408041 A7 B7 五、發明説明（1 ) 〔發明之詳細說明〕 〔發明所屬之技術領域〕 本發明是關於將基板相對於噴嘴的吐出口而載置於工 作台上，在基板主面上維持著垂直方向的該噴嘴與該基板 之預定相對距離，使塡充於錫膏收納筒之錫膏從該吐出口 吐出於該基板上，使該基板與該噴嘴的相對位置關係變化 ’而可於該基板上塗布預定形狀之錫膏模樣的錫膏塗布機 ，尤其是關於可提高生產性之錫膏塗布機者。 〔習知技術〕 習知，之錫膏塗布機中，作爲提高生產性的方法有將塡 充於錫膏收納筒的錫膏從噴嘴一邊吐出至基板上，並提高 噴嘴與基板間的相對移動速度，即塗布錫膏模樣時的速度 (以下，稱塗布速度）。 〔發明所欲解決之問題〕 但是，錫膏塗布機如上述習知之技術，一旦提高塗布 速度時，錫膏模樣的直線部雖無問題，但是曲率半徑小的 曲線部在塗布方向呈直角變化時，即例如從X軸方向至Y 軸方向或從Y軸方向至X軸方向改變其塗布方向時，會使 移動的部分發生振動。例如，移動部份爲噴嘴，固定部分 爲載置於基板之基板吸盤時（即，相對於基板移動噴嘴時 )，使噴嘴的移動方向發生變化時，噴嘴產生垂直（Z軸 )方向或水平（X，Y軸）方向的振動尤其是垂直方向 本紙伕尺度適用中國國家標率（CNS ) A4規格（210X297公釐） <祷先閱讀背面之注意事項再填寫本頁) ‘裝· ΤΓ*— 經濟部智慧財產局員工消費合作社印製 -4- 408041 at _ B7_ 五、發明説明（2 ) (請先閱讀背面之注意事項再填寫本頁) 的振動大。又，固定部份爲噴嘴，移動部分爲基板吸盤時 (即，基板移動時），同樣使該基板吸盤的移動方向發生 變化時，基板吸盤因此使載置固定於此之基板產生相同的 振動，尤其會使垂直方向的振動增大。上述振動在基板周 邊部，尤其是角隅部較大。因此，在噴嘴與基板間之基板 的主面產生垂直方向之（相對）距離的變動而會降低塗布 精度。 即，如第1 0圖所示，噴嘴1 3 a與基板2 2間之基 板的相對（位置）距離在5 — z之間變動*因此可變化每 單位時間的錫膏塗布量，會有不能塗布形成預定形狀之錫 膏模樣2，3的問題，並且越提高塗布速度時會增大噴嘴 1 3 a與基板2 2間之相對“位置）距離的變動。因此形 成不能提高塗布速度而不能提高其生產性者。 本發明之目的爲提供可消除上述問題，並可提高塗布 速度增加生產性，同時可進行良好之預定形狀的錫膏模樣 塗布形成之錫膏塗布機。 經濟部智慧財產局員工消費合作社印製 〔解決問題之手段〕 爲達成上述之目的，本發明之錫膏塗布機是將基扳載 置於工作台上形成與噴嘴吐出口相對，在基板主面上維持 著垂直方向之該噴嘴與該基板間相對的預定距離，使塡充 於錫膏收納筒的錫膏從該吐出口吐出至該基板上，使該基 板與該噴嘴之該基板主面的相對位置關係變化，而可在該 基板上描繪預定形狀之錫膏模樣的錫膏塗布機中，其特徵 本紙張尺度適用中國國家標準（CNS > A4规格（210X297公釐） -5- 408041 377 五、發明説明（3 ) 爲： (請先閎讀背面之注項再填寫本頁) 具備以預定之相對移動速度使載置於該工作台的預定 基板及與該噴嘴間的相對位置關係變化，檢測出垂直該噴 嘴與該預定基板間之該預定基板主面方向間之相對距離的 第1手段； 判定是否爲預先設定該第1手段所檢測之該相對距離 的容許範圍之第2手段： . 藉該第2手段判定該相對距離爲容許範圍外時，以較 該預定之相對速度降低預定量的速度作爲新的預定之相對 移動速度，利用該新的預定之相對移動速度使第1手段動 作之第3手段；及， 藉該第2手段判定該相對距離爲容許範圍內時，爲了 描繪預定形狀之錫膏模樣而以當時之預定相對移動速度作 爲從該噴嘴吐出口吐出錫膏的基板與該噴嘴之間的相對移 動速度的第4手段。 〔發明之實施形態〕 經濟部智慧財產局員工消費合作社印製 使用圖示說明本發明之一實施形態如下。 第1圖是表示本發明錫膏塗布機之一實施形態之透視 圖，1是架台，2a 、2b爲基板運送機，3爲支持台， 4爲基板吸盤，5爲Θ軸移動台，6a 、6b爲X軸移動 台’ 7爲Y軸移動台’ 8a 、8b爲伺服馬達’ 9爲Z軸 移動台，10爲伺服馬達，1 1爲滾珠螺桿，12爲伺月艮 馬達，1 3爲錫膏收納筒（缸筒），1 4爲里程計，1 5 本紙張尺度適用中圏國家梯準（CNS ) A4規格（210X297公釐） -6- A7 B7 ^08041 五、發明説明（4 ) (請先閲讀背面之注意事項再填寫本頁) 爲支持板，1 6 a 、1 6b爲影像識別攝影機，1 7控芾!J 部，1 8爲監視器，1 9爲鍵盤，2 0爲具備外部記憶裝 置之個人電腦本體，2 1爲電纜。 同圖中，架台1上設有平行於X方向，且可自由升降 之2基板運送機2a、2b ，將未圖示的基板從圖示內側 朝著跟前方，即X軸方向水平運送。又，架台1設有支持 台3 ’在該支持台3上藉由0軸移動台5載置基板吸盤4 。該0軸移動台5係可使基板吸盤4朝著Z軸周圍的0方 向轉動者。 經濟部智慧財產局員工消費合作杜印製 架台1更設有較基板運送機2a 、2b外側而平行X 軸的X軸，移動台6 a 、6b ，設置Y軸移動台7跨越該等 X軸移動台6 a 、6b之間.。該Y軸移動台7是藉著設於 X軸移動台6a 、6b之伺服馬達8a 、8b的正向或逆 向的轉動（正逆轉）朝著X軸方向水平運送。Y軸移動台 7上設有藉伺服馬達1 0的驅動使滾珠螺桿1 1正逆轉而 朝著Y軸方向移動之Z軸移動台9。該Z軸移動台9設有 支持固定錫膏收納筒1 3或里程計1 4之支持板1 5，伺 服馬達1 2是藉由設於該支持板1 5之未圖示線性引導的 可動部使錫膏收納筒13或里程計14朝著Z軸方向移動 錫膏收納筒1 3係可自由拆卸地安裝於該線性引導的可 動部。又，架台1的天板上向上設置未圖示之基板定位等 用之影像識別攝影機1 6 a 、1 6 b。 架台1的內部設有控制伺服馬達8 a 、8 b、1 〇、 1 2、24 (未圖示）等的控制部1 7，該控制部1 7是 本紙張尺度適用中國國家揉準（CNS > A4规格（2丨Ο X 297公釐） ^1)8041 A7 _ B7 五、發明説明（5 ) (請先閲讀背面之注$項再填寫本頁) 藉由電纜2 1與監視器1 8及鍵盤1 9、個人電腦本體 2 0連接，從鍵盤1 9輸入上述控制部1 7之各種處理用 的數據，以監視器顯示影像識別攝影機1 6 a、1 6 b所 捕捉的影像或控制部1 7的處理狀況。 又，從鍵盤1 9所輸入的數據等係記憶保管於個人電 腦本體2 0之外部記億裝置的磁片等記憶媒體。 第2圖是將第1圖所示錫膏收納筒1 3與里程計1 4 的部分擴大表示之透視圖，13a爲噴嘴、22爲基板、 2 3爲錫膏模樣，對應第1圖的部分係賦予同一符號。 經濟部智慧財產局員工消費合作社印製 同圖中，里程計1 4下端部具有三角形缺口部，在該 缺口部內、設有發光元件與複數個受光元件。噴嘴1 3 a係 定位於里程計1 4之缺口部·下部。里程計1 4係以非接觸 之三角測法測量從噴嘴1 3 a前端部至玻璃所成之基板 2 2表面（上面）的距離。即，在上述三角形缺口部的單 側斜面上設置發光元件，自該發光元件所放射的雷射光L 是以基板2 2上的測量點S反射，以設於上述缺口部另一 側斜面之複數受光元件的任一元件受光。因此，雷射光L 不致爲錫膏收納筒1 3或噴嘴1 3 a所遮蔽。 又，基板2 2上的雷射光L之測量點S與噴嘴1 3 a 正下方位置僅在基板2 2上偏離ΔΧ、ΔΥ，該等微小的 距離ΔΧ、ΔΥ左右偏離的位置間，不具基板2 2表面膨 脹（凹凸）差，因此從里程計1 4的測量結果與噴嘴 1 3 a前端部至基板2 2表面爲止的距離之間幾乎不存在 有任何差距。因此，根據該里程計1 4的測量結果控制伺 本紙張尺度適用中國國家搮準（CNS ) A4規格（210X297公釐） -8 - ^08041 經濟部智慧財產局員工消費合作社印製 A7 WJ_五、發明説明（6 ) 服馬達1 2，藉此可配合基板2 2表面的膨脹維持噴嘴 1 3 a前端部至基板2 2表面間一定的距離，在基板2 2 上形成一樣之錫膏模樣2 3的寬度與厚度。 第3圖是表示第1圖所示控制部17的構成與錫膏收 納筒1 3之氣壓的控制、基板2 2的控制之方塊圖， 17a爲微電腦、17b爲電動機控制器、17c 1、 17c2爲XI ，X2軸驅動器、17d爲Y軸驅動器、 ]_7e爲0軸驅動器、17ί爲Z軸驅動器、17g爲數 據通訊匯流排、17 h爲外部介面、2 4爲驅動0軸移動 台5 (第1圖）之伺服馬達、25〜29爲編碼器、30 爲正壓源、’、30a爲正壓調節器、31爲負壓源、31a 爲負壓調節器、3 2爲閥組•，對應第1圖及第2圖的部分 賦予相同符號。 同圖中，控制部1 7內設有處理微電腦1 7 a及電動 機控制器176，又、丫、2、0各軸驅動器17〇1〜 1 7 f 、影像識別攝影機1 6 a 、1 6 b所獲得的映像訊 號之影像處理裝置1 7 i 、鍵盤1 9等間的訊號傳送之外 部介面1 7 h。 控制部1 7更包含有基板運送機2 a 、2 b的驅動控 制系，但在此省略其圖示。 又’微電腦1 7 a雖未圖示，但具備儲存進行主運算 部及後述之錫膏塗布描繪用處理程式的ROM;儲存主運 算部的處理結果及來自外部介面1 7 h及電動機控制器 1 7 b的輸入數據之ram ;及，處理外部介面1 7 h及 (讀先W讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS ) A4^格（2丨0><297公釐） -9- 經濟部智慧財產局員工消費合作社印製 A7 -408(Ηί-—- 五、發明説明（7 ) 電動機控制器1 7 b的數據之輸出入部等。各伺服馬達 8a 、8b、1〇、12、24設有檢測轉動量之編碼器 2 5〜29 ，將其檢測結果回饋至X、Y、Z、0的各軸 驅動器1 7 c 1〜1 7 ί進行位置控制。 伺服馬達8 a、8 b、1 0是根據從鍵盤輸入而儲存 在微電腦1 7 a之RAM的數據而正逆向轉動，藉此可利 用來自負壓源分配的負壓對於基板吸盤4 (第1圖）真空 吸附之基板2 2 ，使噴嘴13 a (第2圖）經由Z軸移動 台9 (第1圖）朝著X、Y軸方向移動任意的距離，其移 動中•藉微電腦1 7 a控制閥組3 2，可從正壓源3 0經 由正壓調•節器3 0 a與閥組3 2，僅微量外加空氣壓至錫 膏收納筒1 3，從噴嘴1 3 _a前端部吐出口吐出錫膏以預 定的模樣將錫膏塗布於基板2 2。該Z軸移動台9的X、 Y軸方向的水平移動中，里程計1 4可測量噴嘴1 3 a與 基板2 2間的距離，以Z軸驅動器1 7 f控制伺服馬達 1 2以經常維持該距離的一定性。 又，未進行錫膏塗布之待機狀態中，藉微電腦1 7 a 控制著閥組3 2 ，使負壓源3 1經由負壓調節器3 1 a及 閥組3 2連通於錫膏收納筒1 3 ，使噴嘴1 3 a吐出口所 吐出的錫膏回到錫膏收納筒1 3內。藉此可防止該吐出口 之錫膏的滴下。.並且，也可以未圖示之影像識別攝影機監 視此噴嘴1 3 a的吐出□，僅液體滴下時將負壓源3 1連 通於錫膏收納筒1 3。 第4圖是表示第1圖所示實施形態之連續動作的方塊 本紙張尺度適用中國國家標準（CNS > A4規格（210 X 297公釐） n n n I I -I - , - n n I -I -L__,- - 1 (請先聞讀背面之注意事項再填寫本頁) -10- 經濟部智慧財產局員工消費合作社印製 A7 __ 五、發明説明（8 ) 圖。 同圖中，首先將電源投入此實施形態之錫膏塗布機時 (步驟100) *可實行其初期設定（步驟200)。該 初期設定過程於第1圖中，藉著伺服馬達8 a、8b、 10的驅動，使Z軸移動台朝著X、Y軸方向移動而定位 於預定的基準位置上，且爲了將噴嘴1 3 a定位在其錫膏 吐出口開始吐出錫膏的位置上（即，錫膏塗布開始點）， 設置在預定之原點位置上的同時，進行塗布在以錫膏模樣 描繪爲對象的基板（以下，稱實基板）之1以上的每一錫 膏模樣的數據（以下，稱錫膏模樣數據）或實基板的位置 數據；在、實基板上實際塗布錫膏時之該實基板與噴嘴間的 相對速度（此係稱爲塗布速度，尤其該種場合的塗布速度 稱爲初期設定塗布速度）與自基板表面的噴嘴高度（此係 稱爲塗布高度，尤其該種場合的塗布高度稱爲初期設定塗 布高度）與外加於決定噴嘴之錫膏吐出量之錫膏收納筒 1 3的壓力（此係稱爲塗布壓力，尤其該種場合的塗布壓 力稱爲初期設定塗布壓力）等分別的數據；顯示錫膏吐出 完成位置的位置數據；及，塗布之錫膏模樣的測量位置數 據等的設定。上述數據的輸入是由鍵盤19 (第1圖）進 行，輸入之數據係儲存於內設在微電腦1 7 a (第3圖） 的R A Μ內。 完成此初期設定處理過程（步驟2 0 0 )時，其次， 於第1圖中，將判斷是否可高精度塗布預定形狀之錫膏模 樣時所使用的僞基板（未圖示）載置吸附保持在基板吸盤 本紙伕尺度適用中國國家橾準（CNS > Α4規格< 210X297公釐） ~ -11 - I- -I ^^1 1 I , ^^1 ^^1 1! I ΙΓ -____ - - (請先W讀背面之注意事項再填寫本頁) 408041 A7 __B7_ 五、發明説明（9 ) C讀先閲讀背面之注意事項再填寫本頁) 4上（步驟300)。該僞基板載置過程中，僞基板是藉 基板運送機2a、2b朝著X軸方向運送至基板吸盤4的 上方，其次，利用未圖示之升降手段使該等基板運送機 2a 、2b下降而載置於基板吸盤4上。 其次，爲測定錫膏塗布動作時之可動部有無振動，使 用此僞基板進行模擬之錫膏的塗布動作（錫膏模擬塗布動 作）。該錫膏模擬塗布動作的目的是檢測出實基板上塗布 描繪錫膏模樣時之可動部的振動發生處，同時可求得不發 生上述位置振動的最大塗布速度，並且求得相對於該所求 得之塗布速度的塗布高度 '塗布壓力者。再者，上述初期 設定處理、過程（步驟2 0 0 )所設定之上述初期設定塗布 速度或初期速度塗布高度、初期設定塗布壓力係根據經驗 而在所決定的錫膏模樣直線部塗布錫膏者。 經濟部智慧財產局員工消費合作社印製 上述錫膏模擬塗布動作是從噴嘴1 3 a與基板2 2 ( 第2圖）間的距離變化測定有無振動，此係使用里程計 1 4以作爲此振動測定桿測器者。又，該錫膏模擬塗布動 作所使用之錫膏模樣是使用於實基板的η個（但是，η爲 一般之1以上的整數）錫膏模樣，如上述，該等錫膏模樣 數據是由鍵盤19 (第1圖）輸入而在微電腦17 a (第 3圖）之R A Μ內（以下，僅稱爲記憶體），例如依照實 基板之錫膏塗布時所使用的順序賦予1、2、…η號碼而 予以儲存。 開始上述錫膏模擬塗布動作時，首先，將作爲振動測 定感測器而使用之里程計1 4定位在僞基板上的預定高度 本纸張尺度適用中國國家標準（CNS Μ4規格（210 X 297公釐） -12- A7 408041 B7 五、發明説明（1〇 ) ----------裝-- -- (請先W讀背面之注意ί項再填寫本頁) (步驟400)。並且，從儲存於記億體之錫膏模樣數據 選擇模擬塗布動作所使用之錫膏模樣的數據，將其號碼儲 存於記憶體內。最初，選擇號碼1之錫膏模樣數據（步驟 5 0 0 ) = 其中，首先微電腦17 a (第3圖）係立即使用該選 擇之號碼1的錫膏模樣數據控制伺服馬達8 a、8 b、 1 0，使噴嘴1 3 a沿著該號碼1之錫膏模樣數據所規定 的錫膏模樣以上述初期設定塗布速度移動，藉此開始模擬 塗布動作（步驟600)。此時，並未從噴嘴13a吐出 錫膏，且伺服馬達1 2亦未受控制。 該模*擬塗布動作開始的同時，利用里程計1 4依序測 定噴嘴1 3 a與基板2 2間之基板2 2的主面與垂直方向 的距離，以此測定數據作爲垂直方向的距離測定結果與錫 膏模樣數據表示的位置數據相互關聯而儲存於記憶體內（ 步驟7 0 0 )。 第5圖是表示該距離測定處理步驟（步驟7 0 0 )之 詳細流程圖。 經濟部智慧財產局員工消費合作杜印製 同圖中，利用距離計1 4依序測定噴嘴1 3 a與基板 2 2間的距離（步驟7 1 0 )，將依序所獲得的結果作爲 距離數據與上述位置數據相關而儲存於記憶體內（步驟 720)。上述距離數據的測定.儲存的處理是持續至進 行模擬塗布動作號碼1的錫膏模樣完成爲止（步驟7 3 ◦ )° 上述距離測定處理過程（步驟7 0 0 )完成時，將里 本紙張尺度逍用中國國家標準（CNS ) Α4規格（210X297公釐i , -13- 408041 五、發明説明（11 ) (諳先聞讀背面之注意事項再填寫本頁) 程計14退避至上方（步驟8 0 0 )，從所獲得的距離數 據進行容許範圍外的振動產生位置，即產生錫膏模樣上之 容許範圍外振動的錫膏塗布位置的探索.判定（步驟 9 0 0 )。 第6圖是詳細表示該容許範圍外之振動產生模樣的探 索處理過程（步驟9 0 0 )之流程圖。 同圖中，首先最初判定是否存有應探索.判定之距離 數據（步驟9 10)。完成距離數據的探索.判定時，以 不存在有應探索.判定之距離數據，將値0代入容許範圍 判定標記用的變數V_F內（步驟950)。另一方面. 未完成距*離數據的探索·判定時，使其次的距離數據以讀 取進行數據變換（步驟920)。 經濟部智慧財產局員工消費合作社印製 以第7圖說明該數據變換處理時，第7 ( a )圖是表 示藉距離測定所得之距離數據（波形1 )，該距離數據之 微緩膨脹爲僞基板表面的膨脹者，對伺服馬達1 2不產生 控制，因此里程計1 4係測定該膨脹所導致噴嘴1 3 a與 基板2 2間的距離變化。又，該距離數據的部份a的激烈 變化爲里程計1 4 (因此，噴嘴1 3 a )的上下振動所產 生，塗布速度，即噴嘴的移動速度過快的狀態下，當噴嘴 1 3 a的移動方向變化時所產生。 爲了判定第7 ( a )圖表示的振動部份是否在預先設 定的容許範圍外，除去距離數據中的僞基板表面的膨脹所 造成的變化量，進行使振動變化量顯現的數據變換。其一 方法爲微分處理距離數據的方法，將該處理所獲得的數據 本紙張尺度適用中闺國家標準（CNS ) A4規格（210X297公釐） " -14 - __d(\RCidt JL___ 五、發明説明（12 ) 以第7 ( b )圖表示。 - (請先Μ讀背面之注意事項再填寫本頁) 第7 ( b )圖中，變化數據（波形2 )僞基板表面的 膨脹所產生的變化量進入上述的容許範圍內，形成可使噴 嘴1 3 a的振動所產生的變化量明顯呈現。 第6圖之步驟9 3 0是針對此變換的距離數據，判定 是否具有形成上述容許範圍外的部份b ’只要具備1個部 份b時，即可檢測出形成該容許範圍外所有部份b的號碼 1之錫膏模樣數據的位置數據（即，根據錫膏模樣數據之 錫膏模樣上的位置），同時將値1代入容許範圍判定圖表 用的變數V — F (步驟940)。又，即使對於該號碼1 之錫膏模·樣數據至檢測出距離數據完成爲止進行上述判定 處理（步驟9 1 0 )，無任何之容許範圍外的部份b時（ 步驟9 3 0 )，可將値1代入容許範圍判定圖表用的變數 V — F (步驟 950)。 經濟部智慧財產局員工消費合作社印製 此外，上述之距離數據的數據變換方法不僅限於上述 之微分處理的方法，也可採前後數據値的差分之差分處理 的方法等，只要可抑制僞基板表面之膨脹所產生的變化量 使振動所產生的變化量明顯呈現者，無論任何方法皆可。_ 以上爲第4圖之步驟9 0 0 ，藉上述初期設定塗布速 度進行號碼1之錫膏模樣數據的塗布速度之第1次模擬塗 布動作檢測振動發生的位置。藉此未發生振動的位置係可 以號碼1之錫膏模樣數據將進行實基板之實際錫膏塗布時 的塗布速度作爲上述初期設定塗布速度。 完成該步驟9 0 0的處理時，判定變數V — F的値是 本紙張尺度適用中國國家標準（CNS > Α4規格（210X297公釐） -15- 經濟部智慧財產局員工消費合作社印製 __408041 b7___ 五、發明説明（13) 否爲1 (步驟100 0)，其値爲1時，移至塗布條件修 正過程（步驟11 00)。藉第8圖說明該塗布條件修正 過程（步驟1 1 0 0 )說明如下。 同圖中，首先，預先將上述初期設定塗布速度僅減小 所決定的値而形成新的塗布速度（步驟1110)。 但是，一般在減少塗布速度時，形成多量的噴嘴 1 3 a之每單位移動距離的錫膏吐出量，因此形成大的錫 膏模樣寬度，高度也同時增高而不能獲得預定形狀的錫膏 模樣。因此，藉著錫膏之吐出壓力，即塗布壓力的減少， 可減少錫膏吐出量，形成可獲得預定形狀之錫膏模樣者。 