TW449844B - Ball grid array package having an integrated circuit chip - Google Patents
Ball grid array package having an integrated circuit chip Download PDFInfo
- Publication number
- TW449844B TW449844B TW087103626A TW87103626A TW449844B TW 449844 B TW449844 B TW 449844B TW 087103626 A TW087103626 A TW 087103626A TW 87103626 A TW87103626 A TW 87103626A TW 449844 B TW449844 B TW 449844B
- Authority
- TW
- Taiwan
- Prior art keywords
- integrated circuit
- heat sink
- package
- grid array
- tracking layer
- Prior art date
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- H01L2924/3025—Electromagnetic shielding
Description
丨 9 844 6 五、發明説明( A7 B7 經濟部中央標準局I工消費合作社印製 <發明之範圍> =明係有關於一種具有例如積體電路晶片等電子元 ,尤其制有_ —種球形網袼陣列找者。該 匕裴具有輕減重量與減小製造成本的優點。 <發明之背景> 在早期,積體電路晶片係以金屬或究器包裝。以 =器形成半導體包裝時具有優異的熱特性。然而亦有例 σ冋製造成本與其製造技術須耗費時間等的缺點。 為了解決這種缺點,已有許多包裝方式被推荐,其中 最醒目者為一種㈣模造包裝。尤其是一種塑膠模造球形 ,同格陣列包裝可排除傳統表面安裝微細間距塑勝包裝所遇 技術上的困難者。塑膠模造球形網格陣列包裝又可免除將 包裝引伸至積體電路包裝外部邊緣的需要1膠模造球形 網格陣列X可料較小的包裝及絲㈣—印刷電路板上 的極為接近間_包裝。總而言之,球形網格陣列包裝提 供了較短的互連長度之結果改進了其電氣雜。如上揭優 點,連同球形齡陣列包裝的低廉成本,使球形網格陣列 包裝成為一理想的包裝方式而可應用於許多積體電路包裝 上。 第1圖表示一傳統的球形網格陣列包裝的剖面。該圖中 所示之球形網格陣列包裝包含一連接於積體電路圖型的互 連基板1及以可黏性預成劑3附著於基板1的積體電路晶片 2,且具有複數的接合襯墊2a於上部表面上。基板〗的電路 圖型與積體電路晶片2上的接合襯墊2a亦互相連接。同時為 本纸伕尺度適用中國國家標準(CNS ) A4洗格(210Χ297公釐) (诗先K讀背^之注意事項再填寫本丈) ----—------- 、1r 線— A7 B7 449844 五、發明説明(> ) 了從外界環境保護積體電路晶片2的表面,基板丨的導線接 合部份與積體電路晶片2乃以環氧樹脂5封裝。在基板1的下 部表面係附著於複數的軟焊球6以便與形成於一^板(未標 示)上的電源端子做電氣上的連接。 第1圊所示的球形網格陣列包裝降低積體電路晶片的 可靠性’尤有甚者其散熱魏較錢招來積料路晶片的 破壞。為了發散這種積體電路晶片所產生㈣於包 部,即有-耗電更多的問題。同時包裝的整體厚度勢必非 常的厚。 最近為了改善球形網格陣列包裝的散熱特性’開發了 一種具有散熱板的超級球形網格陣列包裝,以該散熱板來 驅散所產生的熱。 第2圖即表示具有散熱板的超級球形網格陣列包裝的 剖面圖。參照該圖,該互連基板包含:由銅製成之三導電 性追蹤層18 ’及夾於導電性追蹤層1δ之三絕緣層lr^尤= 特別的係’互連基板包含全部六層,其最底科電性追縱 層18係安置更底於最底層絕緣層17 ^因此’該絕緣層u 係安置於互連基板最上層。最上層絕緣層17_著於散熱 板11。另外,複數的通孔19係形成於互連基板,通孔19: 各内壁係以導電性金屬電氣連接導電性追蹤層18而加以鍍 膜。