JP2006269531A - 光半導体装置 - Google Patents
光半導体装置 Download PDFInfo
- Publication number
- JP2006269531A JP2006269531A JP2005082263A JP2005082263A JP2006269531A JP 2006269531 A JP2006269531 A JP 2006269531A JP 2005082263 A JP2005082263 A JP 2005082263A JP 2005082263 A JP2005082263 A JP 2005082263A JP 2006269531 A JP2006269531 A JP 2006269531A
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- JP
- Japan
- Prior art keywords
- optical semiconductor
- conductive film
- transparent conductive
- semiconductor element
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Led Device Packages (AREA)
- Led Devices (AREA)
Abstract
【解決手段】 光半導体素子3の上面に向かって高い屈折率を有した透明導電膜6を、光半導体素子3上および光半導体素子3近傍から外側に導出するリードフレーム2bにかけて被覆させることにより、光半導体素子3の半導体層と透明導電膜層間での屈折率に大きな差が生じなくなる。これにより、半導体層界面で全反射する光の量が減少することから、光半導体素子3からの光の取り出し効率が向上すると共に、ワイヤレス化により光半導体装置の低背化を実現する事ができる。
【選択図】 図1
Description
2a リードフレーム
2b リードフレーム
3 光半導体素子
4 導電ペースト
5 絶縁性物質
6 透明導電膜
7 透光性樹脂
8 中央部
9 凹部
Claims (2)
- リードフレームに形成された基体と、前記基体に形成された光放射口と、前記光放射口の中央部の底部に露出された少なくとも一対のリードフレームと、前記露出された少なくとも一対のリードフレームの第一のリードフレーム表面に発光面を上面に導電性接着剤を介して搭載された光半導体素子と、前記露出された少なくとも一対のリードフレームの第二のリードフレームと前記光半導体素子とを接続する透明導電膜とからなり、前記第一のリードフレームと前記透明導電膜との間に絶縁領域を備えたことを特徴とする、光半導体装置。
- 前記光半導体素子の発光領域を前記透明導電膜により被覆されたことを特徴とする、請求項1記載の光半導体装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005082263A JP2006269531A (ja) | 2005-03-22 | 2005-03-22 | 光半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005082263A JP2006269531A (ja) | 2005-03-22 | 2005-03-22 | 光半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006269531A true JP2006269531A (ja) | 2006-10-05 |
JP2006269531A5 JP2006269531A5 (ja) | 2007-03-08 |
Family
ID=37205209
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005082263A Pending JP2006269531A (ja) | 2005-03-22 | 2005-03-22 | 光半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2006269531A (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010029872A1 (ja) * | 2008-09-09 | 2010-03-18 | 昭和電工株式会社 | 発光装置、発光モジュール、表示装置 |
JP2010067862A (ja) * | 2008-09-11 | 2010-03-25 | Showa Denko Kk | 発光装置、発光モジュール、表示装置 |
JP2010067863A (ja) * | 2008-09-11 | 2010-03-25 | Showa Denko Kk | 発光装置、発光モジュール |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0518839U (ja) * | 1991-08-30 | 1993-03-09 | シヤープ株式会社 | 発光装置 |
JPH11219734A (ja) * | 1998-01-30 | 1999-08-10 | Sekisui Chem Co Ltd | 光電変換材料用半導体及びこの半導体を用いた積層体並びにこれらの製造方法及び光電池 |
JP2002171000A (ja) * | 2000-09-21 | 2002-06-14 | Sharp Corp | 半導体発光装置およびそれを用いた発光表示装置 |
JP2002314139A (ja) * | 2001-04-09 | 2002-10-25 | Toshiba Corp | 発光装置 |
JP2004228297A (ja) * | 2003-01-22 | 2004-08-12 | Sharp Corp | 半導体発光装置 |
-
2005
- 2005-03-22 JP JP2005082263A patent/JP2006269531A/ja active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0518839U (ja) * | 1991-08-30 | 1993-03-09 | シヤープ株式会社 | 発光装置 |
JPH11219734A (ja) * | 1998-01-30 | 1999-08-10 | Sekisui Chem Co Ltd | 光電変換材料用半導体及びこの半導体を用いた積層体並びにこれらの製造方法及び光電池 |
JP2002171000A (ja) * | 2000-09-21 | 2002-06-14 | Sharp Corp | 半導体発光装置およびそれを用いた発光表示装置 |
JP2002314139A (ja) * | 2001-04-09 | 2002-10-25 | Toshiba Corp | 発光装置 |
JP2004228297A (ja) * | 2003-01-22 | 2004-08-12 | Sharp Corp | 半導体発光装置 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010029872A1 (ja) * | 2008-09-09 | 2010-03-18 | 昭和電工株式会社 | 発光装置、発光モジュール、表示装置 |
US8378369B2 (en) | 2008-09-09 | 2013-02-19 | Showa Denko K.K. | Light emitting unit, light emitting module, and display device |
JP2010067862A (ja) * | 2008-09-11 | 2010-03-25 | Showa Denko Kk | 発光装置、発光モジュール、表示装置 |
JP2010067863A (ja) * | 2008-09-11 | 2010-03-25 | Showa Denko Kk | 発光装置、発光モジュール |
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