如上、述，於步驟1 1 1 0將初期設定速度僅減少上述 預定量而形成新的塗布速度，判定對於此一新的塗布速度 是否有變更塗布壓力的必要時，以新的塗布速度的變更値 作爲判斷基準而減少預先決定値量的塗布壓力（步驟 113 0)。 其次，對於新的塗布速度判定是否有變更塗布時之噴 嘴設定高度（塗敷高度）的必要，須變更時，與變更塗布 壓力同樣地，以塗布速度的變更値作爲判斷基準而上升預 先決定値量的塗布高度（步驟1150)。 完成以上之步驟1 1 0 0的處理時，以使用上述號碼 1之錫膏模樣數據之最初的模擬塗布動作所檢測之振動發 生處的塗布速度、塗布壓力、塗布高度設定爲上述新的塗 布速度、塗布壓力、塗布高度。 並且，第4圖中，進行使用來自該·等新的塗布速度、 本紙張尺度適用中國圉家標準（CNS ) A4規格（210X29?公釐） I I « n I - I ^ n 11 - n ·--— m · - ~ (請先W讀背面之注f項再填寫本頁) -16- __408041 B7_ 五、發明説明（14) 塗布壓力、塗布高度相同號碼1之錫音模樣數據的步驟 4 0 0所成上述一連的第2次模擬塗布動作。 {請先W讀背面之注—事項再填寫本頁) 該第2次之模擬塗布動作，同樣在容許範圍外之處存 有振動時，以塗布條件修正過程（步驟1 1 0 0 )，將上 述使用之塗布速度修正如上述並重新設定新的塗布速度， 同時必要時可修正塗布壓力與塗布高度（第8圖的步驟 1130、1150)，將振動在容許範圍外位置的塗布 速度、塗布壓力、塗布高度變更爲修正後之塗布速度、塗 布壓力、塗布高度。因此，以上述第2次模擬塗布動作形 成振動小於容許範圍內之處係形成第1次模擬塗布所求得 之上述新釣塗布速度、塗布壓力、塗布高度之狀態。 經濟部智慧財產局員工消費合作社印製 如上述，一旦藉第2次模擬塗布動作求得新的塗布速 度、塗布壓力、塗布高度時，從步驟4 0 0開始使用以此 條件相同的號碼1之錫膏模樣數據的第3次模擬塗布動作 ，以下，重複使變數V — F形成値0爲止（步驟1 0 0 0 )。如上述，相對於號碼1之錫膏模樣數據可獲得上述錫 膏模樣上的各個位置之塗布速度或塗布壓力、塗布高度。 此時，該錫膏模樣之直線部各處係分配成初期設定塗布速 度及初期設定塗布、初期設定高度’又’越是大的振動發 生處，其分配之塗布速度越小’而可對應此以決定塗布壓 力與塗布高度。 第9圖係模式表示以上模擬塗布動作獲得之數據’號 碼1之錫膏模樣數據之錫膏模樣上的塗布位置爲5 1〜 5 7的7個。 本紙張尺及遙用中國國家標準（CNS ) A4規格（210X297公釐> -17- 經濟部智慧財產局員工消費合作社印製 408041 B7__ 五、發明説明（15) 第9 ( a )圖是表示最初模擬塗布動作的場合，以 Vo ~爲初期設定塗布速度、Fo >爲初期設定塗布壓力 、Η 〇爲初期設定塗布高度。現在，以此最初的模擬塗布 動作使容許範圍外的振動發生在塗布位置S2、S 5時， 如第9 (b)圖所示，將相對於該等塗布位置S2、S5 的塗布速度従初期設定塗布速度Vo修正爲VI(此時， 雖必須將該等的塗布壓力從F 〇修正爲F 1 ，但是可不須 修正其塗布高度），以此新的塗布速度VI進行第2次的 模擬塗布動作。以此第2次模擬塗布動作在塗布位置S 2 產生容許範圍外的振動時，如第9 ( c ).圖所示，將相對 於此塗布*位置S 2的塗布速度從塗布速度V 1修正爲 (此時，雖不須修正塗布壓力，但是必需將塗布高度從 H0修正爲H1)，以此新的塗布速度V2進行第3次的 模擬塗布動作。如以此第3次模擬塗布動作在任意的塗布 位置上皆未發生容許範圍外的振動時，以此完成使用該號 碼1之錫膏模樣數據的模擬塗布動作，相對於該錫膏模樣 數據來決定第9 ( c )圖表示之各塗布位置的塗布速度與 塗布壓力、塗布高度。 如上述完成相對於號碼1之錫膏模樣數據的模擬塗布 動作時（步驟1 〇 〇 0 ) *其次，選擇號碼2之錫膏模樣 數據〔步驟1 2 〇 0 )，從步驟4 0 〇重複上述之模擬塗 布動作，以下，依照號碼3、4 . •的順序進行錫膏模樣 數據的模擬塗布動作。此時，各錫膏模樣數據之第1次模 擬塗布動作係使用步驟2 0 0初期設定之初期設定塗布速 本紙張尺度適用中國國家槺準（CNS ) A4規格（210X297公釐） I ----- ϋ ^---- J— I (讀先w讀背面之注意事項再填寫本頁) -18- 4〇B〇4iA7 Β7 經濟部智慧財產局員工消費合作杜印製 五、發明説明（16 ) 度、初期設定塗布壓力 '初期設定高度以作爲塗布速度、 塗布壓力、塗布高度者。 最後號碼η爲止的所有錫膏模樣數據一旦變數V - F 形成値0而完成模擬塗布動作時（步驟1 200)，在各 個錫膏模樣數據分別設定有各個錫膏模樣數據上之各處的 塗布速度、塗布壓力、塗布高度，藉此，當進行實基扳之 錫膏塗布描繪時，於不影響預定之塗布錫膏模樣精度的條 件下設定噴嘴1 3 a發生之振動者，將僞基板排出（步驟 1 3 0 0 )，其次移至實基板生產的說明（錫膏模樣的塗 布描繪）。 首先*_，將實基板載置於基板吸盤4 (第1圖）上予以 吸附保持（步驟1 4 0 0 。該基板載置過程中，藉基板 運送機2a 、2b (第1圖）將實基板朝著X方向運送至 基板吸盤4的上方，以未圖示之升降手段使該等基板運送 機2 a、2b下降，可將實基板載置於基板吸盤4上。 其次，進行基板預備定位處理（步驟1500)。此 一處理係於第1圖中，藉未圖示之定位卡盤進行該實基板 之X、Y方向的定位。又，以影像識別攝影機1 6 a 、 1 6 b拍攝載置於基板吸盤4之實基板的定位用標記，以 影像處理求得定位用標記的重心檢測出實基板方向的傾斜 ，對應此而驅動伺服馬達2 4 (第3圖），同時修正其方 向的傾斜。 再者，錫膏收納筒1 3內的錫膏殘量減少，而有在錫 膏模樣的塗布動作中錫膏中途用盡的可能時，預先與噴嘴 ---------裝— (锖先閱讀背面之注意事項再填寫本頁) 訂. 本紙張尺度適用中國國家標準（CNS ) Α4規格（2丨0X297公釐） -19- 408041 at _ B7 五、發明説明（17〉 (讀先閱讀背面之注意事項再填寫本頁) 1 3 a同時更換錫膏收納筒1 3，但是在更換噴嘴1 3 a 時，與交換前比較，可能會產生安裝位置的偏位而有損其 重現性。因此，爲了確保重現性1在實基板上未塗布錫膏 之處使用交換後新的噴嘴1 3 a進行十字型的錫膏塗布， 該十字塗布模樣的交點重心位置是以影像處理求得，算出 該重心位置與實基板之定位用標記之重心位置間的距離， 以此作爲噴嘴1 3 a之錫膏吐出口的偏位量d X、dy ( 第2圖）而儲存於內設在個人電腦1 7 a的RAM內。此 係相對於實基板之基板預備定位處理（步驟1500) ’ 使用上述之噴嘴1 3 a的偏位量d X、d y ’修正隨後進 行錫膏模樣之塗布描繪時噴嘴1 3 a的偏位。 其次，從號碼1之錫膏模樣數據的順序進行錫膏模樣 塗布處理（步驟1600) 0該處理中，爲了將噴嘴 1 3 a的吐出口定位在塗布開始位置而移動2軸移動台9 (第1圖），進行噴嘴位置的比較.調整移動。因此，首 經濟部智慧財產局員工消費合作社印製408041 A7 B7 V. Description of the invention (1) [Detailed description of the invention] [Technical field to which the invention belongs] The present invention relates to placing a substrate on a table with respect to a discharge port of a nozzle, and maintaining the substrate on a main surface of the substrate The predetermined relative distance between the nozzle and the substrate in the vertical direction enables the solder paste filled in the solder paste storage cylinder to be ejected from the ejection outlet onto the substrate, so that the relative positional relationship between the substrate and the nozzle can be changed. A solder paste applicator for applying a solder paste of a predetermined shape to a substrate, and more particularly to a solder paste applicator capable of improving productivity. [Knowledge technology] It is known that in the solder paste coating machine, as a method to improve productivity, the solder paste filled in the solder paste storage cylinder is ejected from the nozzle side to the substrate, and the relative movement between the nozzle and the substrate is increased. The speed is the speed at which the solder paste is applied (hereinafter, referred to as the coating speed). [Problems to be Solved by the Invention] However, when the solder paste coating machine is a conventional technique as described above, once the coating speed is increased, the straight portion of the solder paste pattern is not a problem, but when the curved portion with a small radius of curvature changes at a right angle in the coating direction That is, for example, when the coating direction is changed from the X-axis direction to the Y-axis direction or from the Y-axis direction to the X-axis direction, the moving part will vibrate. For example, when the moving part is a nozzle and the fixed part is a substrate chuck mounted on a substrate (that is, when the nozzle is moved relative to the substrate), when the nozzle's moving direction is changed, the nozzle produces a vertical (Z-axis) direction or a horizontal ( X, Y axis) direction vibration, especially the vertical direction. The paper scale is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) < Please read the precautions on the back before filling this page) '装 · ΤΓ * — Printed by the Employees' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs -4- 408041 at _ B7_ V. Invention Description (2) (Please read the precautions on the back before filling this page). In addition, when the fixed part is a nozzle and the moving part is a substrate chuck (that is, when the substrate is moved), when the moving direction of the substrate chuck is also changed, the substrate chuck thus causes the substrate mounted on the substrate to generate the same vibration. In particular, vibration in the vertical direction is increased. The above-mentioned vibration is large at the peripheral portion of the substrate, especially at the corner portion. Therefore, a variation in the (relative) distance in the vertical direction occurs between the main surface of the substrate between the nozzle and the substrate, which reduces the coating accuracy. That is, as shown in FIG. 10, the relative (position) distance of the substrate between the nozzles 13a and the substrate 22 varies between 5 and z. Therefore, the amount of solder paste applied per unit time can be changed, and there is no possibility. The problem of coating the solder paste to form a predetermined shape is 2, 3, and the more the coating speed is increased, the larger the change in the relative “position” distance between the nozzle 1 3 a and the substrate 22 is. Therefore, the formation cannot increase the coating speed and cannot increase. The object of the present invention is to provide a solder paste coating machine that can eliminate the above problems, increase the coating speed and increase productivity, and can apply a good predetermined shape of the solder paste pattern. Employees of the Intellectual Property Bureau of the Ministry of Economic Affairs Printed by a consumer cooperative [means for solving problems] In order to achieve the above-mentioned purpose, the solder paste coating machine of the present invention is placed on a workbench to form a nozzle opposite to the nozzle outlet, and maintains a vertical direction on the main surface of the substrate. The predetermined distance between the nozzle and the substrate is such that the solder paste filled in the solder paste storage cylinder is discharged from the discharge port onto the substrate, so that the substrate and the substrate of the nozzle are The relative positional relationship of the paper changes, and the characteristics of this paper scale apply to the Chinese national standard (CNS > A4 specification (210X297 mm) -5- 408041) 377 V. Description of the invention (3): (Please read the note on the back before filling out this page) Have a predetermined substrate mounted on the table at a predetermined relative moving speed and the relative positional relationship with the nozzle The first means for detecting the relative distance between the nozzle and the main direction of the main surface of the predetermined substrate perpendicular to the predetermined substrate is changed; determining whether it is the second method for setting the allowable range of the relative distance detected by the first method in advance :. When the relative distance is determined to be outside the allowable range by the second means, a speed reduced by a predetermined amount from the predetermined relative speed is used as