TW201614367A - Pellicle, pellicle production method and exposure method using pellicle - Google Patents

Pellicle, pellicle production method and exposure method using pellicle

Info

Publication number
TW201614367A
TW201614367A TW104130869A TW104130869A TW201614367A TW 201614367 A TW201614367 A TW 201614367A TW 104130869 A TW104130869 A TW 104130869A TW 104130869 A TW104130869 A TW 104130869A TW 201614367 A TW201614367 A TW 201614367A
Authority
TW
Taiwan
Prior art keywords
pellicle
frame body
pellicle film
production method
filter
Prior art date
Application number
TW104130869A
Other languages
English (en)
Other versions
TWI693466B (zh
Inventor
Kazuo Kohmura
Daiki Taneichi
Takashi Kozeki
Yosuke Ono
Hisako Ishikawa
Tsuneaki BIYAJIMA
Atsushi Okubo
Yasuyuki Sato
Toshiaki Hirota
Original Assignee
Mitsui Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Chemicals Inc filed Critical Mitsui Chemicals Inc
Publication of TW201614367A publication Critical patent/TW201614367A/zh
Application granted granted Critical
Publication of TWI693466B publication Critical patent/TWI693466B/zh

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • G03F1/64Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof characterised by the frames, e.g. structure or material, including bonding means therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/66Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • G03F7/2002Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2008Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the reflectors, diffusers, light or heat filtering means or anti-reflective means used
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7095Materials, e.g. materials for housing, stage or other support having particular properties, e.g. weight, strength, conductivity, thermal expansion coefficient
    • G03F7/70958Optical materials or coatings, e.g. with particular transmittance, reflectance or anti-reflection properties
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
TW104130869A 2014-09-19 2015-09-18 防塵薄膜、防塵薄膜的製造方法及使用防塵薄膜的曝光方法 TWI693466B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-192007 2014-09-19
JP2014192007 2014-09-19

Publications (2)

Publication Number Publication Date
TW201614367A true TW201614367A (en) 2016-04-16
TWI693466B TWI693466B (zh) 2020-05-11

Family

ID=55533337

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104130869A TWI693466B (zh) 2014-09-19 2015-09-18 防塵薄膜、防塵薄膜的製造方法及使用防塵薄膜的曝光方法

Country Status (8)

Country Link
US (1) US10585348B2 (zh)
EP (1) EP3196700B1 (zh)
JP (1) JP6367342B2 (zh)
KR (1) KR101910302B1 (zh)
CN (1) CN106796391B (zh)
SG (1) SG11201701802SA (zh)
TW (1) TWI693466B (zh)
WO (1) WO2016043301A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI797292B (zh) * 2018-03-27 2023-04-01 日商三井化學股份有限公司 支持框、防塵薄膜及曝光原版、及使用上述的曝光裝置、以及半導體裝置的製造方法

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016043301A1 (ja) 2014-09-19 2016-03-24 三井化学株式会社 ペリクル、ペリクルの製造方法及びペリクルを用いた露光方法
SG11201701805QA (en) * 2014-09-19 2017-04-27 Mitsui Chemicals Inc Pellicle, production method thereof, exposure method
WO2017179199A1 (ja) * 2016-04-15 2017-10-19 凸版印刷株式会社 ペリクル
JP6732019B2 (ja) * 2016-06-28 2020-07-29 三井化学株式会社 ペリクル膜、ペリクル枠体、ペリクル、及びその製造方法
CN109416503B (zh) 2016-07-05 2023-06-09 三井化学株式会社 防护膜、防护膜组件框体、防护膜组件、其制造方法、曝光原版、曝光装置、半导体装置的制造方法
WO2018151056A1 (ja) * 2017-02-17 2018-08-23 三井化学株式会社 ペリクル、露光原版、露光装置、及び半導体装置の製造方法
JP2018200380A (ja) * 2017-05-26 2018-12-20 日本特殊陶業株式会社 ペリクル枠及びその製造方法
US11143952B2 (en) * 2017-09-28 2021-10-12 Taiwan Semiconductor Manufacturing Company, Ltd. Pellicle removal method
JP7357432B2 (ja) 2017-10-10 2023-10-06 信越化学工業株式会社 Euv用ペリクルフレーム、ペリクル、ペリクル付露光原版、露光方法、及び半導体の製造方法
EP3764161A4 (en) * 2018-03-05 2021-12-01 Mitsui Chemicals, Inc. PELLICLE, EXPOSURE MASTER, EXPOSURE DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR COMPONENT
KR102099872B1 (ko) 2018-05-25 2020-05-28 주식회사 에프에스티 펠리클용 벤트 필터 및 이를 포함하는 펠리클
KR102459119B1 (ko) * 2018-06-12 2022-10-26 미쯔이가가꾸가부시끼가이샤 펠리클용 지지 프레임, 펠리클 및 펠리클용 지지 프레임의 제조 방법, 그리고 펠리클을 사용한 노광 원판 및 노광 장치
TWI687760B (zh) * 2019-04-16 2020-03-11 家登精密工業股份有限公司 具有擾流結構的光罩盒
KR102207853B1 (ko) 2019-06-27 2021-01-27 주식회사 에프에스티 펠리클용 벤트 필터 및 이를 포함하는 펠리클
US11347143B2 (en) * 2019-09-30 2022-05-31 Taiwan Semiconductor Manufacturing Company Ltd. Cleaning method, method for forming semiconductor structure and system thereof
KR102530226B1 (ko) * 2020-10-28 2023-05-09 주식회사 에프에스티 극자외선 리소그라피용 펠리클 프레임 및 그 제조방법
KR20220142571A (ko) * 2021-04-14 2022-10-24 한국전자기술연구원 극자외선 노광용 펠리클

