TW201129476A - Laminate having porous layer and functional laminate using the same - Google Patents

Laminate having porous layer and functional laminate using the same

Info

Publication number
TW201129476A
TW201129476A TW99142916A TW99142916A TW201129476A TW 201129476 A TW201129476 A TW 201129476A TW 99142916 A TW99142916 A TW 99142916A TW 99142916 A TW99142916 A TW 99142916A TW 201129476 A TW201129476 A TW 201129476A
Authority
TW
Taiwan
Prior art keywords
porous layer
laminate
based resin
substrate
polyamide
Prior art date
Application number
TW99142916A
Other languages
English (en)
Inventor
Yo Yomato
Original Assignee
Daicel Chem
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daicel Chem filed Critical Daicel Chem
Publication of TW201129476A publication Critical patent/TW201129476A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/0427—Coating with only one layer of a composition containing a polymer binder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/18—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/043—Improving the adhesiveness of the coatings per se, e.g. forming primers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/044—Forming conductive coatings; Forming coatings having anti-static properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/046—Forming abrasion-resistant coatings; Forming surface-hardening coatings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/056—Forming hydrophilic coatings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/28—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof by elimination of a liquid phase from a macromolecular composition or article, e.g. drying of coagulum
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2479/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2461/00 - C08J2477/00
    • C08J2479/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2479/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249987—With nonvoid component of specified composition
    • Y10T428/249988—Of about the same composition as, and adjacent to, the void-containing component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249987—With nonvoid component of specified composition
    • Y10T428/24999—Inorganic
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249987—With nonvoid component of specified composition
    • Y10T428/249991—Synthetic resin or natural rubbers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
TW99142916A 2009-12-14 2010-12-09 Laminate having porous layer and functional laminate using the same TW201129476A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009283203 2009-12-14

Publications (1)

Publication Number Publication Date
TW201129476A true TW201129476A (en) 2011-09-01

Family

ID=44167174

Family Applications (1)

Application Number Title Priority Date Filing Date
TW99142916A TW201129476A (en) 2009-12-14 2010-12-09 Laminate having porous layer and functional laminate using the same

Country Status (7)

Country Link
US (1) US20130020117A1 (zh)
EP (1) EP2514591A4 (zh)
JP (1) JP5793425B2 (zh)
KR (1) KR20120123017A (zh)
CN (1) CN102666096A (zh)
TW (1) TW201129476A (zh)
WO (1) WO2011074418A1 (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9251778B2 (en) 2014-06-06 2016-02-02 Industrial Technology Research Institute Metal foil with microcracks, method of manufacturing the same, and sound-absorbing structure having the same
TWI620368B (zh) * 2011-11-11 2018-04-01 Ｌｇ化學股份有限公司 分隔件及其製造方法以及包含其之電化學裝置
TWI688473B (zh) * 2014-08-20 2020-03-21 日商昭和電工股份有限公司 層合薄片及層合薄片之製造方法

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5461973B2 (ja) * 2009-12-14 2014-04-02 株式会社ダイセル 多孔質膜及びその製造方法
FR2980040B1 (fr) * 2011-09-14 2016-02-05 Commissariat Energie Atomique Transistor organique a effet de champ
JP5458137B2 (ja) * 2012-03-29 2014-04-02 日東電工株式会社 電気絶縁性樹脂シート
JP2014028326A (ja) * 2012-07-31 2014-02-13 Daicel Corp 多孔質層を有する積層体及びその製造方法
JP2014097529A (ja) * 2012-10-18 2014-05-29 Fuji Electric Co Ltd 発泡金属による接合方法、半導体装置の製造方法、半導体装置
JP2014110514A (ja) * 2012-11-30 2014-06-12 Toppan Forms Co Ltd アンテナ構造体、通信機器及びアンテナ構造体の製造方法
JP5919184B2 (ja) * 2012-12-17 2016-05-18 日東電工株式会社 ポリエーテルイミド多孔質体及びその製造方法
KR20140081072A (ko) * 2012-12-21 2014-07-01 삼성전자주식회사 안테나 및 안테나 제조 방법
JP2014124906A (ja) * 2012-12-27 2014-07-07 Daicel Corp 金属薄膜層が設けられた多孔膜積層体及びその製造方法
WO2014119371A1 (ja) * 2013-01-29 2014-08-07 東レ株式会社 基板及びそれを用いたタッチパネル部材
JP2014180787A (ja) * 2013-03-18 2014-09-29 Ube Ind Ltd 積層体および積層体の製造方法
JP6261596B2 (ja) * 2013-08-20 2018-01-17 株式会社ダイセル ガス発生器
CN103747659B (zh) * 2014-01-08 2017-01-18 中国科学院金属研究所 一种多孔铜散热片及其制备方法
US9666514B2 (en) * 2015-04-14 2017-05-30 Invensas Corporation High performance compliant substrate
DE102015106828A1 (de) * 2015-04-30 2016-11-03 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Vorrichtung zum elektrischen Verbinden von Komponenten mit einem rissminimierenden Haftvermittler und Herstellungsverfahren dafür
JP6509779B2 (ja) * 2015-06-01 2019-05-08 ユニチカ株式会社 芳香族アミド系高分子溶液および多孔質芳香族アミド系フィルム
CN105237952B (zh) * 2015-09-29 2017-11-17 苏州宽温电子科技有限公司 一种电磁波吸收薄膜及其制备方法
CA3002391C (en) 2015-10-30 2021-01-05 Blueshift Materials, Inc. Highly branched non-crosslinked aerogel, methods of making, and uses thereof
KR101632584B1 (ko) * 2015-11-03 2016-06-23 건양테크(주) 반도체 방열판 제조 방법
WO2017078888A1 (en) 2015-11-03 2017-05-11 Blueshift International Materials, Inc. Internally reinforced aerogel and uses thereof
TWI558740B (zh) 2015-12-07 2016-11-21 財團法人工業技術研究院 導熱樹脂及包含該導熱樹脂之熱界面材料
JP6366564B2 (ja) * 2015-12-08 2018-08-01 キヤノンファインテックニスカ株式会社 転写材、記録物、それらの製造装置および製造方法
JP6689880B2 (ja) 2015-12-16 2020-04-28 テクノＵｍｇ株式会社 レーダー装置が発するビームの経路に配置される樹脂部品、レドーム及びレーダー装置
WO2017130574A1 (ja) * 2016-01-25 2017-08-03 株式会社ダイセル 二次電池
CA3016132A1 (en) 2016-06-08 2017-12-14 Blueshift Materials, Inc. Polymer aerogel with improved mechanical and thermal properties
KR101809369B1 (ko) * 2016-06-10 2017-12-15 한양대학교 산학협력단 전도성 구조체 및 그 제조 방법, 그를 포함하는 터치 센서 및 터치 센서의 제조 방법 및 터치 센싱 방법
JP6567590B2 (ja) * 2016-07-25 2019-08-28 日東電工株式会社 ミリ波アンテナ用フィルム
JP7024225B2 (ja) * 2017-06-29 2022-02-24 富士フイルムビジネスイノベーション株式会社 ポリイミド積層膜、及びポリイミド積層膜の製造方法
JP6508296B2 (ja) * 2017-11-20 2019-05-08 宇部興産株式会社 積層体および積層体の製造方法
JP6508295B2 (ja) * 2017-11-20 2019-05-08 宇部興産株式会社 積層体および積層体の製造方法
CN111433265B (zh) 2017-12-05 2023-09-29 蓝移材料有限公司 经热处理的聚酰胺酰胺气凝胶
JP2019183153A (ja) * 2018-04-12 2019-10-24 ユニチカ株式会社 ポリイミドエアロゲルの製造方法
CN108847395B (zh) * 2018-06-25 2020-01-07 深圳市先进连接科技有限公司 一种用于低温快速连接的预烧结纳米网络银膜制备及封装方法
CN110787653B (zh) * 2018-08-01 2022-10-11 孝感市思远新材料科技有限公司 一种含共价有机框架材料的复合膜及制备方法
JP7151425B2 (ja) * 2018-11-29 2022-10-12 株式会社リコー 多孔質層の製造方法、多孔質層および電極
CN111116972B (zh) * 2018-10-31 2022-08-19 株式会社理光 多孔质层及电极
CN113024878B (zh) * 2019-12-25 2023-10-03 株式会社理光 多孔质结构体，多孔质结构体的制造方法以及制造装置
JPWO2022071301A1 (zh) * 2020-09-30 2022-04-07
JPWO2023054591A1 (zh) * 2021-09-30 2023-04-06
CN114917774B (zh) * 2022-05-07 2023-03-14 大连理工大学 一种聚丙烯腈基热交联膜的制备方法
CN117613517B (zh) * 2024-01-22 2024-05-07 宁德新能源科技有限公司 隔离膜、二次电池以及电化学装置

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ID21147A (id) 1996-12-10 1999-04-29 Daicel Chem Film berpori, proses untuk menghasilkannya, dan film laminasi serta lembaran pencatat yang dibuat dengan memakai film berpori
JP4338264B2 (ja) * 1998-09-17 2009-10-07 パナソニック株式会社 多孔質体の製造方法
JP2000143848A (ja) 1998-11-13 2000-05-26 Daicel Chem Ind Ltd インク受像シート及びその製造方法
JP2000158798A (ja) 1998-11-24 2000-06-13 Daicel Chem Ind Ltd インク受像シート及びその製造方法
KR100683321B1 (ko) * 2000-05-15 2007-02-15 미쓰비시덴키 가부시키가이샤 센서 소자 및 그의 제조 방법
JP2002154273A (ja) * 2000-11-21 2002-05-28 Alps Electric Co Ltd リライト記録媒体およびリライト記録媒体を用いた記録方法
JP4530630B2 (ja) 2002-11-12 2010-08-25 ダイセル化学工業株式会社 多孔性フィルムの製造方法、及び多孔性フィルム
EP1561561B1 (en) * 2002-11-12 2011-10-12 Daicel Chemical Industries, Ltd. Process for producing porous film and porous film
KR101184540B1 (ko) * 2003-09-25 2012-09-19 가부시끼가이샤 다이셀 내약품성을 갖는 다공성 필름
JP2005212389A (ja) * 2004-01-30 2005-08-11 Mitsubishi Plastics Ind Ltd ポリアミド系積層フィルム
WO2006038651A1 (ja) * 2004-10-06 2006-04-13 Kansai Paint Co., Ltd. 活性エネルギー線硬化性塗料組成物及び塗膜形成方法
JP2006237322A (ja) 2005-02-25 2006-09-07 Mitsubishi Paper Mills Ltd 銅ポリイミド基板の製造方法
CN101384425A (zh) * 2006-02-20 2009-03-11 大赛璐化学工业株式会社 多孔性薄膜及使用了多孔性薄膜的层叠体
US8294040B2 (en) * 2006-02-20 2012-10-23 Daicel Chemical Industries, Ltd. Porous film and multilayer assembly using the same
US20100252310A1 (en) * 2007-07-27 2010-10-07 Kiyoshige Kojima Composite for multilayer circuit board
JP5117150B2 (ja) * 2007-09-21 2013-01-09 株式会社ダイセル 多孔質層を有する積層体及びその製造方法、並びに多孔質膜及びその製造方法
JP5189379B2 (ja) * 2008-02-20 2013-04-24 リンテック株式会社 樹脂組成物及びこれを用いたフィルム、ならびにフィルムの製造方法
KR20110004907A (ko) * 2008-06-10 2011-01-14 다이셀 가가꾸 고교 가부시끼가이샤 다공질층을 갖는 적층체 및 그것을 사용한 기능성 적층체
JP5363227B2 (ja) * 2009-03-19 2013-12-11 富士フイルム株式会社 電子回路基板製造方法
EP2478752A1 (de) * 2009-09-14 2012-07-25 Felix Schoeller Jr. Foto- Und Spezialpapiere GmbH & Co. KG Substrat für elektronische schaltungen
JP5461973B2 (ja) * 2009-12-14 2014-04-02 株式会社ダイセル 多孔質膜及びその製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI620368B (zh) * 2011-11-11 2018-04-01 Ｌｇ化學股份有限公司 分隔件及其製造方法以及包含其之電化學裝置
US10033024B2 (en) 2011-11-11 2018-07-24 Lg Chem, Ltd. Separator and electrochemical device having the same
US9251778B2 (en) 2014-06-06 2016-02-02 Industrial Technology Research Institute Metal foil with microcracks, method of manufacturing the same, and sound-absorbing structure having the same
TWI688473B (zh) * 2014-08-20 2020-03-21 日商昭和電工股份有限公司 層合薄片及層合薄片之製造方法

