TW355176B - A method for conveying the thin plate-like substrate - Google Patents

A method for conveying the thin plate-like substrate

Info

Publication number
TW355176B
TW355176B TW086117595A TW86117595A TW355176B TW 355176 B TW355176 B TW 355176B TW 086117595 A TW086117595 A TW 086117595A TW 86117595 A TW86117595 A TW 86117595A TW 355176 B TW355176 B TW 355176B
Authority
TW
Taiwan
Prior art keywords
substrate
thin plate
hold
conveying
down pin
Prior art date
Application number
TW086117595A
Other languages
English (en)
Inventor
Masayuki Toda
Tadahiro Ohmi
Yoshio Ishihara
Original Assignee
Nippon Oxygen Co Ltd
Tadahiro Ohmi
Masayuki Toda
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Oxygen Co Ltd, Tadahiro Ohmi, Masayuki Toda filed Critical Nippon Oxygen Co Ltd
Application granted granted Critical
Publication of TW355176B publication Critical patent/TW355176B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67724—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations by means of a cart or a vehicule
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67736—Loading to or unloading from a conveyor

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)
TW086117595A 1996-11-26 1997-11-24 A method for conveying the thin plate-like substrate TW355176B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP31519396A JP3901265B2 (ja) 1996-11-26 1996-11-26 薄板状基体の搬送方法及び搬送装置

Publications (1)

Publication Number Publication Date
TW355176B true TW355176B (en) 1999-04-01

Family

ID=18062539

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086117595A TW355176B (en) 1996-11-26 1997-11-24 A method for conveying the thin plate-like substrate

Country Status (7)

Country Link
US (1) US6343239B1 (zh)
EP (1) EP0889515B1 (zh)
JP (1) JP3901265B2 (zh)
KR (1) KR100295983B1 (zh)
DE (1) DE69736224T2 (zh)
TW (1) TW355176B (zh)
WO (1) WO1998024123A1 (zh)

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CN101593716B (zh) * 2009-05-12 2011-06-29 上海微电子装备有限公司 器件传输方法及其装置
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DE69736224T2 (de) 2007-05-10
EP0889515A4 (en) 2004-10-20
KR100295983B1 (ko) 2001-08-07
JP3901265B2 (ja) 2007-04-04
WO1998024123A1 (fr) 1998-06-04
DE69736224D1 (de) 2006-08-10
KR19990081918A (ko) 1999-11-15
EP0889515B1 (en) 2006-06-28
EP0889515A1 (en) 1999-01-07
JPH10163288A (ja) 1998-06-19

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