KR100303617B1 - 페이스트도포기 - Google Patents
페이스트도포기 Download PDFInfo
- Publication number
- KR100303617B1 KR100303617B1 KR1019990008747A KR19990008747A KR100303617B1 KR 100303617 B1 KR100303617 B1 KR 100303617B1 KR 1019990008747 A KR1019990008747 A KR 1019990008747A KR 19990008747 A KR19990008747 A KR 19990008747A KR 100303617 B1 KR100303617 B1 KR 100303617B1
- Authority
- KR
- South Korea
- Prior art keywords
- paste
- substrate
- nozzle
- application
- speed
- Prior art date
Links
- 238000000576 coating method Methods 0.000 title abstract description 78
- 239000011248 coating agent Substances 0.000 title abstract description 77
- 239000000758 substrate Substances 0.000 claims abstract description 149
- 230000001965 increasing effect Effects 0.000 claims abstract description 17
- 238000000034 method Methods 0.000 claims description 40
- 230000008569 process Effects 0.000 claims description 27
- 238000007599 discharging Methods 0.000 claims description 4
- 238000004088 simulation Methods 0.000 abstract description 36
- 238000012545 processing Methods 0.000 description 21
- 230000008859 change Effects 0.000 description 19
- 238000001179 sorption measurement Methods 0.000 description 18
- 238000003860 storage Methods 0.000 description 17
- 238000005259 measurement Methods 0.000 description 12
- 238000006243 chemical reaction Methods 0.000 description 5
- 238000012937 correction Methods 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 5
- 238000006073 displacement reaction Methods 0.000 description 4
- 230000003247 decreasing effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 230000003028 elevating effect Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Coating Apparatus (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10-67188 | 1998-03-17 | ||
| JP06718898A JP3492190B2 (ja) | 1998-03-17 | 1998-03-17 | ペースト塗布方法とペースト塗布機 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR19990077916A KR19990077916A (ko) | 1999-10-25 |
| KR100303617B1 true KR100303617B1 (ko) | 2001-09-24 |
Family
ID=13337686
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019990008747A KR100303617B1 (ko) | 1998-03-17 | 1999-03-16 | 페이스트도포기 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP3492190B2 (ja) |
| KR (1) | KR100303617B1 (ja) |
| TW (1) | TW408041B (ja) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4277428B2 (ja) * | 2000-07-18 | 2009-06-10 | パナソニック株式会社 | ボンディングペーストの塗布装置および塗布方法 |
| JP3619791B2 (ja) * | 2001-06-26 | 2005-02-16 | 株式会社 日立インダストリイズ | ペースト塗布機 |
| JP2003031642A (ja) * | 2001-07-16 | 2003-01-31 | Shibaura Mechatronics Corp | 基板搬送装置、それを用いたペースト塗布装置、及びペースト塗布方法 |
| KR100652045B1 (ko) | 2001-12-21 | 2006-11-30 | 엘지.필립스 엘시디 주식회사 | 액정표시소자 및 그 제조방법 |
| KR100672641B1 (ko) | 2002-02-20 | 2007-01-23 | 엘지.필립스 엘시디 주식회사 | 액정표시소자 및 그 제조방법 |
| JP4210139B2 (ja) | 2002-03-23 | 2009-01-14 | エルジー ディスプレイ カンパニー リミテッド | スペーサの高さによって液晶の滴下量調整が可能である液晶滴下装置及びその滴下方法 |
| KR100618578B1 (ko) | 2002-12-20 | 2006-08-31 | 엘지.필립스 엘시디 주식회사 | 액정 표시패널의 디스펜서 및 이를 이용한 디스펜싱 방법 |
| KR100996576B1 (ko) | 2003-05-09 | 2010-11-24 | 주식회사 탑 엔지니어링 | 액정적하장치 및 액정적하방법 |
| KR100696933B1 (ko) * | 2006-05-25 | 2007-03-20 | 주식회사 탑 엔지니어링 | 페이스트 도포기를 위한 페이스트 모의 도포 장치 및 방법 |
| KR101025215B1 (ko) * | 2008-08-08 | 2011-03-31 | 주식회사 탑 엔지니어링 | 기판의 리페어구간 설정방법 |
| KR101023949B1 (ko) * | 2008-08-08 | 2011-03-28 | 주식회사 탑 엔지니어링 | 기판검사정보를 이용한 디스펜서의 페이스트 도포 방법 |
| JP5387149B2 (ja) * | 2009-06-04 | 2014-01-15 | パナソニック株式会社 | ペースト塗布装置、電子部品接合装置、ペースト塗布方法及び電子部品接合方法 |
| CN101927223B (zh) * | 2009-06-23 | 2013-02-06 | 芝浦机械电子装置股份有限公司 | 糊料涂敷装置以及糊料涂敷方法 |
| KR20110028778A (ko) * | 2009-09-14 | 2011-03-22 | 주식회사 탑 엔지니어링 | 페이스트 도포방법 |
| KR101175284B1 (ko) * | 2009-09-15 | 2012-08-21 | 주식회사 탑 엔지니어링 | 페이스트 디스펜서 및 그 제어방법 |
| JP5630050B2 (ja) * | 2010-03-26 | 2014-11-26 | パナソニック株式会社 | ペースト塗布装置 |
| JP5666195B2 (ja) * | 2010-08-10 | 2015-02-12 | 株式会社日立ハイテクインスツルメンツ | ダイボンダ及び半導体製造方法 |
-
1998
- 1998-03-17 JP JP06718898A patent/JP3492190B2/ja not_active Expired - Fee Related
-
1999
- 1999-02-24 TW TW088102789A patent/TW408041B/zh not_active IP Right Cessation
- 1999-03-16 KR KR1019990008747A patent/KR100303617B1/ko not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TW408041B (en) | 2000-10-11 |
| KR19990077916A (ko) | 1999-10-25 |
| JPH11262712A (ja) | 1999-09-28 |
| JP3492190B2 (ja) | 2004-02-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E701 | Decision to grant or registration of patent right | ||
| GRNT | Written decision to grant | ||
| FPAY | Annual fee payment |
Payment date: 20100702 Year of fee payment: 10 |
|
| LAPS | Lapse due to unpaid annual fee |