TW371359B - Method of inspecting semiconductor integrated circuit and semiconductor integrated circuit - Google Patents

Method of inspecting semiconductor integrated circuit and semiconductor integrated circuit

Info

Publication number
TW371359B
TW371359B TW086101565A TW86101565A TW371359B TW 371359 B TW371359 B TW 371359B TW 086101565 A TW086101565 A TW 086101565A TW 86101565 A TW86101565 A TW 86101565A TW 371359 B TW371359 B TW 371359B
Authority
TW
Taiwan
Prior art keywords
fuse
test
semiconductor integrated
integrated circuit
judged
Prior art date
Application number
TW086101565A
Other languages
English (en)
Inventor
Hiroshi Akamatsu
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Application granted granted Critical
Publication of TW371359B publication Critical patent/TW371359B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/02—Detection or location of defective auxiliary circuits, e.g. defective refresh counters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54433—Marks applied to semiconductor devices or parts containing identification or tracking information
    • H01L2223/5444—Marks applied to semiconductor devices or parts containing identification or tracking information for electrical read out
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • For Increasing The Reliability Of Semiconductor Memories (AREA)
  • Dram (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
TW086101565A 1996-10-22 1997-02-12 Method of inspecting semiconductor integrated circuit and semiconductor integrated circuit TW371359B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8279366A JPH10125742A (ja) 1996-10-22 1996-10-22 半導体集積回路の良否判定方法及び半導体集積回路

Publications (1)

Publication Number Publication Date
TW371359B true TW371359B (en) 1999-10-01

Family

ID=17610163

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086101565A TW371359B (en) 1996-10-22 1997-02-12 Method of inspecting semiconductor integrated circuit and semiconductor integrated circuit

Country Status (6)

Country Link
US (1) US5768290A (zh)
JP (1) JPH10125742A (zh)
KR (1) KR100233978B1 (zh)
CN (1) CN1143321C (zh)
DE (1) DE19723262A1 (zh)
TW (1) TW371359B (zh)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6258609B1 (en) 1996-09-30 2001-07-10 Micron Technology, Inc. Method and system for making known good semiconductor dice
US6119252A (en) * 1998-02-10 2000-09-12 Micron Technology Integrated circuit test mode with externally forced reference voltage
JP2000029546A (ja) * 1998-07-09 2000-01-28 Mitsubishi Electric Corp 半導体集積回路装置
US6424161B2 (en) * 1998-09-03 2002-07-23 Micron Technology, Inc. Apparatus and method for testing fuses
US6157583A (en) * 1999-03-02 2000-12-05 Motorola, Inc. Integrated circuit memory having a fuse detect circuit and method therefor
JP3844912B2 (ja) * 1999-06-10 2006-11-15 富士通株式会社 半導体記憶装置の試験方法及び試験装置と半導体記憶装置
US6352881B1 (en) 1999-07-22 2002-03-05 National Semiconductor Corporation Method and apparatus for forming an underfill adhesive layer
US6479310B1 (en) 2000-01-03 2002-11-12 Motorola, Inc. Method for testing a semiconductor integrated circuit device
US6246243B1 (en) * 2000-01-21 2001-06-12 Analog Devices, Inc. Semi-fusible link system
US6472897B1 (en) 2000-01-24 2002-10-29 Micro International Limited Circuit and method for trimming integrated circuits
DE10034878C2 (de) * 2000-07-18 2003-12-04 Infineon Technologies Ag Verfahren zum Überprüfen eines Bauelementes und Bauelement mit Testspeicher
WO2002050910A1 (fr) * 2000-12-01 2002-06-27 Hitachi, Ltd Procede d'identification de dispositif de circuit integre semi-conducteur, procede de production de dispositif de circuit integre semi-conducteur et dispositif correspondant
US6477095B2 (en) * 2000-12-28 2002-11-05 Infineon Technologies Richmond, Lp Method for reading semiconductor die information in a parallel test and burn-in system
KR100464945B1 (ko) * 2000-12-30 2005-01-05 주식회사 하이닉스반도체 내부전압 레벨 트리밍 발생 장치의 퓨즈셋 박스
KR100348102B1 (ko) * 2001-01-17 2002-08-09 삼성전자 주식회사 광학적 문자 인식을 통한 반도체 제품의 마킹 결함 검사방법
DE10108924A1 (de) * 2001-02-23 2002-09-05 Infineon Technologies Ag Wafer-Test- und Markierverfahren für Halbleiterbausteine mit Schmelzstrukturen
DE10137373B4 (de) 2001-07-31 2004-01-29 Infineon Technologies Ag Verfahren zum Ansteuern von zu steuernden Schaltungseinheiten und entsprechende Steuersignalerzeugungsvorrichtung
DE20200885U1 (de) * 2002-01-22 2003-05-28 B. Braun Melsungen Ag, 34212 Melsungen Spritzenpumpe mit Kolbenbremse
JP2003233999A (ja) 2002-02-07 2003-08-22 Hitachi Ltd 半導体集積回路及び半導体集積回路の製造方法
JP2004053257A (ja) * 2002-07-16 2004-02-19 Renesas Technology Corp 半導体故障解析装置
US7423337B1 (en) 2002-08-19 2008-09-09 National Semiconductor Corporation Integrated circuit device package having a support coating for improved reliability during temperature cycling
US6907378B2 (en) * 2002-09-26 2005-06-14 Agilent Technologies, Inc. Empirical data based test optimization method
DE10258511A1 (de) * 2002-12-14 2004-07-08 Infineon Technologies Ag Integrierte Schaltung sowie zugehörige gehäuste integrierte Schaltung
US7301222B1 (en) 2003-02-12 2007-11-27 National Semiconductor Corporation Apparatus for forming a pre-applied underfill adhesive layer for semiconductor wafer level chip-scale packages
JP2005057256A (ja) * 2003-08-04 2005-03-03 Samsung Electronics Co Ltd 漏洩電流を利用した半導体検査装置および漏洩電流補償システム
DE10342997A1 (de) * 2003-09-17 2005-04-28 Infineon Technologies Ag Elektronischer Schaltkreis, Schaltkreis-Testanordnung und Verfahren zum Ermitteln der Funktionsfähigkeit eines elektronischen Schaltkreises
US7282375B1 (en) * 2004-04-14 2007-10-16 National Semiconductor Corporation Wafer level package design that facilitates trimming and testing
US7516375B2 (en) * 2006-03-27 2009-04-07 Via Technologies, Inc. Methods and systems for repairing an integrated circuit device
JP4967532B2 (ja) * 2006-08-25 2012-07-04 富士通セミコンダクター株式会社 半導体集積回路および半導体集積回路のテスト方法
US20080238468A1 (en) * 2007-03-26 2008-10-02 Qimonda North America Corp. Integrated circuit chip and method for testing an integrated circuit chip
US7679332B2 (en) * 2007-06-23 2010-03-16 Neotec Semiconductor Ltd. Delay time control circuit in a battery protector to reduce delay time
DE112008001358T5 (de) * 2008-06-09 2010-04-15 Advantest Corp. Testgerät
CN101937835B (zh) * 2010-06-30 2011-12-21 上海华岭集成电路技术有限责任公司 熔丝类晶圆修调参数的方法
KR20120105828A (ko) * 2011-03-16 2012-09-26 삼성전자주식회사 반도체 발광다이오드 칩, 그 제조방법 및 품질관리방법
US8819511B2 (en) * 2011-12-21 2014-08-26 Advanced Micro Devices, Inc. Methods and systems for an automated test configuration to identify logic device defects
EP2706365B1 (en) * 2012-09-06 2015-03-11 Vetco Gray Controls Limited Testing a fuse
US9791502B2 (en) * 2015-04-30 2017-10-17 Globalfoundries Inc. On-chip usable life depletion meter and associated method
CN104931823B (zh) * 2015-06-08 2018-09-25 小米科技有限责任公司 电子设备的测试方法及装置
CN108398627B (zh) * 2018-02-06 2020-11-17 珠海市杰理科技股份有限公司 芯片引脚电路、芯片和芯片测试方法
KR102608306B1 (ko) * 2019-05-10 2023-12-01 에스케이하이닉스 주식회사 반도체 장치 및 이를 포함하는 반도체 메모리 장치
KR20220006951A (ko) * 2020-07-09 2022-01-18 에스케이하이닉스 주식회사 메모리 장치

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2721151B2 (ja) * 1986-04-01 1998-03-04 株式会社東芝 半導体集積回路装置
JPS63217821A (ja) * 1987-03-06 1988-09-09 Toshiba Corp 半導体集積回路
JP2688976B2 (ja) * 1989-03-08 1997-12-10 三菱電機株式会社 半導体集積回路装置
US5140554A (en) * 1990-08-30 1992-08-18 Texas Instruments Incorporated Integrated circuit fuse-link tester and test method
JPH04119600A (ja) * 1990-09-10 1992-04-21 Mitsubishi Electric Corp テストモード機能内蔵ダイナミックランダムアクセスメモリ装置
JPH0554694A (ja) * 1991-08-27 1993-03-05 Seiko Epson Corp 半導体記憶装置
JPH05188118A (ja) * 1992-01-10 1993-07-30 Hitachi Ltd 半導体集積回路及びその機能変更方法
US5455517A (en) * 1992-06-09 1995-10-03 International Business Machines Corporation Data output impedance control
JPH0676598A (ja) * 1992-08-28 1994-03-18 Mitsubishi Electric Corp 半導体記憶装置
KR0144711B1 (ko) * 1994-12-13 1998-08-17 김광호 반도체 메모리장치의 테스트 제어회로 및 방법

Also Published As

Publication number Publication date
DE19723262A1 (de) 1998-04-30
CN1143321C (zh) 2004-03-24
KR19980032076A (ko) 1998-07-25
JPH10125742A (ja) 1998-05-15
US5768290A (en) 1998-06-16
CN1180930A (zh) 1998-05-06
KR100233978B1 (ko) 1999-12-15

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