TW479371B - Thin film transistor - Google Patents
Thin film transistor Download PDFInfo
- Publication number
- TW479371B TW479371B TW090103830A TW90103830A TW479371B TW 479371 B TW479371 B TW 479371B TW 090103830 A TW090103830 A TW 090103830A TW 90103830 A TW90103830 A TW 90103830A TW 479371 B TW479371 B TW 479371B
- Authority
- TW
- Taiwan
- Prior art keywords
- thin film
- crystal
- channel
- film transistor
- crystal grains
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/38—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by treatments done after the formation of the materials
- H10P14/3802—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
- H10P14/3808—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using laser beams
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6704—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
- H10D30/6713—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device characterised by the properties of the source or drain regions, e.g. compositions or sectional shapes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
- H10D30/673—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
- H10D30/6731—Top-gate only TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6741—Group IV materials, e.g. germanium or silicon carbide
- H10D30/6743—Silicon
- H10D30/6745—Polycrystalline or microcrystalline silicon
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6757—Thin-film transistors [TFT] characterised by the structure of the channel, e.g. transverse or longitudinal shape or doping profile
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/40—Crystalline structures
- H10D62/405—Orientations of crystalline planes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/01—Manufacture or treatment
- H10D86/021—Manufacture or treatment of multiple TFTs
- H10D86/0221—Manufacture or treatment of multiple TFTs comprising manufacture, treatment or patterning of TFT semiconductor bodies
- H10D86/0223—Manufacture or treatment of multiple TFTs comprising manufacture, treatment or patterning of TFT semiconductor bodies comprising crystallisation of amorphous, microcrystalline or polycrystalline semiconductor materials
- H10D86/0229—Manufacture or treatment of multiple TFTs comprising manufacture, treatment or patterning of TFT semiconductor bodies comprising crystallisation of amorphous, microcrystalline or polycrystalline semiconductor materials characterised by control of the annealing or irradiation parameters
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3451—Structure
- H10P14/3452—Microstructure
- H10P14/3456—Polycrystalline
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
- H10P14/2901—Materials
- H10P14/2922—Materials being non-crystalline insulating materials, e.g. glass or polymers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
- H10P14/3404—Deposited materials, e.g. layers characterised by the chemical composition being Group IVA materials
- H10P14/3411—Silicon, silicon germanium or germanium
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3466—Crystal orientation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/38—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by treatments done after the formation of the materials
- H10P14/3802—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
- H10P14/3808—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using laser beams
- H10P14/3816—Pulsed laser beam
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/38—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by treatments done after the formation of the materials
- H10P14/3802—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
- H10P14/382—Scanning of a beam
Landscapes
- Recrystallisation Techniques (AREA)
- Thin Film Transistor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001019026A JP4732599B2 (ja) | 2001-01-26 | 2001-01-26 | 薄膜トランジスタ装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW479371B true TW479371B (en) | 2002-03-11 |
Family
ID=18884972
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW090103830A TW479371B (en) | 2001-01-26 | 2001-02-20 | Thin film transistor |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US6501095B2 (enExample) |
| JP (1) | JP4732599B2 (enExample) |
| KR (1) | KR100704331B1 (enExample) |
| TW (1) | TW479371B (enExample) |
Families Citing this family (56)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6555449B1 (en) | 1996-05-28 | 2003-04-29 | Trustees Of Columbia University In The City Of New York | Methods for producing uniform large-grained and grain boundary location manipulated polycrystalline thin film semiconductors using sequential lateral solidfication |
| US6830993B1 (en) | 2000-03-21 | 2004-12-14 | The Trustees Of Columbia University In The City Of New York | Surface planarization of thin silicon films during and after processing by the sequential lateral solidification method |
| JP4599032B2 (ja) | 2000-10-10 | 2010-12-15 | ザ トラスティーズ オブ コロンビア ユニヴァーシティ イン ザ シティ オブ ニューヨーク | 薄い金属層を処理する方法及び装置 |
| US20020117718A1 (en) * | 2001-02-28 | 2002-08-29 | Apostolos Voutsas | Method of forming predominantly <100> polycrystalline silicon thin film transistors |
| JP2003124230A (ja) * | 2001-10-12 | 2003-04-25 | Hitachi Ltd | 薄膜トランジスタ装置、その製造方法及びこの装置を用いた画像表示装置 |
| KR100483985B1 (ko) * | 2001-11-27 | 2005-04-15 | 삼성에스디아이 주식회사 | 박막 트랜지스터용 다결정 실리콘 박막 및 이를 사용한디바이스 |
| US6864520B2 (en) * | 2002-04-04 | 2005-03-08 | International Business Machines Corporation | Germanium field effect transistor and method of fabricating the same |
| JP4900756B2 (ja) * | 2002-04-16 | 2012-03-21 | セイコーエプソン株式会社 | 半導体装置の製造方法、電気光学装置、集積回路、および電子機器 |
| JP2003332350A (ja) * | 2002-05-17 | 2003-11-21 | Hitachi Ltd | 薄膜半導体装置 |
| KR100483987B1 (ko) * | 2002-07-08 | 2005-04-15 | 삼성에스디아이 주식회사 | 티에프티용 다결정 실리콘 박막 및 이를 사용한 디바이스 |
| WO2004017380A2 (en) | 2002-08-19 | 2004-02-26 | The Trustees Of Columbia University In The City Of New York | A single-shot semiconductor processing system and method having various irradiation patterns |
| JP4873858B2 (ja) | 2002-08-19 | 2012-02-08 | ザ トラスティーズ オブ コロンビア ユニヴァーシティ イン ザ シティ オブ ニューヨーク | エッジ領域を最小にするために基板のフィルム領域のレーザ結晶化処理方法及び装置並びにそのようなフィルム領域の構造 |
| WO2004075263A2 (en) | 2003-02-19 | 2004-09-02 | The Trustees Of Columbia University In The City Of New York | System and process for processing a plurality of semiconductor thin films which are crystallized using sequential lateral solidification techniques |
| CN100555588C (zh) * | 2003-06-27 | 2009-10-28 | 日本电气株式会社 | 薄膜晶体管、薄膜晶体管基板、电子设备及多晶半导体薄膜的制造方法 |
| US7164152B2 (en) | 2003-09-16 | 2007-01-16 | The Trustees Of Columbia University In The City Of New York | Laser-irradiated thin films having variable thickness |
| WO2005029546A2 (en) | 2003-09-16 | 2005-03-31 | The Trustees Of Columbia University In The City Of New York | Method and system for providing a continuous motion sequential lateral solidification for reducing or eliminating artifacts, and a mask for facilitating such artifact reduction/elimination |
