JP5630050B2 - Paste applicator - Google Patents

Description

  The present invention relates to a paste coating apparatus that applies a paste for bonding an electronic component such as a semiconductor device to a substrate.

  In a die bonding process for manufacturing a semiconductor device, a paste for adhering a semiconductor chip is applied to a substrate such as a resin package substrate. The application of the paste is performed by discharging the paste discharged from the dispenser to the application target portion of the substrate through the application nozzle (see Patent Document 1). In the adhesion of electronic parts, it is necessary to apply the paste as uniformly as possible within the adhesion range. Therefore, as this application method, there is a drawing application in which application is performed by discharging the paste while horizontally moving the application nozzle on the substrate. Often used.

  In this drawing application, in order to prevent fluctuations in the application state due to changes in the viscosity of the paste over time, the applied paste is imaged with a camera to determine whether the application shape and application amount are normal. An application state inspection is performed to determine whether or not (see Patent Document 2). As a result, when it is determined that the application state is poor, application condition parameters such as an air pressure value supplied to the syringe for discharging the paste are corrected. Thereby, the application shape and application amount of the paste discharged from the application nozzle are always kept good.

JP 2003-218136 A JP 20034661 A

  However, as in the above-described conventional technology, for the paste supplied in a state of being stored in the syringe, in the conventional technology for correcting the air pressure value that is the coating condition parameter by feeding back the result of the coating state inspection, As described in the above, there is a problem that the feedback process at the time of syringe replacement becomes complicated and an extra work is forced.

  That is, the paste supply syringe is stored in a low-temperature storage before use, and is taken out into a normal working atmosphere in accordance with the timing of syringe replacement. For this reason, after being removed from the storage, the paste in the syringe thickens with time, and the paste is consumed by the execution of the coating operation, the liquid level in the syringe gradually decreases, and the paste head is It gradually decreases. Such fluctuations in the viscosity and water head value of the paste over time act to reduce the amount of paste discharged from the application nozzle, so in the process of continuous paste application, the amount of paste discharged In order to keep the pressure constant, the air pressure value supplied to the syringe is corrected to increase.

  For this reason, the air pressure value supplied to the syringe is successively increased by repeating the above-described feedback processing, and reaches the maximum value when the amount of paste stored in the syringe in use has been consumed. In this state, the syringe is replaced with a new syringe instead of the syringe in which the paste has been consumed in a state where the air pressure value is maximized. There is no thickening due to change, and the liquid level in the syringe is in the highest state.

  And if air pressure is supplied with the above-mentioned air pressure value to the syringe in this state, the paste will be discharged beyond an appropriate amount, so the above-mentioned feedback processing is performed to set the air pressure value to an appropriate value. Returning is done. However, feedback processing when returning the air pressure value that has risen to the maximum value to an appropriate value corresponding to the new syringe is low in convergence, and usually trial and error processing that repeats trial application and application state inspection multiple times is performed. It was necessary and time and effort were required for the feedback process at the time of syringe replacement.

  In addition, such a problem is a so-called multi-type bonding configuration in which a plurality of semiconductor devices are bonded to each package substrate by a paste and mounted on a multi-planar substrate in which a plurality of package substrates are formed on one substrate. Was even more prominent. That is, in this case, since the type of the application target part varies depending on the type of the semiconductor device, it is necessary to attach a plurality of types of syringes and use them separately for each application target part. It was complicated.

  Therefore, an object of the present invention is to provide a paste coating apparatus that can easily perform feedback processing of coating condition parameters when replacing a syringe.

The paste application apparatus of the present invention applies the paste to the application target set on the substrate by discharging the paste for joining electronic components stored in the syringe from the application nozzle connected to the syringe by air pressure. A pressure parameter storage for storing a standard pressure parameter corresponding to a standard air pressure value suitable for an application pattern of the application target portion and an offset pressure parameter corresponding to a correction value of the air pressure value A paste application mechanism that discharges the paste in the syringe from the application nozzle and applies it to the application target part by supplying pneumatic pressure based on the standard pressure parameter and the offset pressure parameter to the syringe; This image is obtained by imaging the paste applied by the paste application mechanism. An inspection means for inspecting the quality of the application state of the coating, a paste application mechanism, an application control unit for performing a feedback process for adjusting the offset pressure parameter based on an inspection result by the inspection means, and the syringe. The machine operator includes a syringe replacement processing unit that executes a predetermined process associated with the syringe replacement when the machine operator inputs a new replacement on the display screen, and the syringe replacement processing unit includes the offset in the predetermined process. Reset pressure parameters to default values.

  According to the present invention, the air pressure supplied to the syringe for discharging the paste, the standard pressure parameter corresponding to the standard air pressure value suitable for the application pattern of the application target portion, and the correction value of this air pressure value When the syringe is replaced, the offset pressure parameter is reset to the default value, so that the application condition parameter feedback process at the time of syringe replacement can be easily performed.

The perspective view of the die-bonding apparatus of one embodiment of this invention Structure explanatory drawing of the board | substrate used as the work object in the die bonding apparatus of one embodiment of this invention Structure explanatory drawing of the coating head in the die bonding apparatus of one embodiment of this invention Operation explanatory diagram of trial application and application state inspection processing in the die bonding apparatus of one embodiment of the present invention Functional explanatory drawing of the nozzle height detection part in the die bonding apparatus of one embodiment of this invention The block diagram which shows the structure of the control system of the die-bonding apparatus of one embodiment of this invention The figure which shows the structure of the application | coating data and board | substrate data which are used for the paste application | coating operation | movement by the die bonding apparatus of one embodiment of this invention. Explanatory drawing of the paste application condition parameters in the die bonding apparatus of one embodiment of the present invention The figure which shows the display screen of the die-bonding apparatus of one embodiment of this invention

  Next, embodiments of the present invention will be described with reference to the drawings. First, the configuration and function of the die bonding apparatus 1 will be described with reference to FIGS. In FIG. 1, a die bonding apparatus 1 has a paste application mechanism having a function of applying a bonding paste (hereinafter simply referred to as “paste”) for bonding electronic components to a substrate 3 positioned and held by a substrate positioning mechanism 2. 1A and a bonding mechanism 1B for bonding an electronic component such as a semiconductor device taken out from the component supply unit 4 to the substrate 3 to which the paste is applied.

  As shown in FIG. 2 (a), the substrate 3 that is a work target of the die bonding apparatus 1 is a multi-sided substrate in which a plurality of unit substrates 3a are formed in a regular arrangement, and a paste is applied to these unit substrates 3a. Application and electronic component bonding are performed. As shown in FIG. 2B, the unit substrate 3a has a plurality of application target portions (here, three first application target portions 31, second application target portions 32, and third application target portions 33 of different types). Is provided. A first application pattern 31a, a second application pattern 32a, and a third application pattern 33a having different application shapes and application amounts are set in the first application target part 31, the second application target part 32, and the third application target part 33, respectively. Has been. The first application pattern 31a, the second application pattern 32a, and the third application pattern 33a are application patterns having application shapes and application amounts suitable for joining large, medium, and small electronic components, respectively. The star mark shape, the second application pattern 32a has an X shape, and the third application pattern 33a has a dot shape.

  The substrate positioning mechanism 2 has a structure in which a substrate holding table 2b that holds a substrate 3 carried in by a substrate transfer device (not shown) is coupled to the upper surface of the moving table 2a. 3 is positioned by moving in the horizontal direction. Above the substrate positioning mechanism 2, a coating head 10 to which the first syringe 12 </ b> A and the second syringe 12 </ b> B are attached is disposed so as to be movable in the X, Y, and Z directions by the coating head drive mechanism 11.

  As shown in FIG. 3, the application head 10 is provided with a first syringe mounting part 21A and a second syringe mounting part 21B each having a syringe holder 20, and the first syringe mounting part 21A and the second syringe mounting part. The first syringe 12A and the second syringe 12B storing the paste 18 are attached to 21B in a replaceable manner. Here, the first syringe mounting part 21A and the second syringe mounting part 21B are divided by numbers (# 1, # 2) so that the syringes to be mounted can be specified. Further, the coating head 10 has a built-in mechanism for selectively changing the height of the first syringe mounting part 21A and the second syringe mounting part 21B, and a syringe application nozzle for applying the paste when applying the paste. The height of the lower end of 19 is positioned at a position lower than the height of the lower end of the application nozzle of the other syringe.

  The first syringe 12A and the second syringe 12B are connected to the first pneumatic unit 13A and the second pneumatic unit 13B, respectively, via an air pipe (not shown). The first pneumatic unit 13A and the second pneumatic unit 13B are pneumatically applied to the first syringe 12A and the second syringe 12B based on a pressure parameter (application condition parameter) commanded from the control unit 30 (see FIG. 6). Supply. As a result, the first syringe 12A and the second syringe 12B discharge the paste 18 having a discharge amount corresponding to the commanded pressure parameter from the application nozzle 19 connected to the lower end. It should be noted that the first syringe 12A and the second syringe 12B may be in the form of using two of the same syringe type / nozzle size and stored paste composition, or one or both of them may be different. Two syringes may be used in combination, and these combinations are selected according to the application characteristics of the application target portion in the same substrate.