Also Published As

Publication number Publication date
US20130020117A1 (en) 2013-01-24
JPWO2011074418A1 (ja) 2013-04-25
EP2514591A4 (en) 2014-02-05
CN102666096A (zh) 2012-09-12
JP5793425B2 (ja) 2015-10-14
KR20120123017A (ko) 2012-11-07
EP2514591A1 (en) 2012-10-24
WO2011074418A1 (ja) 2011-06-23

Similar Documents

Publication Publication Date Title
TW201129476A (en) Laminate having porous layer and functional laminate using the same
EP2412519A4 (en) FILM WITH METAL LAYER USED THEREFOR FOR ELECTRONIC COMPONENTS, METHOD FOR THE PRODUCTION THEREOF AND APPLICATIONS THEREOF
EP3048864A3 (en) Copper foil provided with carrier, laminate, printed wiring board, and method for fabricating printed wiring board
TW200641914A (en) Coated fine particle and their manufacturing method, and conductive fine particle
TW200716367A (en) Gas barrier laminate and laminated article
WO2011037831A3 (en) Articles including a porous substrate having a conformal layer thereon
WO2008126426A1 (ja) 導電性物質吸着性樹脂フイルム、導電性物質吸着性樹脂フイルムの製造方法、それを用いた金属層付き樹脂フイルム、及び、金属層付き樹脂フイルムの製造方法
EP2374612A8 (en) Surface metal film material, process for producing surface metal film material, process for producing metal pattern material, and metal pattern material
WO2008102113A3 (en) Printed circuit boards
WO2009004774A1 (ja) 金属積層ポリイミド基盤及びその製造方法
MX2010004354A (es) Metodo para producir un laminado polimerico que comprende una etapa de activacion por tratamiento de plasma.
MY151913A (en) Surface-treated copper foil, surface-treated copper foil with very thin primer resin layer, method for manufacturing the surface-treated copper foil, and method for manufacturing the surface-treated copper foil with very thin primer resin layer
WO2009099965A3 (en) Multi-layer article
TW200600552A (en) Particles having a functional multilayered structure
EP3000904A3 (en) Copper foil with carrier, method of producing same, copper foil with carrier for printed wiring board, and printed wiring board
WO2009069086A3 (en) Composite materials including an intrinsically conducting polymer, and methods and devices
WO2007024837A3 (en) Fluoropolymer-glass fabric for circuit substrates
WO2008039959A3 (en) Composite structure with organophosphonate adherent layer and method of preparing
WO2011063089A3 (en) Surface-modified adhesives
WO2009130229A3 (en) An article and a method of making an article
WO2014204773A3 (en) Laminate structure including a primer coating therein
MY144558A (en) Copper foil for printed circuit board
EP1930153A4 (en) MULTILAYER BODY COMPRISING A BARRIER AGAINST GASES
TW200710271A (en) Material for plating and use thereof
TW200706365A (en) Polyimide thin film, polyimide metal laminate and method of manufacturing thereof