| US7364952B2 (en) | 2003-09-16 | 2008-04-29 | The Trustees Of Columbia University In The City Of New York | Systems and methods for processing thin films |
| TWI366859B (en) | 2003-09-16 | 2012-06-21 | Univ Columbia | System and method of enhancing the width of polycrystalline grains produced via sequential lateral solidification using a modified mask pattern |
| TWI351713B (en) | 2003-09-16 | 2011-11-01 | Univ Columbia | Method and system for providing a single-scan, con |
| WO2005029551A2 (en) | 2003-09-16 | 2005-03-31 | The Trustees Of Columbia University In The City Of New York | Processes and systems for laser crystallization processing of film regions on a substrate utilizing a line-type beam, and structures of such film regions |
| US7318866B2 (en) | 2003-09-16 | 2008-01-15 | The Trustees Of Columbia University In The City Of New York | Systems and methods for inducing crystallization of thin films using multiple optical paths |
| WO2005034193A2 (en) | 2003-09-19 | 2005-04-14 | The Trustees Of Columbia University In The City Ofnew York | Single scan irradiation for crystallization of thin films |
| KR100611225B1 (ko) * | 2003-11-22 | 2006-08-10 | 삼성에스디아이 주식회사 | 박막트랜지스터 및 그의 제조방법 |
| KR100611744B1 (ko) | 2003-11-22 | 2006-08-10 | 삼성에스디아이 주식회사 | 금속 유도 측면 결정화 방법을 이용한 박막 트랜지스터 및그의 제조 방법 |
| KR100712101B1 (ko) * | 2004-06-30 | 2007-05-02 | 삼성에스디아이 주식회사 | 박막트랜지스터 및 그의 제조 방법 |
| US7645337B2 (en) | 2004-11-18 | 2010-01-12 | The Trustees Of Columbia University In The City Of New York | Systems and methods for creating crystallographic-orientation controlled poly-silicon films |
| US8274073B2 (en) * | 2005-03-11 | 2012-09-25 | Spansion Llc | Memory device with improved switching speed and data retention |
| US8221544B2 (en) | 2005-04-06 | 2012-07-17 | The Trustees Of Columbia University In The City Of New York | Line scan sequential lateral solidification of thin films |
| KR100731752B1 (ko) | 2005-09-07 | 2007-06-22 | 삼성에스디아이 주식회사 | 박막트랜지스터 |
| JP2007088364A (ja) | 2005-09-26 | 2007-04-05 | Hitachi Displays Ltd | 表示装置 |
| TW200733240A (en) | 2005-12-05 | 2007-09-01 | Univ Columbia | Systems and methods for processing a film, and thin films |
| JP4282699B2 (ja) * | 2006-09-01 | 2009-06-24 | 株式会社東芝 | 半導体装置 |
| US8614471B2 (en) | 2007-09-21 | 2013-12-24 | The Trustees Of Columbia University In The City Of New York | Collections of laterally crystallized semiconductor islands for use in thin film transistors |
| US8415670B2 (en) | 2007-09-25 | 2013-04-09 | The Trustees Of Columbia University In The City Of New York | Methods of producing high uniformity in thin film transistor devices fabricated on laterally crystallized thin films |
| EP2212913A4 (en) | 2007-11-21 | 2013-10-30 | Univ Columbia | SYSTEMS AND METHOD FOR PRODUCING EPITACTIC STRUCTURED THICK FILMS |
| WO2009067688A1 (en) | 2007-11-21 | 2009-05-28 | The Trustees Of Columbia University In The City Of New York | Systems and methods for preparing epitaxially textured polycrystalline films |
| US8012861B2 (en) | 2007-11-21 | 2011-09-06 | The Trustees Of Columbia University In The City Of New York | Systems and methods for preparing epitaxially textured polycrystalline films |
| US8569155B2 (en) | 2008-02-29 | 2013-10-29 | The Trustees Of Columbia University In The City Of New York | Flash lamp annealing crystallization for large area thin films |
| KR20100132020A (ko) * | 2008-02-29 | 2010-12-16 | 더 트러스티이스 오브 콜롬비아 유니버시티 인 더 시티 오브 뉴욕 | 균일한 결정질 si 막들을 제조하는 리소그래피 방법 |
| EP2351067A4 (en) | 2008-11-14 | 2013-07-03 | Univ Columbia | SYSTEMS AND METHOD FOR CRYSTALLIZING THIN FILMS |
| US9087696B2 (en) | 2009-11-03 | 2015-07-21 | The Trustees Of Columbia University In The City Of New York | Systems and methods for non-periodic pulse partial melt film processing |
| US9646831B2 (en) | 2009-11-03 | 2017-05-09 | The Trustees Of Columbia University In The City Of New York | Advanced excimer laser annealing for thin films |
| US8440581B2 (en) | 2009-11-24 | 2013-05-14 | The Trustees Of Columbia University In The City Of New York | Systems and methods for non-periodic pulse sequential lateral solidification |
| WO2013005250A1 (ja) * | 2011-07-05 | 2013-01-10 | パナソニック株式会社 | 薄膜トランジスタおよびその製造方法ならびに表示装置 |
| SG2014008239A (en) | 2011-08-10 | 2014-03-28 | Entegris Inc | Aion coated substrate with optional yttria overlayer |
| CN102664144B (zh) * | 2012-05-18 | 2015-04-15 | 北京大学 | 一种适于锗基器件的界面处理方法 |
| KR101983157B1 (ko) * | 2013-11-19 | 2019-05-28 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
| JP6471379B2 (ja) * | 2014-11-25 | 2019-02-20 | 株式会社ブイ・テクノロジー | 薄膜トランジスタ、薄膜トランジスタの製造方法及びレーザアニール装置 |
| EP3271494A1 (en) | 2015-03-18 | 2018-01-24 | Entegris, Inc. | Articles coated with fluoro-annealed films |
| JP6655301B2 (ja) * | 2015-05-19 | 2020-02-26 | 株式会社ブイ・テクノロジー | レーザアニール装置及び薄膜トランジスタの製造方法 |
| JP6434872B2 (ja) * | 2015-07-31 | 2018-12-05 | 東芝メモリ株式会社 | 半導体装置 |
| JP2020004859A (ja) * | 2018-06-28 | 2020-01-09 | 堺ディスプレイプロダクト株式会社 | 薄膜トランジスタ、表示装置及び薄膜トランジスタの製造方法 |
| US11164809B2 (en) * | 2018-12-17 | 2021-11-02 | Intel Corporation | Integrated circuits and methods for forming integrated circuits |
| WO2021030127A1 (en) * | 2019-08-09 | 2021-02-18 | Micron Technology, Inc. | Transistor and methods of forming transistors |
| US11024736B2 (en) | 2019-08-09 | 2021-06-01 | Micron Technology, Inc. | Transistor and methods of forming integrated circuitry |
| US11637175B2 (en) | 2020-12-09 | 2023-04-25 | Micron Technology, Inc. | Vertical transistors |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2777794B2 (ja) * | 1991-08-21 | 1998-07-23 | 東陶機器株式会社 | トイレ装置 |
| KR100270620B1 (ko) * | 1992-10-19 | 2000-12-01 | 윤종용 | 다결정 실리콘 박막의 제조방법 |
| JP3378078B2 (ja) * | 1994-02-23 | 2003-02-17 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| KR0155304B1 (ko) * | 1994-12-23 | 1998-10-15 | 정선종 | 다결정 박막 트랜지스터 및 그 제조방법 |
| KR100205069B1 (ko) * | 1995-12-21 | 1999-07-01 | 정선종 | 다결정 실리콘 박막 트랜지스터의 제조방법 |
| JPH101994A (ja) * | 1996-06-17 | 1998-01-06 | Naoya Suzuki | 腰掛便器での男子用排尿介助器 |
| JPH101996A (ja) * | 1996-06-18 | 1998-01-06 | Hitachi Home Tec Ltd | 衛生洗浄器の火傷防止装置 |
| JP4017706B2 (ja) * | 1997-07-14 | 2007-12-05 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JPH11145056A (ja) * | 1997-11-07 | 1999-05-28 | Sony Corp | 半導体材料 |
-
2001
- 2001-01-26 JP JP2001019026A patent/JP4732599B2/ja not_active Expired - Fee Related
- 2001-02-20 TW TW090103830A patent/TW479371B/zh not_active IP Right Cessation
- 2001-02-24 KR KR1020010009500A patent/KR100704331B1/ko not_active Expired - Fee Related
- 2001-02-26 US US09/791,827 patent/US6501095B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US6501095B2 (en) | 2002-12-31 |
| JP4732599B2 (ja) | 2011-07-27 |
| KR100704331B1 (ko) | 2007-04-09 |
| US20020100909A1 (en) | 2002-08-01 |
| KR20020063093A (ko) | 2002-08-01 |
| JP2002222957A (ja) | 2002-08-09 |
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