (en) * 2020-03-19 2022-02-15 Applied Materials, Inc. Confinement plate for a substrate processing chamber
USD979524S1 (en) * 2020-03-19 2023-02-28 Applied Materials, Inc. Confinement liner for a substrate processing chamber
USD986190S1 (en) 2020-03-19 2023-05-16 Applied Materials, Inc. Confinement plate for a substrate processing chamber
USD934315S1 (en) * 2020-03-20 2021-10-26 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD933726S1 (en) * 2020-07-31 2021-10-19 Applied Materials, Inc. Deposition ring for a semiconductor processing chamber
US11581166B2 (en) 2020-07-31 2023-02-14 Applied Materials, Inc. Low profile deposition ring for enhanced life
USD1049067S1 (en) * 2022-04-04 2024-10-29 Applied Materials, Inc. Ring for an anti-rotation process kit for a substrate processing chamber

Also Published As

Publication number Publication date
TWD155016S (zh) 2013-08-01

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