KR100402187B1 - 탄화규소금속확산차단층을포함하는집적회로및배선반 - Google Patents

탄화규소금속확산차단층을포함하는집적회로및배선반 Download PDF

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Publication number
KR100402187B1
KR100402187B1 KR1019960002496A KR19960002496A KR100402187B1 KR 100402187 B1 KR100402187 B1 KR 100402187B1 KR 1019960002496 A KR1019960002496 A KR 1019960002496A KR 19960002496 A KR19960002496 A KR 19960002496A KR 100402187 B1 KR100402187 B1 KR 100402187B1
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South Korea
Prior art keywords
silicon carbide
layer
integrated circuit
metal
wiring board
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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KR1019960002496A
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English (en)
Korean (ko)
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KR960032640A (ko
Inventor
존 로보다 마크
윈톤 마이클 케이스
Original Assignee
다우 코닝 코포레이션
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Publication of KR960032640A publication Critical patent/KR960032640A/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/45—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their insulating parts
    • H10W20/48—Insulating materials thereof

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  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
KR1019960002496A 1995-02-02 1996-02-02 탄화규소금속확산차단층을포함하는집적회로및배선반 Expired - Lifetime KR100402187B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/382,701 1995-02-02
US08/382701 1995-02-02
US08/382,701 US5818071A (en) 1995-02-02 1995-02-02 Silicon carbide metal diffusion barrier layer

Publications (2)

Publication Number Publication Date
KR960032640A KR960032640A (ko) 1996-09-17
KR100402187B1 true KR100402187B1 (ko) 2004-02-11

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960002496A Expired - Lifetime KR100402187B1 (ko) 1995-02-02 1996-02-02 탄화규소금속확산차단층을포함하는집적회로및배선반

Country Status (6)

Country Link
US (1) US5818071A (https=)
EP (1) EP0725440B1 (https=)
JP (1) JP3731932B2 (https=)
KR (1) KR100402187B1 (https=)
DE (1) DE69633150T2 (https=)
TW (1) TW284920B (https=)

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Also Published As

Publication number Publication date
JP3731932B2 (ja) 2006-01-05
KR960032640A (ko) 1996-09-17
TW284920B (https=) 1996-09-01
DE69633150D1 (de) 2004-09-23
DE69633150T2 (de) 2005-08-18
EP0725440A2 (en) 1996-08-07
US5818071A (en) 1998-10-06
JPH08250594A (ja) 1996-09-27
EP0725440B1 (en) 2004-08-18
EP0725440A3 (en) 1997-01-29

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