TW552722B - Light emitting device - Google Patents

Light emitting device Download PDF

Info

Publication number
TW552722B
TW552722B TW091106884A TW91106884A TW552722B TW 552722 B TW552722 B TW 552722B TW 091106884 A TW091106884 A TW 091106884A TW 91106884 A TW91106884 A TW 91106884A TW 552722 B TW552722 B TW 552722B
Authority
TW
Taiwan
Prior art keywords
light
resin
emitting device
emitting element
item
Prior art date
Application number
TW091106884A
Other languages
English (en)
Chinese (zh)
Inventor
Kenji Shimomura
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=18962398&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TW552722(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Toshiba Corp filed Critical Toshiba Corp
Application granted granted Critical
Publication of TW552722B publication Critical patent/TW552722B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Led Device Packages (AREA)
TW091106884A 2001-04-09 2002-04-04 Light emitting device TW552722B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001110675A JP2002314139A (ja) 2001-04-09 2001-04-09 発光装置

Publications (1)

Publication Number Publication Date
TW552722B true TW552722B (en) 2003-09-11

Family

ID=18962398

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091106884A TW552722B (en) 2001-04-09 2002-04-04 Light emitting device

Country Status (6)

Country Link
US (1) US6710377B2 (https=)
EP (1) EP1249875B2 (https=)
JP (1) JP2002314139A (https=)
CN (1) CN1262023C (https=)
DE (1) DE60239173D1 (https=)
TW (1) TW552722B (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8497145B2 (en) 2007-11-29 2013-07-30 Osram Opto Semiconductors Gmbh Method for producing an optoelectronic component and optoelectronic component
TWI550897B (zh) * 2003-10-22 2016-09-21 克立公司 功率式表面安裝之發光晶粒封裝