一絕緣焊接罩15係形成於最底層追蹤層18,除了球形 區,整個區域係曝露在外。其中,該最上層追蹤層18作為 接地及中間之追蹤層18作為傳輸信號。 這些中間及最上層追縱層18係曝露於井區16,接著各 本纸張尺度適J?i巾關家網L ( eNS )从胁(21QX 297公瘦) ----------裝-----.丨訂--—---線 (铐先K讀背面之注意項再填寫本A ) 經濟部中央榉率局貝工消費合作杜-Sr製 經濟部中央棣率局員工消費合作衽印製 \Ί 9 844 ---〜— —*— ---*—1 ~^ —------------ 五、發明説明($) 別曝露追蹤層18以接合用積體電路晶片10電氣上連接於金 屬導線。整體井區16區域係以封囡材料14封固。同時,一 軟焊球20欲安裝於主機板上,係附著於曝露於絕緣浑接罩 15之最底層追蹤層18,即係於球形區。 其實’與第1圖比較’第2圖所示之超級砵形網格陣列 包裝具有極佳之散熱特性。然而,由於第2圖之包裝有六層 互連基板及一散熱板附著,因此亦有其缺點。因此,然而 由於第2圊的超級球形網格陣列包裝重量大,因而產生一問 題’即是超級球形網格陣列包裝無法應用於筆記本型,袖 珍型電腦或格狀電話等要求輕量的裝置。又由於有昂貴的
兩層或更多銅層的遮覆,因此產生成本高昂而包裝的厚度 太厚的缺點。 X <發明之總論> 為了%決上揭問題,本發明的目的之一乃在提供一種 積體電路元件的包裝,其具有優異的散熱能力,重量輕, 尽度小及製造成本低廉等優點。 以達到本發明所述之目的,球形網格陣列包裝具有以 下組成份: 〜一中央具有井區之互連基板,絕緣層兩側形成第一及 ^二導電性㈣層…與互連基板相同大小之散熱板具有 井區,其係附著於第二導電性追蹤層。具有一接合襯墊 ^積體電路晶片係置於互連基板與散熱板之井 區内,接著 了接σ襯墊係以金屬導線電氣接合於第—導電性追縱層。 同時,一作為接地之接合襯墊係以另一金屬導線電氣連接 本紐从· 297 公沒 _ -----------裝------訂------線 _ (請先閱讀背釭之注意r項再填寫本久) 經濟部中央榇準局員工消費合作社印製 4 9 844 B7 五、發明説明(l|_ ) 附著於第二導電性追蹤層。因此,第二導電性追蹤層係作 為接地,而第一導電性追蹤層係作'為傳輸信號。 整體導線接合部份與丼區係以封固材料封固。其中, 較佳地,積體電路晶片與散熱板處於同一平面上。第一導 電性追蹤層係部份曝露於絕緣焊接罩,及軟焊球係曝露附 著於部份第一導電性追蹤層。 另一方面,第二散熱板較佳的係附著於位於同一平面 上之散熱板版面及積體電路晶片。此外,亦較佳地形成一 於第二散熱板中央曝露積體電路晶片之開口。 第二散熱板亦可與第一散熱板相同,即係,散熱板係 置於積體電路晶片之邊緣。然而,第二散熱板小於第一散 熱板。因此,於第一散熱板邊緣上形成一空間,較佳地此 空間係以周邊絕緣層填充,以防止濕氣滲入第二散熱板。 此情況,省略第一散熱板。 <附圖之簡單說明> 第1圖為傳統球形網格陣列包裝之剖面圖; 第2圖為具有散熱板傳統的超級球形網格陣列包裝之 剖面圖; 第3圖為本發明球形網格陣列包裝第一實施例之剖面 圖; 第4圖為本發明形成於包裝之井區平面圖; 第5圖為一透視圖,表示每一實施例之包裝在製造時使 用一塊狀加熱器; 第6圖為本發明之球形網格陣列包裝第二實施例之剖 本纸張尺度適用中國國家標準(CNS ) Α4現#( 2 ί 〇 X 297公釐) (諸先K讀背氣之注意Ϋ·項再填®) -裝. 訂 4 49844 A 7 B" 五 :¾濟部中央標準局員工消費合作社印製 '發明説明 面圖; 第7圖為本發明之球形網格陣‘列包裝第三實施例之到 面圖; 第8圖為本發明之球形網格陣列包裝第四實施例之剖 面圖; 弟9圖為一曲線圖,係就本發明之第一至第三貫施例中 對各別包裝之散熱特性評估所做模擬試驗的結果; 第10圖為一曲線圖,表示第9圖所示之熱抵抗值轉換成 粍功值之關係; 第11A至11C圊表示本發明之包裝第一實施例中接合用 導線特性的曲線圖; 第12A至12C圖表示本發明之包裝第一實施例中封裝特 性的曲線圖; 第13A至13C圖表示本發明之包裝第一實施例_接合用 導線特性的曲線圖; 弟14A至14C圖表示本發明之包裝第一實施例令封裝.