the new predetermined relative moving speed, and the new predetermined relative moving speed is used to make the first The third means of means operation; and when the relative distance is judged to be within the allowable range by the second means, in order to draw a solder paste shape of a predetermined shape, a predetermined phase at that time is used. The moving speed is the fourth means of the relative moving speed between the substrate from which the solder paste is discharged from the nozzle discharge port and the nozzle. [Embodiments of the Invention] Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, the illustration of the invention One embodiment is as follows. Fig. 1 is a perspective view showing one embodiment of the solder paste coating machine of the present invention, 1 is a stand, 2a, 2b are substrate carriers, 3 is a support table, 4 is a substrate sucker, and 5 is a Θ axis. 6a, 6b are X-axis mobile stages, 7 are Y-axis mobile stages, 8a, 8b are servo motors, 9 are Z-axis mobile stages, 10 are servo motors, 11 are ball screws, and 12 are servo motors. , 13 is a solder paste storage cylinder (cylinder cylinder), 14 is an odometer, 1 5 This paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) -6- A7 B7 ^ 08041 V. Invention Note (4) (Please read the precautions on the back before filling this page) For the support board, 16a, 16b are image recognition cameras, 17 control units! J section, 18 is the monitor, 19 is the keyboard , 20 is a personal computer body with an external memory device, and 21 is a cable. In the same figure, the substrate 1 is provided with two substrate conveyors 2a, 2b that are parallel to the X direction and can be freely raised and lowered, and transports a substrate (not shown) from the inside to the front, that is, horizontally in the X axis direction. In addition, the stand 1 is provided with a support stand 3 ', and the substrate chuck 4 is placed on the support stand 3 via a 0-axis moving table 5. This 0-axis moving table 5 is a system capable of rotating the substrate chuck 4 toward the 0 direction around the Z axis. The Intellectual Property Bureau employee consumption cooperation of the Ministry of Economic Affairs Du printed stand 1 is also provided with an X-axis parallel to the X-axis than the substrate conveyors 2a, 2b, and mobile tables 6a, 6b, and a Y-axis mobile table 7 are arranged to span these X-axes Between mobile stations 6a, 6b ... The Y-axis moving stage 7 is horizontally transported in the X-axis direction by forward or reverse rotation (forward and reverse rotation) of the servo motors 8a and 8b provided on the X-axis moving stages 6a and 6b. The Y-axis moving table 7 is provided with a Z-axis moving table 9 which is driven by the servo motor 10 to rotate the ball screw 11 forward and backward and move in the Y-axis direction. The Z-axis mobile stage 9 is provided with a support plate 15 for supporting a fixed solder paste storage tank 13 or an odometer 14, and the servo motor 12 is a movable part linearly guided by an unillustrated set on the support plate 15 The solder paste storage cylinder 13 or the odometer 14 is moved in the Z-axis direction. The solder paste storage cylinder 13 is detachably attached to the linearly guided movable portion. In addition, image recognition cameras 16 a and 16 b for positioning a substrate (not shown) and the like on the top plate of the stand 1 are provided upward. A control unit 17 for controlling the servo motors 8 a, 8 b, 10, 12, 24 (not shown), etc. is provided inside the gantry 1. The control unit 17 is a Chinese paper standard (CNS) > A4 specifications (2 丨 〇 X 297 mm) ^ 1) 8041 A7 _ B7 V. Description of the invention (5) (Please read the note on the back before filling in this page) With cable 2 1 and monitor 1 8 and the keyboard 1 9. Connect the personal computer body 20, input the various processing data of the control unit 17 from the keyboard 19, and display the images or controls captured by the image recognition cameras 16a, 16b on the monitor. The processing status of the department 17. The data input from the keyboard 19 is a storage medium such as a magnetic disk stored in an external memory device of the personal computer 20. Fig. 2 is a perspective view showing enlarged portions of the solder paste storage cylinders 13 and the odometer 14 shown in Fig. 1. 13a is a nozzle, 22 is a substrate, and 23 is a solder paste pattern, corresponding to the part of Fig. 1 The same symbols are assigned. Printed by the Employees' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs In the figure, the lower end of the odometer 14 has a triangular notch, and in this notch, a light emitting element and a plurality of light receiving elements are provided. The nozzle 1 3 a is positioned at the notch and lower part of the odometer 14. The odometer 14 is a non-contact triangulation method to measure the distance from the front end of the nozzle 1 3 a to the surface (upper surface) of the substrate 2 2 made of glass. That is, a light-emitting element is provided on the one-sided inclined surface of the triangular notch, and the laser light L emitted from the light-emitting element is reflected at a measurement point S on the substrate 22, and is provided in plural on the inclined surface on the other side of the notch. Any one of the light receiving elements receives light. Therefore, the laser light L is not blocked by the solder paste storage tube 13 or the nozzle 1 3 a. In addition, the measurement point S of the laser light L on the substrate 22 and the position directly below the nozzle 1 3 a deviate from ΔX and ΔΥ only on the substrate 2 2, and the positions where the minute distances ΔX and ΔΥ deviate to the left and right are not provided. 2 The surface expansion (concave and convexity) is poor, so there is almost no gap between the measurement result of the odometer 14 and the distance from the front end of the nozzle 1 a to the surface of the substrate 22. Therefore, according to the measurement results of the odometer 14, the paper size is controlled by the Chinese National Standard (CNS) A4 specification (210X297 mm) -8-^ 08041 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 WJ_ 五6. Description of the invention (6) The servo motor 12 can maintain the nozzle 1 3 a to a certain distance from the surface of the substrate 2 2 in accordance with the expansion of the surface of the substrate 2 2 to form the same solder paste pattern 2 on the substrate 2 2. 3 width and thickness. Fig. 3 is a block diagram showing the configuration of the control unit 17 shown in Fig. 1 and the control of the air pressure of the solder paste storage cylinder 13 and the control of the substrate 22, 17a is a microcomputer, 17b is a motor controller, 17c 1, 17c2 Is XI, X2 axis driver, 17d is Y axis driver,] _ 7e is 0 axis driver, 17ί is Z axis driver, 17g is data communication bus, 17h is external interface, 24 is drive 0 axis mobile stage 5 (No. 1 picture) servo motor, 25 to 29 are encoders, 30 is a positive pressure source, ', 30a is a positive pressure regulator, 31 is a negative pressure source, 31a is a negative pressure regulator, and 3 2 is a valve group •, corresponding Parts in FIGS. 1 and 2 are given the same reference numerals. In the same figure, the control unit 17 is provided with a processing microcomputer 17 a and a motor controller 176, and y, 2 and 0 axis drive 1701 to 17f, and image recognition cameras 16a and 16b. The external interface for signal transmission between the image processing device 17i, keyboard 19, etc. of the obtained image signal is 17h. The control unit 17 further includes a drive control system for the substrate carriers 2 a and 2 b, but the illustration is omitted here. Also, although the microcomputer 17a is not shown in the figure, it has a ROM storing a main computing unit and a processing program for painting and painting of solder paste described later; a processing result of the main computing unit and an external interface 17h and a motor controller 1 are stored. 