TW518640B - Dual substrate loadlock process equipment - Google Patents
Dual substrate loadlock process equipment Download PDFInfo
- Publication number
- TW518640B TW518640B TW089126505A TW89126505A TW518640B TW 518640 B TW518640 B TW 518640B TW 089126505 A TW089126505 A TW 089126505A TW 89126505 A TW89126505 A TW 89126505A TW 518640 B TW518640 B TW 518640B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- load chamber
- support
- chamber
- plate
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/068—Stacking or destacking devices; Means for preventing damage to stacked sheets, e.g. spaces
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
- C23C14/566—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases using a load-lock chamber
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/568—Transferring the substrates through a series of coating stations
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/54—Apparatus specially adapted for continuous coating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/02—Controlled or contamination-free environments or clean space conditions
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/04—Arrangements of vacuum systems or suction cups
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Nonlinear Science (AREA)
- General Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Physical Vapour Deposition (AREA)
- Chemical Vapour Deposition (AREA)
- Drying Of Semiconductors (AREA)
- Furnace Charging Or Discharging (AREA)
Description
518640 結構及該第二支撐結構係可相對於該冷卻板作移動。 4. 如申請專利範圍第3項所述之負載室,其中該冷卻板係 附著至該室體。 5. 如申請專利範圍第4項所述之負載室,其中該冷卻板之 中具有多數孔,以允許該第二支撐結構可移動於其間。 6. 如申請專利範圍第1項所述之負載室,其中該冷卻板包 含至少一結構從其中延伸出,且該中間板包含至少一開 口,該開口的尺寸係製作成可容納從該冷卻板延伸出之 至少一結構。 7. 如申請專利範圍第1項所述之負載室,其更包含一下 板,其中該第一支撐結構係連接至該中間板且該第二支 撐結構係連接至該下板。 8. 如申請專利範圍第1項所述之負載室,其中該中間板包 含^一冷卻層及一絕緣層。 9. 如申請專利範圍第1項所述之負載室,其中該第一支撐 結構包含多數銷,及該第二支撐結構包含多數銷。 1 0 . —種基材處理系統,至少包含: 第25頁 518640 至少一處理室; 一傳送室,連接至該至少一處理室;及 一負載室,連接至該傳送室,該負載室至少包含: 一單一基材上支撐件及一單一基材下支撐件; 一電梯,用以上升及下降該單一基材上支撐件 及該單一基材下支撐件; 一冷卻板,安置於該負載室中,並定位以接收 來自該單一基材下支樓件之一單一基材; 一中間板,安置於該冷卻板上方及該加熱元件 下方; 一裝載/卸載孔徑,一未處理基材可以經由該裝 載/卸載孔徑而載入至該負載室中,及一已處理基材可 以經由該裝載/卸載孔徑而由該負載室卸載; 一傳送孔徑,一未處理基材可以經由該傳送孔 徑從該負載室傳送至該傳送室,及一已處理基材可以經 由該傳送孔徑從該傳送室被傳送至該負載室;及 一加熱元件,安置於該單一基材上支樓件上方。 1 1.如申請專利範圍第1 0項所述之基材處理系統,其中該 單一基材上支撐件係連接至該中間板。 1 2.如申請專利範圍第1 1項所述之基材處理系統,更包含 一氣體入口 ,用以供應一氣體至該負載室。 第26頁 518640 1 3 .如申請專利範圍第1 2項所述之基材處理系統,其中該 負載室包含一頂面’該氣體入口係沿著該負载室之頂面 ί己置。 1 4 , 一種負載室,至少包含: 一第一結構,適用以支撐一第一基材; 一第二結構,適用以支撐一第二基材,其中該第二 結構包括數個連接至一下板的銷,其中該數個銷包括中 心銷及外銷; 一冷卻板,安置於該第一結構下方;及 一第三結構,用以使該第一結構與該第二結構互相 連接,該第三結構係適用以使該第一及第二結構一起在 垂直方向移動而不受該冷卻板支配。 1 5 .如申請專利範圍第1 4項所述之負載室,更包含一加熱 裝置安置於該第一結構上方。 1 6.如申請專利範圍第1 5項所述之負載室,更包含一頂板 安置於該加熱裝置及該第一結構之間。 1 7.如申請專利範圍第1 4項所述之負載室,其中該第一結 構包含多數支樓件’適用以支樓一玻璃基材。 1 8.如申請專利範圍第1 4項所述之負載室,更包含一第一 第27頁 518640 孔徑位於該負載室之第一侧及一第二孔徑位於該負載 室之第二側。 1 9.如申請專利範圍第1 8項所述之負載室,更包含一正在 處理之基材位於該第二結構上及一未處理基材位於該 第一結構上。 20。如申請專利範圍第14項所述之負載室,更包含一電 梯,該電梯適用以改變該第一、第二及第三結構之垂直 位置並保持該冷卻板靜止不動。 2 1 · —種用以處理顯示器基材之負載室,至少包含: 一室體,其界定一第一孔徑於一第一側表面及一第 二孔徑於一第二側表面; 一上支撐件,適用以支撐一顯示器基材; 一中間板,連接至該上支撐件; 一下支撐件,適用以支撐一顯示器基材; 一下板,連接至該下支樓件; 一單一冷卻板,定位於該室内,該單一冷卻板係定 位於該中間板及該下板之間; 一加熱元件,安置於該上支撐件上方;及 一上板,定位於該上支樓件上方; 其中該上板、該中間板及該下板係互相連接,以使 得該上板、該中間板及該下板可在垂直方向一起移動而 第28頁 518640 不受該冷卻板支配。 22. 如申請專利範圍第2 1項所述之負載室,更包含同時有 一已處理的顯示器基材於該下支撐件上及一未處理的 顯示器基材於該上支撐件上。 23. 如申請專利範圍第2 1項所述之負載室,其中該顯示器 基材包含玻璃。 24. 如申請專利範圍第2 1項所述之負載室,其中該上支撐 件及該下支撐件的尺寸係製作成可承接一形狀為矩形 的玻璃基材,該矩形之長度至少為650公釐且寬度至少 為8 3 0公釐。 2 5 .如申請專利範圍第2 1項所述之負載室,更包含一氣體 入口及一氣體供應器,該氣體供應器包含氦氣。 26.如申請專利範圍第25項所述之負載室,更包含一過濾 器鄰接於該氣體入口。 2 7.如申請專利範圍第21項所述之負載室,更包含一電梯 連接於該下板並適用以使該下板、該中間板及該上板在 一垂直方向移動,其中當該電梯移動該下板、該中間板 及該上板時,該冷卻板係為靜止不動。 第29頁 518640 二8 .如申#利釦圍第2 1項所述之負載室,其中該中間板 包含一冷卻層及一絕緣層。 2 9. —種負載至糸統,至少包含. 一負載室; 一下板’具有多數支撐件自其中延伸出,該等支撐 件適用以接收一單一基材; 一冷卻板’安置於該室中,該冷卻板係定位以接收 來自該支撐結構之一單一基材,該冷卻板包含多數孔徑 於其中’且該等孔徑的尺寸係製作成可接收該等由該下 方板延伸之支撐件; 一中間板,具有多數支撐件自其中延伸出,該等由 該中間板延伸之支撐件適用於接收一單一基材’該中間 板係定位於該冷卻板上方; 該下板係與該冷卻板成間隔设置且係位於該冷卻板 下方;及 該下板及多數支撐件係適用以在-垂直方向移動而 不受該冷卻板支配。 其中該中 垂直方向 h ren姑O Q tS所球之負載至糸統 30.如申請專利範圍第29項所 / A t_L扣、查接且係適用以在 間板及該下板係彼此相連接 上一起移動。 第30頁 518640 3 1 .如申請專利範圍第3 0項所述之負载室系統,更包含一 上板定位於該中間板上方且係連接於該中間板及該下 板,以使得該上板、該中間板及該下板係在一垂直方向 一起移動。 3 2.如申請專利範圍第29項所述之負載室系統,更包含一 加熱元件定位於該中間板上方。 