特 性的曲線圖;及 第15A至15C圖表示本發明之包裝在第一實施例中球的 裝著特·性的曲線圖。 <圖式中元件名稱與符號對照> 】:勒反 14 :封固材料 19 :通孔 17,32 :絕緣層 5 :環祕脂 16,36 :井區 18’31a’31b:導電性追職 1卜35 :散熱板 本紙張尺度逋用中國國家揉隼(CNS ) M現格(210X297公釐) 61 :塊狀加熱器 70 ’ 80 :第二散熱板 74 :開口 100,200,300,400 :包裝 449844 A7 _____ B7 - 五、發明説明(^) ’ 20 » 34 - 39 :金屬導線 37 :圓形耳部 42 :封固材料 12 ’ 38 :黏合劑(材料) 2 ’ 10 ’40 :積體電路晶片 35a ’ 40a ’ 50a ’ 7〇a,80a :第一表面 2a ’ 41 :接合襯墊 50 :互連基板 62 :真空孔 72 :黏合劑 90 :周邊絕緣層 <較佳具體實施例之詳細描述> 實施例1 如第3圖所示之一種球形網格陣列包裝1〇〇,根據第i 實施例’其包含:一積體電路晶片40,一互連基板50及一 散熱板35。尤其特別係,井區36係於兩個具有相同大小之 互連基板50與散熱板35中央形成及垂直穿透。井區%較積 體電路晶片40大。該互連基板50與散熱板35係利用黏合劑 38附著,積體電路晶片40係以附著組合置於井區3 6正中央 位置。接合襯墊41係置於積體電路晶片4〇底部。 為了方便說明,如第3圖所示’積體電路晶片4〇之底 面’互連基板50及散熱板35視為第一表面,各上層因此視 為第二表面。一參考標誌“a”係指第一表面,而二參考標 誌“b”係指第二表面。因此,互連基板5〇之第二♦面5〇匕 及散熱板35之第一表面35a係附著一起,以及接合概塾心 本紙伕尺度適用中國國家標準(CNS丨A扣見格(210X297公釐) 裝 . 訂 線 .(讀先聞婧背4之注意f項苒填寫孝λ) - 經濟部中夬標準局貝工消費合作社印製 經濟部中央梯準局更工消費合作社印-*'1冬 4 4984 4 at ____ ___ B7 五、發明説明(7 ) 係置於積體電路b曰片40之第一表面4〇a。尤其係,積體電路 晶片40之第一表面40b係置於與散熱板π之第二表面35b相 同平面上。比較先前技藝第2圖’得知先前技藝與本散熱板 有不同之處。傳統散熱板丨丨係直接置於積體電路晶片4〇 上,而本發明之散熱板35係置於積體電路晶片4〇側邊’因 此,可縮小整體包裝厚度。同時,可選擇銅、鋁或銀作為 散熱板35。 互連基板50於%緣層32之兩側上組成第一及第二導電 性追蹤層31a,31b。其中,形成於底部位置之第一導電性追 蹤層31a作為傳輸信號及形成於上層位置之第二導電性追 蹤層31b則作為接地》其係沒有必要於第一及第導 縱層31a,3關電氣接合。 由於第一導電性追蹤層31a係直向底部配置,第二導電 性追蹤層31 b係利用黏合劑38附著於散熱板扔之第—表面 35a。第一導電性追蹤層31以系以金屬導線電氣接合至接合 親墊41。第-導電性追縱層31a係部份曝露於一絕緣焊接^ 33三導線接合料與耗36似材㈣湘。因此除 了第一表面4Gb與金屬導線39,其利用封时料將整體積體 電路晶片4G封固。-軟焊球34係、於部份曝露之第—導電性 追蹤層31a形成。 同時井區36於互連基板5〇形成,如第4圖所示,散 熱板35具有-正方形剖面,同時亦錢形、菱形及星形。 此外’井H 36角落為圓形、菱形或星形邊緣。 一種具有以上所述組成物之包裝1〇〇的組裝方法如 本紙铁尺度通用*f困囷象橾準(CNS ) A4規格(2!〇><297公釐 (請先^讀背1之注意*-.項再填寫为乂) 裝. 線 A7 B7 9844 五、發明説明(含) 下。如第5圖所示,互連基板50及散熱板35係安裝於一塊狀 加熱器61上’其中井區36各自形成;。此時,散熱板35之第 二表面35b面向塊狀加熱器61其中一表面。 參照第5圖,塊狀加熱器61形成一真空之真空孔62。真 空孔62透過互連基板50之各井區36與井區36而曝露於外 部。