7 b ram of input data; and, processing external interface 17 h and (read first and read the notes on the back and then fill out this page) This paper size applies Chinese National Standard (CNS) A4 ^ grid (2 丨 0 > < 297 mm) -9- Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 -408 (Ηί -—- V. Description of the Invention (7) The data input / output section of the motor controller 17b, etc. Each servo motor 8a , 8b, 10, 12, and 24 are provided with encoders 2 5 to 29 for detecting the amount of rotation, and the detection results are fed back to each of the X, Y, Z, and 0 axis drivers 1 7 c 1 to 1 7 ί for position control The servo motors 8 a, 8 b, and 10 are rotated in the forward and reverse directions based on the data stored in the RAM of the microcomputer 1 7 a input from the keyboard, so that the negative pressure from the negative pressure source can be used for the substrate sucker 4 (No. Fig. 1) Vacuum suction of the substrate 2 2, so that the nozzle 13 a (Fig. 2) passes through the Z-axis moving table 9 ( (Picture 1) Moves an arbitrary distance in the X and Y axis directions. During the movement • By using a microcomputer 1 7 a to control the valve group 3 2, a positive pressure source 30 can be adjusted by a positive pressure regulator 30 0 a and the valve. In group 3 2, only a small amount of external air pressure is applied to the solder paste storage cylinder 1 3, and the solder paste is ejected from the ejection outlet of the front end of the nozzle 1 3 _a to apply the solder paste to the substrate 22 in a predetermined pattern. The X of the Z-axis moving table 9 During horizontal movement in the Y-axis direction, the odometer 14 can measure the distance between the nozzle 1 3 a and the substrate 22, and the Z-axis driver 17 f controls the servo motor 12 to constantly maintain the certainty of the distance. In the standby state where no solder paste is applied, the microcomputer 17 a controls the valve group 3 2 so that the negative pressure source 31 communicates with the solder paste storage cylinder 1 3 through the negative pressure regulator 3 1 a and the valve group 3 2. The solder paste discharged from the nozzle 1 3 a discharge port is returned to the solder storage container 13. This can prevent the solder paste from dripping out of the discharge port. Moreover, an image recognition camera (not shown) can be used to monitor the nozzle. 1 3 a spit out □, and only the liquid drips, the negative pressure source 3 1 is connected to the solder paste storage cylinder 1 3. Fig. 4 shows the embodiment shown in Fig. 1 Continuously operated squares The paper size applies to Chinese national standards (CNS > A4 size (210 X 297 mm) nnn II -I-,-nn I -I -L __,--1 (Please read the precautions on the back first (Fill in this page again) -10- A7 printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs __ 5. Description of the invention (8). In the figure, when the power is first applied to the solder paste applicator of this embodiment (step 100) * the initial setting can be performed (step 200). This initial setting process is shown in Fig. 1. By driving the servo motors 8a, 8b, and 10, the Z-axis moving table is moved to the X and Y axis directions and positioned at a predetermined reference position. 3 a is positioned at the position where the solder paste ejection outlet starts to eject the solder paste (ie, the solder paste application start point), and is set at a predetermined origin position while coating on the substrate (the solder paste pattern is drawn as an object) Hereinafter, the data of each solder paste pattern (hereinafter, referred to as solder paste pattern data) or more than 1 of the actual substrate; or the position data of the actual substrate; between the actual substrate and the nozzle when the solder paste is actually applied on the solid substrate Relative speed (this is called the coating speed, especially the coating speed in this case is called the initial set coating speed) and the nozzle height from the surface of the substrate (this is called the coating height, especially the coating height in this case is called the initial Setting the coating height) and the pressure applied to the solder paste storage cylinder 13 that determines the amount of solder paste discharged from the nozzle (this is called the coating pressure, especially the coating pressure in this case is called the initial setting coating pressure), etc. Separate data; position data showing the completion position of solder paste ejection; and measurement position data such as the pattern of the applied solder paste. The input of the above data is performed by the keyboard 19 (Fig. 1), and the input data is stored in the RAM which is built in the microcomputer 17a (Fig. 3). When this initial setting process is completed (step 200), secondly, in the first figure, it will be determined whether a pseudo substrate (not shown) used when a solder paste pattern having a predetermined shape can be applied with high accuracy is placed on the substrate and held there. Applicable to China National Standards (CNS > Α4 size < 210X297 mm) on the substrate size of substrate suction cup paper ~ -11-I- -I ^^ 1 1 I, ^^ 1 ^^ 1 1! I ΙΓ -____- -(Please read the notes on the back before filling this page) 408041 A7 __B7_ V. Description of the invention (9) C Read the notes on the back before filling this page) 4 (Step 300). In the process of placing the dummy substrate, the dummy substrates are transported above the substrate chuck 4 by the substrate conveyors 2a and 2b in the X-axis direction. Next, the substrate conveyors 2a and 2b are lowered by a lifting means (not shown). It is placed on the substrate chuck 4. Next, in order to measure the presence or absence of vibration of the movable part during the solder paste application operation, a pseudo solder paste application operation (a solder paste simulation application operation) was performed using this dummy substrate. The purpose of this solder paste simulation coating operation is to detect where the vibration of the movable part occurs when the solder paste pattern is painted on the real substrate, and to obtain the maximum coating speed at which the above-mentioned positional vibration does not occur. The obtained coating speed is the coating height of the coating pressure. In addition, the initial setting coating speed or initial speed coating height and initial setting coating pressure set in the initial setting process and process (step 200) are those who apply solder paste to the determined linear portion of the solder paste pattern based on experience. . The above-mentioned solder paste simulation coating operation printed by the employee's consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs measures the presence or absence of vibration from the change in distance between the nozzle 1 3 a and the substrate 2 2 (Figure 2). This system uses an odometer 1 4 as the vibration. Measuring rod tester. In addition, the solder paste patterns used in the solder paste simulation coating operation are η (however, η is generally an integer of 1 or more) solder paste patterns used on a real substrate. As described above, the data of these solder paste patterns are obtained from the keyboard. 19 (Fig. 1) is input, and within the RA M of the microcomputer 17 a (Fig. 3) (hereinafter, referred to as a memory only), for example, 1, 2, ... are given in the order used when the solder paste is applied to a real substrate. η number and stored. When starting the solder paste simulation coating operation, first, position the odometer 1 4 used as a vibration measurement sensor at a predetermined height on the pseudo substrate. The paper size applies the Chinese national standard (CNS Μ4 specification (210 X 297 cm) (12%) -12- A7 408041 B7 V. Description of the invention (1〇) ---------- Installation-(Please read the note on the back before filling this page) (Step 400) And, the solder paste pattern data used to simulate the coating operation is selected from the solder paste pattern data stored in the memory, and the number is stored in the memory. Initially, the solder paste pattern data of number 1 is selected (step 5 0 0 ) = Among them, the first microcomputer 17 a (picture 3) is to immediately use the solder pattern data of the selected number 1 to control the servo motors 8 a, 8 b, and 10, so that the nozzle 1 3 a follows the tin of the number 1. The solder paste pattern specified by the paste pattern data is moved at the above-mentioned initial set coating speed, thereby starting the simulated coating operation (step 600). At this time, the solder paste is not ejected from the nozzle 13a, and the servo motor 12 is not controlled. At the same time as the mold coating operation starts, use the odometer 1 4 The distance between the main surface of the substrate 2 2 between the nozzle 1 3 a and the substrate 2 2 and the vertical direction is measured, and the measurement data is used as the distance measurement result in the vertical direction and the position data indicated by the solder paste pattern data are correlated and stored in the memory. (Step 7 0 0). Figure 5 is a detailed flowchart showing the