ATE371196T1 - Vorrichtung für eine schnittstelle zwischen elektronischen gehäusen und testgeräten - Google Patents

Vorrichtung für eine schnittstelle zwischen elektronischen gehäusen und testgeräten

Info

Publication number
ATE371196T1
ATE371196T1 AT03716311T AT03716311T ATE371196T1 AT E371196 T1 ATE371196 T1 AT E371196T1 AT 03716311 T AT03716311 T AT 03716311T AT 03716311 T AT03716311 T AT 03716311T AT E371196 T1 ATE371196 T1 AT E371196T1
Authority
AT
Austria
Prior art keywords
interface
test devices
electronic housings
test apparatus
test
Prior art date
Application number
AT03716311T
Other languages
English (en)
Inventor
John Winter
Larre Nelson
John Bergeron
Lourie Sarcione
Original Assignee
Rika Denshi America Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rika Denshi America Inc filed Critical Rika Denshi America Inc
Application granted granted Critical
Publication of ATE371196T1 publication Critical patent/ATE371196T1/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Connecting Device With Holders (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing, Inspecting, Measuring Of Stereoscopic Televisions And Televisions (AREA)
AT03716311T 2002-03-05 2003-03-05 Vorrichtung für eine schnittstelle zwischen elektronischen gehäusen und testgeräten ATE371196T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US36188202P 2002-03-05 2002-03-05
US41012102P 2002-09-13 2002-09-13

Publications (1)

Publication Number Publication Date
ATE371196T1 true ATE371196T1 (de) 2007-09-15

Family

ID=27807946

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03716311T ATE371196T1 (de) 2002-03-05 2003-03-05 Vorrichtung für eine schnittstelle zwischen elektronischen gehäusen und testgeräten

Country Status (9)

Country Link
US (2) US6992496B2 (de)
EP (1) EP1488245B1 (de)
JP (1) JP3899075B2 (de)
KR (1) KR20040087341A (de)
AT (1) ATE371196T1 (de)
AU (1) AU2003220023A1 (de)
DE (1) DE60315813T2 (de)
TW (1) TWI262314B (de)
WO (1) WO2003076957A1 (de)

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JP2022079959A (ja) * 2020-11-17 2022-05-27 山一電機株式会社 検査用ソケット
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Also Published As

Publication number Publication date
EP1488245A4 (de) 2005-08-17
DE60315813D1 (de) 2007-10-04
KR20040087341A (ko) 2004-10-13
EP1488245A1 (de) 2004-12-22
TW200305028A (en) 2003-10-16
WO2003076957A1 (en) 2003-09-18
US7362114B2 (en) 2008-04-22
US20050146341A1 (en) 2005-07-07
US6992496B2 (en) 2006-01-31
EP1488245B1 (de) 2007-08-22
JP3899075B2 (ja) 2007-03-28
TWI262314B (en) 2006-09-21
US20030218472A1 (en) 2003-11-27
DE60315813T2 (de) 2008-05-21
AU2003220023A1 (en) 2003-09-22
JP2005519307A (ja) 2005-06-30

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