TW284920B - - Google Patents

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Publication number
TW284920B
TW284920B TW085100624A TW85100624A TW284920B TW 284920 B TW284920 B TW 284920B TW 085100624 A TW085100624 A TW 085100624A TW 85100624 A TW85100624 A TW 85100624A TW 284920 B TW284920 B TW 284920B
Authority
TW
Taiwan
Prior art keywords
layer
metal wire
silicon carbide
amorphous silicon
patent application
Prior art date
Application number
TW085100624A
Other languages
English (en)
Chinese (zh)
Original Assignee
Dow Corning
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning filed Critical Dow Corning
Application granted granted Critical
Publication of TW284920B publication Critical patent/TW284920B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/45—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their insulating parts
    • H10W20/48—Insulating materials thereof

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
TW085100624A 1995-02-02 1996-01-24 TW284920B (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/382,701 US5818071A (en) 1995-02-02 1995-02-02 Silicon carbide metal diffusion barrier layer

Publications (1)

Publication Number Publication Date
TW284920B true TW284920B (https=) 1996-09-01

Family

ID=23510038

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085100624A TW284920B (https=) 1995-02-02 1996-01-24

Country Status (6)

Country Link
US (1) US5818071A (https=)
EP (1) EP0725440B1 (https=)
JP (1) JP3731932B2 (https=)
KR (1) KR100402187B1 (https=)
DE (1) DE69633150T2 (https=)
TW (1) TW284920B (https=)

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Also Published As

Publication number Publication date
JP3731932B2 (ja) 2006-01-05
KR960032640A (ko) 1996-09-17
DE69633150D1 (de) 2004-09-23
DE69633150T2 (de) 2005-08-18
EP0725440A2 (en) 1996-08-07
US5818071A (en) 1998-10-06
JPH08250594A (ja) 1996-09-27
EP0725440B1 (en) 2004-08-18
EP0725440A3 (en) 1997-01-29
KR100402187B1 (ko) 2004-02-11

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