3 3.如申請專利範圍第29項所述之負載室系統,更包含一 電梯連接於該下板且適用以改變該下板及多數支撐件 的垂直位置,同時該冷卻板係保持在一固定的垂直位 置,其中該電梯係定位於該下板下方。 3 4. —種負載室系統,至少包含: 一負載室; 一下支撐件結構,適用以支撐該負載室内之一基材; 一上支撐件結構,適用以支撐該負載室内之一基材; 一冷卻板,定位於該負載室中之該下支撐件結構與 該上支撐件結構之間,該冷卻板係適用以支撐一基材; 及 一電梯,定位於該下支撐件結構下方且連接於該下 支樓件結構及該上支撐件結構,該電梯係適用以改變該 下支撐件結構及該上支撐件結構的垂直位置,同時該冷 卻板係保持在一固定的垂直位置。 第31頁 518640 3 5.如申請專利範圍第34項所述之負載室系統,更包含一 加熱元件定位於該負載室中之該上支樓件結構上方。 3 6.如申請專利範圍第3 5項所述之負載室系統,更包含一 第一孔徑定位於該負載室之第一側上及一第二孔徑定 位於該負載室之第二側上,其中該上支撐件結構、該下 支撐件結構及該冷卻板係定位於該第一孔徑與該第二孔 徑之間。 3 7.如申請專利範圍第34項所述之負載室系統,更包含一 氣體入口適用以供應一氣體至該負載室。 3 8.如申請專利範圍第3 7項所述之負載室系統,其中一包 含氦氣之氣體係供應至該負載室。 3 9.如申請專利範圍第3 7項所述之負載室系統,其中一包 含氦氣及氮氣之氣體係供應至該負載室。 4 0.如申請專利範圍第39項所述之負載室系統,其中該供 應至該負載室之氣體係具有約754-759托耳壓力之氮氣 及約1 - 6托耳之氦氣。 4 1 .如申請專利範圍第3 7項所述之負載室系統,其中該負 第32頁 518640 載室係包含一頂面,該氣體入口係沿著該負載室 配置。 42 . —種處理系統,至少包含: 至少一處理室; 一傳送室,連接至該至少一處理室;及 一負載室,連接至該傳送室,該負載室至少 一下支撐件結構,適用以支撐一基材; 一上支撐件結構,適用以支撐一基材; 一冷卻板’定位於該下支禮件結構與該 件結構之間,該冷卻板適用以支撐一基材;及 一電梯,連接至該下支撐件結構及該上 結構,該電梯定位於該下支撐件結構下方且適用 該下支撐件結構及該上支撐件結構之垂直位置, 冷卻板係保持在一固定的垂直位置。 43. 如申請專利範圍第42項所述之處理系統,其中 一處理室係包含至少一室,該至少一室係由一物 沉積室、一化學氣相沉積室、一蝕刻室及一加熱 成之群組中選出。 44. 如申請專利範圍第42項所述之處理系統,更包 部基材供給台,其包含: 一第一機械手臂,以傳送基材至該負載室並 第33頁 之頂面 包含: 上支撐 支撐件 以改變 同時該 該至少 理氣相 室所組 含一外 從該負 518640 載室拾取基材; 至少一未處理基材卡匣,以供應未處理基材至該負 載室;及 至少一已處理基材卡匣,以接收來自該負載室之已 處理基材。 45.如申請專利範圍第44項所述之處理系統,更包含一第 二機械手臂,用以傳送一基材於該負載室及·該傳送室之 間。 4 6, —種基材處理系統,該系統包含至少一處理室及一傳送 室連接至該至少一處理室,該系統更包含一負載室,該 負載室至少包含: 一單一基材上支撐件及一單一基材下支撐件; 一傳送孔徑,適用以傳送一單一基材於該傳送室及 該負載室之間; 一冷卻板,安置於該負載室中,位於該上支撐件及 下支撐件之間,其並定位以接收來自該單一基材下支撐 件之一單一基材,該冷卻板包括數個孔徑,該單一基材 下支撐件可延伸通過該孔徑以支撐一基材; 一卡匣結構,連接該單一基材上支撐件及該單一基 材下支撐件,而未連接於該冷卻板;及 一電梯,適用以上升及下降該卡匣結構,以使得該 單一基材上支撐件及該單一基材下支撐件係一起移 第34頁 518640 動,阳該冷卻板則保持在〆固定位置。 申明專利範圍第46項所述之基材處理系統,其中該 貝载室更包含—加熱元件安置於該單一基材上支撐件 上方。 ' 48·如申請專利範圍第46項所述之基材處理系統,其中該 負载至更包含一含有氦氣及氮氣的冷卻氣體。 4 9.'一 種 ^^右一a 3另一員载室及—傳送室之基材處理系統,至少包 含: 第 支樓機構,用以支撐該負載室中之-未處理 基材; 加熱機構,用4 , 用以加熱該負載室中之該第一支撐機構 上的該未處理基材; $ -支撐機構’用以支撐該負載室中之一已處理 基材,該第二主擔嫵^ 牙钱構係定位於該第一支撐機構下方且 具有數個支撐銷; ϋ機m ’ n該第_支撐機構及該第二支撑機 構連接在一起,以使得該第一支撐機構及該第二支撐機 構係一致移動; 冷卻機構’用以冷卻該負載室中之該已處理基材, 該冷卻機構包含一具有數個孔徑之板,該第二支撐機構 之該數個支撐銷可通過該等孔徑以支撐該已處理基材; 第35頁 518640 機構,用以改變該第一支撐機構及該第二支撐機構 之位置,同時保持該板在一固定位置;及 其中該加熱機構及該冷卻機構係同時安置於該負載 室中。 第36頁
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI510655B (zh) * | 2013-06-08 | 2015-12-01 | Beijing Nmc Co Ltd | Heating chamber and plasma processing device |
CN113035752A (zh) * | 2021-03-05 | 2021-06-25 | 上海广川科技有限公司 | 负载锁定装置及基片传片方法 |
Families Citing this family (59)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000195925A (ja) | 1998-12-28 | 2000-07-14 | Anelva Corp | 基板処理装置 |
US6949143B1 (en) * | 1999-12-15 | 2005-09-27 | Applied Materials, Inc. | Dual substrate loadlock process equipment |
US6672864B2 (en) | 2001-08-31 | 2004-01-06 | Applied Materials, Inc. | Method and apparatus for processing substrates in a system having high and low pressure areas |
US7316966B2 (en) | 2001-09-21 | 2008-01-08 | Applied Materials, Inc. | Method for transferring substrates in a load lock chamber |
TWI342582B (en) * | 2003-07-17 | 2011-05-21 | Applied Materials Inc | Method of surface texturizing |
US7126087B2 (en) * | 2003-08-07 | 2006-10-24 | Canon Kabushiki Kaisha | Method of effecting heating and cooling in reduced pressure atmosphere |
JP4003882B2 (ja) * | 2003-09-26 | 2007-11-07 | シャープ株式会社 | 基板移載システム |
US7207766B2 (en) | 2003-10-20 | 2007-04-24 | Applied Materials, Inc. | Load lock chamber for large area substrate processing system |
US20070269297A1 (en) | 2003-11-10 | 2007-11-22 | Meulen Peter V D | Semiconductor wafer handling and transport |
US7458763B2 (en) | 2003-11-10 | 2008-12-02 | Blueshift Technologies, Inc. | Mid-entry load lock for semiconductor handling system |
US10086511B2 (en) | 2003-11-10 | 2018-10-02 | Brooks Automation, Inc. | Semiconductor manufacturing systems |
WO2005048313A2 (en) | 2003-11-10 | 2005-05-26 | Blueshift Technologies, Inc. | Methods and systems for handling workpieces in a vacuum-based semiconductor handling system |
US20050176252A1 (en) * | 2004-02-10 | 2005-08-11 | Goodman Matthew G. | Two-stage load for processing both sides of a wafer |
TWI286529B (en) * | 2004-05-06 | 2007-09-11 | Hannstar Display Corp | Method and structure for reception and delivery |