此情況下,積體電路晶片40係置於井區36内,以便積 體電路晶片40之第二表面40b面向塊狀加熱器61表面,由此 阻擋著真空孔62。積體電路晶片40透過真空孔62以真空壓 力將塊狀加熱器61穩固固定於塊狀加熱器6〗上。因此,以 上所述之包裝過程完成後,積體電路晶片40之各別第二表 面40b,35b及散熱板35則係位於同一平面上。 藉由這些包裝條件,根據導線接合步驟,積體電路晶 片41之接合襯墊41及第一導電性追蹤層31a係用金屬導線 39來電氣上連接。接著,整體井區36及導線接合部份則以 封固材料42封固。最後’軟焊球34係於第一導電性追蹤層 31a之一部份形成,其係曝露於絕緣焊接罩33。 根據本發明之第1實施例組裝此包裝與第2圖之傳統包 裝比較,有以下優點。 首先’本發明之包裝的散熱板35置於積體電路晶片40 之一側,而第2圖所示之先前技藝包裝,其散熱板11係安置 於積體電路晶片10之上方。包裝之厚度及重量有顯著的降 低。同時,本發明之包裝顯示包裝散熱特性的模擬評估試 驗結果為在氣流2m/sec時的熱阻為15.8°C/W。結果顯示, 並沒有太大差別。即是,本發明之包裝提供類似先前技藝 π .ml tru 1 - ^^3 HI . I —^ϋ ^—ί I- » I 1. - 一OJ· I - 111 HI . ...... (請先閏讀?面之注意.^項再填寫岑7<) 經濟部中央標準局負工消背合作社印裝 本纸乐尺度適用中國國家樣準(CMS ) 格(210X297公釐) 449844 五、發明説明(7 ) 包裝散熱特性的包裝’不過其具有厚度及重量有顯著降低 之優點。 (請先65讀背氐之注意•事項再填寫才菩;) 實施例2 第6圖為本發明之球形網格陣列包裝第2實施例之剖面 圖。第2實施例包裝200之組成物與第1實施例相同,另外不 同之處,將於以下說明。為了改善散熱特性,提供一第二 散熱板70於包裝200<^類似第1實施例所述之其他組成物, 第一散熱板70亦具有一第一表面70a及一第二表面7〇b。第 二散熱板70之第一表面70a置於其底部,其係附著於所述之 第一散熱板35之第二表面35b,40b及積體電路晶片4〇。第 二散熱板70與第一散熱板35為相同大小,其不具有第一散 熱板35之井區36。 根據第2實施例之包裝200,其較第1實施例之包裝100 有更佳地散熱特性。根據模擬試驗結果,包裝2〇〇顯示於空 氣流速為2m/sec時的熱阻為6. 3°C/W,優於第1實施例之包 裝 100。 經濟部中央標準局負工消費合作社印裝 由於如第6圖所示之包裝2〇〇的第二散熱板7〇係於釗固 材料42形成後才附著,其可用較第2圖先前技藝包裝更薄之 材料。因此,包裝200提供較薄之第二散熱板7〇,其重量為 第2圖所示之先前技藝包裝重量的65%。 實施例3 第7圖為本發明之球形網格陣列包裝第3實施例之剖面 圖。第2及第3實施例之差別在於,積體電路晶片4〇沒有藉 由黏合劑附著於第二散熱板70,此外,於第二散熱板7〇中 本纸張尺度適用中國國家標準(CNS ) A4洗格(210X297公釐) 經濟部中央標進.局貝工消費合作社印製 9 844 五、發明説明(ί17) 央形成開口 7 4。 其係由製造過程而造成之差別‘。第2實施例之包裝200 的第二散熱板70係於封固材料42形成後形成,以及第二散 熱板7 0係附著於積體電路晶片4 0上。而第3實施例之散熱板 70係於封固材料未形成前附著於積體電路晶片40上。因 此,根據第3實施例之包裝300,第一散熱板35係利用黏合 劑72附著於第二散熱板70,且積體電路晶片40並沒有附 著,而只是放置於第二散熱板70之第一表面70a上。 此情況下,如第5圖所示,整體合成體係置於塊狀加熱 器61上,接著,透過真空孔62而將真空壓力施於整體合成 體。此時,由於真空壓力必須施於積體電路晶片40上,以 便積體電路晶片40能於第二散熱板70上穩固固定。開口74 將積體電路晶片40之第二表面40b曝露形成於第二散熱板 70。 根據模擬試驗結杲,相似於第1實施例之包裝100,包 裝300顯示於空氣流速2m/sec時的熱阻為7. 8°C/W。因而證 明包裝30ΰ較第1實施例之包裝100,具有更佳之散熱特性。 同時,第7圖所示之包裝300之重量,為第2圖包裝200重量 之 85%。 實施例4 第8圖為本發明之球形網格陣列包裝之第4實施例的剖 面圖。第2與第4實施例之差別在於第4實施例之包裝400不 具有第一散熱板,以及第4實施例之第二散熱板80小於第2 實施例之第二散熱板70。 13 本纸張尺度適用中國國家標準(CNTS ) A4規格(2!〇x 297公釐〉 —--------^1----,—ΐτ--t —--^ (势.户€讀背£-~之注意事項再填£,卢,1) 經濟初I中央標準局員工消費合作社印製 A; E" 五、發明説明(I I ) 即是,第二散熱板80之第一表面8〇a係以黏合劑72直接 附著於互連基板5〇與積體電路晶,片4〇之第二表面5〇b, 40b。同時’由於第二散熱板8〇小於第2實施例之包裝2〇〇 的第一散熱板70,因而互連基板50之第二表面5〇b兩端具有 空間。該空間係由周邊絕緣層9〇填充。該周邊絕緣層作 為防止濕氣滲入第二散熱板8〇及黏合劑72。 第9圖表示就本發明之第一至第三施例中之包裝對其 散熱特性之評估所做模擬試驗結果的曲線圖。在第g圖中縱 座標為以°C/W表示的熱阻,而橫座標表示氣流速度⑴/北^。 在第9圖中’曲線A為本發明第一實施例中包裝的試驗結 果’曲線B為本發明第二實施例争包裝的試驗結果,曲線c 為本發明第三實施例中包裝的試驗結果,及曲線D為本發明 第四實施例中包裝的試驗結果。 如第9圖所示’第一實施例的包裝表示優異的熱阻15 8 °C/W於氣流速度2m/sec下,雖然它並無附著於積體電路晶 體後側的散熱板,但只這樣本發明第一實施例的包裝熱.阻 就能充分發散積體電路晶片所產生的熱。又第二實施例的 包裝表現最優異的熱阻,即大約6. 3°C/W於氣流速度2m/sec 下。又第三實施例的包裝表現的熱阻約為7. 8。〇 / w於氣流速 度2m/sec下。最後,第四實施例的包裝表現的熱阻為約6. 5 °C/W於氣流速度2m/sec下。 第10圖所示者為第9圖的熱阻值轉換為功率散失值的 曲線圖。在第9圖中,縱座標表示功率散失值,以w表示, 而横座標表示氣流速度,單位為m/sec。在第1〇圖中曲線e 本紙伕尺度適用中國國家標準(CNS ) A4規格(2!0Χ297公釐) ----------裝------、玎------M (請先閎讀背氣之注意事項再填寫方,^.} 鯉濟部中夫標準局員工消費合作杜印裝 4 今 844 at _________ 五、發明説明(/Λ ) ' 表不本發明第一實施例中包裝的功率散失特性,曲線F表示 士發明第二實施例中包裝的該特性,曲線6表示本發明第三 只k例中包裝的該特性,而曲線^1表示本發明第四實施例中 包裝的該特性。由第10圖可知,本發明的包裝表現優異的 功率散失特性3. 2W或更多於氣流速度2[η/ sec 下。 第11A至11C圖表示本發明之包裝在第一實施例中接合 =導,特性的曲線圖。於此第11A圖表示接合性拉力試驗結 果。第11B圖表示球的剪斷試驗結果。第uc圖表示環路高 度測定結果。在實施這些試驗之前,為了要在第5圖所示塊 狀加熱器上施行導線接合步驟,韓國K&s公司製造之K&s 1488 1'11]:13〇接合用導線,韓國旧1^6〇叩%,製造的1.3[^15 厚金線,及以商品名Micro Swiss 6 mil Tip販賣的毛管線 乃被使用。對於第一條線與第二條線,導線接合溫度各為 18.0 C,時間各為25msec,所用功率對於第一條線為6〇· ’ 對於第二條線為12_,及所用力量對於第一條線為45g,對 於第二條線為ll〇g〇 第11A圖的曲線I指示在接合性拉力試驗,所有21樣品 值均高於參考值的5g (如曲線J中所示)。因此,可見所完 成之導線接合強度甚大。第11B圖的曲線^指示’在球的剪 斷試驗,所有21樣品值均高於應大於3〇g的參考值。由第ye 圖的曲線N可知,所有22條導線樣品均通過應小於1 丄s 的參考值的標準。 如上揭描述’從第11A至11C所示結果,可以確定將積 體電路晶片以真空力附著於第5圖的塊狀加熱器的狀態下 15 本紙疚尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -----------丨^------1T------^ (請先闔讀背&.