Family Cites Families (63)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4939703U (zh) 1972-07-08 1974-04-08
JPS60147737A (ja) * 1984-01-13 1985-08-03 Hitachi Ltd ペリクルホルダ
JPS6141255U (ja) 1984-08-20 1986-03-15 株式会社ニコン マスク保護装置
JPS6344824Y2 (zh) * 1985-02-28 1988-11-21
JPH0262542A (ja) 1988-08-29 1990-03-02 Shin Etsu Chem Co Ltd エキシマレーザーリソグラフィー用ペリクル
JPH0342153A (ja) 1989-07-10 1991-02-22 Hitachi Ltd 薄板鋳片連続鋳造機
JPH0342153U (zh) * 1989-08-31 1991-04-22
JPH0493945A (ja) * 1990-08-07 1992-03-26 Seiko Epson Corp フォトマスク
JPH05107747A (ja) 1991-10-18 1993-04-30 Seiko Epson Corp フオトマスク及び半導体装置の製造方法
JPH05113658A (ja) 1991-10-21 1993-05-07 Seiko Epson Corp フオトマスク及び半導体装置の製造方法
US5604955A (en) 1994-06-10 1997-02-25 Graphic Controls Corporation Surgical lighting fixture cover
JP3529062B2 (ja) * 1994-10-07 2004-05-24 株式会社渡辺商行 ペリクル及びレチクル
JPH1048812A (ja) 1996-08-07 1998-02-20 Mitsui Petrochem Ind Ltd マスク保護装置と、その支持構造
JP2000292909A (ja) * 1999-04-09 2000-10-20 Shin Etsu Chem Co Ltd ペリクルおよびペリクルの製造方法
US6300019B1 (en) 1999-10-13 2001-10-09 Oki Electric Industry Co., Ltd. Pellicle
JP2001133960A (ja) 1999-11-08 2001-05-18 Shin Etsu Chem Co Ltd リソグラフィー用ペリクル及びペリクルの使用方法
JP2001312048A (ja) 2000-04-28 2001-11-09 Mitsui Chemicals Inc ペリクル
JP2002107914A (ja) * 2000-10-02 2002-04-10 Asahi Glass Co Ltd ペリクルおよびペリクルの装着方法
JP2002107915A (ja) 2000-10-02 2002-04-10 Asahi Glass Co Ltd ペリクルおよびペリクル板とペリクルフレームとの固定方法
US6524754B2 (en) 2001-01-22 2003-02-25 Photronics, Inc. Fused silica pellicle
US6593035B1 (en) * 2001-01-26 2003-07-15 Advanced Micro Devices, Inc. Pellicle for use in small wavelength lithography and a method for making such a pellicle using polymer films
JP2002323752A (ja) * 2001-04-24 2002-11-08 Asahi Glass Co Ltd ペリクル
JP2003107678A (ja) 2001-09-27 2003-04-09 Mitsui Chemicals Inc ペリクル
KR20030041811A (ko) * 2001-11-21 2003-05-27 아사히 가라스 가부시키가이샤 페리클의 포토마스크에 대한 장착구조
JP2004258113A (ja) * 2003-02-24 2004-09-16 Nikon Corp マスク保護装置、マスク、ガス置換装置、露光装置、ガス置換方法及び露光方法
JP2004294786A (ja) * 2003-03-27 2004-10-21 Semiconductor Leading Edge Technologies Inc ペリクル
JP2004354720A (ja) * 2003-05-29 2004-12-16 Semiconductor Leading Edge Technologies Inc マスク用ペリクル
JP2005019822A (ja) * 2003-06-27 2005-01-20 Asahi Glass Co Ltd マスク保護装置及びマスク保護装置の製造方法、並びにマスク
US20050042524A1 (en) * 2003-08-22 2005-02-24 Bellman Robert A. Process for making hard pellicles
JP2005250188A (ja) * 2004-03-05 2005-09-15 Asahi Glass Co Ltd ペリクル
JP2006060037A (ja) * 2004-08-20 2006-03-02 Canon Inc 露光装置
JP4478558B2 (ja) 2004-12-08 2010-06-09 大日本印刷株式会社 大型ペリクルの搬送方法、搬送用治具及びペリクルケース