US7497414B2 (en) | 2004-06-14 | 2009-03-03 | Applied Materials, Inc. | Curved slit valve door with flexible coupling |
JP4860167B2 (ja) * | 2005-03-30 | 2012-01-25 | 東京エレクトロン株式会社 | ロードロック装置,処理システム及び処理方法 |
US8353986B2 (en) * | 2005-03-31 | 2013-01-15 | Tokyo Electron Limited | Substrate processing apparatus |
JP4519037B2 (ja) * | 2005-08-31 | 2010-08-04 | 東京エレクトロン株式会社 | 加熱装置及び塗布、現像装置 |
US20080257260A9 (en) * | 2005-09-30 | 2008-10-23 | Applied Materials, Inc. | Batch wafer handling system |
US7845891B2 (en) | 2006-01-13 | 2010-12-07 | Applied Materials, Inc. | Decoupled chamber body |
JP5026715B2 (ja) * | 2006-03-17 | 2012-09-19 | 株式会社アルバック | 金属とSiO2の混合膜の成膜方法 |
US7665951B2 (en) * | 2006-06-02 | 2010-02-23 | Applied Materials, Inc. | Multiple slot load lock chamber and method of operation |
US7695232B2 (en) * | 2006-06-15 | 2010-04-13 | Applied Materials, Inc. | Multi-level load lock chamber, transfer chamber, and robot suitable for interfacing with same |
US7845618B2 (en) | 2006-06-28 | 2010-12-07 | Applied Materials, Inc. | Valve door with ball coupling |
US20080025823A1 (en) * | 2006-07-31 | 2008-01-31 | Masahiko Harumoto | Load lock device, and substrate processing apparatus and substrate processing system including the same |
US8124907B2 (en) | 2006-08-04 | 2012-02-28 | Applied Materials, Inc. | Load lock chamber with decoupled slit valve door seal compartment |
KR100744145B1 (ko) * | 2006-08-07 | 2007-08-01 | 삼성전자주식회사 | 초임계 유체를 이용하는 웨이퍼 처리 장치 및 웨이퍼 처리방법 |
US7822324B2 (en) * | 2006-08-14 | 2010-10-26 | Applied Materials, Inc. | Load lock chamber with heater in tube |
US9147588B2 (en) * | 2007-03-09 | 2015-09-29 | Tel Nexx, Inc. | Substrate processing pallet with cooling |
US9177843B2 (en) * | 2007-06-06 | 2015-11-03 | Taiwan Semiconductor Manufacturing Company, Ltd. | Preventing contamination in integrated circuit manufacturing lines |
US8905124B2 (en) | 2007-06-27 | 2014-12-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | Temperature controlled loadlock chamber |
US20100047954A1 (en) * | 2007-08-31 | 2010-02-25 | Su Tzay-Fa Jeff | Photovoltaic production line |
EP2198367A1 (en) * | 2007-08-31 | 2010-06-23 | Applied Materials, Inc. | Photovoltaic production line |
JP5084420B2 (ja) * | 2007-09-21 | 2012-11-28 | 東京エレクトロン株式会社 | ロードロック装置および真空処理システム |
WO2010009048A2 (en) * | 2008-07-15 | 2010-01-21 | Applied Materials, Inc. | Tube diffuser for load lock chamber |
WO2010067544A1 (ja) * | 2008-12-12 | 2010-06-17 | 芝浦メカトロニクス株式会社 | 基板冷却装置および基板処理システム |
GB2469112A (en) | 2009-04-03 | 2010-10-06 | Mapper Lithography Ip Bv | Wafer support using controlled capillary liquid layer to hold and release wafer |
WO2010094802A1 (en) * | 2009-02-22 | 2010-08-26 | Mapper Lithography Ip B.V. | Preparation unit for lithogrpahy machine |
JP5037551B2 (ja) * | 2009-03-24 | 2012-09-26 | 東京エレクトロン株式会社 | 基板交換機構及び基板交換方法 |
US10655219B1 (en) * | 2009-04-14 | 2020-05-19 | Goodrich Corporation | Containment structure for creating composite structures |
US20120171002A1 (en) * | 2011-01-05 | 2012-07-05 | Electro Scientific Industries, Inc | Apparatus and method for transferring a substrate |
JP6054314B2 (ja) * | 2011-03-01 | 2016-12-27 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 基板搬送及びラジカル閉じ込めのための方法及び装置 |
JP5490741B2 (ja) * | 2011-03-02 | 2014-05-14 | 東京エレクトロン株式会社 | 基板搬送装置の位置調整方法、及び基板処理装置 |
JP2011117085A (ja) * | 2011-03-10 | 2011-06-16 | Canon Anelva Corp | ロードロック室及びそれを備えた薄膜形成装置 |
TWI514089B (zh) | 2011-04-28 | 2015-12-21 | Mapper Lithography Ip Bv | 在微影系統中用於轉移基板的設備 |
JP2013197401A (ja) * | 2012-03-21 | 2013-09-30 | Ulvac Japan Ltd | ロードロックチャンバ |
JP6082283B2 (ja) * | 2012-05-30 | 2017-02-15 | 東京エレクトロン株式会社 | 筐体及びこれを含む基板処理装置 |
KR101375646B1 (ko) * | 2012-06-18 | 2014-03-18 | 주식회사 씨엘디 | 가압 장치 및 방법 |
US20140061039A1 (en) * | 2012-09-05 | 2014-03-06 | Applied Materials, Inc. | Target cooling for physical vapor deposition (pvd) processing systems |
US9016998B2 (en) * | 2013-03-14 | 2015-04-28 | Varian Semiconductor Equipment Associates, Inc. | High throughput, low volume clamshell load lock |
JP5941016B2 (ja) * | 2013-05-27 | 2016-06-29 | 株式会社神戸製鋼所 | 成膜装置およびそれを用いた成膜方法 |
