FR2794286B1 - Niveau d'interconnexion de type damascene pour dispositif micro-electronique - Google Patents

Niveau d'interconnexion de type damascene pour dispositif micro-electronique

Info

Publication number
FR2794286B1
FR2794286B1 FR9906628A FR9906628A FR2794286B1 FR 2794286 B1 FR2794286 B1 FR 2794286B1 FR 9906628 A FR9906628 A FR 9906628A FR 9906628 A FR9906628 A FR 9906628A FR 2794286 B1 FR2794286 B1 FR 2794286B1
Authority
FR
France
Prior art keywords
microelectronic device
interconnection level
type interconnection
damascene type
damascene
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9906628A
Other languages
English (en)
Other versions
FR2794286A1 (fr
Inventor
Gerard Passemard
Patrick Maury
Jean Christophe Maisonobe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA filed Critical Commissariat a lEnergie Atomique CEA
Priority to FR9906628A priority Critical patent/FR2794286B1/fr
Publication of FR2794286A1 publication Critical patent/FR2794286A1/fr
Application granted granted Critical
Publication of FR2794286B1 publication Critical patent/FR2794286B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/5329—Insulating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
FR9906628A 1999-05-26 1999-05-26 Niveau d'interconnexion de type damascene pour dispositif micro-electronique Expired - Fee Related FR2794286B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR9906628A FR2794286B1 (fr) 1999-05-26 1999-05-26 Niveau d'interconnexion de type damascene pour dispositif micro-electronique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9906628A FR2794286B1 (fr) 1999-05-26 1999-05-26 Niveau d'interconnexion de type damascene pour dispositif micro-electronique

Publications (2)

Publication Number Publication Date
FR2794286A1 FR2794286A1 (fr) 2000-12-01
FR2794286B1 true FR2794286B1 (fr) 2003-06-06

Family

ID=9546002

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9906628A Expired - Fee Related FR2794286B1 (fr) 1999-05-26 1999-05-26 Niveau d'interconnexion de type damascene pour dispositif micro-electronique

Country Status (1)

Country Link
FR (1) FR2794286B1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW432546B (en) * 1999-11-25 2001-05-01 Taiwan Semiconductor Mfg Manufacturing method of copper damascene
US6737747B2 (en) 2002-01-15 2004-05-18 International Business Machines Corporation Advanced BEOL interconnect structures with low-k PE CVD cap layer and method thereof
JP4340040B2 (ja) 2002-03-28 2009-10-07 富士通マイクロエレクトロニクス株式会社 半導体装置の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5818071A (en) * 1995-02-02 1998-10-06 Dow Corning Corporation Silicon carbide metal diffusion barrier layer
US6156149A (en) * 1997-05-07 2000-12-05 Applied Materials, Inc. In situ deposition of a dielectric oxide layer and anti-reflective coating

Also Published As

Publication number Publication date
FR2794286A1 (fr) 2000-12-01

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Legal Events

Date Code Title Description
ST Notification of lapse