JP5454136B2 (ja) * 2007-03-01 2014-03-26 株式会社ニコン ペリクルフレーム装置、マスク、レチクル装置、露光方法及び露光装置並びにデバイスの製造方法
US8018578B2 (en) * 2007-04-19 2011-09-13 Asml Netherlands B.V. Pellicle, lithographic apparatus and device manufacturing method
CN102681334B (zh) 2007-07-06 2015-09-30 旭化成电子材料株式会社 从容纳容器取出大型表膜构件的取出方法
US7829248B2 (en) * 2007-07-24 2010-11-09 Taiwan Semiconductor Manufacturing Company, Ltd. Pellicle stress relief
JP4928494B2 (ja) * 2008-05-02 2012-05-09 信越化学工業株式会社 ペリクルおよびペリクルの製造方法
JP4934099B2 (ja) * 2008-05-22 2012-05-16 信越化学工業株式会社 ペリクルおよびペリクルの製造方法
JP4903829B2 (ja) * 2009-04-02 2012-03-28 信越化学工業株式会社 リソグラフィ用ペリクル
JP5142297B2 (ja) * 2009-06-19 2013-02-13 信越化学工業株式会社 ペリクル
JP5047232B2 (ja) 2009-06-26 2012-10-10 信越化学工業株式会社 ペリクル
JP5479868B2 (ja) 2009-12-02 2014-04-23 旭化成イーマテリアルズ株式会社 ペリクル及びその取付方法
JP5033891B2 (ja) * 2010-02-23 2012-09-26 信越化学工業株式会社 ペリクル膜の製造方法
KR102068146B1 (ko) 2010-06-25 2020-01-20 에이에스엠엘 네델란즈 비.브이. 리소그래피 장치 및 방법
JP2012093595A (ja) 2010-10-28 2012-05-17 Shin Etsu Chem Co Ltd ペリクルフレームおよびペリクル
JP2012151158A (ja) 2011-01-17 2012-08-09 Shin Etsu Chem Co Ltd Euv用ペリクル膜及びペリクル、並びに該膜の製造方法
JP5279862B2 (ja) 2011-03-31 2013-09-04 信越化学工業株式会社 ペリクル膜、その製造方法及び該膜を張ったペリクル
KR20130067325A (ko) * 2011-10-07 2013-06-24 삼성전자주식회사 버퍼 존을 가진 펠리클 및 펠리클이 장착된 포토마스크 구조체
KR101303795B1 (ko) 2011-12-26 2013-09-04 주식회사 에프에스티 초극자외선용 펠리클 및 그 제조방법
JP5711703B2 (ja) * 2012-09-03 2015-05-07 信越化学工業株式会社 Euv用ペリクル
JP5854511B2 (ja) 2012-10-16 2016-02-09 信越化学工業株式会社 ペリクルおよびペリクルの貼付け方法
JP2014160752A (ja) 2013-02-20 2014-09-04 Asahi Glass Co Ltd Euvリソグラフィ用反射型マスクブランクおよび該マスクブランク用反射層付基板
JP6008784B2 (ja) 2013-04-15 2016-10-19 信越化学工業株式会社 ペリクルフレーム及びその製作方法とペリクル
CN103246157A (zh) * 2013-05-21 2013-08-14 上海和辉光电有限公司 防尘薄膜框架、光学掩膜版及其安装方法
KR101707763B1 (ko) 2013-05-24 2017-02-16 미쯔이가가꾸가부시끼가이샤 펠리클 및 이것을 포함하는 euv 노광 장치
US9140975B2 (en) * 2013-12-13 2015-09-22 Globalfoundries Inc. EUV pellicle frame with holes and method of forming
WO2015166927A1 (ja) * 2014-05-02 2015-11-05 三井化学株式会社 ペリクル枠、ペリクル及びその製造方法、露光原版及びその製造方法、露光装置、並びに半導体装置の製造方法
JP6423730B2 (ja) * 2014-05-26 2018-11-14 三井化学株式会社 ペリクル用の支持枠
SG11201701805QA (en) * 2014-09-19 2017-04-27 Mitsui Chemicals Inc Pellicle, production method thereof, exposure method
WO2016043301A1 (ja) 2014-09-19 2016-03-24 三井化学株式会社 ペリクル、ペリクルの製造方法及びペリクルを用いた露光方法
SG11201705304PA (en) * 2015-02-24 2017-07-28 Mitsui Chemicals Inc Pellicle film, pellicle frame, and pellicle and method for producing same
EP3079013B1 (en) * 2015-03-30 2018-01-24 Shin-Etsu Chemical Co., Ltd. Pellicle
EP3291006A4 (en) * 2015-04-27 2019-01-23 Mitsui Chemicals, Inc. PELLIC MANUFACTURING METHOD AND METHOD FOR PRODUCING A PHOTOMASK WITH PELLICLES