distance measurement processing steps (Step 7 0 0). The consumption cooperation of employees of the Intellectual Property Bureau of the Ministry of Economic Affairs is printed in the same figure, using the distance meter 1 4 in order Measure the distance between the nozzle 1 3 a and the substrate 2 2 (step 7 1 0), and store the result obtained in order as the distance data and the position data in the memory (step 720). The measurement of the distance data. The storage process is continued until the solder paste pattern with the simulated coating action number 1 is completed (step 7 3 ◦) ° When the above-mentioned distance measurement process (step 7 0 0) is completed, the Japanese paper standard is applied to the Chinese standard ( CNS) Α4 specification (210X297mmi, -13-408041) 5. Description of the invention (11) (谙 First read the precautions on the back and then fill out this page) Program 14 retreat to the top (step 8 0 0), The obtained distance data is used to search for the vibration-generating position outside the allowable range, that is, the solder paste application position where the vibration outside the allowable range on the solder paste pattern is generated. Judgment (step 9 0 0). Figure 6 shows the details outside the allowable range. The flowchart of the search processing process (step 9 0 0) of vibration-like appearance. In the same figure, first of all, it is first determined whether there is distance data to be searched. The judgment distance data (step 9 10) is completed. When the distance data is searched. Based on the absence of distance data to be searched and determined, 値 0 is substituted into the variable V_F for the allowable range determination flag (step 950). On the other hand, when the search and determination of the distance * distance data is not completed, the next distance data is read for data conversion (step 920). Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs when the data conversion process is illustrated in Figure 7. Figure 7 (a) shows the distance data (waveform 1) obtained from the distance measurement. The slight expansion of the distance data is false. The expander on the substrate surface does not control the servo motor 12, so the odometer 14 measures the change in the distance between the nozzle 13a and the substrate 22 caused by the expansion. In addition, the drastic change in part a of the distance data is caused by the up-and-down vibration of the odometer 1 4 (hence the nozzle 1 3 a), and the coating speed, that is, the state in which the nozzle moves too fast, when the nozzle 1 3 a Occurs when the moving direction of the In order to determine whether the vibration part shown in Fig. 7 (a) is outside the preset allowable range, the data conversion is performed to show the vibration change amount by removing the change amount caused by the expansion of the pseudo substrate surface in the distance data. One method is the method of differentially processing distance data. The data obtained from the processing is applied to the Chinese standard (CNS) A4 specification (210X297 mm) " -14-__d (\ RCidt JL___ V. Description of the invention (12) It is shown in Figure 7 (b).-(Please read the precautions on the back before filling in this page) Figure 7 (b), the change caused by the expansion of the surface of the dummy substrate (waveform 2) The amount is within the above-mentioned allowable range, so that the amount of change caused by the vibration of the nozzle 1 3 a can be clearly displayed. Step 9 30 in FIG. 6 is based on the distance data of this transformation to determine whether it has a value outside the above-mentioned allowable range. Part b 'As long as there is one part b, the position data of the solder paste pattern data of number 1 forming all part b outside the allowable range can be detected (ie, the solder paste pattern data based on the solder paste pattern data Position), and substitute 値 1 into the variable V — F for the allowable range determination chart (step 940). Furthermore, the above-mentioned determination processing is performed even if the solder paste sample data of the number 1 is completed until the distance data is detected ( Step 9 1 0), if there is no part b outside the allowable range (step 9 3 0), you can substitute 代 1 into the variable V — F for the allowable range determination chart (step 950). Employee Consumer Cooperatives, Bureau of Intellectual Property, Ministry of Economic Affairs Printing In addition, the data conversion method of the above-mentioned distance data is not limited to the above-mentioned differential processing method, but also a differential processing method of the difference between the front and back data, as long as the amount of change caused by the expansion of the surface of the pseudo substrate can be suppressed. The amount of change caused by vibration is obvious, no matter what method is used. _ The above is the step 9 0 of Figure 4. Based on the above initial setting coating speed, the first simulation of the coating speed of the solder paste pattern data of No. 1 is performed. The coating operation detects the position where vibration occurs. The position where vibration does not occur is based on the solder paste pattern data of No. 1. The coating speed when the actual solder paste is applied to the actual substrate is used as the initial setting coating speed. Complete this step 9 0 0 During the processing, it is determined that the variable V — F is the size of this paper. The Chinese national standard (CNS > Α4 specification (210X297 mm)) is applied. Printed by the Consumer Affairs Cooperative of the Property Bureau __408041 b7___ V. Description of the invention (13) If it is 1 (step 100 0), when it is 1, move to the coating condition correction process (step 11 00). This is illustrated in Figure 8 The process of modifying the coating conditions (step 1 100) is described below. In the same figure, first, the above-mentioned initial set coating speed is reduced by only a predetermined amount to form a new coating speed (step 1110). However, generally, the coating speed is reduced. At the coating speed, a large amount of the solder paste discharge amount per unit moving distance of the nozzles 13a is formed, so a large solder paste pattern width is formed, and the height is increased at the same time, and a predetermined solder paste pattern cannot be obtained. Therefore, by reducing the discharge pressure of the solder paste, that is, by reducing the application pressure, the amount of solder paste discharge can be reduced to form a solder paste pattern having a predetermined shape. As described above, in step 1 1 10, the initial set speed is reduced by only the above-mentioned predetermined amount to form a new coating speed. If it is necessary to change the coating pressure for this new coating speed, the new coating speed is changed. As a criterion for the determination, the application pressure is reduced by a predetermined application amount (step 113 0). Next, it is necessary to determine whether it is necessary to change the nozzle setting height (coating height) at the new coating speed. If it is necessary to change the coating speed, the coating speed is changed in the same way as the coating pressure. Amount of coating height (step 1150). When the above steps 1 1 0 0 are completed, the coating speed, coating pressure, and coating height at the vibration occurrence detected by the first simulated coating operation using the solder paste pattern data of the above number 1 are set to the new coating speed described above. , Coating pressure, coating height. In addition, in Figure 4, the new coating speed from this grade is used. The paper size applies the Chinese Standard (CNS) A4 specification (210X29? Mm) II «n I-I ^ n 11-n ·- -— m ·-~ (please read the note f on the back before filling this page) -16- __408041 B7_ V. Description of the invention (14) Step 4 of tin tone pattern data with the same coating pressure and coating height 1 The second simulation coating operation was completed as described above. {Please read the note on the back—items before filling out this page.) For the second simulation coating operation, if there is vibration outside the allowable range, use the coating conditions to modify the process (step 1 1 0 0). The coating speed used above is corrected as described above and a new coating speed is reset. At the same time, if necessary, the coating pressure and the coating height can be corrected (steps 1130 and 1150 in FIG. 8). The coating height is changed to the corrected coating speed, coating pressure, and coating height. Therefore, where the vibration is smaller than the allowable range by the second simulated coating operation, the state of the new fishing coating speed, coating pressure, and coating height obtained by the first simulated coating is formed. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs as described above. Once the new coating speed, coating pressure, and coating height are obtained through the second simulation coating operation, use the same number 1 from step 4 0. The third simulation coating operation of the solder paste pattern data is repeated until the variable V-F becomes 値 0 (step 1 0 0 0). As described above, with respect to the solder paste pattern data of No. 1, the application speed, the application pressure, and the application height of each position on the solder paste pattern can be obtained. At this time, the linear portion of the solder paste pattern is allocated to the initial setting coating speed and initial setting coating, and the initial setting height is "the greater the vibration occurs, the smaller the coating speed is allocated", which can correspond to this. To determine the coating pressure and coating height. Fig. 9 shows the pattern of the data obtained by the above-mentioned simulated coating operation, and the number of application positions on the solder paste pattern of the number 1 solder paste pattern is 5 1 to 5 7. This paper ruler and remotely used Chinese National Standard (CNS) A4 specification (210X297 mm > -17- Printed by the Employees' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 408041 B7__ 5. Description of the invention (15) Figure 9 (a) shows When the coating operation was first simulated, Vo ~ was used to set the initial coating speed, Fo > was used to set the initial coating pressure, and 〇 was set to the initial coating height. Now, with this initial simulated coating operation, vibrations outside the allowable range occur. At the coating positions S2 and S5, as shown in FIG. 9 (b), the coating speeds 従 initial setting coating speed Vo with respect to these coating positions S2 and S5 are corrected to VI (in this case, it is necessary to The coating pressure was modified from F 0 to F 1, but the coating height may not need to be modified.) With this new coating speed VI, the second simulated coating operation is performed. With this second simulated coating operation, allowance is made at the coating position S 2 In the case of vibration outside the range, as shown in Fig. 9 (c)., The coating speed relative to this coating * position S 2 is corrected from the coating speed V 1 to (at this time, it is not necessary to modify the coating pressure, but it is necessary to adjust the Coating height from H0 It is H1), and the third simulation coating operation is performed at the new coating speed V2. If the third simulation coating operation does not cause vibration outside the allowable range at any application position, the use is completed. The simulated coating operation of the solder paste pattern data of the number 1 determines the coating speed, coating pressure, and coating height of each coating position shown in FIG. 9 (c) with respect to the solder paste pattern data. It is completed as described above with respect to the number 1. When the solder paste pattern data is simulated with the coating operation (step 1000) * Next, select the solder paste pattern data with the number 2 (step 12), and repeat the above-mentioned simulated coating operation from step 4 00. Below, Follow the sequence of numbers 3, 4. • to perform the simulation coating operation of the solder paste pattern data. At this time, the first simulation coating operation of each solder paste pattern data is to use the initial setting of the initial setting in step 2000. The paper size is applicable to China National Standard (CNS) A4 (210X297 mm) I --- -ϋ ^ ---- J—I (read the w notes on the back before filling out this page) -18- 4〇B〇4iA7 Β7 Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs on consumer cooperation 16) Degree, initial setting coating pressure 'Initial setting height is used as the coating speed, coating pressure, and coating height. Once all the solder paste pattern data up to the last number η are set to 値 0 and the simulated coating operation is completed (step 1 200), each solder paste pattern data is set with the coating on each solder paste pattern data. Speed, coating pressure, and coating height, so that when the real solder paste coating and drawing is performed, the vibration generated by the nozzle 1 3 a is set without affecting the accuracy of the predetermined pattern of the applied solder paste, and the dummy substrate is discharged. (Step 1 3 0 0), and then move on to the description of the production of the real substrate (the coating drawing of the solder paste pattern). First * _, the real substrate is placed on the substrate chuck 4 (picture 1) and held by suction (step 1 400). During the substrate placement process, the substrate is transported by the substrate conveyors 2a and 2b (picture 1). The substrate is conveyed above the substrate chuck 4 in the X direction, and the substrate conveyors 2 a and 2 b are lowered by lifting means (not shown), and the actual substrate can be placed on the substrate chuck 4. Next, the substrate is prepared and positioned. Process (step 1500). This process is shown in Fig. 1. The positioning of the real substrate in the X and Y directions is performed by using a positioning chuck (not shown). In addition, the images are taken by the image recognition cameras 16a and 16b. The positioning mark of the solid substrate placed on the substrate chuck 4 is obtained by image processing. The center of gravity of the positioning mark is detected, and the tilt of the direction of the solid substrate is detected. In response to this, the servo motor 2 4 (Figure 3) is driven and the direction is corrected. In addition, the residual amount of solder paste in the solder paste storage tube 1 3 is reduced, and if there is a possibility that the solder paste is exhausted halfway during the coating operation of the solder paste shape, contact the nozzle in advance -------- -装 — (锖 Please read the notes on the back before filling this page) Order. This paper size Applicable to Chinese National Standard (CNS) Α4 specification (2 丨 0X297mm) -19- 408041 at _ B7 V. Description of the invention (17> (Read the precautions on the back before filling this page) 1 3 a At the same time replace the solder paste The storage tube 1 3, but when the nozzle 1 3 a is replaced, compared with before the exchange, the mounting position may be misaligned and the reproducibility is impaired. Therefore, to ensure the reproducibility 1, no tin is coated on the solid substrate. The paste is applied to the cross-shaped solder paste using a new nozzle 1 3 a after the exchange. The position of the center of gravity of the intersection of the cross coating pattern is obtained through image processing. The center of gravity position is calculated from the center of gravity position of the real substrate. This distance is used as the offset amount d X, dy (Fig. 2) of the solder paste discharge outlet of the nozzle 1 3 a and stored in the RAM built in the personal computer 17 a. Substrate preliminary positioning process (step 1500) 'Use the above-mentioned offset amount d X, dy of the nozzle 1 3 a' to correct the offset of the nozzle 1 3 a during subsequent coating and drawing of the solder paste pattern. Next, from the tin of number 1 Solder paste pattern coating process in order of paste pattern data (Step 1600) 0 In this process, in order to position the discharge opening of the nozzle 13a at the coating start position, the 2-axis moving stage 9 (Fig. 1) is moved, and the nozzle positions are compared and adjusted. Therefore, the Ministry of Economy Printed by the Intellectual Property Bureau Staff Consumer Cooperative