US10796935B2 (en) | 2017-03-17 | 2020-10-06 | Applied Materials, Inc. | Electronic device manufacturing systems, methods, and apparatus for heating substrates and reducing contamination in loadlocks |
JP6863041B2 (ja) * | 2017-04-21 | 2021-04-21 | 東京エレクトロン株式会社 | 基板加熱装置 |
CN108258467B (zh) * | 2017-12-01 | 2020-08-28 | 番禺得意精密电子工业有限公司 | 电连接器 |
CN108193189A (zh) * | 2017-12-27 | 2018-06-22 | 深圳市华星光电技术有限公司 | 一种真空溅射设备及其真空大气交换装置 |
US10607866B2 (en) * | 2018-08-01 | 2020-03-31 | Boston Process Technologies, Inc | Hot wall flux free solder ball treatment arrangement |
CN111968926A (zh) * | 2019-05-20 | 2020-11-20 | 北京北方华创微电子装备有限公司 | 半导体设备以及半导体工艺处理方法 |
US20200395232A1 (en) * | 2019-06-14 | 2020-12-17 | Brooks Automation, Inc. | Substrate process apparatus |
JP2022549271A (ja) * | 2019-09-22 | 2022-11-24 | アプライド マテリアルズ インコーポレイテッド | マルチウエハ空間の単一移送チャンバのファセット |
Family Cites Families (155)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3976330A (en) | 1975-10-01 | 1976-08-24 | International Business Machines Corporation | Transport system for semiconductor wafer multiprocessing station system |
US4047624A (en) | 1975-10-21 | 1977-09-13 | Airco, Inc. | Workpiece handling system for vacuum processing |
US4178113A (en) | 1977-12-05 | 1979-12-11 | Macronetics, Inc. | Buffer storage apparatus for semiconductor wafer processing |
US5187115A (en) | 1977-12-05 | 1993-02-16 | Plasma Physics Corp. | Method of forming semiconducting materials and barriers using a dual enclosure apparatus |
CH626214GA3 (zh) | 1979-02-07 | 1981-11-13 | ||
US4680061A (en) | 1979-12-21 | 1987-07-14 | Varian Associates, Inc. | Method of thermal treatment of a wafer in an evacuated environment |
US4512391A (en) | 1982-01-29 | 1985-04-23 | Varian Associates, Inc. | Apparatus for thermal treatment of semiconductor wafers by gas conduction incorporating peripheral gas inlet |
US5259881A (en) | 1991-05-17 | 1993-11-09 | Materials Research Corporation | Wafer processing cluster tool batch preheating and degassing apparatus |
US4801241A (en) * | 1984-03-09 | 1989-01-31 | Tegal Corporation | Modular article processing machine and method of article handling therein |
US4693777A (en) | 1984-11-30 | 1987-09-15 | Kabushiki Kaisha Toshiba | Apparatus for producing semiconductor devices |
US4759681A (en) | 1985-01-22 | 1988-07-26 | Nissin Electric Co. Ltd. | End station for an ion implantation apparatus |
US5224809A (en) | 1985-01-22 | 1993-07-06 | Applied Materials, Inc. | Semiconductor processing system with robotic autoloader and load lock |
US5044871A (en) | 1985-10-24 | 1991-09-03 | Texas Instruments Incorporated | Integrated circuit processing system |
US4687542A (en) | 1985-10-24 | 1987-08-18 | Texas Instruments Incorporated | Vacuum processing system |
US4966519A (en) | 1985-10-24 | 1990-10-30 | Texas Instruments Incorporated | Integrated circuit processing system |
US4709655A (en) | 1985-12-03 | 1987-12-01 | Varian Associates, Inc. | Chemical vapor deposition apparatus |
US4836733A (en) * | 1986-04-28 | 1989-06-06 | Varian Associates, Inc. | Wafer transfer system |
US4770590A (en) | 1986-05-16 | 1988-09-13 | Silicon Valley Group, Inc. | Method and apparatus for transferring wafers between cassettes and a boat |
US4775281A (en) | 1986-12-02 | 1988-10-04 | Teradyne, Inc. | Apparatus and method for loading and unloading wafers |
US5292393A (en) | 1986-12-19 | 1994-03-08 | Applied Materials, Inc. | Multichamber integrated process system |
US4951601A (en) | 1986-12-19 | 1990-08-28 | Applied Materials, Inc. | Multi-chamber integrated process system |
US5882165A (en) | 1986-12-19 | 1999-03-16 | Applied Materials, Inc. | Multiple chamber integrated process system |
US4785962A (en) | 1987-04-20 | 1988-11-22 | Applied Materials, Inc. | Vacuum chamber slit valve |
US4913929A (en) | 1987-04-21 | 1990-04-03 | The Board Of Trustees Of The Leland Stanford Junior University | Thermal/microwave remote plasma multiprocessing reactor and method of use |
JPS63291419A (ja) | 1987-05-24 | 1988-11-29 | Tatsumo Kk | 加熱処理装置 |
US4846102A (en) | 1987-06-24 | 1989-07-11 | Epsilon Technology, Inc. | Reaction chambers for CVD systems |
US4828224A (en) * | 1987-10-15 | 1989-05-09 | Epsilon Technology, Inc. | Chemical vapor deposition system |
JPH0333058Y2 (zh) | 1987-06-26 | 1991-07-12 | ||
JPS6411320A (en) | 1987-07-06 | 1989-01-13 | Toshiba Corp | Photo-cvd device |
US4816098A (en) | 1987-07-16 | 1989-03-28 | Texas Instruments Incorporated | Apparatus for transferring workpieces |
US4911103A (en) | 1987-07-17 | 1990-03-27 | Texas Instruments Incorporated | Processing apparatus and method |
EP0306967B1 (en) | 1987-09-11 | 1997-04-16 | Hitachi, Ltd. | Apparatus for performing heat treatment on semiconductor wafers |
FR2621930B1 (fr) | 1987-10-15 | 1990-02-02 | Solems Sa | Procede et appareil pour la production par plasma de couches minces a usage electronique et/ou optoelectronique |
US5020475A (en) | 1987-10-15 | 1991-06-04 | Epsilon Technology, Inc. | Substrate handling and transporting apparatus |
US5202716A (en) | 1988-02-12 | 1993-04-13 | Tokyo Electron Limited | Resist process system |
US5259883A (en) | 1988-02-16 | 1993-11-09 | Kabushiki Kaisha Toshiba | Method of thermally processing semiconductor wafers and an apparatus therefor |
US4857689A (en) | 1988-03-23 | 1989-08-15 | High Temperature Engineering Corporation | Rapid thermal furnace for semiconductor processing |
DE58909880D1 (de) | 1988-05-24 | 2001-12-20 | Unaxis Balzers Ag | Vakuumanlage |
US5536128A (en) | 1988-10-21 | 1996-07-16 | Hitachi, Ltd. | Method and apparatus for carrying a variety of products |
US4952299A (en) | 1988-10-31 | 1990-08-28 | Eaton Corporation | Wafer handling apparatus |
US4923584A (en) * | 1988-10-31 | 1990-05-08 | Eaton Corporation | Sealing apparatus for a vacuum processing system |
US5186718A (en) * | 1989-05-19 | 1993-02-16 | Applied Materials, Inc. | Staged-vacuum wafer processing system and method |
US5254170A (en) | 1989-08-07 | 1993-10-19 | Asm Vt, Inc. | Enhanced vertical thermal reactor system |
US5447409A (en) | 1989-10-20 | 1995-09-05 | Applied Materials, Inc. | Robot assembly |
EP0423608B1 (en) | 1989-10-20 | 1996-06-05 | Applied Materials, Inc. | Two-axis magnetically coupled robot |
US5227708A (en) | 1989-10-20 | 1993-07-13 | Applied Materials, Inc. | Two-axis magnetically coupled robot |
US5060354A (en) | 1990-07-02 | 1991-10-29 | George Chizinsky | Heated plate rapid thermal processor |
US5252807A (en) | 1990-07-02 | 1993-10-12 | George Chizinsky | Heated plate rapid thermal processor |
JP2644912B2 (ja) | 1990-08-29 | 1997-08-25 | 株式会社日立製作所 | 真空処理装置及びその運転方法 |
US5261935A (en) * | 1990-09-26 | 1993-11-16 | Tokyo Electron Sagami Limited | Clean air apparatus |
JP2595132B2 (ja) | 1990-11-26 | 1997-03-26 | 株式会社日立製作所 | 真空処理装置 |
US5685684A (en) | 1990-11-26 | 1997-11-11 | Hitachi, Ltd. | Vacuum processing system |
US5199483A (en) | 1991-05-15 | 1993-04-06 | Applied Materials, Inc. | Method and apparatus for cooling wafers |
US5131460A (en) | 1991-10-24 | 1992-07-21 | Applied Materials, Inc. | Reducing particulates during semiconductor fabrication |
JP2598353B2 (ja) | 1991-12-04 | 1997-04-09 | アネルバ株式会社 | 基板処理装置、基板搬送装置及び基板交換方法 |
US5376212A (en) | 1992-02-18 | 1994-12-27 | Tokyo Electron Yamanashi Limited | Reduced-pressure processing apparatus |
JP2748070B2 (ja) * | 1992-05-20 | 1998-05-06 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
US5404894A (en) | 1992-05-20 | 1995-04-11 | Tokyo Electron Kabushiki Kaisha | Conveyor apparatus |
JPH0616206A (ja) | 1992-07-03 | 1994-01-25 | Shinko Electric Co Ltd | クリーンルーム内搬送システム |
US5697749A (en) | 1992-07-17 | 1997-12-16 | Tokyo Electron Kabushiki Kaisha | Wafer processing apparatus |
NZ255814A (en) * | 1992-08-17 | 1996-06-25 | Weyerhaeuser Co | Particle binders for high bulk fibres for absorbent articles |
US5516732A (en) * | 1992-12-04 | 1996-05-14 | Sony Corporation | Wafer processing machine vacuum front end method and apparatus |
EP0608620B1 (en) * | 1993-01-28 | 1996-08-14 | Applied Materials, Inc. | Vacuum Processing apparatus having improved throughput |
US5352294A (en) | 1993-01-28 | 1994-10-04 | White John M | Alignment of a shadow frame and large flat substrates on a support |
US5607009A (en) * | 1993-01-28 | 1997-03-04 | Applied Materials, Inc. | Method of heating and cooling large area substrates and apparatus therefor |
JP3258748B2 (ja) | 1993-02-08 | 2002-02-18 | 東京エレクトロン株式会社 | 熱処理装置 |
US5474410A (en) | 1993-03-14 | 1995-12-12 | Tel-Varian Limited | Multi-chamber system provided with carrier units |
US5695568A (en) | 1993-04-05 | 1997-12-09 | Applied Materials, Inc. | Chemical vapor deposition chamber |
KR100221983B1 (ko) | 1993-04-13 | 1999-09-15 | 히가시 데쓰로 | 처리장치 |
JP3380988B2 (ja) * | 1993-04-21 | 2003-02-24 | 東京エレクトロン株式会社 | 熱処理装置 |
KR100267617B1 (ko) | 1993-04-23 | 2000-10-16 | 히가시 데쓰로 | 진공처리장치 및 진공처리방법 |
US5421889A (en) | 1993-06-29 | 1995-06-06 | Tokyo Electron Limited | Method and apparatus for inverting samples in a process |
DE69402918T2 (de) | 1993-07-15 | 1997-08-14 | Applied Materials Inc | Substratfangvorrichtung und Keramikblatt für Halbleiterbearbeitungseinrichtung |
JP3654597B2 (ja) | 1993-07-15 | 2005-06-02 | 株式会社ルネサステクノロジ | 製造システムおよび製造方法 |
US5616208A (en) | 1993-09-17 | 1997-04-01 | Tokyo Electron Limited | Vacuum processing apparatus, vacuum processing method, and method for cleaning the vacuum processing apparatus |
US5588827A (en) | 1993-12-17 | 1996-12-31 | Brooks Automation Inc. | Passive gas substrate thermal conditioning apparatus and method |
US5738767A (en) * | 1994-01-11 | 1998-04-14 | Intevac, Inc. | Substrate handling and processing system for flat panel displays |
JP3846740B2 (ja) * | 1994-02-25 | 2006-11-15 | 臼井国際産業株式会社 | パイプの曲げ加工装置 |
US5431460A (en) * | 1994-03-07 | 1995-07-11 | Orscheln Co. | Hood release latch mechanism including spring clutch means |
US5934856A (en) | 1994-05-23 | 1999-08-10 | Tokyo Electron Limited | Multi-chamber treatment system |
US5586585A (en) | 1995-02-27 | 1996-12-24 | Asyst Technologies, Inc. | Direct loadlock interface |
JP3270852B2 (ja) | 1995-04-20 | 2002-04-02 | 東京エレクトロン株式会社 | 圧力調整装置及びこれを用いた部屋の連通方法 |
JP3288200B2 (ja) * | 1995-06-09 | 2002-06-04 | 東京エレクトロン株式会社 | 真空処理装置 |
TW309503B (zh) | 1995-06-27 | 1997-07-01 | Tokyo Electron Co Ltd | |
US5615988A (en) | 1995-07-07 | 1997-04-01 | Pri Automation, Inc. | Wafer transfer system having rotational capability |
JP3225337B2 (ja) * | 1995-07-13 | 2001-11-05 | 株式会社新川 | マガジン搬送装置 |
JPH0936198A (ja) | 1995-07-19 | 1997-02-07 | Hitachi Ltd | 真空処理装置およびそれを用いた半導体製造ライン |
US5716207A (en) | 1995-07-26 | 1998-02-10 | Hitachi Techno Engineering Co., Ltd. | Heating furnace |
KR100310249B1 (ko) | 1995-08-05 | 2001-12-17 | 엔도 마코토 | 기판처리장치 |
JPH09107036A (ja) * | 1995-08-09 | 1997-04-22 | Toshiba Corp | 半導体装置 |
US5588627A (en) * | 1995-09-19 | 1996-12-31 | Franklin Brass Manufacturing Company | Paper roller |
US5616964A (en) * | 1995-09-19 | 1997-04-01 | Deere & Company | Lawn and garden tractor interlock circuit |
CH691376A5 (de) * | 1995-10-17 | 2001-07-13 | Unaxis Balzers Ag | Vakuumanlage zur Oberflächenbearbeitung von Werkstücken. |
US6299404B1 (en) * | 1995-10-27 | 2001-10-09 | Brooks Automation Inc. | Substrate transport apparatus with double substrate holders |
JP2713276B2 (ja) | 1995-12-07 | 1998-02-16 | 日本電気株式会社 | 半導体装置の製造装置およびこれを用いた半導体装置の製造方法 |
US5751003A (en) | 1996-02-16 | 1998-05-12 | Eaton Corporation | Loadlock assembly for an ion implantation system |
JPH09284344A (ja) * | 1996-04-11 | 1997-10-31 | Fujitsu Ltd | Atm/stm混在ネットワークシステム |
US6224680B1 (en) * | 1996-07-09 | 2001-05-01 | Gamma Precision Technology, Inc. | Wafer transfer system |
US5944940A (en) | 1996-07-09 | 1999-08-31 | Gamma Precision Technology, Inc. | Wafer transfer system and method of using the same |
US5954472A (en) | 1996-07-15 | 1999-09-21 | Brooks Automation, Inc. | Batch loader arm |
US5891251A (en) | 1996-08-07 | 1999-04-06 | Macleish; Joseph H. | CVD reactor having heated process chamber within isolation chamber |
JP3202929B2 (ja) | 1996-09-13 | 2001-08-27 | 東京エレクトロン株式会社 | 処理システム |
US5997235A (en) | 1996-09-20 | 1999-12-07 | Brooks Automation, Inc. | Swap out plate and assembly |
US6048154A (en) * | 1996-10-02 | 2000-04-11 | Applied Materials, Inc. | High vacuum dual stage load lock and method for loading and unloading wafers using a high vacuum dual stage load lock |
US5855681A (en) | 1996-11-18 | 1999-01-05 | Applied Materials, Inc. | Ultra high throughput wafer vacuum processing system |
US5902088A (en) | 1996-11-18 | 1999-05-11 | Applied Materials, Inc. | Single loadlock chamber with wafer cooling function |
US6082950A (en) | 1996-11-18 | 2000-07-04 | Applied Materials, Inc. | Front end wafer staging with wafer cassette turntables and on-the-fly wafer center finding |
US6152070A (en) * | 1996-11-18 | 2000-11-28 | Applied Materials, Inc. | Tandem process chamber |
US5961269A (en) | 1996-11-18 | 1999-10-05 | Applied Materials, Inc. | Three chamber load lock apparatus |
US5909994A (en) | 1996-11-18 | 1999-06-08 | Applied Materials, Inc. | Vertical dual loadlock chamber |
US5833426A (en) | 1996-12-11 | 1998-11-10 | Applied Materials, Inc. | Magnetically coupled wafer extraction platform |
US5795355A (en) | 1996-12-24 | 1998-08-18 | Applied Materials, Inc. | Integrated micro-environment container loader apparatus having a semipermeable barrier |
KR100234539B1 (ko) * | 1996-12-24 | 1999-12-15 | 윤종용 | 반도체장치 제조용 식각 장치 |
US6059507A (en) * | 1997-04-21 | 2000-05-09 | Brooks Automation, Inc. | Substrate processing apparatus with small batch load lock |
US5944857A (en) * | 1997-05-08 | 1999-08-31 | Tokyo Electron Limited | Multiple single-wafer loadlock wafer processing apparatus and loading and unloading method therefor |
US5951770A (en) | 1997-06-04 | 1999-09-14 | Applied Materials, Inc. | Carousel wafer transfer system |
KR100271758B1 (ko) | 1997-06-25 | 2001-01-15 | 윤종용 | 반도체장치 제조설비 및 이의 구동방법 |
US6276072B1 (en) * | 1997-07-10 | 2001-08-21 | Applied Materials, Inc. | Method and apparatus for heating and cooling substrates |
US5882413A (en) * | 1997-07-11 | 1999-03-16 | Brooks Automation, Inc. | Substrate processing apparatus having a substrate transport with a front end extension and an internal substrate buffer |
US6034000A (en) | 1997-07-28 | 2000-03-07 | Applied Materials, Inc. | Multiple loadlock system |
JPH1154496A (ja) | 1997-08-07 | 1999-02-26 | Tokyo Electron Ltd | 熱処理装置及びガス処理装置 |
JP4048387B2 (ja) * | 1997-09-10 | 2008-02-20 | 東京エレクトロン株式会社 | ロードロック機構及び処理装置 |
US6235634B1 (en) * | 1997-10-08 | 2001-05-22 | Applied Komatsu Technology, Inc. | Modular substrate processing system |
US6688375B1 (en) * | 1997-10-14 | 2004-02-10 | Applied Materials, Inc. | Vacuum processing system having improved substrate heating and cooling |
WO1999028951A2 (en) * | 1997-11-28 | 1999-06-10 | Mattson Technology, Inc. | Systems and methods for low contamination, high throughput handling of workpieces for vacuum processing |
US6270582B1 (en) * | 1997-12-15 | 2001-08-07 | Applied Materials, Inc | Single wafer load lock chamber for pre-processing and post-processing wafers in a vacuum processing system |
US6042623A (en) * | 1998-01-12 | 2000-03-28 | Tokyo Electron Limited | Two-wafer loadlock wafer processing apparatus and loading and unloading method therefor |
JP3966594B2 (ja) * | 1998-01-26 | 2007-08-29 | 東京エレクトロン株式会社 | 予備真空室およびそれを用いた真空処理装置 |
KR100265287B1 (ko) * | 1998-04-21 | 2000-10-02 | 윤종용 | 반도체소자 제조용 식각설비의 멀티챔버 시스템 |
US6206176B1 (en) | 1998-05-20 | 2001-03-27 | Applied Komatsu Technology, Inc. | Substrate transfer shuttle having a magnetic drive |
US6213704B1 (en) | 1998-05-20 | 2001-04-10 | Applied Komatsu Technology, Inc. | Method and apparatus for substrate transfer and processing |
US6215897B1 (en) * | 1998-05-20 | 2001-04-10 | Applied Komatsu Technology, Inc. | Automated substrate processing system |
US6079693A (en) | 1998-05-20 | 2000-06-27 | Applied Komatsu Technology, Inc. | Isolation valves |
US6086362A (en) | 1998-05-20 | 2000-07-11 | Applied Komatsu Technology, Inc. | Multi-function chamber for a substrate processing system |
US6517303B1 (en) * | 1998-05-20 | 2003-02-11 | Applied Komatsu Technology, Inc. | Substrate transfer shuttle |
US6176668B1 (en) * | 1998-05-20 | 2001-01-23 | Applied Komatsu Technology, Inc. | In-situ substrate transfer shuttle |
US6375746B1 (en) * | 1998-07-10 | 2002-04-23 | Novellus Systems, Inc. | Wafer processing architecture including load locks |
US6431807B1 (en) | 1998-07-10 | 2002-08-13 | Novellus Systems, Inc. | Wafer processing architecture including single-wafer load lock with cooling unit |
US6162299A (en) * | 1998-07-10 | 2000-12-19 | Asm America, Inc. | Multi-position load lock chamber |
US6016611A (en) * | 1998-07-13 | 2000-01-25 | Applied Komatsu Technology, Inc. | Gas flow control in a substrate processing system |
JP2000195925A (ja) * | 1998-12-28 | 2000-07-14 | Anelva Corp | 基板処理装置 |
US6120229A (en) * | 1999-02-01 | 2000-09-19 | Brooks Automation Inc. | Substrate carrier as batchloader |
US6106634A (en) * | 1999-02-11 | 2000-08-22 | Applied Materials, Inc. | Methods and apparatus for reducing particle contamination during wafer transport |
US6145673A (en) | 1999-03-31 | 2000-11-14 | Applied Materials, Inc. | Wafer transfer cassette |
US6610150B1 (en) * | 1999-04-02 | 2003-08-26 | Asml Us, Inc. | Semiconductor wafer processing system with vertically-stacked process chambers and single-axis dual-wafer transfer system |
US6486444B1 (en) * | 1999-06-03 | 2002-11-26 | Applied Materials, Inc. | Load-lock with external staging area |
US6318945B1 (en) * | 1999-07-28 | 2001-11-20 | Brooks Automation, Inc. | Substrate processing apparatus with vertically stacked load lock and substrate transport robot |
US6568899B1 (en) * | 1999-11-30 | 2003-05-27 | Wafermasters, Inc. | Wafer processing system including a robot |
US6558509B2 (en) * | 1999-11-30 | 2003-05-06 | Applied Materials, Inc. | Dual wafer load lock |
US6410455B1 (en) * | 1999-11-30 | 2002-06-25 | Wafermasters, Inc. | Wafer processing system |
US6949143B1 (en) * | 1999-12-15 | 2005-09-27 | Applied Materials, Inc. | Dual substrate loadlock process equipment |
KR20080109062A (ko) * | 2000-09-15 | 2008-12-16 | 어플라이드 머티어리얼스, 인코포레이티드 | 처리 장비용 더블 이중 슬롯 로드록 |
US6609869B2 (en) * | 2001-01-04 | 2003-08-26 | Asm America | Transfer chamber with integral loadlock and staging station |
US20020137346A1 (en) * | 2001-03-12 | 2002-09-26 | Applied Materials. Inc. | Workpiece distribution and processing in a high throughput stacked frame |
US7207766B2 (en) * | 2003-10-20 | 2007-04-24 | Applied Materials, Inc. | Load lock chamber for large area substrate processing system |
-
1999
- 1999-12-15 US US09/464,362 patent/US6949143B1/en not_active Expired - Lifetime
-
2000
- 2000-12-11 EP EP00311017A patent/EP1109203A3/en not_active Withdrawn
- 2000-12-12 TW TW091121938A patent/TW550653B/zh not_active IP Right Cessation
- 2000-12-12 TW TW089126505A patent/TW518640B/zh not_active IP Right Cessation
- 2000-12-14 SG SG200007457A patent/SG90766A1/en unknown
- 2000-12-15 KR KR1020000076959A patent/KR20010062475A/ko not_active Application Discontinuation
- 2000-12-15 JP JP2000382319A patent/JP4409756B2/ja not_active Expired - Fee Related
-
2004
- 2004-05-10 US US10/842,079 patent/US7641434B2/en not_active Expired - Fee Related
-
2006
- 2006-11-01 KR KR1020060107074A patent/KR100809139B1/ko active IP Right Grant
- 2006-12-20 US US11/613,556 patent/US20070086881A1/en not_active Abandoned
-
2007
- 2007-07-11 KR KR1020070069588A patent/KR100916026B1/ko active IP Right Grant
-
2010
- 2010-01-21 US US12/691,612 patent/US7976635B2/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI510655B (zh) * | 2013-06-08 | 2015-12-01 | Beijing Nmc Co Ltd | Heating chamber and plasma processing device |
CN113035752A (zh) * | 2021-03-05 | 2021-06-25 | 上海广川科技有限公司 | 负载锁定装置及基片传片方法 |
Also Published As
Publication number | Publication date |
---|---|
US7641434B2 (en) | 2010-01-05 |
KR20060125651A (ko) | 2006-12-06 |
JP2001257250A (ja) | 2001-09-21 |
KR100916026B1 (ko) | 2009-09-08 |
US7976635B2 (en) | 2011-07-12 |
SG90766A1 (en) | 2002-08-20 |
EP1109203A3 (en) | 2005-08-03 |
TW550653B (en) | 2003-09-01 |
KR100809139B1 (ko) | 2008-02-29 |
US6949143B1 (en) | 2005-09-27 |
KR20010062475A (ko) | 2001-07-07 |
US20100107672A1 (en) | 2010-05-06 |
EP1109203A2 (en) | 2001-06-20 |
US20050016454A1 (en) | 2005-01-27 |
US20070086881A1 (en) | 2007-04-19 |
KR20070078420A (ko) | 2007-07-31 |
JP4409756B2 (ja) | 2010-02-03 |
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