之注意事項再填寫方1) 449844 經濟部中央標準局負工消费合作社印裝 五、發明説明(/3 ) 施行導線接合作業可保證獲得成功的導線接合結果而不致 於對包裝的導線接合特性有任何壞影響。 第12A至12C圖表示本發明之包裝第一實施例中封裝特 性的曲線圖。第12A圖表示封裝高度的測定結果。第12B圖 表示導線旋刮的測定結果。第12C圖為空隙的測定結果□在 施行這些試驗之前,為了封裝已接合好導線的包裝,在第5 圖的塊狀加熱器上使用一種調配系統,亦即以商品名 CAMAL05000市售者,及一種堰止/填充材料,亦即以商品 名Hysol 4451/4450市售者曾被使用。封裝溫度為3〇它,而 封裝壓力為1.4bar。如從第12A圖之曲線〇可知,22個樣品 通過了應小於16mils (如曲線P所示)之參考值,如第 圖之曲線Q可知’ 22樣品在導線旋到的測定令均通過應小於 5. 0 %的參考值(如曲線R指示者)。從第12C圖之曲線§可 知’在封裝空隙比試驗中22樣品均通過封裝空隙比應為5 〇 %以下的參考值(如曲線Τ指示者)。 從以上的封裝特性測定結果,可球定將積體電路曰.片 以真空壓力附著於第5圖的塊狀加熱器的狀態下施行封f 作業時可成功的完成封裝而不致於對封裝特性有彳壬彳^ 影響。 .& 第13A至13C圖表示本發明之包裝在第二實施例中接合 用導線特性的曲線圖。第13A圖表示接合拉力試驗的結果。 第13B圖表示球的剪斷試驗結果。第13C圖表示環路高度試 驗結果。 在施行這些性能試驗之前,為了在第5圖所示之塊狀加 16 本紙伎尺度適用中國國家標準(CNS ) A4規格< 2丨公釐) (諳先閏讀背面之注意事項再填寫本異) 裝 訂 線 經濟部中央標準局員工消費合作社印製 4498心 :: 五、發明説明(j ) 熱器上實施導線接合作業,使用了韓國K&s公司出品之K&s 1488 Turbo接合用導線,韓國Mikyeong Sa出品之1. 3mi Is 直徑之金線,及以商品名STP市售之毛管線。第—導線的接 合溫度為220 C,時間為25msec,而對第二導線的接合溫度 仍為22 C,時間則為30msec ,功率對第一與第二導線均各 為60mw,所用之力對第一導線為45g,對第二導線為55g。 如第13A圖之曲線u指示,在接合拉力試驗中21樣品均 具有高於參考值應高於5g以上(如曲線V所示)之值。因此, 可確疋獲得了咼強度導線接合特性。如第13B圖之曲線w所 示,在球的剪斷試驗中,所有21樣品均通過了應大於3〇g 之參考值(如曲線X所示)。如第13C圖之曲線γ所示,22 導線樣品均通過了應小於10mns之參考值(如曲線冗所 示)°從以上的結果,可以確定將積體電路晶片以真空壓 力附著於第5圖的塊狀加熱器的狀態下施行導線接合作業 可保證有成功的導線接合結果。 第14A至14C圖表示本發明之包裝在第二實施例中封裝 特性的曲線圖。第14八圖表示封裝高度的測定結果,第丄仙 圖表示導線旋刮的測定結果,而第14C圖表示封裝空陳的測 定結果。 ' 在施行這些性能試驗以前,為了封裝已經做好導線接 合的包裝,使用一種以商品名CAMAL05000市售的調配系統 及以商品名Hysol 4451/4450市售的堰止/填充材料。封事 溫度為80°C,而封裝壓力為1. 5bar。如第14A圖中曲線W的 指示’ 22樣品均通過了封裝高度應在I6mils以下的參考值 17 本紙弦尺度適用中國國家標芈(CNS ) A4規格(210X297公釐) -------和衣------------—線 ·' (锜先聞讀背面之注意事項再填寫本) A7 449844 五、發明説明(/ί ) (如曲線B1所示)。如第14β圖中曲線^指示,22樣品均通 過了導線旋刮試驗值的應在5· 〇%以下的參考值(如曲線⑴ 所示)。如第14C圖中曲線^的指示,22樣品在封裝空隙比 試驗中其封裝空隙比均通過了應在5, 〇%以下的參考值(如 曲線F1所示)。從以上第丨4八至14(:所示之封裝特性,可以 確定將積體電路晶片以真空壓力附著於第5圖的塊狀加熱 器的狀態下施行封裝作業時可成功的完成封裝而不致於對 封裝特性有任何不良影響。