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI797292B (zh) * 2018-03-27 2023-04-01 日商三井化學股份有限公司 支持框、防塵薄膜及曝光原版、及使用上述的曝光裝置、以及半導體裝置的製造方法

Also Published As

Publication number Publication date
JP6367342B2 (ja) 2018-08-01
CN106796391B (zh) 2020-02-11
WO2016043301A1 (ja) 2016-03-24
EP3196700B1 (en) 2019-01-30
SG11201701802SA (en) 2017-04-27
KR20170038910A (ko) 2017-04-07
US20170184957A1 (en) 2017-06-29
CN106796391A (zh) 2017-05-31
EP3196700A1 (en) 2017-07-26
KR101910302B1 (ko) 2018-10-19
EP3196700A4 (en) 2018-06-20
TWI693466B (zh) 2020-05-11
JPWO2016043301A1 (ja) 2017-06-29
US10585348B2 (en) 2020-03-10

Similar Documents

Publication Publication Date Title
TW201614367A (en) Pellicle, pellicle production method and exposure method using pellicle
TW201612622A (en) Pellicle, production method thereof, exposure method
EP3477387A4 (en) PELLICLE FILM, PELLICLE FRAME BODY, PELLICLE AND METHOD FOR PRODUCING PELLICLES
TWI563348B (en) Extreme ultraviolet radiation source, extreme ultraviolet lithography system, and extreme ultraviolet lithography process
SG11201608777TA (en) Pellicle frame, pellicle and method of manufacturing the same,original plate for exposure and method of manufacturing thesame, exposure device, and method of manufacturingsemiconductor device
EP4286941A3 (en) Pellicle attachment apparatus
EP3133442A4 (en) Pellicle film, pellicle, exposure master, exposure device, and method for manufacturing semiconductor device
PL3007901T3 (pl) Proces drukowania przy użyciu miękkich klisz fotopolimerowych
EP3481562A4 (en) MODELING NANOSTRUCTURES USING PRINT LITHOGRAPHY
SG11201609095VA (en) Material for forming film for lithography, composition for forming film for lithography, film for lithography, pattern forming method and purification method
EP3264175A4 (en) Pellicle film, pellicle frame, and pellicle and method for producing same
PL3234696T3 (pl) Sposób wytwarzania form fleksograficznych poprzez wielokrotne naświetlanie za pomocą diod UV-LED
SG11201708585SA (en) Method for producing pellicle, and method for producing pellicle-attached photomask
EP3217221A4 (en) Pellicle support frame and production method
IL266851A (en) Designing optical layers in lithography processes with a stamp
SG11201604509UA (en) Imprint lithography template and method for zero-gap imprinting
IL273853A (en) Configuration of optical layers in lithographic imprinting processes
EP3202586A4 (en) Lithographic printing plate master, manufacturing method therefor, and printing method using same
EP3128369A4 (en) Photosensitive resin composition, lithographic printing original plate and method for producing lithographic printing plate
EP3151065A4 (en) Support frame for pellicles
IL249046A0 (en) Lithographic device and exposure method
EP3339955A4 (en) EXTRACTION SHEET FRAME, EXTRACTION EMULSION LAYER THEREWITH, METHOD FOR PRODUCING THE EXTRACTION MEMBRANE LAYER FRAME AND METHOD FOR PRODUCING THE EXTRACTION EMULSION LAYER
IL239577A0 (en) Correction of variation in critical dimension in extreme ultraviolet lithography
EP3254304A4 (en) Method and system for imaging of a photomask through a pellicle
IL247013B (en) Stage positioning system and lithographic device