Families Citing this family (75)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10033502A1 (de) * 2000-07-10 2002-01-31 Osram Opto Semiconductors Gmbh Optoelektronisches Modul, Verfahren zu dessen Herstellung und dessen Verwendung
JP2002314138A (ja) * 2001-04-09 2002-10-25 Toshiba Corp 発光装置
JP4101468B2 (ja) * 2001-04-09 2008-06-18 豊田合成株式会社 発光装置の製造方法
DE20301627U1 (de) 2003-01-30 2003-04-17 OSA Opto Light GmbH, 12555 Berlin Optoelektronisches SMD-Bauelement für nicht axiale Anwendungen
DE10307800A1 (de) * 2003-02-24 2004-09-02 Vishay Semiconductor Gmbh Halbleiterbauteil
TW200427111A (en) * 2003-03-12 2004-12-01 Shinetsu Chemical Co Material for coating/protecting light-emitting semiconductor and the light-emitting semiconductor device
JP4599857B2 (ja) * 2003-04-24 2010-12-15 日亜化学工業株式会社 半導体装置及びその製造方法
JP4645071B2 (ja) * 2003-06-20 2011-03-09 日亜化学工業株式会社 パッケージ成型体およびそれを用いた半導体装置
JP4586967B2 (ja) * 2003-07-09 2010-11-24 信越化学工業株式会社 発光半導体被覆保護材及び発光半導体装置
TWI373150B (en) 2003-07-09 2012-09-21 Shinetsu Chemical Co Silicone rubber composition, light-emitting semiconductor embedding/protecting material and light-emitting semiconductor device
US6995402B2 (en) * 2003-10-03 2006-02-07 Lumileds Lighting, U.S., Llc Integrated reflector cup for a light emitting device mount
US7276782B2 (en) * 2003-10-31 2007-10-02 Harvatek Corporation Package structure for semiconductor
JP4150980B2 (ja) * 2003-11-04 2008-09-17 信越半導体株式会社 発光素子
JP4803339B2 (ja) 2003-11-20 2011-10-26 信越化学工業株式会社 エポキシ・シリコーン混成樹脂組成物及び発光半導体装置
US7329904B2 (en) * 2004-01-30 2008-02-12 Toyoda Gosei Co., Ltd. LED lamp device
JP4300418B2 (ja) 2004-04-30 2009-07-22 信越化学工業株式会社 エポキシ・シリコーン混成樹脂組成物及び発光半導体装置
US20050280016A1 (en) * 2004-06-17 2005-12-22 Mok Thye L PCB-based surface mount LED device with silicone-based encapsulation structure
US20060006791A1 (en) * 2004-07-06 2006-01-12 Chia Chee W Light emitting diode display that does not require epoxy encapsulation of the light emitting diode
US20060046327A1 (en) * 2004-08-30 2006-03-02 Nan Ya Plastics Corporation High heat dissipation LED device and its manufacturing method
KR100709890B1 (ko) * 2004-09-10 2007-04-20 서울반도체 주식회사 다중 몰딩수지를 갖는 발광다이오드 패키지
WO2006059828A1 (en) * 2004-09-10 2006-06-08 Seoul Semiconductor Co., Ltd. Light emitting diode package having multiple molding resins
DE102005043928B4 (de) * 2004-09-16 2011-08-18 Sharp Kk Optisches Halbleiterbauteil und Verfahren zu dessen Herstellung
DE102004045950A1 (de) 2004-09-22 2006-03-30 Osram Opto Semiconductors Gmbh Gehäuse für ein optoelektronisches Bauelement, optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements
US7748873B2 (en) 2004-10-07 2010-07-06 Seoul Semiconductor Co., Ltd. Side illumination lens and luminescent device using the same
CN100382287C (zh) * 2004-10-12 2008-04-16 宏齐科技股份有限公司 一种半导体的封装结构
US20060092644A1 (en) * 2004-10-28 2006-05-04 Mok Thye L Small package high efficiency illuminator design
JP4634810B2 (ja) * 2005-01-20 2011-02-16 信越化学工業株式会社 シリコーン封止型ｌｅｄ
JP5694875B2 (ja) * 2005-02-23 2015-04-01 三菱化学株式会社 半導体発光デバイス用部材及びその製造方法、並びにそれを用いた半導体発光デバイス
TWI382077B (zh) 2005-02-23 2013-01-11 三菱化學股份有限公司 半導體發光裝置用構件及其製造方法，暨使用其之半導體發光裝置
CN100377376C (zh) * 2005-03-21 2008-03-26 亿光电子工业股份有限公司 发光二极管反射盖制造方法
JP2006269531A (ja) * 2005-03-22 2006-10-05 Matsushita Electric Ind Co Ltd 光半導体装置
JP4744178B2 (ja) 2005-04-08 2011-08-10 シャープ株式会社 発光ダイオード
US20060270808A1 (en) * 2005-05-24 2006-11-30 Shin-Etsu Chemical Co., Ltd. Epoxy-silicone mixed resin composition, cured article thereof, and light-emitting semiconductor device
DE102005034122A1 (de) * 2005-07-21 2007-02-08 Wacker Chemie Ag Siliconharzverguss von Leuchtdioden
US7952108B2 (en) * 2005-10-18 2011-05-31 Finisar Corporation Reducing thermal expansion effects in semiconductor packages
KR100691440B1 (ko) * 2005-11-15 2007-03-09 삼성전기주식회사 Ｌｅｄ 패키지
JP2007194401A (ja) * 2006-01-19 2007-08-02 Showa Denko Kk 化合物半導体発光素子を用いたｌｅｄパッケージ
US8044412B2 (en) 2006-01-20 2011-10-25 Taiwan Semiconductor Manufacturing Company, Ltd Package for a light emitting element
DE102006030003A1 (de) 2006-05-11 2007-11-15 Wacker Chemie Ag Siliconharzbeschichtung für elektronische Bauteile
JP5141107B2 (ja) * 2006-06-27 2013-02-13 三菱化学株式会社 照明装置
WO2008001799A1 (fr) 2006-06-27 2008-01-03 Mitsubishi Chemical Corporation Dispositif d'éclairage
JP5205724B2 (ja) * 2006-08-04 2013-06-05 日亜化学工業株式会社 発光装置
US20080049445A1 (en) * 2006-08-25 2008-02-28 Philips Lumileds Lighting Company, Llc Backlight Using High-Powered Corner LED
KR101258227B1 (ko) 2006-08-29 2013-04-25 서울반도체 주식회사 발광 소자
KR100828900B1 (ko) 2006-09-04 2008-05-09 엘지이노텍 주식회사 발광 다이오드 패키지 및 그 제조방법
JP5380774B2 (ja) 2006-12-28 2014-01-08 日亜化学工業株式会社 表面実装型側面発光装置及びその製造方法
KR101119172B1 (ko) * 2007-02-05 2012-03-21 삼성전자주식회사 발광 다이오드 모듈 및 이를 구비한 표시 장치
DE102007025749A1 (de) * 2007-06-01 2008-12-11 Wacker Chemie Ag Leuchtkörper-Silicon-Formteil
JP5052326B2 (ja) * 2007-10-31 2012-10-17 シャープ株式会社 チップ部品型ｌｅｄ及びその製造方法
JP5136963B2 (ja) * 2008-03-24 2013-02-06 信越化学工業株式会社 硬化性シリコーンゴム組成物及び半導体装置
JP2010031149A (ja) * 2008-07-29 2010-02-12 Shin-Etsu Chemical Co Ltd 光半導体素子封止用樹脂組成物
WO2010044023A1 (en) * 2008-10-17 2010-04-22 Koninklijke Philips Electronics N.V. Light emitting device
TWI384591B (zh) * 2008-11-17 2013-02-01 億光電子工業股份有限公司 發光二極體電路板
JP5333758B2 (ja) * 2009-02-27 2013-11-06 東芝ライテック株式会社 照明装置および照明器具
US20100289055A1 (en) * 2009-05-14 2010-11-18 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Silicone leaded chip carrier
JP5305452B2 (ja) 2009-06-12 2013-10-02 信越化学工業株式会社 光半導体素子封止用樹脂組成物
JP5354191B2 (ja) * 2009-06-30 2013-11-27 東芝ライテック株式会社 電球形ランプおよび照明器具
JP2011049527A (ja) 2009-07-29 2011-03-10 Toshiba Lighting & Technology Corp Ｌｅｄ照明装置
US8678618B2 (en) 2009-09-25 2014-03-25 Toshiba Lighting & Technology Corporation Self-ballasted lamp having a light-transmissive member in contact with light emitting elements and lighting equipment incorporating the same
JP5257622B2 (ja) 2010-02-26 2013-08-07 東芝ライテック株式会社 電球形ランプおよび照明器具
JP5489280B2 (ja) 2010-04-07 2014-05-14 信越化学工業株式会社 光半導体封止用エポキシ組成物
JP2012019062A (ja) 2010-07-08 2012-01-26 Shin Etsu Chem Co Ltd 発光半導体装置、実装基板及びそれらの製造方法
KR101626412B1 (ko) 2010-12-24 2016-06-02 삼성전자주식회사 발광소자 패키지 및 그 제조방법
DE102011100028A1 (de) * 2011-04-29 2012-10-31 Osram Opto Semiconductors Gmbh Bauelement und Verfahren zur Herstellung eines Bauelements
KR101830717B1 (ko) * 2011-06-30 2018-02-21 엘지이노텍 주식회사 발광 소자 패키지
JP5682497B2 (ja) * 2011-07-29 2015-03-11 信越化学工業株式会社 表面実装型発光装置の製造方法及びリフレクター基板
CN102623623A (zh) * 2012-03-26 2012-08-01 李海涛 一种软胶保护内芯的表面贴装式led装置
JP5721668B2 (ja) * 2012-06-29 2015-05-20 シャープ株式会社 発光装置、照明装置および表示装置用バックライト
JP2014120515A (ja) * 2012-12-13 2014-06-30 Shin Etsu Chem Co Ltd 光学半導体装置用基板とその製造方法、集合基板、及び光学半導体装置とその製造方法
JP6707369B2 (ja) 2015-03-30 2020-06-10 ダウ・東レ株式会社 シリコーン材料、硬化性シリコーン組成物、および光デバイス
CN105316564B (zh) * 2015-06-08 2017-05-17 天津达祥精密工业有限公司 采用喂丝球化处理的高镍奥氏体球墨铸铁生产工艺
JP6679306B2 (ja) * 2015-12-28 2020-04-15 シャープ株式会社 発光素子の製造方法
EP3888140B1 (en) * 2018-11-29 2022-08-24 Lumileds LLC Light-emitting device and method of packaging the same
US11600754B2 (en) 2018-11-29 2023-03-07 Lumileds Llc Light-emitting device and method of packaging the same
CN114784170A (zh) * 2022-04-14 2022-07-22 佛山市国星光电股份有限公司 一种led支架、支架的制备方法、发光器件及支架阵列

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6254974A (ja) * 1985-09-04 1987-03-10 Mitsubishi Electric Corp 光結合半導体装置
JP2715792B2 (ja) * 1992-02-13 1998-02-18 信越化学工業株式会社 光透過性エポキシ樹脂組成物及び光半導体装置
JPH065742A (ja) * 1992-06-22 1994-01-14 Mitsubishi Electric Corp 半導体装置、その封止に用いられる樹脂および半導体装置の製造方法
JPH07111343A (ja) * 1993-10-13 1995-04-25 Matsushita Electron Corp 光電装置
DE69428578T2 (de) * 1993-12-16 2002-06-27 Sharp K.K., Osaka Herstellungsverfahren für lichtemittierenden Halbleitervorrichtungen
JP3648756B2 (ja) * 1994-03-22 2005-05-18 Ｊｓｒ株式会社 半導体素子用コーテイング材
JPH07278438A (ja) * 1994-04-14 1995-10-24 Toray Dow Corning Silicone Co Ltd 電子部品含浸用硬化性オルガノポリシロキサン組成物および電子部品
US5832600A (en) * 1995-06-06 1998-11-10 Seiko Epson Corporation Method of mounting electronic parts
JP3393247B2 (ja) * 1995-09-29 2003-04-07 ソニー株式会社 光学装置およびその製造方法
JPH09246423A (ja) * 1996-03-13 1997-09-19 Hitachi Ltd 半導体装置
JP3034363U (ja) * 1996-05-01 1997-02-18 武雄 稲垣 発光素子を内蔵した表示灯
JP3492178B2 (ja) * 1997-01-15 2004-02-03 株式会社東芝 半導体発光装置及びその製造方法
US6274890B1 (en) * 1997-01-15 2001-08-14 Kabushiki Kaisha Toshiba Semiconductor light emitting device and its manufacturing method
TW414924B (en) * 1998-05-29 2000-12-11 Rohm Co Ltd Semiconductor device of resin package
JP3618551B2 (ja) * 1998-06-30 2005-02-09 株式会社東芝 光半導体モジュール
JP2000156528A (ja) * 1998-11-19 2000-06-06 Sharp Corp 発光素子
JP3613041B2 (ja) * 1998-12-16 2005-01-26 日亜化学工業株式会社 発光装置及びその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI550897B (zh) * 2003-10-22 2016-09-21 克立公司 功率式表面安裝之發光晶粒封裝
US8497145B2 (en) 2007-11-29 2013-07-30 Osram Opto Semiconductors Gmbh Method for producing an optoelectronic component and optoelectronic component

