JP4003882B2 - 基板移載システム - Google Patents
基板移載システム Download PDFInfo
- Publication number
- JP4003882B2 JP4003882B2 JP2003336499A JP2003336499A JP4003882B2 JP 4003882 B2 JP4003882 B2 JP 4003882B2 JP 2003336499 A JP2003336499 A JP 2003336499A JP 2003336499 A JP2003336499 A JP 2003336499A JP 4003882 B2 JP4003882 B2 JP 4003882B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- storage tray
- substrate storage
- pallet
- opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6734—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
- B65G2201/0235—Containers
- B65G2201/0258—Trays, totes or bins
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53261—Means to align and advance work part
Description
11 底部
11a 開口部
12 枠部
13 係合部
20 ガラス基板
30 基板移載システム
31 架台
32 トレイ保持ユニット
32a トレイ側縁係合部
32c トレイ側縁係合部材
32d スライドガイド
32f 係合爪部
33 昇降台
34 基板取出し具
35 昇降ユニット
A 基板収納トレイ用パレット
70 パレット本体
71 パレット本体開口部
80 シャッター体
81b シャッター体開口部
81c シャッター体開口部
81x、81y、81z プレート
82 枠部
84x、84y、84z シャッター部材
87a 連結ワイヤー
87b、87c 牽引ワイヤー
87f スライドロッド
88 引張りバネ
Claims (7)
- 基板が水平状態で載置される底部に複数の開口部が設けられて上下方向に積み重ね可能に形成された基板収納トレイが、上下方向に積み重ねられた状態で上面に載置されるとともに、載置された最下段の前記基板収納トレイの前記各開口部に対向して基板取出し具挿入用開口部がそれぞれ形成された基板収納トレイ用パレットと、
該基板収納トレイ用パレットが載置された状態で昇降可能になった昇降台と、
該昇降台上に載置された前記基板収納トレイ用パレットの前記各基板取出し具挿入用開口部に対向して該昇降台の下方にそれぞれの下端部が配置されて、前記昇降台の下降にともなって、該昇降台および前記基板収納トレイ用パレットの前記各基板取出し具挿入用開口部を貫通して最下段の前記基板収納トレイの前記各開口部内にそれぞれ挿入されて該基板収納トレイ内の基板をそれぞれの上端部によって上方に持ち上げる複数の基板取出し具と、
前記基板収納トレイ用パレット上に載置された前記各基板収納トレイのそれぞれを、前記昇降台の上方において水平状態で保持することができるように構成されて、最下段の基板収容トレイの内部に収容された基板を取り出すために前記基板収納トレイ用パレット上に載置された状態の前記最下段の基板収容トレイ以外の上段側の基板収容トレイを一括して保持して、前記昇降台の下降によって前記最下段の基板収容トレイと分離するトレイ保持手段とを具備し、
前記基板収納トレイ用パレットは、上下方向に貫通するパレット本体開口部を備えたパレット本体と、前記パレット本体の上面に配置され、前記パレット本体開口部に対向する位置に配置されるシャッター体開口部を有するシャッター体とを有し、前記パレット本体開口部と前記シャッター体開口部とによって、前記基板取出し具挿入用開口部が形成されており、
前記シャッター体は、前記各基板取出し具挿入用開口部を開閉するシャッター部材を備えていることを特徴とする基板移載システム。 - 前記シャッター部材は、水平方向にスライドすることにより前記基板取出し具挿入用開口部を開閉する請求項1に記載の基板移載システム。
- 前記基板取出し具挿入用開口部を閉じる方向に前記シャッター部材を付勢する付勢手段と、
外力が付加されることによって、前記基板取出し具挿入用開口部が開放される方向に前記シャッター部材を前記付勢手段に抗してスライドさせるシャッター開閉機構とを有する請求項2に記載の基板移載システム。 - 前記シャッター開閉機構は、前記シャッター部材に連結されたワイヤーと、
該ワイヤーに連結され、外力が付加されることによって、該ワイヤーを牽引して前記基板取出し具挿入用開口部を開放するように前記シャッター部材をスライドさせる操作手段と、を具備する請求項3に記載の基板移載システム。 - 前記シャッター部材は、前記シャッター体開口部の上側に配置されて上下方向に回動動作することによって該シャッター体開口部を開閉する請求項1に記載の基板移載システム。
- 前記シャッター部材は、前記基板取出し具挿入用開口部内に挿入される基板取出し具によって、該基板取出し具挿入用開口部を開放するように上方に回動される請求項5に記載の基板移載システム。
- 前記基板収納トレイ用パレットを前記基板取出し具が配置された位置に移動させる移動手段をさらに備え、
前記移動手段により前記基板収納トレイ用パレットを前記基板取出し具が配置された位置に移動させたときに、前記操作手段に当接して該操作手段を押圧する押圧手段を備え、該押圧手段によって該操作手段が押圧されることによって、前記シャッター部材が前記基板取出し具挿入用開口部を開放するようにスライドする、請求項4に記載の基板移載システム。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003336499A JP4003882B2 (ja) | 2003-09-26 | 2003-09-26 | 基板移載システム |
US10/947,235 US7568281B2 (en) | 2003-09-26 | 2004-09-23 | Substrate accommodating tray pallet and substrate transfer system |
KR1020040077492A KR100673522B1 (ko) | 2003-09-26 | 2004-09-24 | 기판 수납 트레이 팰릿 및 기판이송시스템 |
TW093129051A TWI255252B (en) | 2003-09-26 | 2004-09-24 | Substrate accommodating tray pallet and substrate transfer system |
CNB200410098130XA CN1304247C (zh) | 2003-09-26 | 2004-09-27 | 基片容纳托盘平板架及基片传送系统 |
US12/491,452 US8756799B2 (en) | 2003-09-26 | 2009-06-25 | Substrate accommodating tray pallet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003336499A JP4003882B2 (ja) | 2003-09-26 | 2003-09-26 | 基板移載システム |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005104475A JP2005104475A (ja) | 2005-04-21 |
JP4003882B2 true JP4003882B2 (ja) | 2007-11-07 |
Family
ID=34373239
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003336499A Expired - Fee Related JP4003882B2 (ja) | 2003-09-26 | 2003-09-26 | 基板移載システム |
Country Status (5)
Country | Link |
---|---|
US (2) | US7568281B2 (ja) |
JP (1) | JP4003882B2 (ja) |
KR (1) | KR100673522B1 (ja) |
CN (1) | CN1304247C (ja) |
TW (1) | TWI255252B (ja) |
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JP2009292595A (ja) * | 2008-06-05 | 2009-12-17 | Toppan Printing Co Ltd | 基板移載装置 |
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US20120027550A1 (en) * | 2010-07-29 | 2012-02-02 | John Bellacicco | Automated installation system for and method of deployment of photovoltaic solar panels |
JP5681412B2 (ja) * | 2010-08-27 | 2015-03-11 | 川崎重工業株式会社 | 板状部材収納用ラック、板状部材移載設備、及び板状部材収納方法 |
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-
2003
- 2003-09-26 JP JP2003336499A patent/JP4003882B2/ja not_active Expired - Fee Related
-
2004
- 2004-09-23 US US10/947,235 patent/US7568281B2/en active Active
- 2004-09-24 TW TW093129051A patent/TWI255252B/zh not_active IP Right Cessation
- 2004-09-24 KR KR1020040077492A patent/KR100673522B1/ko active IP Right Grant
- 2004-09-27 CN CNB200410098130XA patent/CN1304247C/zh active Active
-
2009
- 2009-06-25 US US12/491,452 patent/US8756799B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
TWI255252B (en) | 2006-05-21 |
JP2005104475A (ja) | 2005-04-21 |
US7568281B2 (en) | 2009-08-04 |
US20090255930A1 (en) | 2009-10-15 |
CN1607163A (zh) | 2005-04-20 |
US20050069402A1 (en) | 2005-03-31 |
US8756799B2 (en) | 2014-06-24 |
TW200524787A (en) | 2005-08-01 |
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