TW200933316A - Diffraction based overlay metrology tool and method of diffraction based overlay metrology - Google Patents

Diffraction based overlay metrology tool and method of diffraction based overlay metrology

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TW200933316A
TW200933316A TW097147706A TW97147706A TW200933316A TW 200933316 A TW200933316 A TW 200933316A TW 097147706 A TW097147706 A TW 097147706A TW 97147706 A TW97147706 A TW 97147706A TW 200933316 A TW200933316 A TW 200933316A
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grating
substrate
composite
along
pattern
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TWI414910B (zh
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Boef Arie Jeffrey Den
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Asml Netherlands Bv
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605Workpiece metrology
    • G03F7/70616Monitoring the printed patterns
    • G03F7/70633Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • G01N21/95607Inspecting patterns on the surface of objects using a comparative method
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058Mask illumination systems
    • G03F7/7015Details of optical elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274Photolithographic processes

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)

Description

200933316 九、發明說明: 【發明所屬之技術領域】 本發明係關於一種以繞射為基礎之疊對量測工具及以繞 射為基礎之疊對量測方法。 【先前技術】 微影裝置為將所要圖案施加至基板上(通常施加至基板 之目標部分上)的機器。微影裝置可用於(例如)積體電路 (ic)之製造中。在該情況下,圖案化器件(其或者被稱作光 ❹ 罩或主光罩)可用以產生待形成於1C之個別層上的電路圖 案。可將此圖案轉印至基板(例如,石夕晶圓)上之目標部分(例 如,包括晶粒之一部分、一個晶粒或若干晶粒)上。圖案之 轉印通常係經由成像至提供於基板上之輻射敏感材料(光 阻)層上。一般而言,單一基板將含有經順次圖案化之鄰近 目標部分的網路。已知微影裝置包括:所謂的步進器其 中藉由一次性將整個圖案曝光至目標部分上來照射每一目 ❹ 標部分;及所謂的掃描器,其中藉由在給定方向("掃描"方 向)上經由輻射光束而掃描圖案同時平行或反平行於此方 向而同步地掃描基板來照射每一目標部分。亦有可能藉由 將圖案壓印至基板上而將圖案自圖案化器件轉印至基板。 - 針對微影處理,基板上之後續層中之圖案的位置應儘可 能地精確以用於基板上之器件特徵之正確界定,該等特徵 均應具有在指定容許度内之尺寸。疊對誤差(亦即,後續層 之間的失配)應在用於形成功能器件之良好界定的容許度 内。 又 136498.doc 200933316 為此’叠對測量模組通常用於判定基板上之圖案與如圖 案之頂部上之光阻層中所界定之光罩圖案的疊對誤差。 