TW201232784A - Staggered thin film transistor and method of forming the same - Google Patents

Staggered thin film transistor and method of forming the same Download PDF

Info

Publication number
TW201232784A
TW201232784A TW100129784A TW100129784A TW201232784A TW 201232784 A TW201232784 A TW 201232784A TW 100129784 A TW100129784 A TW 100129784A TW 100129784 A TW100129784 A TW 100129784A TW 201232784 A TW201232784 A TW 201232784A
Authority
TW
Taiwan
Prior art keywords
layer
copper
oxide
thin film
film transistor
Prior art date
Application number
TW100129784A
Other languages
English (en)
Chinese (zh)
Inventor
Fabio Pieralisi
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of TW201232784A publication Critical patent/TW201232784A/zh

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/674Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6755Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/01Manufacture or treatment
    • H10D30/021Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/031Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6729Thin-film transistors [TFT] characterised by the electrodes
    • H10D30/6737Thin-film transistors [TFT] characterised by the electrodes characterised by the electrode materials
    • H10D30/6739Conductor-insulator-semiconductor electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/60Electrodes characterised by their materials
    • H10D64/62Electrodes ohmically coupled to a semiconductor
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00Subject matter not provided for in other groups of this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00Interconnections in chips, wafers or substrates
    • H10W20/40Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/41Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
    • H10W20/425Barrier, adhesion or liner layers

Landscapes

  • Thin Film Transistor (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Formation Of Insulating Films (AREA)
TW100129784A 2010-09-03 2011-08-19 Staggered thin film transistor and method of forming the same TW201232784A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP10175294A EP2426720A1 (en) 2010-09-03 2010-09-03 Staggered thin film transistor and method of forming the same

Publications (1)

Publication Number Publication Date
TW201232784A true TW201232784A (en) 2012-08-01

Family

ID=43104661

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100129784A TW201232784A (en) 2010-09-03 2011-08-19 Staggered thin film transistor and method of forming the same

Country Status (7)

Country Link
US (1) US20120056173A1 (https=)
EP (1) EP2426720A1 (https=)
JP (1) JP2013541192A (https=)
KR (1) KR20130102576A (https=)
CN (1) CN103140929B (https=)
TW (1) TW201232784A (https=)
WO (1) WO2012028432A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI594333B (zh) * 2013-12-31 2017-08-01 國立交通大學 降低氧化物薄膜電晶體之接觸電阻的方法

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8962386B2 (en) * 2011-11-25 2015-02-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
JP6051960B2 (ja) * 2012-03-19 2016-12-27 株式会社リコー 導電性薄膜、導電性薄膜形成用塗布液、電界効果型トランジスタ、及び電界効果型トランジスタの製造方法
WO2013183254A1 (ja) * 2012-06-08 2013-12-12 パナソニック株式会社 薄膜トランジスタ及び薄膜トランジスタの製造方法
JP5972065B2 (ja) * 2012-06-20 2016-08-17 富士フイルム株式会社 薄膜トランジスタの製造方法
US9379247B2 (en) * 2012-06-28 2016-06-28 Cbrite Inc. High mobility stabile metal oxide TFT
US8823003B2 (en) * 2012-08-10 2014-09-02 Apple Inc. Gate insulator loss free etch-stop oxide thin film transistor
WO2014067463A1 (zh) * 2012-11-02 2014-05-08 京东方科技集团股份有限公司 薄膜晶体管及其制作方法、阵列基板、显示装置和阻挡层
US9601557B2 (en) 2012-11-16 2017-03-21 Apple Inc. Flexible display
KR102163730B1 (ko) * 2014-03-25 2020-10-08 삼성전자주식회사 트랜지스터와 그 제조방법 및 트랜지스터를 포함하는 전자소자
US9600112B2 (en) 2014-10-10 2017-03-21 Apple Inc. Signal trace patterns for flexible substrates
KR102260886B1 (ko) * 2014-12-10 2021-06-07 삼성디스플레이 주식회사 박막 트랜지스터
KR102708773B1 (ko) 2016-12-26 2024-09-23 엘지디스플레이 주식회사 플렉서블 표시장치
US10224224B2 (en) 2017-03-10 2019-03-05 Micromaterials, LLC High pressure wafer processing systems and related methods
US10622214B2 (en) 2017-05-25 2020-04-14 Applied Materials, Inc. Tungsten defluorination by high pressure treatment
US10847360B2 (en) 2017-05-25 2020-11-24 Applied Materials, Inc. High pressure treatment of silicon nitride film
JP7190450B2 (ja) 2017-06-02 2022-12-15 アプライド マテリアルズ インコーポレイテッド 炭化ホウ素ハードマスクのドライストリッピング
US10276411B2 (en) 2017-08-18 2019-04-30 Applied Materials, Inc. High pressure and high temperature anneal chamber
JP6947914B2 (ja) 2017-08-18 2021-10-13 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated 高圧高温下のアニールチャンバ
SG11202001450UA (en) 2017-09-12 2020-03-30 Applied Materials Inc Apparatus and methods for manufacturing semiconductor structures using protective barrier layer
US10643867B2 (en) 2017-11-03 2020-05-05 Applied Materials, Inc. Annealing system and method
EP4321649B1 (en) 2017-11-11 2025-08-20 Micromaterials LLC Gas delivery system for high pressure processing chamber
JP7330181B2 (ja) 2017-11-16 2023-08-21 アプライド マテリアルズ インコーポレイテッド 高圧蒸気アニール処理装置
JP2021503714A (ja) 2017-11-17 2021-02-12 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated 高圧処理システムのためのコンデンサシステム
KR102649241B1 (ko) 2018-01-24 2024-03-18 어플라이드 머티어리얼스, 인코포레이티드 고압 어닐링을 사용한 심 힐링
SG11202008256WA (en) 2018-03-09 2020-09-29 Applied Materials Inc High pressure annealing process for metal containing materials
US10714331B2 (en) 2018-04-04 2020-07-14 Applied Materials, Inc. Method to fabricate thermally stable low K-FinFET spacer
US10950429B2 (en) 2018-05-08 2021-03-16 Applied Materials, Inc. Methods of forming amorphous carbon hard mask layers and hard mask layers formed therefrom
US10566188B2 (en) 2018-05-17 2020-02-18 Applied Materials, Inc. Method to improve film stability
US10704141B2 (en) 2018-06-01 2020-07-07 Applied Materials, Inc. In-situ CVD and ALD coating of chamber to control metal contamination
US10748783B2 (en) 2018-07-25 2020-08-18 Applied Materials, Inc. Gas delivery module
US10675581B2 (en) 2018-08-06 2020-06-09 Applied Materials, Inc. Gas abatement apparatus
KR102528076B1 (ko) 2018-10-30 2023-05-03 어플라이드 머티어리얼스, 인코포레이티드 반도체 응용들을 위한 구조를 식각하기 위한 방법들
WO2020101935A1 (en) 2018-11-16 2020-05-22 Applied Materials, Inc. Film deposition using enhanced diffusion process
WO2020117462A1 (en) 2018-12-07 2020-06-11 Applied Materials, Inc. Semiconductor processing system
US11901222B2 (en) 2020-02-17 2024-02-13 Applied Materials, Inc. Multi-step process for flowable gap-fill film