第15Α至15C圖為表示本發明之包裝在第二實施例中球 的裝著特性的曲線圖,其中第15Α圖表示包裝翹起度的測定 結果’第15Β圖表示軟焊球剪斷試驗測定結果,及第15C圖 表示平坦性的測定結果。在施行這些試驗以前,為了安裝 複數的軟焊球於已封固的包裝内,使用了 一種以sHIBUYA SBM-230的商品名市售的裝球器,一種以商品名CHRONICS SMD-522N市售的火爐,一種以商品名ACCEL MICROCEL 2市 售的焊劑清除器,及一種以商品名SENJU 635Sn/37Pb市售 的軟焊球。於此,在作業過程中火爐最高溫度保持225τ/ 5t: ’而洗滌時焊劑清除時間為i20sec,沖洗時間亦為 120sec而乾燥時間為i60sec。第15A圖中如曲線G1所示,12 樣品全部通過包裝纽曲試驗參考值的5· Omi 1 s (如曲線hi 之指示)。再者,第15B圖中如曲線J1所示,22軟焊球樣品 通過了小於剪斷力試驗參考值的lkg (如曲線K1之指示)。 第15C圖中如曲線L1與L2所示,48樣品用於二個平坦面試 驗’ 24樣品用於一個平坦面試驗,全部通過應小於6mils 18 本紙伕尺度適用中國國家榡準(CNS ) A4g ( 2丨OX2?7公釐} ---------裝------訂------線 /·· (請先閏讀背^之注意事碩再填寫名夷〕 經"部中央標準局負工消費合作社印製 4 4 9 844 五、發明説明(丨b ) -- 之平坦試驗參考值(如曲線Ml所示)。從第l5A至15C圖所 不,可以確定在本發明的第二實施例中軟焊球已成功 裝於包裝内。 關於本發明第三與第四實施例的包裝,其導線接合特 性的試驗,封裝特性與軟焊球安裝特性並未施行。然而雖 然=些試驗並未施行,但是本發明各發明人預期第三與第 四實施例的包裝將與本發明的第二實施例一樣,其導線接 合特性’封裝特性與軟焊球安裝特性均有同樣的結果,此 乃由於第三與第四實施例中的包裝較之本發明第二實施例 中的包裝具有結構上的相同性,各實施例中的包裝均有一 附著於積體電路晶片第二表面上的散熱板。 如上揭描述,本發明的球形網格陣列包裝具有積體電 路晶片像露於包裝之外部或具有淺針或箔片附著於曝露的 積體電路晶片的表面。因此本發明的包裝具有優異的散熱 特性’輕量’厚度薄及製造成本低廉的優點。 經":部中央標準局員工消費合作社印製 本發明的數項詳細實施例與其製造方法業已提供如 上。本發明係依據這些特定的實施例與製造方法加以描 述’上揭描述乃僅屬於關於本發明的說明而並非用來對本 發明做任何限制者。熟習於此方面技術人士或可對本發明 做各種變更或修飾,但如未能脫離本發明之精神範疇時, 概應認為被涵蓋於本發明之申請專利範圍内,特此聲明。 ___ 19 本紙用中SS 家標準(〔NS ) ( 21GX297公釐)
Claims (1)
- AS 4 49 84 4 cb 六、申請專利範圍 1. 一種球形網格陣列包裝,包括: 一互連基板之第一導電性追蹤層'與第二導電性追蹤層係 形成於絕緣層兩側,部份第一導電性追蹤層係曝露於一 絕緣焊接罩及一井區係形成於互連基板中央; 一散熱板具有互面對之第一及第二表面,其中,第一表 面係附著於互連基板之第二導電性追蹤層,一具有與互 連基板相同大小之井區,形成於散熱板中央; 一積體電路晶片具有互對立之第一及第二表面,以及其 係置於散熱板與互連基板之各別井區,其t,接合襯墊 係置於第一表面上,而第二表面係置於與散熱板之第二 表面於相同平面; 複數的金屬導線用以電氣上連接積體電路晶片之各別接 合襯墊、第一導電性追蹤層或第二導電性追蹤層; 一封固材料作為封固整體金屬導線,用以填補各別井 區,及 一軟焊球安裝於曝露於絕緣焊接罩之第一導電性追蹤 層。 經濟部中央標华局員工消費合作社印製 (請先-「讀^£之注^事項再填穷"頁) 2. 如申請專利範圍第1項所述之球形網格陣列包裝,其中, 第二散熱板係附著於積體電路晶片與散熱板之各別第二 表面。 3. 如申請專利範圍第1項所述之球形網格陣列包裝,其中, 第二散熱板係附著於散熱板之第二表面,及用作提供真 空壓力至積體電路晶片之第二表面的開口,其係形成第 二散熱板之中央。 