昼對测量模組通常以光學器件來執行測量。藉由測量來 自由光源所照明之光學標記(optieal随_的光學回應來 - 狀光阻層中之光罩圖案相對於基板上之圖案之位置的位 • f。藉由感測器配置來測量由光學標記所產生之信號。藉 由使用感測器之輸出,可導出疊對誤差。通常,測量叠對 Φ 誤差所在之圖案位於目標部分之間的切割道内。 已知疊對量測之兩個基本概念。 第一概念係關於以影像為基礎之叠對誤差測量。比較基 板上之圖案之影像的位置與光阻層中之光罩圖案的位置。 根據比較,判定疊對誤差。測量疊對誤差之實例為所謂的 交互框(box-in-box)結構,其中相對於外部框之位置來測量 外部框内之内部框的位置。 以影像為基礎之疊對誤差測量在測量期間可能對振動敏 ❹❹亦對聚焦品質敏感。出於該原因,以影像為基礎之疊 對誤差測量在經受振動之環境中(諸如,在軌道系統内)可^ 較不精確。X,以影像為基礎之疊對測量可能易遭受光學 器件中之像差,其可進一步減少測量之精確度。 第二概念係關於以繞射為基礎之疊對誤差測量。在基板 上之圖案層中,定位第一光柵,且在光阻層中,以與;一 光柵大體上相同之間距來定位第二光柵。第二光拇標稱地 位於第一光柵之頂部上。藉由測量如由彼此疊置之第一光 拇與第二光柵所產生之繞射圖案的強度,可獲得針對查對 I36498.doc 200933316 誤差之測量。若在第一光栅與第二光柵之間存在某疊對誤 差’則此可自繞射圖案被偵測。 在以繞射為基礎之疊對誤差測量中,可僅照明第一光柵 及第二光柵,因為自圍繞光柵之鄰近區域反射之光干涉繞 • 射圖案之強度位準。然而,趨勢顯現為使疊對誤差測量接 近於晶粒内(且未必在切割道内)之臨界結構。又,需要減少 光栅之尺寸’以便具有可用於電路之較大區域。在某種程 ❸ 度上,可藉由減少撞擊於第一光柵及第二光柵上之照明光 束的橫截面以便避免光栅外部之區域的照明來適應該等需 要。然而’照明光束之最小橫截面基本上係由物理學定律 限制(亦即,歸因於繞射之限制)。下文中,發生光束繞射之 橫截面尺寸將被稱作繞射極限》 【發明内容】 需要具有一種以改良繞射為基礎之疊對誤差測量系統及 方法》 φ 根據本發明之一態樣’提供一種用於判定基板之表面上 之第一圖案與疊置於第一圖案上之第二圖案之間的疊對誤 差之方法’基板包含在第一圖案中之第一光柵及在第一光 柵之頂部上之第二光柵,第二光柵具有與第一光栅大體上 相同之間距,第二光柵與第一光柵形成第一複合光柵,方 法包括:提供用於沿著基板之表面沿著第一水平方向在入 射角下照明至少第一複合光柵之第一照明光束,基板在固 定位置中’且自第一複合光栅測量第一級繞射光束之第一 強度;及提供用於沿著基板之表面沿著第二水平方向在入 136498.doc 200933316 射角下照明至少第一複合光柵之第二照明光束,其中第二 水平方向與第一水平方向相反,基板在固定位置中,且自 第一複合光柵測量負第一級繞射光束之第二強度。 根據本發明之一態樣,方法進一步包括判定第一強度與 . 第二強度之間的強度差,強度差係成比例於第一光栅與第 . 二光栅之間的疊對誤差。 根據本發明之—態樣,第一照明光束及第二照明光束為 共同照明光束之部分。 ❹ 根據本發明之一態樣’共同照明光束具有環形橫截面。 根據本發明之一態樣,入射角相對於基板之表面為傾斜 的’第一繞射光束及負第一繞射光束相對於表面之法線的 繞射角小於入射角。 根據本發明之一態樣,入射角大體上垂直於基板之表 面’且方法包括將第一照明光束用作第二照明光束,且自 第一複合光栅測量第一級繞射光束之第一強度及自第一複 Φ 合光柵測量第一級繞射光束之第二強度係在提供第一照明 光束期間被連續地執行。 根據本發明之一態樣,方法包括:當提供第一照明光束 時’阻擋除了第一繞射級以外之繞射級之光束;當提供第 二照明光束時’阻擋除了負第一繞射級以外之繞射級之光 束。 根據本發明之一態樣,自複合光柵測量第一級繞射光束 之第一強度包括藉由圖案辨識來偵測複合光栅之僅由第一 級繞射光束所獲得之影像’且自複合光柵測量複合光柵之 136498.doc -9- 200933316 僅由負第-級繞射光柵所獲得之第二強度包括藉由圖案辨 識來偵測複合光柵之僅由負第一級繞射光束所獲得之奢 像。 〜 根據本發明之-態樣,方法包括:將第二複合光柵提供 於基板上,第二複合光栅係由在第一圖案中之第三光柵及 在第一光栅之頂部上之第四光柵予以形成,第三光柵及第 四光柵具有與第一光柵及第二光柵大體上相同之間距其
中第一複合光柵在沿著光柵方向之移位方向上以第一移2 而偏移,且第二複合光栅在沿著光栅方向之移位方向上以 第二移位而偏移,第一移位與第二移位不同;提供用於沿 著基板之表面沿著第一水平方向在入射角下照明第二複合 光柵之第一照明光束,基板在固定位置中,且自第二複入 光柵測量第一級繞射光束之第一強度;提供用於沿著基^ 之表面沿著第二水平方向在入射角下照明第二複合光柵之 第二照明光束’且自第二複合光栅測量負第一級繞射光束 之第二強度。 根據本發明之一態樣,提供一種經組態以判定基板之表 面上之第一圖案與疊置於第-圖案上之第二圖案之間的叠 對誤差之m統,彳貞測系統包括照明源、複數個透鏡、 孔徑光闌及影像偵測器,複數個透鏡沿著用於固持基板之 基板位置與影像偵測器之間的光徑而配置;基板包括在第 一圖案中之第一光柵及在第一光柵之頂部上之二 第二光柵具有與第一光柵相同之間距,第二光柵與第一光 柵形成複合光栅·’照明源經配置㈣成用於沿著基板之表 136498.doc ,10· 200933316 面沿著第一水平方向在入射角下照明基板上之複合光柵的 第一照明光束’基板在基板位置中;影像偵測器經配置以 自複合光柵接收第一級繞射光束;照明源經配置以形成用 於沿著基板之表面沿著第二水平方向在入射角下照明基板 - 上之複合光柵的第二照明光束,其中第二水平方向與第一 • 水平方向相反,基板在基板位置中,影像偵測器經配置以 自複合光柵接收負第一級繞射光束。 ❹ 根據本發明之一態樣,提供一種微影裝置,微影裝置包 括如以上所描述的用於判定基板之表面上之第一圖案與疊 置於第一圖案上之第二圖案之間的疊對誤差之偵測系統。 【實施方式】 現將參看隨附示意性圖式而僅藉由實例來描述本發明之 實施例,在該等圖式中,對應參考符號指示對應部分。 圖1示意性地描緣根據本發明之一實施例的微影裝置。裝 置包括·照明系統(照明器)IL,其經組態以調節輻射光束 φ B(例如,UV輻射或EUV輻射圖案化器件支撐件或支撐結 構(例如,光罩台)MT,其經建構以支揮圖案化器件(例如, 光罩)MA且連接至經組態以根據某些參數來精確地定位圖 案化器件之第一定位器PM;基板台(例如,晶圓台)WT,其 經建構以固持基板(例如,塗覆光阻之晶圓)w且連接至經組 態以根據某些參數來精確地定位基板之第二定位器pw;及 投影系統(例如’折射投影透鏡系統)ps,其經組態以將由 圖案化器件MA賦予至輻射光束8之圖案投影至基板w之目 標部分C(例如’包括一或多個晶粒)上。 •U· 136498.doc 200933316 照明系統可包括用於引導、成形或控制輕射之各種類型 的光學組件,諸如,折射、反射、磁性、電磁、靜電^ 他類型的光學組件,或其任何組合。 圖案化器件支撐件或支撐結^視圖㈣ϋ件之定向、 微影裝置之設計及其他條件(諸如,圓案化器件是否固持於 真空環境中)而定的方式來固持圖案化器件。圖案化器件支 擇件或支料構可使錢械、U、㈣或其他央持技術 ❹ 來固持圖案化器件。支揮結構可為(例如)框架或台,其可根 據需要而為固定或可移動的°㈣結構可確保圖案化器件 (例如)相對於投影系統而處於所要位置。可認為本文對術語 ”主光罩”或"光罩”之任何使用均與更通用之術語”圖案化器 件"同義。 本文所使用之術語"圖案化器件•,應被廣泛地解釋為指代 可用以在轄射光束之橫截面中向輕射光束賦予圖案以便在 基板之目標部分中形成圖案的任何器件。應注意,例如, Φ 純賦予至輻射光束之圖案包括相移特徵或所謂的輔助特 徵,則圖案可能不會精破地對應於基板之目標部分中的所 要圖案。通常’被賦予至輻射光束之圖案將對應於目標部 分中所形成之器件(諸如,積體電路)中的特定功能層。 圖案化ϋ件可為透射或反射的。时化器件之實例包括 光罩、可程式化鏡面陣列,及可程式化LCD面板。光罩在 微影術中為熟知的,且包括諸如二元交變相移及衰減相移 之光罩類型,以及各種混合光罩類型。可程式化鏡面陣列 之一實例使用小鏡面之矩陣配置,該等小鏡面中之每一者 136498.doc •12· 200933316 以便在不同方向上反射
才又影透鏡"之任何使用均與更 可個別地傾斜,以便在不 斜鏡面將圖案賦予於由鏡 參 通用之術語,’投影系統"同義。 如此處所H裝置為透射類型⑼如,使用透射光罩)。 或者,裝置可為反射類型(例如,使用如以上所提及之類型 的可程式化鏡面陣列,或使用反射光罩)^ 微影裝置可為具有兩個(雙平台)或兩個以上基板台(及/ 或兩個或兩個以上光罩台)的類型。在該等"多平台"機器 中,可並行地使用額外台,或可在一或多個台上進行預備 步驟’同時將一或多個其他台用於曝光。 φ 微影裝置亦可為如下類型:其中基板之至少一部分可由 具有相對較高折射率之液體(例如,水)覆蓋,以便填充投影 系統與基板之間的空間。亦可將浸沒液體施加至微影裝置 中之其他空間’例如,圖案化器件(例如,光罩)與投影系統 之間。浸沒技術在此項技術甲被熟知用於增加投影系統之 數值孔徑。如本文所使用之術語”浸沒"不意謂諸如基板之 結構必須浸潰於液體中,而是僅意謂液體在曝光期間位於 投影系統與基板之間。 參看圖1,照明器IL自輻射源SO接收輻射光束。舉例而 13649S.doc -13- 200933316 言’當輻射源為準分子雷射器時,輻射源與微影裝置可為 單獨實體。在該等情況下,不認為輻射源形成微影裝置之 一部分,且輻射光束借助於包括(例如)適當引導鏡面及/或 光束放大器之光束傳送系統BD而自輕射源s〇傳遞至照明 ' 器1L。在其他情況下,例如,當輕射源為汞燈時,輻射源 • 可為微影裝置之整體部分。輻射源so及照明器江連同光束 傳送系統BD(在需要時)可被稱作輻射系統。 ❹ 照明器IL可包括用於調整輻射光束之角強度分布的調整 器AD。通常,可調整照明器之曈孔平面中之強度分布的至 少外部徑向範圍及/或内部徑向範圍(通常分別被稱作〇外 部及σ内部)。此外,照明器几可包括各種其他組件,諸如, 積光器IN及聚光器CO。照明器可用以調節輻射光束,以在 其橫截面中具有所要均一性及強度分布。 輻射光束B入射於被固持於圖案化器件支撐件或支撐結 構(例如,光罩台MT)上之圖案化器件(例如,光罩)MA上, φ 且由圖案化器件圖案化。在橫穿圖案化器件(例如,光罩)MA 後,輻射光束B穿過投影系統PS,投影系統以將光束聚焦 至基板W之目標部分c上。借助於第二定位器pw及位置感 測β IF(例如,干涉量測器件、線性編碼器或電容性感測 器)’基板台WT可精確地移動,例如,以便在輻射光束8之 路徑中定位不同目標部分Ce類似地,第一定位器pM及另 一位置感測器(其未在圖1中被明確地描繪)可用以(例如)在 自光罩庫之機械擷取之後或在掃描期間相對於輻射光束B 之路徑來精確地定位圖案化器件(例如,光罩)ma。一般而 I36498.doc • 14· 200933316 言可借助於形成第一定位器PM之-部分的長衝程模組(粗 略疋位)及短衝程模組(精細定位)來實現圖案化器件支樓件 (例如’光罩台)MT之移動。類似地,可使用形成第二定位 器PW之一部分的長衝程模組及短衝程模組來實現基板台 • 资之移動。在步進器(與掃描器相對)之情況下,圖案化器 件支撐件(例如,光罩台)Μτ可僅連接至短衝程致動器,或 可為固定的》可使用光罩對準標記河1、河2及基板對準標記 φ P1、P2來對準圖案化器件(例如,光罩)MA及基板W。儘管 如所說明之基板對準標記佔用專用目標部分,但其可位於 目標部分之間的空間中(此等被稱為切割道對準標記)。類似 地,在一個以上晶粒提供於圖案化器件(例如,光罩)MAl 之情形中’光罩對準標記可位於該等晶粒之間。 所描繪裝置可用於以下模式中之至少一者中: 1. 在步進模式中’在將被賦予至輻射光束之整個圖案一 次性投影至目標部分c上時,使圖案化器件支撐件(例如, φ 光罩台)MT及基板台WT保持基本上靜止(亦即,單次靜態曝 光)。接著’使基板台WT在X及/或Y方向上移位,使得可曝 光不同目標部分ο在步進模式中,曝光場之最大尺寸限制 單次靜態曝光中所成像之目標部分c的尺寸。 2. 在掃描模式中,在將被賦予至輻射光束之圖案投影至 目標部分C上時,同步地掃描圖案化器件支撐件(例如,光 軍台)MT及基板台WT(亦即,單次動態曝光)。可藉由投影 系統PS之放大率(縮小率)及影像反轉特性來判定基板台 WT相對於圖案化器件支摔件(例如,光罩台)μτ之速度及方 136498.doc -15- 200933316 向。在掃描模式中,曝光場之最大尺寸限制單次動態曝光 中之目標部分的寬度(在非掃描方向上),而掃描運動之長度 判定目標部分之高度(在掃描方向上)。
3.在另一模式中,在將被賦予至輻射光束之圖案投影至 . 目標部分0上時’使圖案化器件支撐件(例如,光罩台)MT • 保持基本上靜止,從而固持可程式化圖案化器件,且移動 或掃描基板台WT^在此模式中,通常使用脈衝式輻射源, φ 且在基板台WT之每一移動之後或在掃描期間的順次輻射 脈衝之間根據需要而更新可程式化圖案化器件。此操作模 式可易於應用於利用可程式化圖案化器件(諸如,如以上所 提及之類型的可程式化鏡面陣列)之無光罩微影術。 亦可使用對以上所描述之使用模式之組合及/或變化或 完全不同的使用模式。 圖2a、圖2b、圖2c說明根據一實施例的在照明光束與可 用於繞射疊對量測之2個重疊光柵之間的相互作用。 φ 在圖2a中’展示複合光柵、120之橫截面,其展現零 疊對誤差。 在基板100上’建構包括第一光柵110及第二光栅120之複 合光柵。第一光柵110在基板材料中經圖案化且包括沿著光 柵方向X1之第一週期性結構。 在一實施例中,第一光栅之週期性結構包括插入有次要 光柵線(secondary line)l 12之複數個主要光柵線(primary line)lii。週期性結構形成於層115中。 出於清楚之原因’圖2a中藉由參考數字來僅指示一主要 136498.doc -16 - 200933316 光柵線111及一鄰近次要光栅線丨丨2。 光柵110之間距P等於一光柵線lu及一次要光柵線112之 寬度。 熟習此項技術者應瞭解,次要光柵線112可由基板光柵線 . (substrate Une)111之間由與基板材料不同之材料所填充的 ㈣予以形成。舉例而f,基板材料為矽n冓材料為 如二氧化矽之介電質或如鎢或銅之金屬。 在第一光柵110之頂部上,存在第二光柵120。第二光柵 膠 由第二週期性結構組成。 在所示實施例中,第二週期性結構包括沿著光栅方向幻 插入有渠溝122之複數個光柵線121。 在此貫例中’光柵線121定位於第一光栅1丨〇之次要光栅 線112之頂部上。第二光柵120在方向χι上具有等於一光栅 線丨21及一渠溝122之寬度的間距p,。第二光柵12〇之間距ρ· 經選擇為大體上等於第一光栅110之間距p。在一實施例 ❹ 中,第二光柵I20之光柵線121可具有與第一光柵11〇之次要 光柵線112大體上相同之寬度。 或者,第二光栅120之光栅線121可位於第一光柵11〇之主 要光柵線111之頂部上。 第一光棚可為形成於光阻層125中之圖案。 在圖2a之情況下,第一光柵11〇與第二光柵12〇之對準為 完美的,失配理想地為零(其將被稱作零疊對誤差^第二光 柵120之光柵線121與第一光柵11〇之次要光柵線112完全對 準。 136498.doc -17- 200933316 在圖2a中’示意性地展示在照明光束IB與複合光栅丨丨〇、 120之間的相互作用之實施例。 在此實施例中’照明光束ΙΒ在光栅方向XI上於第一斜入 射角β下撞擊於光栅結構上。相對於表面法線η來採取入射 角β。照明光束ΙΒ藉由複合光栅11〇、120而散射,且分別形 成第一級及第零級之(至少)兩個繞射光束Β +及Β〇。分別 地’第一級繞射光束Β+在角度Θ(相對於表面法線η)下離開 基板,且第零級繞射光束在鏡面反射下離開。注意,複合 光柵110、120之間距Ρ及照明光束扭之波長經選擇以便實現 繞射條件。在圖2a中’繞射級及照明光束展示於一平面中, 但此僅係出於便利起見。本發明之一實施例亦可應用於圓 錐形繞射之情況下,其中繞射光束可能不在與照明光束相 同之平面中。 視光柵之間距P(其中p=p,)與照明光束汨之波長的比率而 定,亦可存在更高級繞射光束,但此處忽略此等更高級繞 射光束。 在圖2b中,圖2a之複合光柵110、12〇之相同橫截面係用 於照明光束IB之第二斜入射。 在圖2b中,照明光束把在第二斜入射[β下撞擊於光拇 結構上。第二人射角_β具有與第—人射角βΑ體上相同之量 值,但在比較下係在沿著光栅方向χι之相反方向上經引 導。相對於表面法線η來採取第二入射角_β。 々照明光束IB藉由複合光柵11〇、12〇而散射,且分別形成 第(負)級及第零級之(至少)兩個繞射光束及B〇,其分別 136498.doc -18· 200933316 在角度-θ下及在鏡面反射下離開基板。 繞射光束Β+描繪第一繞射級,繞射光束Β_描缘負第—繞 射級。歸因於第—光栅與第二光柵完全對準之事實,複人 光栅為對稱的,亦即,第—光栅11〇之次要光栅線112與第 光柵120之光柵線121重合以作為複合光栅線丨丨]、I。。 由於複合光柵之對稱性,繞射圖案亦為對稱的:亦即,第 一級繞射光束Β +之強度1+大體上等於負第一級繞射光東& 之強度I-。 1+=1_=1+。 方程式(1), 其中1+0表示對稱複合光柵之第一級繞射光束之強度。 在圖2C中’展示複合光柵11〇、12〇之橫截面,其展現非 零疊對誤差。第二光柵12〇之光柵線121顯示相對於第一光 栅之次要光柵線112的疊對誤差(未對準片。結果,如圖2c 所示之複合光栅為不對稱的:與第一光柵11〇中之次要光柵 線112相比’在距離ε内移位第二光柵12〇之光栅線〗21。 〇 歸因於不對稱性’在第一斜入射角β下所測量的第一級繞 射光束Β +之強度1+在此情況下不等於在第二斜角下所測 量的負第一級繞射光束Β-之強度I-。 對於小疊對誤差,繞射光束之強度改變與疊對誤差成線 性比例。作為疊對誤差ε之函數的第一級繞射光束β +之強度 1+係在優良近似值申: Ι+=Ι+0+Κχ& 方程式(2), 其中K為比例因數》 負第一級繞射光束B-之強度I-係由以下方程式近似: 136498.doc -19- 200933316 Ι-=Ι+〇-Κχε 方程式(3)。 藉由採取差^1=1+-1-,獲得以疊對誤差ε而線性地定標之信 號。 ΑΙ=2Κχε 方程式(4)。 - 以下將更詳細地論述比例因數Κ。 • 在另一實施例中,疊對量測可包括使用第一照明光束ΙΒ1 及第二照明光束ΙΒ2 ’各自在複合光柵11 〇、120上之大體上 正入射下。熟習此項技術者應瞭解,在該實施例中,第一 ❹ 照明光束ΙΒ1與第二照明光束ΙΒ2重合且被提供為單一照明 光束。第一照明光束可用作第二照明光束》在照明光束之 正入射下’亦將出現第一級繞射光束Β +及負第一級繞射光 束Β-。在此等光束Β+、Β-之中,強度將展示與以上參看圖 2a至圖2c及方程式】至方程式4所描述之關係相同的關係。 在此實施例中’可藉由使用第一照明光束且分別連續地測 量第一級繞射光束及負第一級繞射光束之強度來測量第一 φ 級繞射光束與負第一級繞射光束之強度差ΔΙ。 圖33示意性地描繪在固持複合光栅11〇、120之基板之第 一測量中根據本發明之一實施例的以繞射為基礎之疊對誤 差债測系統(在下文中被稱作偵測系統)2〇(^在本發明之一 實施例中,偵測系統可包括經組態以支撐基板之支撐件。 在本發明之一實施例中’支撐件亦可為圖1之微影裝置之基 板台。 债測系統200包括複數個透鏡(在此實施例中,第一正透 鏡L1、第二正透鏡Μ、第三正透鏡L3及第四正透鏡L4)、孔 136498.doc -20- 200933316 徑光闌DF ’及影像偵測器id β 在偵測系統200内,配置光軸〇ρ,其自可藉由照明光束m 在斜入射角下照明複合光柵丨〗〇、! 2〇之基板位置延伸至可 將複合光栅之影像投影於影像偵測器ID上之位置。 . 舉例而言,影像偵測器ID可為CCD相機。經照明區域大 於光柵之區域。換言之,亦照明周圍環境。此亦被稱作"填 充過量"(overfill)。 φ 沿著光軸OP,第一正透鏡L1、第二正透鏡L2、第三正透 鏡L3及第四正透鏡L4係以可將複合光栅11〇、12〇之影像投 影於4貞測系統200之影像偵測器1〇上的方式而經配置成其 各別中心在光軸上。 第一透鏡L1定位於基板位置上方,其中可定位基板丨〇〇 上之複合光栅110、120»第一透鏡與基板位置之間的距離 大體上等於第一透鏡L1之焦距F1。在離第一透鏡L1之某距 離處’沿著光軸0P成對地配置第二透鏡L2及第三透鏡L3。 φ 第四透鏡L4經配置為影像偵測器ID之投影透鏡。在第三透 鏡L3與第四透鏡L4之間,定位孔徑光闌DF。 在測量期間,具有複合光栅110、120之基板位於基板位 置處。複合光栅110、120在預定位置(指示為Q)中。沿著基 板之表面在第一水平方向(由箭頭D1指示)上於斜入射下之 不對稱照明模式中使用第一照明光束IB 1。舉例而言,第一 照明光束沿著基板之表面沿著具有沿著第一水平方向之分 量的方向而傳播。第一照明光束IB1以第一照明光束IB丨在 穿過第一透鏡之後在繞射角Θ下形成第一繞射級光束β+之 136498.doc -21- 200933316 角度下撞擊於複合光柵上的方式而進入第一透鏡u “士 果,現在基板之表面處繞射第一級繞射光束B+,且在· 反射下(在此實例中,在角度20下)繞射第零級繞射光束別。 第-級繞射光束B +及第零級光束B〇兩者均穿過第一透 鏡Li。因為複合光柵在第一透鏡u之焦距^處,所以第一 級繞射光束B +與第零級繞射光束3〇在穿過第一透鏡Li2 後經平行地引導。 • 緊接著,第一級繞射光束B +及第零級繞射光束B〇穿過第 二透鏡L2»第一級繞射光束B+與光軸大體上重合且穿過第 二透鏡L2之中心。第零級繞射光束B〇離軸地穿過第二透鏡 L2,且在穿過之後經引導穿過第二透鏡“之焦點。 第三透鏡L3經配置成焦點F3與第二透鏡L2之焦點F2重 合0 第一級繞射光束B +與第三透鏡之光軸重合,且穿過第三 透鏡L3之中心且繼續在光轴上。第零級繞射光束bo離軸地 穿過第三透鏡。歸因於第二透鏡之焦點F2與第三透鏡之焦 點F3重合之事實,第零級繞射光束在穿過第三透鏡L3之後 大體上平行於光軸。 在第三透鏡L3之後,孔徑光闌DF定位於光軸上且經配置 以阻擋第零繞射級。孔徑光闌DF允許光轴OP上之第一級繞 射光束B+穿過且阻擋第零級繞射光束B0。以此方式,相機 上之影像僅藉由第一繞射級而形成且不藉由第零級而形 成。此成像模式通常被稱作"暗場"成像。孔徑光闌DF經配 置以具有允許阻擋第零級繞射光束B0且允許使第一級繞射 136498.doc -22- 200933316 光束B+穿過之寬度。 結果’複合光柵之影像僅使用第一繞射級或負第一繞射 &而形成於CCD相機上。為熟習此項技術者已知之適當影 I處理及圖案辨識演算法可接著用以自圍繞複合光樹之乘 • 積結構識別複合光栅。孔徑光闌之應用允許使用具有大於 繞射極限之橫截面尺寸的照明光束,而光柵之尺寸可小於 由繞射極限所指示之尺寸。 φ 最後,第一級繞射光束B+穿過經配置用於將第一級繞射 光束B +成像於影像偵測器ID上之第四透鏡L4 » 以此方式,將複合光柵11〇、12〇之源自第一級繞射光束 B +之影像投影於影像偵測器1〇上。因為影像僅係藉由一更 高(第一)繞射級而形成,所以影像將不展示個別光柵線之調 變。 注意,第一繞射級可能未必精確地垂直於表面。第一繞 射級可能與晶圓表面形成任何角度,只要其係由孔徑光鬧 ,透射即可(而無任何其他級穿過孔徑光闌)。 自複合光柵110、120之暫存於影像偵測器上之影像可 判定強度藉由圖案辨識演算法(例如,邊緣偵測)來判定 光栅之影像的精確位置。 圖3b示意性地描繪在固持複合光柵11〇、12〇之基板之第 二測量中根據本發明之一實施例的以繞射為基礎之 差偵測系統。 ^ 在圖3b t ,具有與前述圖中所示之參考數字相同的參 數字之實體指代對應實體。 136498.doc •23· 200933316 在第一測量中,在與如在第一測量中所使用之第一水平 方向D1 (如圖3a所示)相反的第二水平方向(由箭頭D2指示) 上藉由第二照明光束IB2來不對稱地照明複合光柵丨1〇、 120。舉例而言,第二照明光束沿著基板之表面沿著具有沿 • 著第一水平方向之分量的方向而傳播。複合光柵維持於與 在第一測量期間之預定位置相同的預定位置Q中。 在此等條件下,負第一級繞射光束B_現垂直於基板之表 ❹ 面繞射,且第零級繞射光束B0在角度Θ下繞射。孔徑光闌 DF經配置以具有允許阻擋第零級繞射光束B〇且允許使負 第一級繞射光束B-穿過之寬度。 結果’在第二測量期間’將複合光柵〗丨〇、12〇之源自負 第一級繞射光束B-之影像投影於影像偵測器1〇上。自複合 光柵110、120之暫存於影像偵測器1£)上之影像,可判定強 度I-。再次,可使用圖案辨識技術來識別CCD上必須進行強 度之測量之區域。 ❿ 注意’在一不同實施例中,照明光束具有大體上正入射。 熟習此項技術者應瞭解,此實施例可使用不同但功能上等 效之照明/偵測布局,其中用以允許在第一情況下僅第一級 繞射光束穿過與在第二情況下僅負第一級繞射光束穿過之 孔徑光闌的功能將相同。 此外,注意,斜入射為不需要的,但可為較佳的,因為 其允許使用具有更小間距之光柵。 如以上所描述,根據方程式4,第一級繞射光束B+之強度 1+與負第一級繞射光束B_之強度I-的差係成比例於疊對誤 136498.doc -24· 200933316 差ε比例因數κ視處理條件、照明光束之波長、繞射角及 偏振而定。熟習此項技術者應瞭解,對於處理、波長、繞 射角及偏振之給定組合,需要進行比例因數之校準。 在本發明之一實施例中,藉由判定基板上之兩個偏移複 合光栅上的疊對誤差ε來校準比例因數尺。每一偏移複合光 柵在第一光栅110與第二光柵12〇之間具有各別預定内建式 移位。兩個偏移光柵在相對於彼此之固定位置中之基板上。
第一偏移複合光柵在沿著光柵方向X1之移位方向上具有 第一内建式移位+d。第二偏移複合光柵沿著光柵方向幻具 有第二内建式移位-d,其等於第一内建式移位,但具有與 第一内建式移位相反的正負號。 在疊對誤差ε之情況下,第一偏移複合光柵展現總疊對誤 差ε+d ’且第二偏移複合光柵展現總疊對誤差。 第一偏移複合光栅上之第一繞射級與負第一繞射級之間 的強度差ΔΙ1及第二偏移複合光柵上之第一繞射級與負第 一繞射級之間的強度差AI2係由以下方程式給出: M\ = Kx{e + d) 方程式(5) (針對第一偏移複合光柵),及 方程式(6) 方程式(7) Δ/2 = Kx(e-d) (針對第二偏移複合光栅)。 K之消除導致: Δ/1 + Δ/2 ε = d-
Ml-M2 136498.doc -25- 200933316 在一實施例中,可藉由如圖3a、圖3b所示之偵測系統來 同時測量第一偏移複合光栅及第二偏移複合光柵兩者。在 該情況下,影像偵測器ID同時暫存來自第一偏移複合光柵 之影像及第二偏移複合光栅之影像。藉由使用影像處理軟 • 體,可單獨地判定第一偏移複合光柵之影像的強度及第二 偏移複合光柵的強度。可使用方程式(5H7)來計算疊對誤 差ε。 因為第一照明光束1B1及第二照明光束ΙΒ2各自在掠入射 下,所以將反射離開複合光柵外部之表面區域(亦即,乘積 區域)的光將不可能經由第一透鏡L1、第二透鏡L2、第三透 鏡L3及第四透鏡L4之系統而到達影像偵測器ID。在本發明 之一實施例中,第一照明光束ιΒ1&/或第二照明光束IB2可 具有比基板上之複合光柵110、12〇大的橫截面,而不導致 反射離開光柵外部之表面之光與由複合光栅所繞射之光之 間的干涉》 〇 孔徑光闌DF之數值孔徑之大值為較佳的,因為其允許複 合光柵與嵌入有複合光栅之周圍乘積區域之間的急劇過 渡。