TW538093B - An incombustibility epoxy resin composition and a laminated sheet thereof - Google Patents
An incombustibility epoxy resin composition and a laminated sheet thereof Download PDFInfo
- Publication number
- TW538093B TW538093B TW89126140A TW89126140A TW538093B TW 538093 B TW538093 B TW 538093B TW 89126140 A TW89126140 A TW 89126140A TW 89126140 A TW89126140 A TW 89126140A TW 538093 B TW538093 B TW 538093B
- Authority
- TW
- Taiwan
- Prior art keywords
- epoxy resin
- scope
- derivatives
- patent application
- item
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
- C08G59/063—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with epihalohydrins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31515—As intermediate layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31663—As siloxane, silicone or silane
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Reinforced Plastic Materials (AREA)
- Epoxy Resins (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP34944099 | 1999-12-08 | ||
JP2000361170A JP3460820B2 (ja) | 1999-12-08 | 2000-11-28 | 難燃性エポキシ樹脂組成物 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW538093B true TW538093B (en) | 2003-06-21 |
Family
ID=26578951
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW89126140A TW538093B (en) | 1999-12-08 | 2000-12-07 | An incombustibility epoxy resin composition and a laminated sheet thereof |
Country Status (7)
Country | Link |
---|---|
US (1) | US6730402B2 (de) |
EP (1) | EP1260551B1 (de) |
JP (1) | JP3460820B2 (de) |
CN (1) | CN1169878C (de) |
DE (1) | DE60041419D1 (de) |
TW (1) | TW538093B (de) |
WO (1) | WO2001042360A1 (de) |
Families Citing this family (46)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW538482B (en) * | 1999-04-26 | 2003-06-21 | Shinetsu Chemical Co | Semiconductor encapsulating epoxy resin composition and semiconductor device |
AU2929101A (en) | 2000-01-05 | 2001-07-16 | Saint-Gobain Technical Fabrics America, Inc. | Smooth reinforced cementitious boards and methods of making same |
JP4524837B2 (ja) * | 2000-02-07 | 2010-08-18 | 住友ベークライト株式会社 | エポキシ樹脂組成物及び半導体装置 |
TWI287554B (en) * | 2000-10-05 | 2007-10-01 | Nippon Kayaku Kk | Sheet made of epoxy resin composition and cured product thereof |
US6706409B2 (en) * | 2000-10-13 | 2004-03-16 | Hitachi Chemical Co., Ltd. | Incombustible resin composition, prepreg, laminated plate, metal-clad laminated plate, printed wiring board and multi-layer printed wiring board |
JP4948716B2 (ja) * | 2001-06-29 | 2012-06-06 | 東レ・ダウコーニング株式会社 | 硬化性エポキシ樹脂組成物 |
US20050011592A1 (en) * | 2001-11-30 | 2005-01-20 | Smith James B. | Stabilizer bar |
JP2003268079A (ja) * | 2002-03-18 | 2003-09-25 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
JP4240448B2 (ja) * | 2002-08-22 | 2009-03-18 | 三井金属鉱業株式会社 | 樹脂層付銅箔を用いた多層プリント配線板の製造方法 |
US7049251B2 (en) * | 2003-01-21 | 2006-05-23 | Saint-Gobain Technical Fabrics Canada Ltd | Facing material with controlled porosity for construction boards |
WO2004065300A1 (ja) * | 2003-01-21 | 2004-08-05 | Yazaki Corporation | 水酸化マグネシウム、水酸化マグネシウム・シリカ複合化粒子、それらの製造方法、それらの表面処理方法、およびそれらを用いた樹脂組成物、電線 |
JP4251612B2 (ja) * | 2003-01-30 | 2009-04-08 | ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. | エポキシ含有物質を含むネガ型感光性樹脂組成物 |
JP4397601B2 (ja) * | 2003-02-06 | 2010-01-13 | ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. | フェノール−ビフェニレン樹脂を含むネガ型感光性樹脂組成物 |
NL1023563C2 (nl) * | 2003-05-28 | 2004-11-30 | Dsm Ip Assets Bv | Thermohardend materiaal; werkwijze en installatie voor het vervormen van een al dan niet uitgehard thermohardend materiaal. |
US20070060720A1 (en) * | 2003-07-03 | 2007-03-15 | Yukihiro Kiuchi | Epoxy resin composition |
TWI274771B (en) * | 2003-11-05 | 2007-03-01 | Mitsui Chemicals Inc | Resin composition, prepreg and laminate using the same |
US7790069B2 (en) * | 2003-12-19 | 2010-09-07 | Nec Corporation | Flame-retardant thermoplastic resin composition |
WO2006006592A1 (ja) * | 2004-07-13 | 2006-01-19 | Hitachi Chemical Co., Ltd. | 封止用エポキシ樹脂成形材料及び電子部品装置 |
KR100840065B1 (ko) * | 2004-07-13 | 2008-06-19 | 히다치 가세고교 가부시끼가이샤 | 밀봉용 에폭시 수지 성형 재료 및 전자 부품 장치 |
EP1815273A2 (de) * | 2004-09-28 | 2007-08-08 | Brewer Science, Inc. | Härtbare harze mit hohem brechungsindex für optoelektronische anwendungen |
WO2006049156A1 (ja) * | 2004-11-02 | 2006-05-11 | Sumitomo Bakelite Company, Ltd. | エポキシ樹脂組成物及び半導体装置 |
JP5153141B2 (ja) * | 2004-11-11 | 2013-02-27 | 株式会社カネカ | エポキシ樹脂組成物 |
CN1989166B (zh) * | 2004-11-30 | 2010-04-28 | 松下电工株式会社 | 预浸料用环氧树脂组合物、预浸料及多层印刷电路板 |
JP4662793B2 (ja) * | 2005-03-01 | 2011-03-30 | ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. | エポキシ含有物質を含むネガ型感光性樹脂組成物 |
JP4633500B2 (ja) * | 2005-03-01 | 2011-02-16 | ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. | エポキシ含有物質を含むネガ型感光性樹脂組成物 |
EP1647576A1 (de) * | 2005-04-01 | 2006-04-19 | Huntsman Advanced Materials (Switzerland) GmbH | Zusammensetzung beinhaltend Benzoxazin- und Epoxyharz |
US8029704B2 (en) * | 2005-08-25 | 2011-10-04 | American Thermal Holding Company | Flexible protective coating |
US7601429B2 (en) | 2007-02-07 | 2009-10-13 | Mitsubishi Gas Chemical Company, Inc. | Prepreg and laminate |
US8465837B2 (en) * | 2007-04-10 | 2013-06-18 | Sumitomo Bakelite Co., Ltd. | Epoxy resin composition, prepreg, laminate board, multilayer printed wiring board, semiconductor device, insulating resin sheet, and process for manufacturing multilayer printed wiring board |
TWI347330B (en) * | 2007-04-23 | 2011-08-21 | Ind Tech Res Inst | Flame retardant crosslink agent and epoxy resin compositions free of halogen and phosphor |
WO2008156840A1 (en) * | 2007-06-19 | 2008-12-24 | Flexible Ceramics, Inc., A California Corporation | 'red heat' exhaust system silicone composite o-ring gaskets and method for fabricating same |
US20120148753A1 (en) * | 2007-12-12 | 2012-06-14 | Masanori Kubota | Prepreg |
JP5185218B2 (ja) * | 2009-06-30 | 2013-04-17 | エムテックスマツムラ株式会社 | 半導体装置用中空パッケージおよび半導体部品装置 |
JP5380325B2 (ja) * | 2010-02-18 | 2014-01-08 | 日東電工株式会社 | 光半導体素子封止用熱硬化性樹脂組成物およびその硬化体、ならびにそれを用いて得られる光半導体装置 |
EP2554561B1 (de) * | 2010-03-26 | 2019-09-04 | Panasonic Intellectual Property Management Co., Ltd. | Epoxidharzzusammensetzung für ein prepreg, prepreg und mehrschichtige bestückte leiterplatte |
EP2557121B1 (de) | 2010-04-08 | 2020-03-04 | Mitsubishi Gas Chemical Company, Inc. | Harzzusammensetzung, prepreg und laminat |
JP2012116891A (ja) * | 2010-11-29 | 2012-06-21 | Hitachi Chemical Co Ltd | 難燃性樹脂組成物並びにこれを用いたプリプレグ及び積層板 |
JP2012116890A (ja) * | 2010-11-29 | 2012-06-21 | Hitachi Chemical Co Ltd | 難燃性樹脂組成物並びにこれを用いたプリプレグ及び積層板 |
JP2012116892A (ja) * | 2010-11-29 | 2012-06-21 | Hitachi Chemical Co Ltd | 難燃性樹脂組成物並びにこれを用いたプリプレグ及び積層板 |
CN102408545B (zh) * | 2011-10-19 | 2013-06-26 | 江苏华海诚科新材料有限公司 | 一种稀土永磁无铁芯节能电机密封用树脂组合物 |
CN102504490B (zh) * | 2011-11-08 | 2013-06-26 | 桂林电器科学研究院 | 一种可注射成型的电工环氧模塑料及其制备方法 |
JP6008104B2 (ja) * | 2012-09-04 | 2016-10-19 | 住友ベークライト株式会社 | プリプレグおよび金属張積層板 |
JP2014109027A (ja) * | 2012-12-04 | 2014-06-12 | Hitachi Chemical Co Ltd | エポキシ樹脂組成物、プリプレグ、金属張積層板及びこれらを用いた印刷配線板 |
JPWO2014184859A1 (ja) * | 2013-05-14 | 2017-02-23 | 株式会社日立製作所 | エポキシ樹脂組成物、エポキシ樹脂硬化物、モータ及びアキシャルギャップ型モータ |
JP2017088656A (ja) * | 2015-11-04 | 2017-05-25 | 信越化学工業株式会社 | 難燃性樹脂組成物、難燃性樹脂フィルム及び半導体装置とその製造方法 |
KR102623238B1 (ko) * | 2020-09-11 | 2024-01-10 | 삼성에스디아이 주식회사 | 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 사용하여 밀봉된 반도체 소자 |
Family Cites Families (21)
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JPH0597965A (ja) * | 1991-10-04 | 1993-04-20 | Mitsui Toatsu Chem Inc | エポキシ樹脂組成物 |
JPH05318653A (ja) | 1992-05-23 | 1993-12-03 | Toshiba Chem Corp | 難燃性銅張積層板の製造方法 |
EP0795570A4 (de) * | 1995-09-29 | 2001-01-24 | Toshiba Chem Corp | Halogenfreie flammwidrige epoxidharzzusammensetzung, und diese zusammensetzung enthaltender prepreg und verbundstoff |
JPH09208666A (ja) | 1996-01-30 | 1997-08-12 | Nippon Steel Chem Co Ltd | 低誘電率樹脂組成物、及びその硬化物 |
JP3317481B2 (ja) | 1996-11-21 | 2002-08-26 | 住友ベークライト株式会社 | 半導体封止用樹脂組成物 |
JPH10279782A (ja) | 1997-04-08 | 1998-10-20 | Sumitomo Chem Co Ltd | エポキシ樹脂組成物および樹脂封止型半導体装置 |
JPH1112439A (ja) | 1997-06-20 | 1999-01-19 | Nec Corp | 難燃性熱硬化性樹脂組成物 |
KR100635710B1 (ko) * | 1997-08-01 | 2007-06-12 | 니폰 가야꾸 가부시끼가이샤 | 흑색 액정시일제 및 액정 셀 |
JP3466884B2 (ja) | 1997-09-03 | 2003-11-17 | 東洋通信機株式会社 | フィルタバンク回路 |
US6130282A (en) * | 1997-10-01 | 2000-10-10 | Kyowa Chemical Industry Co Ltd | Flame retardant resin composition |
JP3297014B2 (ja) | 1997-10-01 | 2002-07-02 | 協和化学工業株式会社 | 難燃性樹脂組成物 |
JPH11140277A (ja) | 1997-11-10 | 1999-05-25 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及びこれを用いた半導体装置 |
JPH11179841A (ja) | 1997-12-24 | 1999-07-06 | Shin Kobe Electric Mach Co Ltd | コンポジット金属箔張り積層板 |
JPH11246741A (ja) | 1998-02-27 | 1999-09-14 | Sumitomo Bakelite Co Ltd | 積層板用エポキシ樹脂組成物 |
JP3388537B2 (ja) * | 1998-05-15 | 2003-03-24 | 信越化学工業株式会社 | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
JP2975349B1 (ja) | 1998-08-06 | 1999-11-10 | 東芝ケミカル株式会社 | ガラスエポキシ銅張積層板用樹脂組成物 |
JP2000103839A (ja) * | 1998-09-25 | 2000-04-11 | Matsushita Electric Works Ltd | 封止用樹脂組成物及び半導体装置 |
JP3349963B2 (ja) * | 1998-10-21 | 2002-11-25 | 日本電気株式会社 | 難燃性エポキシ樹脂組成物及びそれを用いた半導体装置 |
JP3707043B2 (ja) * | 1999-03-18 | 2005-10-19 | 三菱瓦斯化学株式会社 | プリント配線板用プリプレグ及び積層板 |
JP2001048957A (ja) | 1999-05-31 | 2001-02-20 | Hitachi Chem Co Ltd | 封止用エポキシ樹脂成形材料及び電子部品装置 |
JP2001089641A (ja) | 1999-09-27 | 2001-04-03 | Nippon Kayaku Co Ltd | 難燃性エポキシ樹脂組成物 |
-
2000
- 2000-11-28 JP JP2000361170A patent/JP3460820B2/ja not_active Expired - Fee Related
- 2000-12-05 US US10/070,827 patent/US6730402B2/en not_active Expired - Fee Related
- 2000-12-05 DE DE60041419T patent/DE60041419D1/de not_active Expired - Lifetime
- 2000-12-05 CN CNB008155453A patent/CN1169878C/zh not_active Expired - Fee Related
- 2000-12-05 EP EP20000979090 patent/EP1260551B1/de not_active Expired - Lifetime
- 2000-12-05 WO PCT/JP2000/008595 patent/WO2001042360A1/ja active Application Filing
- 2000-12-07 TW TW89126140A patent/TW538093B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP1260551A1 (de) | 2002-11-27 |
EP1260551A4 (de) | 2003-03-19 |
EP1260551B1 (de) | 2009-01-14 |
CN1169878C (zh) | 2004-10-06 |
CN1390246A (zh) | 2003-01-08 |
US6730402B2 (en) | 2004-05-04 |
JP3460820B2 (ja) | 2003-10-27 |
US20030152776A1 (en) | 2003-08-14 |
JP2001226465A (ja) | 2001-08-21 |
WO2001042360A1 (fr) | 2001-06-14 |
DE60041419D1 (de) | 2009-03-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GD4A | Issue of patent certificate for granted invention patent | ||
MM4A | Annulment or lapse of patent due to non-payment of fees |