DE60041419D1 - Er hergestelltes mehrschichtmaterial - Google Patents

Er hergestelltes mehrschichtmaterial

Info

Publication number
DE60041419D1
DE60041419D1 DE60041419T DE60041419T DE60041419D1 DE 60041419 D1 DE60041419 D1 DE 60041419D1 DE 60041419 T DE60041419 T DE 60041419T DE 60041419 T DE60041419 T DE 60041419T DE 60041419 D1 DE60041419 D1 DE 60041419D1
Authority
DE
Germany
Prior art keywords
material manufactured
multilayer material
multilayer
manufactured
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60041419T
Other languages
English (en)
Inventor
Yukihiro Kiuchi
Masatosahi Iji
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Application granted granted Critical
Publication of DE60041419D1 publication Critical patent/DE60041419D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/063—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with epihalohydrins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
DE60041419T 1999-12-08 2000-12-05 Er hergestelltes mehrschichtmaterial Expired - Lifetime DE60041419D1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP34944099 1999-12-08
JP2000361170A JP3460820B2 (ja) 1999-12-08 2000-11-28 難燃性エポキシ樹脂組成物
PCT/JP2000/008595 WO2001042360A1 (fr) 1999-12-08 2000-12-05 Composition de resine epoxyde ignifuge et stratifie obtenu a partir de celle-ci

Publications (1)

Publication Number Publication Date
DE60041419D1 true DE60041419D1 (de) 2009-03-05

Family

ID=26578951

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60041419T Expired - Lifetime DE60041419D1 (de) 1999-12-08 2000-12-05 Er hergestelltes mehrschichtmaterial

Country Status (7)

Country Link
US (1) US6730402B2 (de)
EP (1) EP1260551B1 (de)
JP (1) JP3460820B2 (de)
CN (1) CN1169878C (de)
DE (1) DE60041419D1 (de)
TW (1) TW538093B (de)
WO (1) WO2001042360A1 (de)

Families Citing this family (47)

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Publication number Priority date Publication date Assignee Title
TW538482B (en) * 1999-04-26 2003-06-21 Shinetsu Chemical Co Semiconductor encapsulating epoxy resin composition and semiconductor device
WO2001049484A1 (en) 2000-01-05 2001-07-12 Saint-Gobain Technical Fabrics Of America, Inc. Smooth reinforced cementitious boards and methods of making same
JP4524837B2 (ja) * 2000-02-07 2010-08-18 住友ベークライト株式会社 エポキシ樹脂組成物及び半導体装置
US6723801B2 (en) * 2000-10-05 2004-04-20 Nippon Kayaku Kabushiki Kaisha Polyphenol resin, process for its production, epoxy resin composition and its use
US6706409B2 (en) * 2000-10-13 2004-03-16 Hitachi Chemical Co., Ltd. Incombustible resin composition, prepreg, laminated plate, metal-clad laminated plate, printed wiring board and multi-layer printed wiring board
JP4948716B2 (ja) * 2001-06-29 2012-06-06 東レ・ダウコーニング株式会社 硬化性エポキシ樹脂組成物
US20050011592A1 (en) * 2001-11-30 2005-01-20 Smith James B. Stabilizer bar
JP2003268079A (ja) * 2002-03-18 2003-09-25 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP4240448B2 (ja) * 2002-08-22 2009-03-18 三井金属鉱業株式会社 樹脂層付銅箔を用いた多層プリント配線板の製造方法
US7049251B2 (en) * 2003-01-21 2006-05-23 Saint-Gobain Technical Fabrics Canada Ltd Facing material with controlled porosity for construction boards
JPWO2004065300A1 (ja) * 2003-01-21 2006-05-18 矢崎総業株式会社 水酸化マグネシウム、水酸化マグネシウム・シリカ複合化粒子、それらの製造方法、それらの表面処理方法、およびそれらを用いた樹脂組成物、電線
JP4251612B2 (ja) * 2003-01-30 2009-04-08 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． エポキシ含有物質を含むネガ型感光性樹脂組成物
JP4397601B2 (ja) * 2003-02-06 2010-01-13 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． フェノール−ビフェニレン樹脂を含むネガ型感光性樹脂組成物
NL1023563C2 (nl) * 2003-05-28 2004-11-30 Dsm Ip Assets Bv Thermohardend materiaal; werkwijze en installatie voor het vervormen van een al dan niet uitgehard thermohardend materiaal.
WO2005003208A1 (ja) * 2003-07-03 2005-01-13 Nec Corporation エポキシ樹脂組成物
TWI274771B (en) * 2003-11-05 2007-03-01 Mitsui Chemicals Inc Resin composition, prepreg and laminate using the same
CN1914279B (zh) * 2003-12-19 2010-05-05 日本电气株式会社 阻燃热塑性树脂组合物
WO2006006592A1 (ja) * 2004-07-13 2006-01-19 Hitachi Chemical Co., Ltd. 封止用エポキシ樹脂成形材料及び電子部品装置
WO2006006593A1 (ja) * 2004-07-13 2006-01-19 Hitachi Chemical Co., Ltd. 封止用エポキシ樹脂成形材料及び電子部品装置
CN101142499A (zh) * 2004-09-28 2008-03-12 布鲁尔科技公司 用于光电子用途的可固化的高折射率树脂
WO2006049156A1 (ja) * 2004-11-02 2006-05-11 Sumitomo Bakelite Company, Ltd. エポキシ樹脂組成物及び半導体装置
JP5153141B2 (ja) * 2004-11-11 2013-02-27 株式会社カネカ エポキシ樹脂組成物
CN1989166B (zh) * 2004-11-30 2010-04-28 松下电工株式会社 预浸料用环氧树脂组合物、预浸料及多层印刷电路板
JP4633500B2 (ja) * 2005-03-01 2011-02-16 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． エポキシ含有物質を含むネガ型感光性樹脂組成物
JP4662793B2 (ja) * 2005-03-01 2011-03-30 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． エポキシ含有物質を含むネガ型感光性樹脂組成物
EP1647576A1 (de) * 2005-04-01 2006-04-19 Huntsman Advanced Materials (Switzerland) GmbH Zusammensetzung beinhaltend Benzoxazin- und Epoxyharz
US8029704B2 (en) * 2005-08-25 2011-10-04 American Thermal Holding Company Flexible protective coating
EP1961554B1 (de) 2007-02-07 2010-01-27 Mitsubishi Gas Chemical Company, Inc. Prepreg und Laminat
CN101652401B (zh) * 2007-04-10 2012-09-05 住友电木株式会社 环氧树脂组合物、预浸料坯、层叠板、多层印刷线路板、半导体器件、绝缘树脂片、和制造多层印刷线路板的方法
TWI347330B (en) * 2007-04-23 2011-08-21 Ind Tech Res Inst Flame retardant crosslink agent and epoxy resin compositions free of halogen and phosphor
US20100320700A1 (en) * 2007-06-19 2010-12-23 Flexible Ceramics, Inc. Red Heat Exhaust System Silicone Composite O-Ring Gaskets and Method for Fabricating Same
US20120148753A1 (en) * 2007-12-12 2012-06-14 Masanori Kubota Prepreg
JP5185218B2 (ja) * 2009-06-30 2013-04-17 エムテックスマツムラ株式会社 半導体装置用中空パッケージおよび半導体部品装置
JP5380325B2 (ja) * 2010-02-18 2014-01-08 日東電工株式会社 光半導体素子封止用熱硬化性樹脂組成物およびその硬化体、ならびにそれを用いて得られる光半導体装置
JP5576930B2 (ja) * 2010-03-26 2014-08-20 パナソニック株式会社 プリプレグ用エポキシ樹脂組成物、プリプレグ、及び多層プリント配線板
JP5935690B2 (ja) 2010-04-08 2016-06-15 三菱瓦斯化学株式会社 樹脂組成物、プリプレグおよび積層板
JP2012116890A (ja) * 2010-11-29 2012-06-21 Hitachi Chemical Co Ltd 難燃性樹脂組成物並びにこれを用いたプリプレグ及び積層板
JP2012116891A (ja) * 2010-11-29 2012-06-21 Hitachi Chemical Co Ltd 難燃性樹脂組成物並びにこれを用いたプリプレグ及び積層板
JP2012116892A (ja) * 2010-11-29 2012-06-21 Hitachi Chemical Co Ltd 難燃性樹脂組成物並びにこれを用いたプリプレグ及び積層板
CN103764283A (zh) * 2011-09-06 2014-04-30 住友电木株式会社 树脂担载催化剂和树脂担载催化剂的制造方法
CN102408545B (zh) * 2011-10-19 2013-06-26 江苏华海诚科新材料有限公司 一种稀土永磁无铁芯节能电机密封用树脂组合物
CN102504490B (zh) * 2011-11-08 2013-06-26 桂林电器科学研究院 一种可注射成型的电工环氧模塑料及其制备方法
JP6008104B2 (ja) * 2012-09-04 2016-10-19 住友ベークライト株式会社 プリプレグおよび金属張積層板
JP2014109027A (ja) * 2012-12-04 2014-06-12 Hitachi Chemical Co Ltd エポキシ樹脂組成物、プリプレグ、金属張積層板及びこれらを用いた印刷配線板
JPWO2014184859A1 (ja) * 2013-05-14 2017-02-23 株式会社日立製作所 エポキシ樹脂組成物、エポキシ樹脂硬化物、モータ及びアキシャルギャップ型モータ
JP2017088656A (ja) 2015-11-04 2017-05-25 信越化学工業株式会社 難燃性樹脂組成物、難燃性樹脂フィルム及び半導体装置とその製造方法
KR102623238B1 (ko) * 2020-09-11 2024-01-10 삼성에스디아이 주식회사 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 사용하여 밀봉된 반도체 소자

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JP3707043B2 (ja) * 1999-03-18 2005-10-19 三菱瓦斯化学株式会社 プリント配線板用プリプレグ及び積層板
JP2001048957A (ja) 1999-05-31 2001-02-20 Hitachi Chem Co Ltd 封止用エポキシ樹脂成形材料及び電子部品装置
JP2001089641A (ja) 1999-09-27 2001-04-03 Nippon Kayaku Co Ltd 難燃性エポキシ樹脂組成物

Also Published As

Publication number Publication date
JP3460820B2 (ja) 2003-10-27
CN1390246A (zh) 2003-01-08
EP1260551A4 (de) 2003-03-19
CN1169878C (zh) 2004-10-06
US20030152776A1 (en) 2003-08-14
TW538093B (en) 2003-06-21
WO2001042360A1 (fr) 2001-06-14
EP1260551A1 (de) 2002-11-27
JP2001226465A (ja) 2001-08-21
US6730402B2 (en) 2004-05-04
EP1260551B1 (de) 2009-01-14

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