先以先前之基板預備定位處理（步驟1 5 0 0 )獲得而儲 存於個人電腦1 7 a的RAM中噴嘴1 3 a的偏位量d x 、d y判斷是否在第2圖表示噴嘴1 3 a偏位量的容許範 圍ΑΧ、ΔΥ內。在容許範圍內（即，d x及AY 2 d y )時，即以其狀態，如在容許範圍外（即，△ x < dx或ΔΥ<άγ)時，根據其位置偏位量dx、67移 動Z軸移動台9調整錫膏收納筒13 ’藉此解除噴^ 1 3 a之錫膏吐出口與實基板的預定位置間的偏位’可將 噴嘴1 3 a定位在預定位置。 本紙張尺度適用中國國家樣準（CNS ) A4規格（210X297公釐） -20- 408041 a7 _ B7 五、發明説明（18 ) (請先閱讀背面之注意事項再填寫本頁) 其次，進行噴嘴1 3 a的高度設定。未更換錫膏收納 筒1 3時，沒有噴嘴1 3 a之偏位量d X、dy的數據， 因此在進入錫膏模樣塗布處理（步驟1 6 0 0 )時，立即 進行噴嘴1 3 a之高度設定。此設定之高度是設定以先前 模擬塗布動作所使用之初期設定塗布高度，設噴嘴1 3 a 的吐出口至實基板表面的距離爲錫膏厚度，即形成該塗布 尚度者。 完成以上之處理時，其次根據儲存於微電腦1 7 a之 RAM的錫膏模樣數據驅動伺服馬達8a 、8b、10 ( 第1圖），藉此可使噴嘴13 a之錫膏吐出口在與實基板 相對的狀廟下，對應此錫膏模樣數據而朝著X、Y方向移 動，同時從正壓源3 0 (第·3圖）僅將微量的空氣壓外加 於錫膏收納筒1 3內，從噴嘴1 3 a的錫膏吐出口開始吐 出錫膏。此時的塗布速度爲先前模擬塗布動作所使用之初 期設定塗布速度，又空氣壓係對應先前模擬塗布動作所使 用之初期塗布壓力者。藉此，可以先前模擬塗布動作所獲 得的塗布速度開始實基板之錫膏模樣的塗布描繪。 經濟部智慧財產局員工消費合作社印製 此塗布描繪動作開始的同時，微電腦1 7 a係根據先 前模擬塗布動作所獲得的數據，對應錫膏模樣的塗布位置 控制塗布速度及塗布壓力、塗布高度。採第9 ( c )圖表 示數據之例時*塗布位置S 1是以Vo —爲塗布速度、First, the offset amount dx and dy of the nozzle 1 3 a in the RAM of the personal computer 17 a obtained from the previous substrate preliminary positioning process (step 15 0 0) are stored to determine whether the nozzle 1 3 a is misaligned in the second figure The allowable range of the bit amount is within the range AX, ΔΥ. When it is within the allowable range (ie, dx and AY 2 dy), it is in its state, such as when it is outside the allowable range (ie, △ x < dx or ΔΥ < άγ), according to its position deviation dx, 67 The Z-axis moving table 9 adjusts the solder paste storage cylinder 13 'to thereby cancel the offset between the solder paste ejection outlet of the inkjet nozzle 1 and a predetermined position of the solid substrate', so that the nozzle 1 3 a can be positioned at the predetermined position. This paper size is applicable to China National Standard (CNS) A4 specification (210X297 mm) -20- 408041 a7 _ B7 V. Description of the invention (18) (Please read the precautions on the back before filling this page) Next, the nozzle 1 3 a height setting. When the solder paste storage cylinder 1 3 has not been replaced, there is no data of the offset amounts d X, dy of the nozzles 13 a, so when entering the solder paste coating process (step 16 0 0), the nozzles 1 3 a Height setting. The height of this setting is the initial setting of the coating height used in the previous simulation coating operation, and the distance from the discharge port of the nozzle 1 a to the surface of the solid substrate is the thickness of the solder paste, which forms the coating level. When the above process is completed, the servo motors 8a, 8b, and 10 are driven based on the solder paste pattern data stored in the RAM of the microcomputer 17a (Fig. 1), so that the solder paste exit of the nozzle 13a can be realized. Under the shape of the substrate facing the substrate, it moves in the X and Y directions according to the data of the solder paste. At the same time, only a small amount of air pressure is applied from the positive pressure source 3 0 (Fig. 3) to the solder paste storage cylinder 1 3 , The solder paste is ejected from the solder paste ejection outlet of the nozzle 1 a. The coating speed at this time is the initial setting coating speed used in the previous simulated coating operation, and the air pressure system corresponds to the initial coating pressure used in the previous simulated coating operation. Thereby, the coating speed obtained by previously simulating the coating operation can be used to start coating drawing of the solder paste pattern of the actual substrate. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. At the same time when the coating drawing operation is started, the microcomputer 17a controls the coating speed, coating pressure, and coating height based on the data obtained by previously simulating the coating operation. When the data shown in the 9th (c) chart is used as an example * The coating position S 1 is Vo — as the coating speed,
Fo '爲塗布壓力、Ho爲塗布高度，接近塗布位置S2 的同時，以V2 —爲塗布速度、F1 <爲塗布壓力、H1 爲塗布高度，使該塗布位置S 2形成上述之塗布速度、塗 本紙張尺度速用中國國家標準（CNS ) A4規格（210X297公釐） -21 - 408041 A7 _____B7 五、發明説明（19) 布壓力、塗布高度者。 (諳先闖讀免面之注$項再填寫本頁) 藉此，以塗布位置S 2進行錫膏塗布時，在可動部不 會發生上述容許範圍外的大振動。又，一旦超過該塗布位 置S 2時，塗布速度、塗布壓力、塗布高度恢復至原來的 ν〇 > 、Fo > 、Ho ，其次接近塗布位置S5時，分另0 變更塗布速度爲V 1、塗布壓力爲f 1。 又’在描繪上述錫膏模樣的同時，微電腦1 7 a係輸 入里程計1 4至噴嘴1 3 a之錫膏吐出口與實基板表面間 之距離的實測數據’測定實基板表面的膨脹，對應此測定 値驅動伺服馬達1 2 ’藉此維持一定之實基板表面至噴嘴 1 3 a間的設定高度而進行錫膏模樣的塗布描繪。 如上述’持續著錫膏模樣的塗布描繪，但是進行繼續 錫膏模樣的塗布描繪動作，或完成的判定是藉著塗布點是 否爲錫膏模樣數據所決定應塗布之錫膏模樣終端的判斷來 決定’如非終端時，再次回到實基板表面之膨脹的測定處 理’以下係重複上述各過程持續至到達錫膏模樣的塗布終 端爲止。 經濟部智慧財產局員工消費合作社印製 上述錫膏模樣的塗布動作是針對所設定之所有η個錫 膏模樣數據進行，一旦到達最後號碼η的錫膏模樣數據之 錫膏模樣的終端時，驅動伺服馬達1 2使噴嘴1 3 a上升 ，完成該錫膏模樣塗布過程（步驟1 6 0 0 )。 其次，前進至基板排出處理（步驟1700)。該處 理過程係於第1圖中，解除實基板對基板吸盤4的吸附， 使基板運送機2 a ' 2 b上升將實基板2 2載置其上，在 本紙張尺度適用中國國家標準（CMS ) A4規格（21〇χ297公董） -22- 408041 A7 B7 經濟部智慧財產局員工消貪合作社印製 五、發明説明（2〇 ) 此狀態下藉此基板運送機2 a、2 b排出裝置外。 並且，判定以上所有過程是否已完成（步驟1 8 0 0 )’使用與複數片實基板相同之錫膏模樣數據塗布錫膏模 樣時’對於其他實基板重複基板載置處理（步驟1 4 0 ◦ )。並且，對於所有實基板完成相關之連續處理時，完成 所有的作業（步驟1 9 〇 〇 )。 再者’上述實施形態中，以噴嘴作爲可動部，以基板 作爲固定部，但本發明不僅限於此，也可以噴嘴爲固定部 、以基板爲移動部者。 如上述，此一實施形態係使用僞基板進行模擬塗布動 作’且爲.了決定預先塗布之錫膏模.樣數據的塗布條件，可 不須對實基板進行無謂的塗布動作，可提高其精度。 又，對應錫膏模樣之直線部與曲線部，即錫膏模樣的 形狀決定實基板的塗布條件（即，塗布速度與塗布壓力、 塗布高度），因此實基板之錫膏模樣的塗布描繪可減小至 不影響描繪可動部（噴嘴部或實基板）的振動之錫膏模樣 的程度，又，可確保塗布精度維持每單位時間之錫膏的一 定塗布量，而可以高精度塗布形成預定形狀的錫膏模樣。 此外，錫膏模樣的曲線部受可動部振動的影響極大， 因此即使不可能提高其塗布速度1仍可形成不產生振動影 響的最大塗布速度，又直線部的振動影響小，因此可提高 其塗布速度。如此可縮短錫膏模樣的塗布時間，並可進行 良好的錫膏模樣的塗布描繪，獲得生產性的提升。 又，於第6圖詳細表示之第4圖的容許範圍外之振動 (請先閏讀背面之注意事項再填寫本頁) 本紙張尺度適用中.國國家標準（CNS ) A4规格（210X297公釐） -23- 經濟部智慧財產局員工消費合作社印製 408041 A7 _ B7五、發明説明（21 ) 產生錫膏模樣的探索處理過程（步右9 0 0 )中，即使以 初期設定塗布速度對所有的距離數據進行有無振動的探索 時，可能會有完全不存有振動的情形。此係於初期設定中 設定較低之塗布速度者，即使更快速的塗布速度仍可能不 會發生振動。 因此，也可以其次之第4圖容許範圍外的振動發生錫 膏模樣的探索處理過程（步驟9 0 0 )進行探索第8圖詳 細表示之第4圖的塗布條件修正過程（步驟1 1 0 0 )之 振動的有無。 即，第8圖之步驟1 1 1 0是將初期設定塗布速度僅 減小預先.決定値而作爲新的塗布速度，但是相反地可將初 期設定塗布速度僅增大預先決定値而作爲新的塗布速度。 並且，步驟1 1 2 0是判斷是否必須進行與第8圖相同之 壓力變更，如是則於步驟1 1 3 0中設定値量增加塗布壓 力，且步驟1 1 4 0同樣是判斷是否必須進行與第8圖相 同之塗布高度變更，如是則於步驟1 1 5 0中設定値量減 少塗布高度。如上述回到第4圖的步驟4 0 0實行至步驟 9 0 0爲止，並檢討塗布速度增加至何程度時會發生振動 。且振動發生時因應該發生位置（塗敷位置）未發生振動 時瞬間前的塗布速度而如第9 (c)圖加以登錄。 藉由上述，不僅可探索其錫膏塗布機之振動發生瞬間 前的塗布速度界限，並可藉塗布速度的提升縮短1片塗布 所須的時間。 (請先閲讀背面之注意事項再填寫本頁) 本纸張尺度適用中國國家標準（CNS ) A4规格（210X297公釐） -24- A7 B7 408041 五、發明説明（22 ) 〔發明效果〕 如以上說明，根據本發明可於抑制可動部振動的範圍 內儘可能地設定最大的塗布速度，可進行預定形狀之錫膏 模樣的良好塗布描繪而大幅提高其生產性。 〔圖式之簡單說明〕 第1圖是表示本發明錫膏塗布機一實施形態之透視圖 〇 第2圖是表示第1圖之錫膏收納筒與里程計部份擴大 之透視圖。 第3 ·圖是表示第1圖之控制部的構成及其控制系統之 方塊圖。 < 第4圖是表示第1圖所示實施形態之全體動作的流程 圖。 第5圖是表示第4圖之振動測定處理過程的詳細流程 圖。 第6圖是表示第4圖之振動產生錫膏模樣的探索.判 定處理過程之詳細流程圖。 第7圖爲第6圖之距離數據讀取，變換過程及是否爲 容許範圍外之判定過程說明圖。 第8圖是表示第4圖之塗布條件修正處理過程的詳細 流程圖。 第9圖是表示第4圖之塗布條件修正過程之塗布條件 變化用之圖。 本紙張尺度通用中國國家標準（CNS ) A4規格（2丨0X297公釐> ----------d-----：--1T---U----^ (請先閔讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 -25-Fo 'is the coating pressure, Ho is the coating height, and while approaching the coating position S2, V2 is the coating speed, F1 < is the coating pressure, and H1 is the coating height, so that the coating position S 2 forms the coating speed and coating described above. Quickly use the Chinese National Standard (CNS) A4 size of this paper (210X297 mm) -21-408041 A7 _____B7 V. Description of the invention (19) Those who apply pressure and coating height. (Please read the $ -free note first and then fill out this page.) Therefore, when solder paste is applied at the coating position S 2, no large vibration outside the above-mentioned allowable range will occur in the movable part. When the coating position S 2 is exceeded, the coating speed, coating pressure, and coating height are restored to the original values of ν〇 >, Fo >, Ho. When the coating position S5 is next, the coating speed is changed to V1 by 0. The coating pressure was f 1. Also "while drawing the above solder paste pattern, the microcomputer 17a is inputting the measured data of the distance between the solder paste outlet of the odometer 14 to the nozzle 13a and the surface of the solid substrate" to measure the expansion of the surface of the solid substrate, corresponding In this measurement, the servo motor 12 'is driven to maintain a predetermined height from the surface of the solid substrate to the nozzle 13a to perform coating and drawing of a solder paste pattern. As described above, the painting and drawing of the solder paste pattern are continued, but the operation of continuing the painting and drawing of the solder paste pattern, or the completion of the judgment is based on the judgment of the terminal of the solder paste pattern that should be applied based on whether the application point is the solder paste data. The decision "If it is not the terminal, the measurement processing for the expansion of the surface of the solid substrate is returned again" is repeated below until the coating terminal of the solder paste shape is reached. The coating operation for printing the solder paste pattern by the consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs is performed on all the solder paste pattern data that has been set. Once it reaches the terminal of the solder paste pattern data of the final number η, it drives The servo motor 12 raises the nozzle 13a to complete the solder paste coating process (step 1660). Next, the process proceeds to a substrate discharge process (step 1700). This process is shown in Figure 1. The solid substrate is desorbed from the substrate chuck 4 and the substrate conveyor 2 a '2 b is lifted to place the solid substrate 2 2 on it. The Chinese national standard (CMS) is applied to this paper scale. ) A4 specifications (21 × 297 public directors) -22- 408041 A7 B7 Printed by the Anti-corruption Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (20) In this state, the substrate conveyor 2 a, 2 b discharge device outer. And, it is determined whether all the above processes have been completed (step 1 800) 'when applying the solder paste pattern with the same solder paste pattern data of a plurality of solid substrates' and repeating the substrate mounting process for other solid substrates (step 1 4 0 ◦ ). In addition, when the related continuous processing is completed for all the real substrates, all the operations are completed (step 1900). Furthermore, in the above-mentioned embodiment, the nozzle is used as the movable portion and the substrate is used as the fixed portion. However, the present invention is not limited to this. The nozzle may be used as the fixed portion and the substrate may be used as the moving portion. As described above, this embodiment uses a pseudo substrate to perform a simulated coating operation 'and determines the coating conditions for the pre-applied solder paste sample data. This eliminates the need to perform unnecessary coating operations on a real substrate and improves its accuracy. In addition, the straight and curved portions corresponding to the solder paste pattern, that is, the shape of the solder paste pattern determines the coating conditions of the real substrate (that is, the coating speed, the coating pressure, and the coating height). Therefore, the coating drawing of the solder paste pattern of the real substrate can be reduced. It is small enough not to affect the shape of the solder paste that depicts the vibration of the movable part (nozzle part or solid substrate), and it can ensure the coating accuracy to maintain a certain amount of solder paste per unit time. Looks like solder paste. In addition, the curved portion of the solder paste pattern is greatly affected by the vibration of the movable portion. Therefore, even if it is impossible to increase the coating speed1, the maximum coating speed without vibration influence can be formed, and the vibration effect of the linear portion is small, so the coating can be improved. speed. In this way, the coating time of the solder paste pattern can be shortened, and a good coating pattern of the solder paste pattern can be performed, thereby improving productivity. In addition, the vibration outside the allowable range of Figure 4 shown in Figure 6 in detail (please read the precautions on the back before filling out this page) The paper size is applicable. National Standard (CNS) A4 Specification (210X297 mm ) -23- Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 408041 A7 _ B7 V. Description of the invention (21) In the process of exploring and generating the solder paste appearance (step right 9 0), When the distance data is searched for vibration, there may be no vibration at all. This is the case where a lower coating speed is set in the initial setting. Even faster coating speed may not cause vibration. Therefore, it is also possible to search for the coating process of the vibration generation solder paste outside the tolerance range of FIG. 4 (step 9 0 0). The process of correcting the coating conditions of step 4 shown in detail in FIG. 8 (step 1 1 0 0) The presence or absence of vibration. That is, step 1 1 1 0 of FIG. 8 is to reduce the initial setting coating speed by only preliminarily. It is determined as a new coating speed, but conversely, the initial setting coating speed may be increased only by a predetermined determination and new. Coating speed. In addition, step 1 1 2 0 is to determine whether it is necessary to perform the same pressure change as in Fig. 8. If so, set the volume in step 1 1 3 0 to increase the coating pressure, and step 1 1 4 0 is also to determine whether it is necessary to perform The same coating height is changed in Figure 8. If so, set the amount in step 1 150 to reduce the coating height. As described above, return to step 4 of Figure 4 to step 9 0, and review to what extent the coating speed will increase when vibration occurs. In addition, when the vibration occurs, it should be registered as shown in Figure 9 (c) due to the coating speed immediately before the vibration occurs at the application position (application position). Based on the above, not only can the coating speed limit of the solder paste coating machine immediately before the vibration occurs, but also the time required for one sheet coating can be shortened by increasing the coating speed. (Please read the precautions on the back before filling out this page) This paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) -24- A7 B7 408041 5. Description of the invention (22) [Invention effect] As above According to the present invention, the maximum coating speed can be set as much as possible within the range of suppressing the vibration of the movable portion, and a good coating and drawing of a solder paste pattern of a predetermined shape can be performed, thereby greatly improving its productivity. [Brief Description of the Drawings] Fig. 1 is a perspective view showing an embodiment of the solder paste coating machine of the present invention. Fig. 2 is a perspective view showing an enlarged portion of the solder paste storage cylinder and the odometer in Fig. 1. Fig. 3 is a block diagram showing a configuration of a control unit and a control system of Fig. 1; < FIG. 4 is a flowchart showing the overall operation of the embodiment shown in FIG. 1. Fig. 5 is a detailed flowchart showing the vibration measurement processing procedure of Fig. 4; Fig. 6 is a detailed flowchart showing the process of searching for and determining the pattern of solder paste generated by vibration in Fig. 4; Fig. 7 is an explanatory diagram of the distance data reading, conversion process, and determination process of whether it is outside the allowable range in Fig. 6. Fig. 8 is a detailed flowchart showing a coating condition correction processing procedure of Fig. 4. Fig. 9 is a graph showing changes in coating conditions in the coating condition correction process of Fig. 4; The paper size is in accordance with the Chinese National Standard (CNS) A4 specification (2 丨 0X297 mm > ---------- d -----:-1T --- U ---- ^ ( Please read the notes on the back before filling out this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs-25-
40804F 五、發明説明（23 ) 第1 0圖是表示習知錫膏塗布機所塗敷之錫膏厚度變 化圖。 _(請先閱讀背-面之注意事項再填寫本頁) 主要元件對照表 1 架 台 2 a 、2 b 基 板 運 送 機 3 支 持 台 4 基 板 吸 rifey. 5 Θ 軸 移 動 台 6 a 、6 b X 軸 移 動 台 7 Y 軸 移 動 台 8 a 、8 b 伺 服 馬 達 « 9 Z 軸 移 動 台 1 〇 伺 服 馬 達 1 1 滾 珠 螺 桿 1 2 伺 服 馬 達 1 3 錫 膏 收 納 筒 1 4 里 程 計 1 5 支 持 板 1 6 a、 1 6 b 影 像 識別攝影機 1 7 控 制 部 1 7 a 微 電 腦 1 7 b 電 動 機 控 制 器 1 了 cl X 1 軸 驅 動 器 經濟部皙慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS > A4规格（210X297公釐） -26- _ 408041 五、發明説明（<24) 1 7 c 2 X2軸驅動器 1 7 d Y軸驅動器 1 7 e 0軸驅動器 1 7 f Z軸驅動器 1- 7 g 數據匯流排 1 7 h 外部介面 18 馬達 19 鍵盤 20 外部記憶裝置 2 1 電纜 2 2 基板 2 3 錫膏模樣 · 2 4 伺服馬達 25〜29 編碼器 131 負壓源 (請先閲讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 本纸張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -27-40804F V. Description of the Invention (23) Figure 10 is a graph showing changes in the thickness of a solder paste applied by a conventional solder paste applicator. _ (Please read the back-to-side precautions before filling out this page) Main component comparison table 1 Stand 2 a, 2 b Substrate conveyor 3 Support stand 4 Substrate suction rifey. 5 Θ axis mobile stage 6 a, 6 b X axis Mobile stage 7 Y-axis mobile stage 8 a, 8 b Servo motor «9 Z-axis mobile stage 1 〇 Servo motor 1 1 Ball screw 1 2 Servo motor 1 3 Solder paste storage cylinder 1 4 Odometer 1 5 Support board 1 6 a, 1 6 b Image recognition camera 1 7 Control unit 1 7 a Microcomputer 1 7 b Motor controller 1 cl X 1 Axis driver Printed by the staff consumer cooperative of Xihui Property Bureau of the Ministry of Economy This paper applies Chinese national standards (CNS > A4 Specifications (210X297mm) -26- _ 408041 V. Description of the invention (< 24) 1 7 c 2 X2-axis driver 1 7 d Y-axis driver 1 7 e 0-axis driver 1 7 f Z-axis driver 1- 7 g Data Bus 1 7 h External interface 18 Motor 19 Keyboard 20 External memory device 2 1 Cable 2 2 Base plate 2 3 Tin Paste appearance · 2 4 Servo motor 25 ~ 29 Encoder 131 Negative pressure source (please read the precautions on the back before filling this page) Printed on paper size applicable to China National Standard (CNS) A4 specifications (210X297 mm) -27-