Also Published As

Publication number Publication date
CN1380704A (zh) 2002-11-20
DE60239173D1 (de) 2011-03-31
EP1249875B2 (en) 2019-02-20
CN1262023C (zh) 2006-06-28
EP1249875B1 (en) 2011-02-16
US6710377B2 (en) 2004-03-23
US20020145152A1 (en) 2002-10-10
EP1249875A3 (en) 2007-12-19
JP2002314139A (ja) 2002-10-25
EP1249875A2 (en) 2002-10-16

Similar Documents

Publication Publication Date Title
TW552722B (en) Light emitting device
CN210296410U (zh) 一种紫外led发光器件封装结构
JP4599857B2 (ja) 半導体装置及びその製造方法
JP4709487B2 (ja) オプトエレクトロニクスデバイス
JP5366587B2 (ja) 光半導体封止用加工シート
US20110176573A1 (en) Silicone Leaded Chip Carrier
TW200905925A (en) Side-view light-emitting diode package and fabrication method thereof
CN115079469B (zh) 光源、光源模组和显示装置
US7893452B2 (en) Optoelectronic component and package for an optoelectronic component
JP4600404B2 (ja) 半導体装置及びその製造方法
JP3931916B2 (ja) 半導体装置及びその製造方法
CN103050582A (zh) 具胶墙的发光二极管封装方法
CN102185082B (zh) 发光二极管构造及其制造方法
JP6274434B2 (ja) シリコーン樹脂組成物およびそれを用いた発光装置
CN207781640U (zh) 一种紫外led封装结构及紫外led灯
TWI597865B (zh) Optical semiconductor device
CN102479909B (zh) 发光二极管
CN108538987A (zh) 光半导体装置与光半导体装置的封装件
KR101334314B1 (ko) 발광 다이오드 램프 및 그것을 제조하는 방법
KR101309758B1 (ko) 발광 다이오드 램프 및 그것을 제조하는 방법
KR101334315B1 (ko) 발광 다이오드 램프 및 그것을 제조하는 방법
CN211907460U (zh) 一种led封装结构
CN101452922B (zh) 发光单元
TWI603509B (zh) 發光元件
TWM305437U (en) Light-emitting diode package structure

Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent