TW538093B - An incombustibility epoxy resin composition and a laminated sheet thereof - Google Patents

An incombustibility epoxy resin composition and a laminated sheet thereof Download PDF

Info

Publication number
TW538093B
TW538093B TW89126140A TW89126140A TW538093B TW 538093 B TW538093 B TW 538093B TW 89126140 A TW89126140 A TW 89126140A TW 89126140 A TW89126140 A TW 89126140A TW 538093 B TW538093 B TW 538093B
Authority
TW
Taiwan
Prior art keywords
epoxy resin
scope
derivatives
patent application
item
Prior art date
Application number
TW89126140A
Other languages
English (en)
Chinese (zh)
Inventor
Yukihiro Kiuchi
Masatoshi Iji
Original Assignee
Nec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Corp filed Critical Nec Corp
Application granted granted Critical
Publication of TW538093B publication Critical patent/TW538093B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/063—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with epihalohydrins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Reinforced Plastic Materials (AREA)
  • Epoxy Resins (AREA)
TW89126140A 1999-12-08 2000-12-07 An incombustibility epoxy resin composition and a laminated sheet thereof TW538093B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP34944099 1999-12-08
JP2000361170A JP3460820B2 (ja) 1999-12-08 2000-11-28 難燃性エポキシ樹脂組成物

Publications (1)

Publication Number Publication Date
TW538093B true TW538093B (en) 2003-06-21

Family

ID=26578951

Family Applications (1)

Application Number Title Priority Date Filing Date
TW89126140A TW538093B (en) 1999-12-08 2000-12-07 An incombustibility epoxy resin composition and a laminated sheet thereof

Country Status (7)

Country Link
US (1) US6730402B2 (de)
EP (1) EP1260551B1 (de)
JP (1) JP3460820B2 (de)
CN (1) CN1169878C (de)
DE (1) DE60041419D1 (de)
TW (1) TW538093B (de)
WO (1) WO2001042360A1 (de)

Families Citing this family (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW538482B (en) * 1999-04-26 2003-06-21 Shinetsu Chemical Co Semiconductor encapsulating epoxy resin composition and semiconductor device
AU2929101A (en) 2000-01-05 2001-07-16 Saint-Gobain Technical Fabrics America, Inc. Smooth reinforced cementitious boards and methods of making same
JP4524837B2 (ja) * 2000-02-07 2010-08-18 住友ベークライト株式会社 エポキシ樹脂組成物及び半導体装置
TWI287554B (en) * 2000-10-05 2007-10-01 Nippon Kayaku Kk Sheet made of epoxy resin composition and cured product thereof
US6706409B2 (en) * 2000-10-13 2004-03-16 Hitachi Chemical Co., Ltd. Incombustible resin composition, prepreg, laminated plate, metal-clad laminated plate, printed wiring board and multi-layer printed wiring board
JP4948716B2 (ja) * 2001-06-29 2012-06-06 東レ・ダウコーニング株式会社 硬化性エポキシ樹脂組成物
US20050011592A1 (en) * 2001-11-30 2005-01-20 Smith James B. Stabilizer bar
JP2003268079A (ja) * 2002-03-18 2003-09-25 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP4240448B2 (ja) * 2002-08-22 2009-03-18 三井金属鉱業株式会社 樹脂層付銅箔を用いた多層プリント配線板の製造方法
US7049251B2 (en) * 2003-01-21 2006-05-23 Saint-Gobain Technical Fabrics Canada Ltd Facing material with controlled porosity for construction boards
WO2004065300A1 (ja) * 2003-01-21 2004-08-05 Yazaki Corporation 水酸化マグネシウム、水酸化マグネシウム・シリカ複合化粒子、それらの製造方法、それらの表面処理方法、およびそれらを用いた樹脂組成物、電線
JP4251612B2 (ja) * 2003-01-30 2009-04-08 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． エポキシ含有物質を含むネガ型感光性樹脂組成物
JP4397601B2 (ja) * 2003-02-06 2010-01-13 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． フェノール−ビフェニレン樹脂を含むネガ型感光性樹脂組成物
NL1023563C2 (nl) * 2003-05-28 2004-11-30 Dsm Ip Assets Bv Thermohardend materiaal; werkwijze en installatie voor het vervormen van een al dan niet uitgehard thermohardend materiaal.
US20070060720A1 (en) * 2003-07-03 2007-03-15 Yukihiro Kiuchi Epoxy resin composition
TWI274771B (en) * 2003-11-05 2007-03-01 Mitsui Chemicals Inc Resin composition, prepreg and laminate using the same
US7790069B2 (en) * 2003-12-19 2010-09-07 Nec Corporation Flame-retardant thermoplastic resin composition
WO2006006592A1 (ja) * 2004-07-13 2006-01-19 Hitachi Chemical Co., Ltd. 封止用エポキシ樹脂成形材料及び電子部品装置
KR100840065B1 (ko) * 2004-07-13 2008-06-19 히다치 가세고교 가부시끼가이샤 밀봉용 에폭시 수지 성형 재료 및 전자 부품 장치
EP1815273A2 (de) * 2004-09-28 2007-08-08 Brewer Science, Inc. Härtbare harze mit hohem brechungsindex für optoelektronische anwendungen
WO2006049156A1 (ja) * 2004-11-02 2006-05-11 Sumitomo Bakelite Company, Ltd. エポキシ樹脂組成物及び半導体装置
JP5153141B2 (ja) * 2004-11-11 2013-02-27 株式会社カネカ エポキシ樹脂組成物
CN1989166B (zh) * 2004-11-30 2010-04-28 松下电工株式会社 预浸料用环氧树脂组合物、预浸料及多层印刷电路板
JP4662793B2 (ja) * 2005-03-01 2011-03-30 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． エポキシ含有物質を含むネガ型感光性樹脂組成物
JP4633500B2 (ja) * 2005-03-01 2011-02-16 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． エポキシ含有物質を含むネガ型感光性樹脂組成物
EP1647576A1 (de) * 2005-04-01 2006-04-19 Huntsman Advanced Materials (Switzerland) GmbH Zusammensetzung beinhaltend Benzoxazin- und Epoxyharz
US8029704B2 (en) * 2005-08-25 2011-10-04 American Thermal Holding Company Flexible protective coating
US7601429B2 (en) 2007-02-07 2009-10-13 Mitsubishi Gas Chemical Company, Inc. Prepreg and laminate
US8465837B2 (en) * 2007-04-10 2013-06-18 Sumitomo Bakelite Co., Ltd. Epoxy resin composition, prepreg, laminate board, multilayer printed wiring board, semiconductor device, insulating resin sheet, and process for manufacturing multilayer printed wiring board
TWI347330B (en) * 2007-04-23 2011-08-21 Ind Tech Res Inst Flame retardant crosslink agent and epoxy resin compositions free of halogen and phosphor
WO2008156840A1 (en) * 2007-06-19 2008-12-24 Flexible Ceramics, Inc., A California Corporation 'red heat' exhaust system silicone composite o-ring gaskets and method for fabricating same
US20120148753A1 (en) * 2007-12-12 2012-06-14 Masanori Kubota Prepreg
JP5185218B2 (ja) * 2009-06-30 2013-04-17 エムテックスマツムラ株式会社 半導体装置用中空パッケージおよび半導体部品装置
JP5380325B2 (ja) * 2010-02-18 2014-01-08 日東電工株式会社 光半導体素子封止用熱硬化性樹脂組成物およびその硬化体、ならびにそれを用いて得られる光半導体装置
EP2554561B1 (de) * 2010-03-26 2019-09-04 Panasonic Intellectual Property Management Co., Ltd. Epoxidharzzusammensetzung für ein prepreg, prepreg und mehrschichtige bestückte leiterplatte
EP2557121B1 (de) 2010-04-08 2020-03-04 Mitsubishi Gas Chemical Company, Inc. Harzzusammensetzung, prepreg und laminat
JP2012116891A (ja) * 2010-11-29 2012-06-21 Hitachi Chemical Co Ltd 難燃性樹脂組成物並びにこれを用いたプリプレグ及び積層板
JP2012116890A (ja) * 2010-11-29 2012-06-21 Hitachi Chemical Co Ltd 難燃性樹脂組成物並びにこれを用いたプリプレグ及び積層板
JP2012116892A (ja) * 2010-11-29 2012-06-21 Hitachi Chemical Co Ltd 難燃性樹脂組成物並びにこれを用いたプリプレグ及び積層板
CN102408545B (zh) * 2011-10-19 2013-06-26 江苏华海诚科新材料有限公司 一种稀土永磁无铁芯节能电机密封用树脂组合物
CN102504490B (zh) * 2011-11-08 2013-06-26 桂林电器科学研究院 一种可注射成型的电工环氧模塑料及其制备方法
JP6008104B2 (ja) * 2012-09-04 2016-10-19 住友ベークライト株式会社 プリプレグおよび金属張積層板
JP2014109027A (ja) * 2012-12-04 2014-06-12 Hitachi Chemical Co Ltd エポキシ樹脂組成物、プリプレグ、金属張積層板及びこれらを用いた印刷配線板
JPWO2014184859A1 (ja) * 2013-05-14 2017-02-23 株式会社日立製作所 エポキシ樹脂組成物、エポキシ樹脂硬化物、モータ及びアキシャルギャップ型モータ
JP2017088656A (ja) * 2015-11-04 2017-05-25 信越化学工業株式会社 難燃性樹脂組成物、難燃性樹脂フィルム及び半導体装置とその製造方法
KR102623238B1 (ko) * 2020-09-11 2024-01-10 삼성에스디아이 주식회사 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 사용하여 밀봉된 반도체 소자

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0597965A (ja) * 1991-10-04 1993-04-20 Mitsui Toatsu Chem Inc エポキシ樹脂組成物
JPH05318653A (ja) 1992-05-23 1993-12-03 Toshiba Chem Corp 難燃性銅張積層板の製造方法
EP0795570A4 (de) * 1995-09-29 2001-01-24 Toshiba Chem Corp Halogenfreie flammwidrige epoxidharzzusammensetzung, und diese zusammensetzung enthaltender prepreg und verbundstoff
JPH09208666A (ja) 1996-01-30 1997-08-12 Nippon Steel Chem Co Ltd 低誘電率樹脂組成物、及びその硬化物
JP3317481B2 (ja) 1996-11-21 2002-08-26 住友ベークライト株式会社 半導体封止用樹脂組成物
JPH10279782A (ja) 1997-04-08 1998-10-20 Sumitomo Chem Co Ltd エポキシ樹脂組成物および樹脂封止型半導体装置
JPH1112439A (ja) 1997-06-20 1999-01-19 Nec Corp 難燃性熱硬化性樹脂組成物
KR100635710B1 (ko) * 1997-08-01 2007-06-12 니폰 가야꾸 가부시끼가이샤 흑색 액정시일제 및 액정 셀
JP3466884B2 (ja) 1997-09-03 2003-11-17 東洋通信機株式会社 フィルタバンク回路
US6130282A (en) * 1997-10-01 2000-10-10 Kyowa Chemical Industry Co Ltd Flame retardant resin composition
JP3297014B2 (ja) 1997-10-01 2002-07-02 協和化学工業株式会社 難燃性樹脂組成物
JPH11140277A (ja) 1997-11-10 1999-05-25 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及びこれを用いた半導体装置
JPH11179841A (ja) 1997-12-24 1999-07-06 Shin Kobe Electric Mach Co Ltd コンポジット金属箔張り積層板
JPH11246741A (ja) 1998-02-27 1999-09-14 Sumitomo Bakelite Co Ltd 積層板用エポキシ樹脂組成物
JP3388537B2 (ja) * 1998-05-15 2003-03-24 信越化学工業株式会社 半導体封止用エポキシ樹脂組成物及び半導体装置
JP2975349B1 (ja) 1998-08-06 1999-11-10 東芝ケミカル株式会社 ガラスエポキシ銅張積層板用樹脂組成物
JP2000103839A (ja) * 1998-09-25 2000-04-11 Matsushita Electric Works Ltd 封止用樹脂組成物及び半導体装置
JP3349963B2 (ja) * 1998-10-21 2002-11-25 日本電気株式会社 難燃性エポキシ樹脂組成物及びそれを用いた半導体装置
JP3707043B2 (ja) * 1999-03-18 2005-10-19 三菱瓦斯化学株式会社 プリント配線板用プリプレグ及び積層板
JP2001048957A (ja) 1999-05-31 2001-02-20 Hitachi Chem Co Ltd 封止用エポキシ樹脂成形材料及び電子部品装置
JP2001089641A (ja) 1999-09-27 2001-04-03 Nippon Kayaku Co Ltd 難燃性エポキシ樹脂組成物

Also Published As

Publication number Publication date
EP1260551A1 (de) 2002-11-27
EP1260551A4 (de) 2003-03-19
EP1260551B1 (de) 2009-01-14
CN1169878C (zh) 2004-10-06
CN1390246A (zh) 2003-01-08
US6730402B2 (en) 2004-05-04
JP3460820B2 (ja) 2003-10-27
US20030152776A1 (en) 2003-08-14
JP2001226465A (ja) 2001-08-21
WO2001042360A1 (fr) 2001-06-14
DE60041419D1 (de) 2009-03-05

Similar Documents

Publication Publication Date Title
TW538093B (en) An incombustibility epoxy resin composition and a laminated sheet thereof
TWI597325B (zh) A ceramifying silicone resin composition and prepreg and laminate using the same
TWI378938B (en) Cyclic cyanato group-containing phosphazene compound and method for making such compound
CN101974208B (zh) 高导热树脂组合物及使用其制作的高导热覆金属箔板
TWI532784B (zh) A halogen-free resin composition and use thereof
CN105936745A (zh) 一种树脂组合物
TWI546319B (zh) 含磷聚苯醚樹脂及其製法、含磷聚苯醚預聚物之製法、樹脂組成物及其應用
KR101803115B1 (ko) 프리프레그, 금속 피복 적층판 및 인쇄 배선판
TW200930739A (en) Resin composition, prepreg and laminate using the same
CN102051022A (zh) 环氧树脂组合物及使用其制作的半固化片与层压板
JP2007030326A (ja) 樹脂付銅箔、プリント配線板製造用積層体及び多層プリント配線板
JP2012180521A (ja) エポキシ樹脂組成物
TW201206977A (en) Epoxy resin composition, and prepreg and printed wiring board using the same
WO2018120589A1 (zh) 一种改性聚苯醚树脂及其应用
TW201134671A (en) Laminate plate, use therefor, and production method thereof
WO2019019465A1 (zh) 一种热固性树脂组合物、由其制作的半固化片、覆金属箔层压板及高频电路板
WO2018103199A1 (zh) 一种热固性树脂组合物
JP2007153749A (ja) 反応性基含有環状ホスファゼン化合物およびその製造方法
WO2018103276A1 (zh) 一种热固性树脂组合物
WO2016107067A1 (zh) 一种无卤热固性树脂组合物及使用它的预浸料和印制电路用层压板
TW201623358A (zh) 一種無鹵熱固性樹脂組合物及使用其之預浸料和印製電路用層壓板
EP3144350B1 (de) Isolierende wärmeleitende harzzusammensetzung
TW201136980A (en) Epoxy resin composition, preprey and printed circuit board manufactured thereof
JP2003147052A (ja) 難燃性エポキシ樹脂組成物
JP5635655B1 (ja) 熱硬化性組成物、ドライフィルムおよびプリント配線板

Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees