TW373074B - Test probe for semiconductor devices, method of manufacturing of the same, and member for removing foreign matter - Google Patents

Test probe for semiconductor devices, method of manufacturing of the same, and member for removing foreign matter

Info

Publication number
TW373074B
TW373074B TW087112002A TW87112002A TW373074B TW 373074 B TW373074 B TW 373074B TW 087112002 A TW087112002 A TW 087112002A TW 87112002 A TW87112002 A TW 87112002A TW 373074 B TW373074 B TW 373074B
Authority
TW
Taiwan
Prior art keywords
test probe
pad
semiconductor
probe
front portion
Prior art date
Application number
TW087112002A
Other languages
English (en)
Inventor
Shigeki Maekawa
Mogumi Takemoto
Yoshihiro Kashiba
Kazunobu Miki
Mutsumi Kano
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP03842998A external-priority patent/JP3238659B2/ja
Priority claimed from JP03843098A external-priority patent/JP3279246B2/ja
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Application granted granted Critical
Publication of TW373074B publication Critical patent/TW373074B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
TW087112002A 1997-07-24 1998-07-23 Test probe for semiconductor devices, method of manufacturing of the same, and member for removing foreign matter TW373074B (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP19853497 1997-07-24
JP24849397 1997-09-12
JP03842998A JP3238659B2 (ja) 1997-07-24 1998-02-20 プローブ先端付着異物の除去部材および除去部材の製造方法
JP03843098A JP3279246B2 (ja) 1997-09-12 1998-02-20 半導体装置のテスト用プローブ針とその製造方法、このプローブ針を用いたプローブ装置、このプローブ針による半導体装置のテスト方法、およびこのプローブ針によりテストされた半導体装置

Publications (1)

Publication Number Publication Date
TW373074B true TW373074B (en) 1999-11-01

Family

ID=27460602

Family Applications (1)

Application Number Title Priority Date Filing Date
TW087112002A TW373074B (en) 1997-07-24 1998-07-23 Test probe for semiconductor devices, method of manufacturing of the same, and member for removing foreign matter

Country Status (6)

Country Link
US (2) US6646455B2 (zh)
EP (3) EP1621893B1 (zh)
KR (1) KR100276422B1 (zh)
CN (1) CN1166957C (zh)
DE (3) DE69837690T2 (zh)
TW (1) TW373074B (zh)

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US9833818B2 (en) 2004-09-28 2017-12-05 International Test Solutions, Inc. Working surface cleaning system and method
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CN101158700B (zh) * 2006-10-08 2011-09-28 上海华虹Nec电子有限公司 探针卡
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US8723546B2 (en) 2007-10-19 2014-05-13 Microprobe, Inc. Vertical guided layered probe
JP5378411B2 (ja) * 2008-01-10 2013-12-25 エシコン・インコーポレイテッド タングステン合金縫合針
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JP5789634B2 (ja) * 2012-05-14 2015-10-07 株式会社荏原製作所 ワークピースを研磨するための研磨パッド並びに化学機械研磨装置、および該化学機械研磨装置を用いてワークピースを研磨する方法
CN104251935B (zh) * 2013-06-26 2018-03-06 中芯国际集成电路制造(上海)有限公司 测量晶圆电阻率的装置及方法
DE102013010934A1 (de) * 2013-06-29 2015-01-15 Feinmetall Gmbh Prüfvorrichtung zur elektrischen Prüfung eines elektrischen Prüflings
JP6525620B2 (ja) * 2015-02-05 2019-06-05 キヤノン株式会社 液体吐出ヘッド用基板の製造方法
CN105092908B (zh) * 2015-06-04 2017-11-14 合肥京东方光电科技有限公司 一种测试探针和测试装置
JP6407128B2 (ja) * 2015-11-18 2018-10-17 三菱電機株式会社 半導体装置の評価装置および半導体装置の評価方法
US9935024B2 (en) 2016-04-28 2018-04-03 Taiwan Semiconductor Manufacturing Co., Ltd. Method for forming semiconductor structure
US9825000B1 (en) 2017-04-24 2017-11-21 International Test Solutions, Inc. Semiconductor wire bonding machine cleaning device and method
US11155428B2 (en) 2018-02-23 2021-10-26 International Test Solutions, Llc Material and hardware to automatically clean flexible electronic web rolls
US10792713B1 (en) 2019-07-02 2020-10-06 International Test Solutions, Inc. Pick and place machine cleaning system and method
US11756811B2 (en) 2019-07-02 2023-09-12 International Test Solutions, Llc Pick and place machine cleaning system and method
US11211242B2 (en) 2019-11-14 2021-12-28 International Test Solutions, Llc System and method for cleaning contact elements and support hardware using functionalized surface microfeatures
US11318550B2 (en) 2019-11-14 2022-05-03 International Test Solutions, Llc System and method for cleaning wire bonding machines using functionalized surface microfeatures
US11035898B1 (en) 2020-05-11 2021-06-15 International Test Solutions, Inc. Device and method for thermal stabilization of probe elements using a heat conducting wafer
JP7497629B2 (ja) * 2020-07-03 2024-06-11 富士電機株式会社 半導体チップの試験装置および試験方法
CN114414862B (zh) * 2020-11-28 2023-03-14 法特迪精密科技（苏州）有限公司 测试探针清洁方法的粘性吸附方法
CN113009324B (zh) * 2021-05-24 2021-08-03 中国电子科技集团公司第二十九研究所 一种曲面多探针测试治具
KR102409029B1 (ko) * 2022-04-12 2022-06-14 이시훈 프로브 핀

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Also Published As

Publication number Publication date
CN1166957C (zh) 2004-09-15
EP0893695A2 (en) 1999-01-27
DE69832110D1 (de) 2005-12-01
EP1621893A1 (en) 2006-02-01
KR19990014174A (ko) 1999-02-25
KR100276422B1 (ko) 2001-01-15
US6888344B2 (en) 2005-05-03
US6646455B2 (en) 2003-11-11
DE69837690T2 (de) 2007-12-27
DE69832110T2 (de) 2006-07-20
EP1351060A2 (en) 2003-10-08
DE69832010D1 (de) 2005-12-01
EP0893695A3 (en) 2000-12-06
EP1621893B1 (en) 2007-04-25
DE69837690D1 (de) 2007-06-06
EP0893695B1 (en) 2005-10-26
CN1213083A (zh) 1999-04-07
EP1351060A3 (en) 2004-02-04
DE69832010T2 (de) 2006-07-13
US20030090280A1 (en) 2003-05-15
US20020097060A1 (en) 2002-07-25
EP1351060B1 (en) 2005-10-26

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