20 本紙張尺度適用中國国家標準(CNS ) A4^格(210X297公釐) /1 4 9 844 | DS ^、申請專到園 4. 如申請專利範圍第1項至第3.項所述之球形網格陣列包 裝,其中,散熱板係由選自一群包含銅'鉋及銀金屬所 製成。 5. 如申請專利範圍第1項或第3項所述之球形網格陣列包 裝,其中’該導電性追蹤層係由銅金屬製成。 6. —種球形網格陣列包裝,其包含: 一互連基板之第一導電性追蹤層與第二導電性追縱層係 形成於絕緣層兩側,部份第一導電性追蹤層係曝露於一 絕緣焊接罩’及一井區係形成於互連基板中央; 一積體電路晶片具有互對立之第一及第二表面,以及其 係置於散熱板與互連基板之各別井區,其中,接合觀墊 係置於第一表面上; 小於互連基板之一散熱板係附著於積體電路晶片之第二 表面及互連基板上; 一封固材料作為封固整體金屬導線,用以填補各別丼 區; 經濟部中央標準局貝工消費合作社印策 複數的金屬導線用以電氣上連接積體電路晶片之各別接 合襯墊、第一導電性追蹤層或第二導電性追蹤層; 一周邊絕緣層係形成於積體電路晶片之第二表面兩端的 空間,其中,避免散熱板與互連基板之接點區域有濕氣 滲入現象;及 一軟焊球安裝於曝露於絕緣焊接罩之第〜導電性追縱 層。 7. 如肀請專利範圍第6項所述之球形網格陣列包裝,其令, 21 本纸铁尺度適用中國园家標準(CNS ) A4規格(210X297公釐) 經濟部中央標準局員工消費合作社印製 449844 会! CS __PS.___ 六、申請專利範園 散熱板係由選自一群包含銅、I呂及銀金屬所製成。 8.如申請專利範圍第6項所述之球形網格陣列包裝,其中 該導電性追蹤層係由銅金屬製成。 2 2 ΤΗ±·衣 i .*τ. (辞先:s-ttt,面之注,意事項'再^窝本頁} 線 本纸伕尺度速用中國闺家標準(CNS ) A4現格(2丨0X297公釐)
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JP (1) | JP3407184B2 (zh) |
CN (1) | CN100365804C (zh) |
DE (1) | DE19821715B4 (zh) |
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- 1998-03-20 GB GB9806078A patent/GB2325340B/en not_active Expired - Fee Related
- 1998-03-27 JP JP10042898A patent/JP3407184B2/ja not_active Expired - Fee Related
- 1998-04-15 US US09/060,981 patent/US6060778A/en not_active Expired - Lifetime
- 1998-05-06 CN CNB981079326A patent/CN100365804C/zh not_active Expired - Fee Related
- 1998-05-14 DE DE19821715A patent/DE19821715B4/de not_active Expired - Fee Related
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US6060778A (en) | 2000-05-09 |
CN100365804C (zh) | 2008-01-30 |
GB2325340A (en) | 1998-11-18 |
JPH1145956A (ja) | 1999-02-16 |
JP3407184B2 (ja) | 2003-05-19 |
GB2325340B (en) | 2002-09-11 |
CN1199927A (zh) | 1998-11-25 |
DE19821715A1 (de) | 1999-01-28 |
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