TW408041B - Tin paste coating machine - Google Patents

Tin paste coating machine Download PDF

Info

Publication number
TW408041B
TW408041B TW088102789A TW88102789A TW408041B TW 408041 B TW408041 B TW 408041B TW 088102789 A TW088102789 A TW 088102789A TW 88102789 A TW88102789 A TW 88102789A TW 408041 B TW408041 B TW 408041B
Authority
TW
Taiwan
Prior art keywords
solder paste
substrate
coating
nozzle
speed
Prior art date
Application number
TW088102789A
Other languages
English (en)
Chinese (zh)
Inventor
Shigeru Ishida
Yukihiro Kawasumi
Fukuo Yoneda
Haruo Sankai
Original Assignee
Hitachi Techno Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Techno Eng filed Critical Hitachi Techno Eng
Application granted granted Critical
Publication of TW408041B publication Critical patent/TW408041B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Coating Apparatus (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW088102789A 1998-03-17 1999-02-24 Tin paste coating machine TW408041B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP06718898A JP3492190B2 (ja) 1998-03-17 1998-03-17 ペースト塗布方法とペースト塗布機

Publications (1)

Publication Number Publication Date
TW408041B true TW408041B (en) 2000-10-11

Family

ID=13337686

Family Applications (1)

Application Number Title Priority Date Filing Date
TW088102789A TW408041B (en) 1998-03-17 1999-02-24 Tin paste coating machine

Country Status (3)

Country Link
JP (1) JP3492190B2 (ja)
KR (1) KR100303617B1 (ja)
TW (1) TW408041B (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101927223A (zh) * 2009-06-23 2010-12-29 芝浦机械电子装置股份有限公司 糊料涂敷装置以及糊料涂敷方法

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4277428B2 (ja) * 2000-07-18 2009-06-10 パナソニック株式会社 ボンディングペーストの塗布装置および塗布方法
JP3619791B2 (ja) * 2001-06-26 2005-02-16 株式会社 日立インダストリイズ ペースト塗布機
JP2003031642A (ja) * 2001-07-16 2003-01-31 Shibaura Mechatronics Corp 基板搬送装置、それを用いたペースト塗布装置、及びペースト塗布方法
KR100652045B1 (ko) 2001-12-21 2006-11-30 엘지.필립스 엘시디 주식회사 액정표시소자 및 그 제조방법
KR100672641B1 (ko) 2002-02-20 2007-01-23 엘지.필립스 엘시디 주식회사 액정표시소자 및 그 제조방법
JP4210139B2 (ja) 2002-03-23 2009-01-14 エルジー ディスプレイ カンパニー リミテッド スペーサの高さによって液晶の滴下量調整が可能である液晶滴下装置及びその滴下方法
KR100618578B1 (ko) 2002-12-20 2006-08-31 엘지.필립스 엘시디 주식회사 액정 표시패널의 디스펜서 및 이를 이용한 디스펜싱 방법
KR100996576B1 (ko) 2003-05-09 2010-11-24 주식회사 탑 엔지니어링 액정적하장치 및 액정적하방법
KR100696933B1 (ko) * 2006-05-25 2007-03-20 주식회사 탑 엔지니어링 페이스트 도포기를 위한 페이스트 모의 도포 장치 및 방법
KR101025215B1 (ko) * 2008-08-08 2011-03-31 주식회사 탑 엔지니어링 기판의 리페어구간 설정방법
KR101023949B1 (ko) * 2008-08-08 2011-03-28 주식회사 탑 엔지니어링 기판검사정보를 이용한 디스펜서의 페이스트 도포 방법
JP5387149B2 (ja) * 2009-06-04 2014-01-15 パナソニック株式会社 ペースト塗布装置、電子部品接合装置、ペースト塗布方法及び電子部品接合方法
KR20110028778A (ko) * 2009-09-14 2011-03-22 주식회사 탑 엔지니어링 페이스트 도포방법
KR101175284B1 (ko) * 2009-09-15 2012-08-21 주식회사 탑 엔지니어링 페이스트 디스펜서 및 그 제어방법
JP5630050B2 (ja) * 2010-03-26 2014-11-26 パナソニック株式会社 ペースト塗布装置
JP5666195B2 (ja) * 2010-08-10 2015-02-12 株式会社日立ハイテクインスツルメンツ ダイボンダ及び半導体製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101927223A (zh) * 2009-06-23 2010-12-29 芝浦机械电子装置股份有限公司 糊料涂敷装置以及糊料涂敷方法
CN101927223B (zh) * 2009-06-23 2013-02-06 芝浦机械电子装置股份有限公司 糊料涂敷装置以及糊料涂敷方法

Also Published As

Publication number Publication date
KR100303617B1 (ko) 2001-09-24
KR19990077916A (ko) 1999-10-25
JPH11262712A (ja) 1999-09-28
JP3492190B2 (ja) 2004-02-03

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Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees