TW201232178A - Photosensitive resin composition, partition wall, color filter, and organic el element - Google Patents

Photosensitive resin composition, partition wall, color filter, and organic el element Download PDF

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Publication number
TW201232178A
TW201232178A TW100147486A TW100147486A TW201232178A TW 201232178 A TW201232178 A TW 201232178A TW 100147486 A TW100147486 A TW 100147486A TW 100147486 A TW100147486 A TW 100147486A TW 201232178 A TW201232178 A TW 201232178A
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TW
Taiwan
Prior art keywords
resin composition
group
partition wall
photosensitive resin
ink
Prior art date
Application number
TW100147486A
Other languages
English (en)
Chinese (zh)
Inventor
Hideyuki Takahashi
Kenji Ishizeki
Masayuki Kawashima
Masaki Obi
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Publication of TW201232178A publication Critical patent/TW201232178A/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G02B5/201—Filters in the form of arrays
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0041—Photosensitive materials providing an etching agent upon exposure
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials For Photolithography (AREA)
  • Electroluminescent Light Sources (AREA)
TW100147486A 2010-12-20 2011-12-20 Photosensitive resin composition, partition wall, color filter, and organic el element TW201232178A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010283376 2010-12-20

Publications (1)

Publication Number Publication Date
TW201232178A true TW201232178A (en) 2012-08-01

Family

ID=46313879

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100147486A TW201232178A (en) 2010-12-20 2011-12-20 Photosensitive resin composition, partition wall, color filter, and organic el element

Country Status (5)

Country Link
JP (1) JP5880445B2 (ja)
KR (1) KR101817378B1 (ja)
CN (1) CN103261968A (ja)
TW (1) TW201232178A (ja)
WO (1) WO2012086610A1 (ja)

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TWI490653B (zh) * 2013-09-10 2015-07-01 Chi Mei Corp 正型感光性樹脂組成物及其圖案形成方法
CN106019826A (zh) * 2015-03-24 2016-10-12 三星Sdi株式会社 感光性树脂组合物、使用其的黑柱间隔件以及滤色器
TWI613221B (zh) * 2012-11-27 2018-02-01 富士軟片股份有限公司 光硬化性組成物、轉印材料、硬化物及其製造方法、樹脂圖案製造方法、硬化膜、液晶顯示裝置、有機ｅｌ顯示裝置及觸控面板顯示裝置
TWI615678B (zh) * 2016-03-08 2018-02-21 三星Ｓｄｉ股份有限公司 感光樹脂組成物、使用其的黑色柱狀間隙物及彩色濾光片
TWI658328B (zh) * 2016-11-09 2019-05-01 日商昭和電工股份有限公司 Positive photosensitive resin composition and titanium black dispersion
TWI731989B (zh) * 2016-06-30 2021-07-01 日商東京應化工業股份有限公司 感光性樹脂組成物、硬化膜、有機ｅｌ元件中之發光層之分區用之隔排、有機ｅｌ元件用之基板、有機ｅｌ元件、硬化膜之製造方法、隔排之製造方法、及有機ｅｌ元件之製造方法
TWI738910B (zh) * 2017-01-18 2021-09-11 日商東京應化工業股份有限公司 樹脂組成物、黑色基質、顯示裝置、及黑色基質之製造方法
TWI760311B (zh) * 2015-08-31 2022-04-11 日商富士軟片股份有限公司 著色感光性組成物、硬化膜、彩色濾光片、遮光膜、固體攝影元件、圖像顯示裝置以及硬化膜的製造方法

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TWI564661B (zh) * 2012-05-25 2017-01-01 Ｌｇ化學股份有限公司 光敏樹脂組成物、使用其形成之圖案以及包含其之顯示面板
KR20160061970A (ko) 2013-09-30 2016-06-01 히타치가세이가부시끼가이샤 감광성 수지 조성물, 감광성 엘리먼트, 반도체 장치 및 레지스터 패턴의 형성 방법
US9841678B2 (en) 2013-09-30 2017-12-12 Hitachi Chemical Company, Ltd. Photosensitive resin composition, photosensitive element, semiconductor device and method for forming resist pattern
TWI506372B (zh) * 2013-12-05 2015-11-01 Chi Mei Corp 正型感光性樹脂組成物、圖案形成方法、薄膜電晶體陣列基板以及液晶顯示元件
JP6308893B2 (ja) * 2014-07-07 2018-04-11 日本特殊陶業株式会社 成形体の製造方法、スパークプラグ用絶縁体、及びスパークプラグ
KR102411740B1 (ko) * 2014-07-18 2022-06-21 에이지씨 가부시키가이샤 네거티브형 감광성 수지 조성물, 수지 경화막, 격벽 및 광학 소자
JP6607682B2 (ja) * 2015-03-05 2019-11-20 日鉄ケミカル＆マテリアル株式会社 遮光膜用黒色樹脂組成物、当該組成物を硬化させた遮光膜を有する遮光膜付基板、並びに当該遮光膜付基板を有するカラーフィルター及びタッチパネル
CN107771358A (zh) * 2015-06-12 2018-03-06 默克专利有限公司 具有含氟聚合物台架结构的有机电子器件
CN105093645B (zh) * 2015-08-06 2019-04-30 深圳市华星光电技术有限公司 彩色滤光基板及其制备方法
JP6421161B2 (ja) * 2015-11-27 2018-11-07 株式会社タムラ製作所 感光性樹脂組成物
KR102363457B1 (ko) * 2015-12-29 2022-02-15 동우 화인켐 주식회사 착색 감광성 수지 조성물 및 이를 포함하는 컬럼 스페이서
JP7043142B2 (ja) * 2016-09-16 2022-03-29 株式会社Adeka 硬化性組成物、硬化物及び硬化物の製造方法
JP6843146B2 (ja) 2016-09-30 2021-03-17 富士フイルム株式会社 構造体、カラーフィルタ、固体撮像素子、画像表示装置、構造体の製造方法および有機物層形成用組成物
JP6825870B2 (ja) * 2016-10-07 2021-02-03 東京応化工業株式会社 感光性樹脂組成物、硬化膜、カラーフィルタ、及び硬化膜の製造方法
JP6856367B2 (ja) * 2016-11-30 2021-04-07 東京応化工業株式会社 感光性組成物、硬化膜、発光表示素子用の発光層、発光表示素子、及び発光層の形成方法
WO2018116914A1 (ja) * 2016-12-22 2018-06-28 旭硝子株式会社 ネガ型感光性樹脂組成物
KR102363566B1 (ko) * 2016-12-26 2022-02-16 도레이 카부시키가이샤 유기 el 표시 장치
JP6845469B2 (ja) * 2017-02-27 2021-03-17 三菱ケミカル株式会社 画像表示装置用着色硬化膜、画像表示装置用感光性着色組成物及び画像表示装置
CN111566561A (zh) * 2018-01-26 2020-08-21 三菱化学株式会社 着色感光性树脂组合物、间隔壁、有机场致发光元件、图像显示装置及照明
JP6699691B2 (ja) * 2018-08-06 2020-05-27 東洋インキＳｃホールディングス株式会社 黒色組成物、黒色塗膜、および積層体
TWI796410B (zh) * 2018-12-25 2023-03-21 奇美實業股份有限公司 化學增幅型正型感光性樹脂組成物及其應用
JP6843949B2 (ja) * 2018-12-27 2021-03-17 株式会社タムラ製作所 黒色感光性樹脂組成物
JP6689434B1 (ja) * 2019-02-06 2020-04-28 昭和電工株式会社 感光性樹脂組成物、有機ｅｌ素子隔壁、及び有機ｅｌ素子
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TW200735700A (en) * 2005-11-28 2007-09-16 Asahi Glass Co Ltd Process for producing organic el, color filter and diaphragm
JP5219345B2 (ja) * 2006-06-20 2013-06-26 株式会社Ｄｎｐファインケミカル カラーフィルタ用着色樹脂組成物用分散液およびその製造方法
JP2008150428A (ja) * 2006-12-14 2008-07-03 Toda Kogyo Corp ブラックマトリックス用着色材及び該ブラックマトリックス用着色材を含有するブラックマトリックス用着色組成物並びにカラーフィルター
KR101412857B1 (ko) * 2007-04-25 2014-06-26 아사히 가라스 가부시키가이샤 감광성 조성물, 격벽, 블랙 매트릭스, 컬러 필터의 제조 방법
WO2008146855A1 (ja) * 2007-05-29 2008-12-04 Asahi Glass Company, Limited 感光性組成物、隔壁、ブラックマトリックス
KR101627381B1 (ko) 2008-07-03 2016-06-03 아사히 가라스 가부시키가이샤 감광성 조성물, 격벽, 컬러 필터 및 유기 ｅｌ 소자

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TWI613221B (zh) * 2012-11-27 2018-02-01 富士軟片股份有限公司 光硬化性組成物、轉印材料、硬化物及其製造方法、樹脂圖案製造方法、硬化膜、液晶顯示裝置、有機ｅｌ顯示裝置及觸控面板顯示裝置
TWI490653B (zh) * 2013-09-10 2015-07-01 Chi Mei Corp 正型感光性樹脂組成物及其圖案形成方法
US9395627B2 (en) 2013-09-10 2016-07-19 Chi Mei Corporation Positive photosensitive resin composition and method for forming pattern by using the same
CN106019826A (zh) * 2015-03-24 2016-10-12 三星Sdi株式会社 感光性树脂组合物、使用其的黑柱间隔件以及滤色器
US10216029B2 (en) 2015-03-24 2019-02-26 Samsung Sdi Co., Ltd. Photosensitive resin composition, black column spacer using the same and color filter
TWI760311B (zh) * 2015-08-31 2022-04-11 日商富士軟片股份有限公司 著色感光性組成物、硬化膜、彩色濾光片、遮光膜、固體攝影元件、圖像顯示裝置以及硬化膜的製造方法
TWI615678B (zh) * 2016-03-08 2018-02-21 三星Ｓｄｉ股份有限公司 感光樹脂組成物、使用其的黑色柱狀間隙物及彩色濾光片
TWI731989B (zh) * 2016-06-30 2021-07-01 日商東京應化工業股份有限公司 感光性樹脂組成物、硬化膜、有機ｅｌ元件中之發光層之分區用之隔排、有機ｅｌ元件用之基板、有機ｅｌ元件、硬化膜之製造方法、隔排之製造方法、及有機ｅｌ元件之製造方法
TWI658328B (zh) * 2016-11-09 2019-05-01 日商昭和電工股份有限公司 Positive photosensitive resin composition and titanium black dispersion
TWI738910B (zh) * 2017-01-18 2021-09-11 日商東京應化工業股份有限公司 樹脂組成物、黑色基質、顯示裝置、及黑色基質之製造方法

Also Published As

Publication number Publication date
JPWO2012086610A1 (ja) 2014-05-22
KR20140001915A (ko) 2014-01-07
KR101817378B1 (ko) 2018-01-11
JP5880445B2 (ja) 2016-03-09
CN103261968A (zh) 2013-08-21
WO2012086610A1 (ja) 2012-06-28

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