  The first syringe 12 </ b> A, the second syringe 12 </ b> B, the first pneumatic unit 13 </ b> A, and the second pneumatic unit 13 </ b> B discharge the paste 18 from the application nozzle 19 based on the pressure parameter, and apply it to the application target portion set on the substrate 3. A paste application mechanism for application is configured. Here, the first syringe 12A and the first pneumatic unit 13A attached to the first syringe attachment part 21A constitute the dispense unit # 1, and the second syringe 12B and the second syringe attached to the second syringe attachment part 21B. The pneumatic unit 13B constitutes the dispensing unit # 2 (see FIG. 6). The coating head drive mechanism 11 that moves the coating head 10 is a nozzle moving mechanism that moves the coating nozzle 19 relative to the substrate 3.

  Substrate positioning is performed by discharging the paste 18 from the application nozzle 19 of either the first syringe 12A or the second syringe 12B while moving the application head 10 along a locus corresponding to a predetermined application pattern by the application head drive mechanism 11. In the unit substrate 3a of the substrate 3 held by the mechanism 2, the first application target part 31, the second application target part 32, and the third application target part 33 are respectively provided with a first application pattern 31a, a second application pattern 32a, The paste 18 is drawn and applied in accordance with the third application pattern 33a. That is, the paste application mechanism 1A (paste application device) sets the paste 18 on the substrate 3 by discharging the paste 18 stored in the first syringe 12A and the second syringe 12B from the application nozzle 19 by air pressure. A plurality of types (here, three types) of application target parts (first application target part 31, second application target part 32, third application target) having a function of applying to the applied application target part and having different application patterns In this example, the paste 18 is applied to the substrate 3 on which a plurality of unit substrates 3a having the portion 33) are formed.

  A substrate recognition camera 14 that moves integrally with the coating head 10 by the coating head drive mechanism 11 is attached to the coating head 10. By moving the camera 14 onto the substrate positioning mechanism 2 and imaging the substrate 3, the position of the unit substrate 3 a on the substrate 3 is recognized. In addition, by moving the camera 14 above the trial hitting stage 8 described below, it is possible to inspect the application state of the paste 18 that has been trial hit.

  The substrate positioning mechanism 2 is provided with a discard strike collecting unit 7, a trial strike stage 8, and a nozzle height detection unit 9. The dumping and collecting unit 7 forcibly discharges the paste 18 discharged by the first syringe 12A and the second syringe 12B for purposes other than the actual paste application, for example, to eliminate clogging in the application nozzle 19 The paste 18 to be collected is collected.

  The test strike stage 8 is used for inspecting the quality of the application state of the paste 18 discharged from the application nozzle 19 by the paste application mechanism described above. That is, prior to the application of the paste 18 to the substrate 3, the coating head 10 is moved above the trial strike stage 8 and the coating nozzle 19 is lowered with respect to the trial strike stage 8 as shown in FIG. Then, the paste 18 is applied to the application surface 8a under predetermined application conditions.

  Next, as shown in FIG. 4B, the camera 14 is positioned above the trial hitting stage 8 and the paste 18 is imaged, so that the paste 18 in the applied state is applied as shown in FIG. A plane image is acquired. By recognizing this image, the contour shape and planar projection area A of the applied paste 18 are obtained. Then, by comparing these with the pre-stored judgment reference data, it is judged whether the application state of the paste 18 is good or not, and the pressure parameter is corrected so as to reduce the deviation by detecting the deviation from the judgment reference data. Feedback data is acquired.

  The nozzle height detection unit 9 has a function of detecting the height position of the lower end portion of the application nozzle 19 in a state where the first syringe 12A and the second syringe 12B are attached to the application head 10. As shown in FIG. 5, the nozzle height detection unit 9 has a configuration in which an optical sensor including a light projecting unit 23a and a light receiving unit 23b is attached to a concave bracket 9a, and the light projecting unit 23a to the light receiving unit. The height position h of the optical axis a reaching 23b is associated with the height reference of the substrate holding table 2b in advance. Therefore, by obtaining the Z-axis drive height of the coating head drive mechanism 11 at the timing when the lower end portion of the coating nozzle 19 coincides with the height position of the optical axis a, the upper surface of the substrate 3 held on the substrate holding table 2b is obtained. The relative position between the application target surface and the height position of the application nozzle 19 can be detected.

  In order to perform paste application normally, it is necessary to properly set the nozzle height, that is, the gap between the discharge port of the application nozzle 19 and the application target surface. When the replacement is performed, since the mounting height of the application nozzle 19 changes, this gap does not become constant but varies. For this reason, every time the syringe is replaced, the application head 10 is accessed to the nozzle height detection unit 9 to detect the height of the lower end of the application nozzle 19 in the mounted state. That is, as shown in FIG. 5, in the process of lowering the application nozzle 19 with respect to the nozzle height detection unit 9, the detection processing unit 24 detects the timing at which the lower end of the application nozzle 19 coincides with the optical axis a. Thereby, the reference height position for adjusting the nozzle height can be obtained.

  Next, the configuration of the bonding mechanism unit 1B will be described. A component supply unit 4 is disposed on the side of the substrate positioning mechanism 2 in the Y direction. The component supply unit 4 indexes a plurality of holding tables 5 each having a plurality of first components 6A, second components 6B, and third components 6C that are divided into individual pieces around the vertical axis by an index mechanism 4a. It is configured to rotate. The first component 6A, the second component 6B, and the third component 6C correspond to electronic components mounted on the first application target portion 31, the second application target portion 32, and the third application target portion 33 of the unit substrate 3a, respectively. ing.

  Above the component supply unit 4, a bonding head 15 having a suction nozzle 15 a at the lower part is disposed so as to be movable in the X, Y, and Z directions by a bonding head driving mechanism 16. In a state where any one of the plurality of holding tables 5 is moved to the component pickup position by the bonding head 15, the bonding head driving mechanism 16 causes the bonding head 15 to take out the component, thereby the first component 6 </ b> A and the second component 6 </ b> A. 6B and the third component 6C are sucked and held by the suction nozzle 15a from the component supply unit 4 and taken out. Next, by moving the coating head 10 onto the substrate positioning mechanism 2 and causing the bonding head 15 to perform a bonding operation, the first component 6A, the second component 6B, and the third component 6C are unit substrates 3a after paste application. Are sequentially bonded to each other.

  Next, the configuration of the control system will be described with reference to FIG. The control unit 30 includes a first syringe 12A, a dispense unit # 1 composed of a first pneumatic unit 13A, a dispense unit # 2 composed of a second syringe 12B and a second pneumatic unit 13B, a coating head drive mechanism 11, and a substrate positioning mechanism. 2. Control the bonding mechanism 1B. In addition, the imaging result of the camera 14, the detection result of the nozzle height detection unit 9, and the operation command from the display / input unit 25 having a touch panel input function are transmitted to the control unit 30.

  The control unit 30 includes an application operation execution unit 30a, a test application execution unit 30b, an application state inspection unit 30c, a data setting unit 30d, a bonding operation execution unit 30e, and a syringe replacement processing unit 30f as internal control functions. The application operation execution unit 30a (application control unit) includes the substrate positioning mechanism 2, the application head drive mechanism 11, the first syringe 12A, the dispense unit # 1 including the first pneumatic unit 13A, the second syringe 12B, and the second pneumatic pressure. By controlling the dispensing unit # 2 including the unit 13B, the first application target portion 31, the second application target portion 32, and the third application target portion 33 of each unit substrate 3a of the substrate 3 held by the substrate positioning mechanism 2 are performed. Next, the application | coating operation | movement which apply | coats the paste 18 according to a predetermined application | coating pattern is performed. In this application operation, the application data 41 and substrate data 42 stored in the storage unit 40 are referred to, and the lowering height of the application head 10 is determined based on the detection result of the application nozzle 19 by the nozzle height detection unit 9. Is controlled to adjust the height position of the application nozzle 19 to an appropriate nozzle height position.

  The test application execution unit 30b causes the substrate positioning mechanism 2, the application head drive mechanism 11, and the dispense units # 1 and # 2 to execute a test application operation of the paste 18 performed by moving the application head 10 to the test hitting stage 8. Process. The application state inspection unit 30 c executes a process for inspecting the quality of the application state of the paste 18 that has been trial-applied to the trial strike stage 8. In other words, the test-applied paste 18 is imaged by the camera 14, and the result of recognition processing of the imaged data is compared with the determination reference data to determine whether the application state is good or bad. The camera 14 and the application state inspection unit 30c capture the image of the paste 18 applied to the substrate 3 by the paste application mechanism or the test paste 18 applied to the trial hitting stage 8 to determine whether the application state of the applied paste 18 is good or bad. Constitutes an inspection means for inspecting

  In the control of the application operation by the application operation execution unit 30a, the paste 18 is applied to the application target portions of the plurality of unit substrates 3a by controlling the paste application mechanism and the nozzle moving mechanism based on the inspection result by the inspection means. A paste application operation is performed. Further, the application operation executing unit 30a as the application control unit controls the paste application mechanism and performs feedback processing for adjusting the offset pressure parameter based on the inspection result by the above-described inspection means.

  The data setting unit 30d performs setting processing of various data input by the display / input unit 25 and stored in the storage unit 40. The bonding operation execution unit 30e controls the bonding mechanism unit 1B including the component supply unit 4, the bonding head 15, and the bonding head drive mechanism 16, and the first component 6A and the first component 6A are applied to the plurality of unit substrates 3a after the paste application. A work operation for bonding the two parts 6B and the third part 6C is executed. The syringe replacement processing unit 30f executes a process that is necessary when the first syringe 12A and the second syringe 12B attached to the application head 10 are replaced.

  Next, the contents of data stored in the storage unit 40 will be described with reference to FIG. The application data 41 is data for drawing and applying the paste 18 in each drawing pattern to a plurality of types of application target portions having different application patterns on the unit substrate 3a, and in other words, for each type of application target portion (in other words, bonding is performed. For each type of electronic component). That is, as shown in FIG. 7A, the application data 41 has a data configuration in which the data number 41a is associated with the drawing data 41b, the standard pressure parameter 41c, the offset pressure parameter 41d, and the dispensing unit section 41e. . The data number 41a is assigned for each type of application target portion on the unit substrate 3a. In the example shown in FIG. 7A, the data numbers 1, 2, and 3 are the first application targets shown in FIG. This corresponds to the part 31, the second application target part 32, and the third application target part 33.

  The drawing data 41b indicates the shape of the paste 18 to be drawn and applied to the application target portion by a code (W001, W002,...). As shown by another frame * in FIG. 7A, the drawing data 41b is obtained by associating the code 41b1 with the application shape 41b2 realized by the drawing data. That is, in the example shown here, dot-shaped application patterns having different sizes correspond to W001 and W002, X-shaped application patterns having different sizes are applied to W003 and W004, and further applied to W005. A star mark type coating pattern, which is a large amount of coating pattern, is supported.

  The standard pressure parameter 41c and the offset pressure parameter 41d are pressure parameters that define the pressure of the air pressure supplied into the syringe for discharging the paste. Accordingly, the storage unit 40 is a pressure parameter storage unit that stores pressure parameters. Here, the standard pressure parameter 41c (P0i) is a fixed parameter set corresponding to a standard air pressure value suitable for the application pattern of the application target portion. Here, an air pressure value that gives an appropriate application result to a newly attached syringe by replacement is obtained by trial or the like, and this air pressure value is adopted as a standard air pressure value. Note that (i) in P0i indicates a parameter corresponding to the data number i.

  The offset pressure parameter 41d (P1i) is a correction value of the standard air pressure value set in this way, that is, a correction value that is automatically and sequentially set with respect to the standard air pressure value by feedback processing described later. These are fluctuating parameters that fluctuate in accordance with the timing of execution of the application operation. Note that (i) in P1i indicates a parameter corresponding to the data number i.

  The dispense unit section 41e is data for specifying a dispense unit used in the paste application operation, and corresponds to each data number 41a, that is, to an application pattern applied to a component type of an electronic component to be bonded. It is set in advance. When performing the coating operation, the dispensing unit section 41e corresponding to the target data number is read out, so that it is mounted on any of the syringe mounting portions (see FIG. 3) identified by the marks # 1 and # 2 in the coating head 10. It is specified whether to use the prepared syringe.

  That is, in the present embodiment, a plurality of (here, two) syringe mounting portions 21A and 21B for mounting a syringe on the paste application mechanism are provided, and the standard pressure parameter 41c is stored in the storage unit 40 which is a pressure parameter storage unit. In addition to the offset pressure parameter 41d, a dispense unit classification 41e (attachment part specifying data) that specifies a syringe attachment part to which a syringe used for application of the application pattern is attached is set for each of a plurality of application patterns. .

  The pressure parameters described above will be described with reference to FIG. In paste application using a syringe, the discharge amount of the paste 18 from the application nozzle 19 attached to the lower end of the syringe assumes that the viscosity of the paste 18 is constant. Defined by pressure. As the viscosity of the paste 18 increases, the discharge amount at the same static pressure value varies in the decreasing direction. Therefore, in order to keep the discharge amount of the paste 18 constant at all times, it is necessary to set the static pressure of the paste 18 at the nozzle position to an appropriate value defined in relation to the viscosity.

  Here, the static pressure at the nozzle position is supplied from the first pneumatic unit 13A and the second pneumatic unit 13B, as shown in FIG. Further, it can be considered that a pressure head Ph corresponding to the liquid level height H of the paste 18 in the syringe is added. Here, since the liquid level height H gradually decreases as the paste 18 in the syringe is consumed by repeatedly performing the application operation, in order to make the static pressure at the nozzle position constant, The pressure P must be increased by the amount that the pressure head Ph has successively decreased. In addition, since the paste 18 in the syringe is thickened with the passage of time to be taken out of the storage at the start of use and placed in the external atmosphere, in order to compensate for the decrease in the discharge amount due to this increase in viscosity. The pressure P needs to be increased.

  Such time-dependent fluctuation of the paste discharge amount is caused by the pressure of the pneumatic pressure supplied to the first syringe 12A and the second syringe 12B by feedback based on the test result of the trial application performed using the trial strike stage 8. Correction is made by changing the value P. FIG. 8B shows the temporal variation of the pressure value Pi when the paste application operation is continuously executed while feedback correcting the paste discharge parameters so that the paste discharge amount becomes constant in this way. Show. That is, as described above, the pressure value Pi gradually increases by a correction amount from the pressure value P0i in the state where the syringe is newly replaced as the liquid level height H decreases and the viscosity increases, and immediately before the syringe replacement. The pressure value Pi is reset to the pressure value P0i again by exchanging the syringe.

  In the present embodiment, the pressure value Pi is set to an offset corresponding to a standard pressure parameter P0i corresponding to a standard air pressure value suitable for a target application pattern and a correction value of the air pressure value corrected upon feedback. The sum of the pressure parameters P1i, that is, Pi = P0i + P1i is defined. In the application data 41 stored in the storage unit 40, P0i and P1i are in the form of individual data of the standard pressure parameter 41c and the offset pressure parameter 41d, for each data number 41a, that is, the application pattern of each application target part. Stored every time.

  When performing the application operation, the application operation execution unit 30a performs the first pneumatic unit 13A, according to the pressure value Pi calculated based on the standard pressure parameter 41c and the offset pressure parameter 41d read from the application data 41 of the storage unit 40. The second pneumatic unit 13B is activated. That is, the above-described paste application mechanism supplies the pneumatic pressure Pi based on the standard pressure parameter 41c (P0i) and the offset pressure parameter 41d (P1i) to the first syringe 12A and the second syringe 12B. The paste 18 is discharged from the application nozzle 19 and applied to the first application target part 31, the second application target part 32, and the third application target part 33.

  The substrate data 42 defines the position of the coating operation on which the paste coating operation is to be performed on the substrate 3 and the coating pattern to be applied. That is, as shown in FIG. 7B, for each coating position number 42a corresponding to each of the plurality of coating target portions on the substrate 3, a position indicating the reference position (for example, the center position of the coating pattern) of each coating target portion. Substrate data 42 in which the coordinates 42b and the coating data number 42c are associated is created. Here, the application data number 42 c indicates a correspondence relationship between the application target portion and the data number 41 a of the application data 41. The bonding data 43 is data used for execution of a die bonding operation to the substrate 3 by the bonding mechanism unit 1B, such as component type data and bonding position table data.

  Next, a syringe replacement process executed in conjunction with replacement of the first syringe 12A and the second syringe 12B attached to the application head 10 will be described with reference to FIG. This process is executed by the syringe replacement processing unit 30f, and a predetermined process is executed when the machine operator inputs an operation according to the operation procedure displayed on the display screen 50 shown in FIG. On the display screen 50, a syringe selection unit 51 for performing an operation of selecting a dispense unit to be replaced is set. By placing a check mark in one of the selection operation frames 51a and 51b, the dispense unit # 1, The syringe which became the exchange object among # 2 can be specified.

  Further, the display screen 50 is provided with display frames 52, 53, 54, and 55 indicating operation contents and check frames 52a, 53a, 54a, and 55a for selecting whether or not to execute each of these processes in an arrangement according to the operation procedure. It has been. The display frame 52 (syringe replacement) is an operation input means for inputting the fact when the syringe replacement is executed, and a check mark is put in the check frame 52a and the execution operation button 57 is operated, so that the syringe is changed. An instruction indicating that the replacement has been made is made to the control unit 30.

  Then, by this instruction input, the syringe replacement processing is executed by the syringe replacement processing unit 30f, and only the offset pressure parameter 41d among the pressure parameters of the application data 41 stored in the storage unit 40 is reset to the default value. That is, as shown in FIG. 8B, the air pressure value Pi supplied to the syringe is defined only by the standard pressure parameter 41c because the offset pressure parameter 41d is reset to the default value (0 in this case). Air pressure value P0i.

  By adopting such a configuration as the pressure parameter as the application condition parameter, it is possible to accurately and easily perform the update process of the air pressure value Pi required for the syringe replacement. That is, since the paste 18 stored in an unused syringe newly taken out from the storage does not increase in viscosity due to deterioration with time and the liquid level does not decrease due to paste consumption, If the air pressure value Pi, that is, the air pressure value Pi (the air pressure value PMi shown in FIG. 8B) that is gradually increased by successively feeding back the correction due to the result of the trial application is used as it is, the discharge amount becomes excessive.

  For this reason, in the first application operation after the syringe replacement, it is necessary to reset the air pressure value Pi to a new syringe state without using the air pressure value PMi as it is. At this time, the air pressure value Pi after the offset pressure parameter 41d is reset to the default value, that is, the preset standard air pressure value P0i is set as the object of the feedback process without setting the air pressure value PMi as the object of feedback. To do. Since this standard air pressure value P0i is set to be an appropriate value for the state immediately after the syringe replacement, the number of trials required for converging to the appropriate value in the feedback processing is small and appropriate. Can be quickly reset to the correct pressure value.

  That is, in the present embodiment, the syringe replacement processing unit 30f executes a predetermined process associated with the syringe replacement when the machine operator inputs on the display screen 50 that the syringe has been newly replaced. The offset pressure parameter 41d is reset to the default value. In the data reset process of the offset pressure parameter 41d, the same dispense unit classification as the dispense unit classification 41e (attachment part specifying data) of the first syringe attachment part 21A and the second syringe attachment part 21B to which the syringes to be replaced are attached. A plurality of offset pressure parameters 41d related to the coating pattern corresponding to 41e are collectively reset. As a result, the plurality of offset pressure parameters 41d that require data reset by syringe replacement can be simultaneously reset by a single operation, and the operation can be simplified.

  In the display frames 53, 54, and 55, the processing contents of the post-syringe replacement processing required after the syringe replacement are displayed, and an operation of adding a check mark to the corresponding check frames 53a, 54a, and 55a was performed. Later, the following process is executed by operating the execution operation button 57, and the process associated with the syringe replacement is ended by operating the end operation button 58. First, by selecting the display frame 53 (nozzle height teach), processing for teaching the height position of the application nozzle 19 of the newly replaced syringe is automatically executed. In this process, the coating head 10 is accessed to the nozzle height detection unit 9 and the height position of the lower end portion of the coating nozzle 19 is detected by the method shown in FIG. A reference position is set.

  Next, by selecting the display frame 54 (nozzle center teach), processing for teaching the reference position of the application nozzle 19 in the horizontal plane is automatically executed. In this process, the application head 10 is accessed to the trial hitting stage 8 to apply the paste 18 in a dot shape from the application nozzle 19, and the application point 19 is imaged by the camera 14 to recognize the position. The center position of is detected. Further, by selecting the display frame 55 (trial application / inspection), the trial application operation and the application state inspection process by the test application execution unit 30b and the application state inspection unit 30c are automatically and continuously executed.

  That is, the syringe replacement processing unit 30f takes an image of the paste 18 that has been trial-applied by the teaching process that teaches the reference nozzle position in the height direction and the horizontal plane of the application nozzle 19 and / or the paste application mechanism, and thereby the paste 18 A post-syringe replacement process including a test application / inspection process for inspecting the quality of the application state is executed. Further, in the present embodiment, an operation procedure for executing the above-described post-syringe replacement processing is displayed on the display screen 50 by the syringe replacement processing unit 30f, and a machine operator inputs an operation according to this operation procedure. The post-syringe replacement process is executed.

  In the above-described example, by selecting the display frames 53, 54, and 55 on the display screen 50, these post-syringe replacement processes are individually executed. However, the display frame 52 (syringe replacement) is input. The operation after the syringe replacement may be automatically executed without performing an input operation to the display frames 53, 54, and 55 by using the operation as a trigger signal.

  As described above, in the paste application apparatus shown in the present embodiment, the air pressure supplied to the syringe for discharging the paste 18 is changed to a standard air pressure value suitable for the application pattern of the application target portion. The offset pressure parameter P1i is composed of two individual parameters, a corresponding standard pressure parameter P0i and an offset pressure parameter P1i corresponding to the correction value of the standard air pressure value. Is reset to the default value.

  As a result, the target air pressure value in the feedback process executed when the pressure parameter is reset is close to the appropriate value of the new syringe state. Therefore, the number of trials required can be greatly reduced as compared with the feedback process associated with the syringe replacement required in the conventional apparatus, and the pressure parameter feedback process at the time of syringe replacement can be easily performed. it can.

  The paste coating apparatus of the present invention has an effect that it is possible to easily perform a feedback process of coating condition parameters at the time of syringe replacement, and is useful in the field of bonding a semiconductor device to a package substrate.

DESCRIPTION OF SYMBOLS 1 Die bonding apparatus 1A Paste application | coating mechanism part 1B Bonding mechanism part 2 Substrate positioning mechanism 3 Substrate 3a Unit substrate 4 Component supply part 6A 1st part 6B 2nd part 6C 3rd part 8 Trial strike stage 9 Nozzle height detection part 10 Application | coating Head 12A First syringe 12B Second syringe 13A First pneumatic unit 13B Second pneumatic unit 14 Camera 15 Bonding head 18 Paste 19 Application nozzle 21A First syringe mounting part 21B Second syringe mounting part 31 First application target part 31a First application pattern 32 Second application target portion 32a Second application pattern 33 Third application target portion 33a Third application pattern 50 Display screen

Claims (5)

A paste application device for applying the paste to an application target set on a substrate by discharging the paste for joining electronic components stored in a syringe from an application nozzle connected to the syringe by air pressure,
A pressure parameter storage unit that stores a standard pressure parameter corresponding to a standard air pressure value suitable for an application pattern of the application target part and an offset pressure parameter corresponding to a correction value of the air pressure value;
A paste application mechanism for supplying air pressure based on the standard pressure parameter and the offset pressure parameter to the syringe, thereby discharging the paste in the syringe from the application nozzle and applying it to the application target part;
Inspection means for inspecting the quality of the application state of the paste by imaging the paste applied by the paste application mechanism;
An application control unit that controls the paste application mechanism and performs a feedback process for adjusting the offset pressure parameter based on an inspection result by the inspection unit;
The machine operator inputs on the display screen that the syringe has been newly replaced, and includes a syringe replacement processing unit that executes a predetermined process associated with the syringe replacement.
The said syringe replacement | exchange process part resets the said offset pressure parameter to a default value in the said predetermined process, The paste coating device characterized by the above-mentioned.   The syringe replacement processing unit performs a teaching process for teaching a reference position of the application nozzle and / or a trial application / inspection process for inspecting the quality of the applied state of the paste by imaging the paste applied by the paste application mechanism. The paste coating apparatus according to claim 1, further comprising a post-syringe replacement process.   The syringe replacement processing unit displays an operation procedure for executing the syringe replacement post-processing on the display screen, and a machine operator inputs an operation according to the operation procedure to execute the syringe replacement post-processing. The paste application apparatus according to claim 2, wherein the apparatus is a paste application apparatus. In the pressure parameter storage unit, the standard pressure parameter and the offset pressure parameter are set for each of the plurality of application patterns,
The paste application device according to any one of claims 1 to 3, wherein the syringe replacement processing unit collectively resets the plurality of offset pressure parameters. The paste application mechanism includes a plurality of syringe attachment units for attaching the syringes, and in addition to the standard pressure parameter and the offset pressure parameter, the pressure parameter storage unit is provided with a syringe used for application of the application pattern. Mounting portion specifying data for specifying a syringe mounting portion is set for each of the plurality of application patterns,
In the data reset process, the plurality of offset pressure parameters related to the application pattern corresponding to the same mounting part specifying data as the mounting part specifying data of the syringe mounting part in which the syringe for replacement is mounted is collectively reset. The paste coating apparatus according to claim 1, wherein the paste coating apparatus is characterized in that:

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