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06333925A (ja) * 1993-05-20 1994-12-02 Nippon Steel Corp 半導体集積回路及びその製造方法
JP4954366B2 (ja) * 2000-11-28 2012-06-13 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP4496518B2 (ja) * 2002-08-19 2010-07-07 日立金属株式会社 薄膜配線
JP3940385B2 (ja) * 2002-12-19 2007-07-04 株式会社神戸製鋼所 表示デバイスおよびその製法
KR100905662B1 (ko) * 2003-06-26 2009-06-30 엘지디스플레이 주식회사 액정표시장치 제조 방법 및 배선 구조
KR20070049278A (ko) * 2005-11-08 2007-05-11 삼성전자주식회사 배선, 이를 포함하는 박막 트랜지스터 기판과 그 제조 방법
JP4609797B2 (ja) * 2006-08-09 2011-01-12 Nec液晶テクノロジー株式会社 薄膜デバイス及びその製造方法
KR20080037296A (ko) * 2006-10-25 2008-04-30 삼성전자주식회사 박막 트랜지스터 기판 및 그 제조방법
US7919795B2 (en) * 2006-12-21 2011-04-05 Samsung Electronics Co., Ltd. Wire structure, method for fabricating wire, thin film transistor substrate, and method for fabricating the thin film transistor substrate
JP5017282B2 (ja) * 2006-12-28 2012-09-05 株式会社アルバック 配線膜の形成方法
KR100858088B1 (ko) * 2007-02-28 2008-09-10 삼성전자주식회사 박막 트랜지스터 및 그 제조 방법
JP4871777B2 (ja) * 2007-04-16 2012-02-08 株式会社アルバック エッチング液及びトランジスタ製造方法
JP5121299B2 (ja) * 2007-05-09 2013-01-16 アルティアム サービシズ リミテッド エルエルシー 液晶表示装置
KR101102891B1 (ko) * 2007-09-04 2012-01-10 삼성전자주식회사 배선구조 및 이를 이용한 박막 트랜지스터
TWI360708B (en) * 2007-12-17 2012-03-21 Au Optronics Corp Pixel structure, display panel, elecro-optical app
KR101296654B1 (ko) * 2007-12-26 2013-08-14 엘지디스플레이 주식회사 구리 배선, 이를 이용한 평판 표시 장치, 및 그 구리배선의 형성 방법
WO2010013636A1 (ja) * 2008-07-29 2010-02-04 株式会社アルバック 配線膜、薄膜トランジスタ、ターゲット、配線膜の形成方法
JP5571887B2 (ja) * 2008-08-19 2014-08-13 アルティアム サービシズ リミテッド エルエルシー 液晶表示装置及びその製造方法
KR101499239B1 (ko) * 2008-08-26 2015-03-06 삼성디스플레이 주식회사 박막 트랜지스터 표시판 및 그 제조 방법
JP5269533B2 (ja) * 2008-09-26 2013-08-21 三菱マテリアル株式会社 薄膜トランジスター
JP5360959B2 (ja) * 2008-10-24 2013-12-04 三菱マテリアル株式会社 バリア膜とドレイン電極膜およびソース電極膜が高い密着強度を有する薄膜トランジスター
US8237163B2 (en) * 2008-12-18 2012-08-07 Lg Display Co., Ltd. Array substrate for display device and method for fabricating the same
CN103456794B (zh) * 2008-12-19 2016-08-10 株式会社半导体能源研究所 晶体管的制造方法
JP4752927B2 (ja) * 2009-02-09 2011-08-17 ソニー株式会社 薄膜トランジスタおよび表示装置
WO2010098101A1 (ja) * 2009-02-27 2010-09-02 株式会社アルバック トランジスタ、トランジスタの製造方法及びその製造装置
KR101690216B1 (ko) * 2009-05-01 2016-12-27 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치의 제작 방법
KR101687311B1 (ko) * 2009-10-07 2016-12-16 삼성디스플레이 주식회사 표시 장치 및 이의 제조 방법

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI594333B (zh) * 2013-12-31 2017-08-01 國立交通大學 降低氧化物薄膜電晶體之接觸電阻的方法

Also Published As

Publication number Publication date
CN103140929A (zh) 2013-06-05
JP2013541192A (ja) 2013-11-07
WO2012028432A1 (en) 2012-03-08
KR20130102576A (ko) 2013-09-17
US20120056173A1 (en) 2012-03-08
EP2426720A1 (en) 2012-03-07
CN103140929B (zh) 2015-12-02

Similar Documents

Publication Publication Date Title
TW201232784A (en) Staggered thin film transistor and method of forming the same
TWI282031B (en) Copper alloy and a liquid crystal display device
US9768322B2 (en) Metal oxide TFT with improved source/drain contacts and reliability
TWI437697B (zh) Wiring structure and a display device having a wiring structure
JP5403527B2 (ja) 半導体装置
US7940361B2 (en) Copper alloy and liquid-crystal display device
CN102804352B (zh) 布线层结构及其制造方法
JP2013541192A5 (https=)
TW201123460A (en) Thin film transistor, method of manufacturing the same, and organic electroluminescent device including thin film transistor
JP7057795B2 (ja) 薄膜トランジスタ、薄膜トランジスタを有する表示装置、及び薄膜トランジスタの製造方法
TW201133862A (en) Oxide semiconductor thin film transistor, method of manufacturing the same, and organic electroluminescent device including the same
CN101283388A (zh) Tft基板及tft基板的制造方法
TW201041140A (en) Transistor, transistor manufacturing method, and manufacturing device thereof
TW201212230A (en) Semiconductor structure and fabricating method thereof
WO2012075722A1 (zh) 带有存储功能的mos器件及其形成方法
TW201119028A (en) Organic light-emitting display device and method of manufacturing the same
KR101748787B1 (ko) 박막 트랜지스터 및 그 제조 방법
KR20000071417A (ko) 이리듐 도전성 전극/배리어 구조 및 그의 제조 방법
WO2019214440A1 (zh) 薄膜晶体管及其制备方法、显示基板和显示装置
TW201041139A (en) Transistor, method for manufacturing transistor, and apparatus for manufacturing transistor
TW201214623A (en) Wiring structure, display device, and semiconductor device
CN101090123A (zh) 具铜导线结构的薄膜晶体管及其制造方法
CN102237491B (zh) 包含硅掺杂的氧化锰基电阻型存储器及其制备方法
TW201005947A (en) Electronic device, thin film transistor, display device, and conductor contacting process
CN115088083B (zh) 包括结晶izto氧化物半导体的薄膜晶体管及其制造方法