因為同時孔徑光闌DF經配置以阻擋第零級繞射光束 B0,所以孔技光闌df之數值孔徑具有上限,其中獲得足夠 第零級繞射光束抑制與歸因於自乘積區域之反射之足夠低 串擾之間的折衷。可行的為,此方法允許使用約1〇χ1〇 μιη2 之尺寸的複合光柵。 注意’模型化軟體可允許計算串擾可經進一步最小化所 針對的乘積區域及嵌入式複合光栅之布局。此方法可允許 I36498.doc • 26 - 200933316 設計具有約4x4 μπι2之尺寸的嵌入式複合光栅。 在一實施例中,孔徑光闌DF之數值孔徑為約0.7,而第一 透鏡之數值孔徑為約0.95。 圖4a說明負第一級繞射光束及第一級繞射光束之作為偏 - 移光柵上之移位d之函數之強度的例示性測量。 在圖4a中’針對具有間距P=660 nm之複合光栅及波長 λ=700 nm之照明光束而展示負第一級繞射光束Β·之強度工_ ❹ 及第一級繞射光束Β +之強度1+隨著移位d的變化。觀測到, 針對接近於0 nm之移位的強度1+、1_之改變為大體上線性 的。 圖4 b說明負第一級繞射光束與第一級繞射光束之間作為 如圖4b所示之偏移光柵上之移位d之函數的強度差。觀測 到’針對接近於〇 nm之移位的強度差^〗之改變為大體上線 性的。 圖5描繪如根據本發明所判定之以影像為基礎之疊對誤 〇 差與以繞射為基礎之疊對誤差之間的相關性。 對於許多樣本,亦藉由以影像為基礎之疊對誤差量測來 測$如藉由以繞射為基礎之疊對誤差量測所測量的偏移複 合光柵之移位d «>在圖5中,展示藉由繞射(沿著垂直軸)所測 量之疊對與如藉由以影像為基礎之方法(沿著水平軸)所測 量之疊對的相關性。藉由實線來說明資料之線性擬合。在 方法之誤差内,實線之係數為一。相關係數超過〇 99。 注意,如以上所描述之照明光束IB可為單一光束。或者, …、明光束可具有半環帶之形狀作為其橫截面。在該情況 136498.doc -27· 200933316 下,可藉由一半環形光束來進行圖3a中之不對稱照明,而 藉由另一半環形光束來進行如圖31)所示之來自相反方向之 不對稱照明。 可藉由光源(諸如,單色燈或雷射源)來形成照明光束 IB »倘若紐時間可用於測量,則可使用具有相對較高強度 之雷射源。 儘管在此本文中可特定地參考微影裝置在IC製造中之使 ❹ 用,但應理解,本文所描述之微影裝置可具有其他應用, 諸如,製造積體光學系統、用於磁域記憶體之導引及偵測 圖案、平板顯示器、液晶顯示器(LCD)、薄膜磁頭,等等。 熟習此項技術者應瞭解,在該等替代應用之情境中,可認 為本文對術語”晶圓,'或"晶粒"之任何使用分別與更通用之 術浯"基板"或"目標部分"同義。可在曝光之前或之後在(例 如)軌道(通常將光阻層施加至基板且顯影經曝光光阻之工 具)、里測工具及/或檢測工具中處理本文所提及之基板。適 Φ 用時,可將本文之揭示應用於該等及其他基板處理工具。 另外’可將基板處理一次以上,(例如)以便形成多層ic,使 付本文所使用之術語基板亦可指&已經含有多個經處理層 之基板。 儘管以上可特定地參考在光學微影術之情境中對本發明 之實施例的使用,但應瞭解,本發明可用於其他應用(例 如塵印微影術)中,且在情境允許時不限於光學微影術。 在壓印微影術中,圖案化器件中之構形界定形成於基板上 之圖案。可將圖案化器件之構形壓入被供應至基板之光阻 I36498.doc -28. 200933316 板上光阻藉由施加電磁輻射、熱、壓力或其 組合而固化。在丼阳m 元阻固化之後,將圖案化器件移出光阻, 從而在其中留下圖案。 _彳使用之術3吾"輻射·,及"光束"涵蓋所有類型之電磁 輻射,包括紫外線(UV)轄射(例如,具有為或為約365 nm、 m 248nm' I93nm、157nm<126nm 之波長)及遠紫 外線(EUV)輪射(例如,具有在為約5⑽至2〇⑽之範圍内的 ❿ 波長:;以及粒子束(諸如,離子束或電子束)。 術π透鏡在情境允許時可指代各種類型之光學組件中 者或,且σ,包括折射、反射、磁性、電磁及靜電光 學組件。 儘官以上已描述本發明之特定實施例,但應瞭解,可以 2所描述之方式不同的其他方式來實踐本發明。舉例而 5 ’本發明可採取如下形式:電腦程式,其含有描述如以 斤揭示之方法之機器可讀指令的一或多個序列;或資料 〇儲存媒體(例如,半導體記憶體、磁碟或光碟),其具有錯存 於其中之該電腦程式。 以上描述意欲為說明性而非限制性的。因此,對於熟習 此項技術者而言將顯而易見的為,可在不脫離以下所閣明 之申請專利範圍之範嘴的情況下對如所描述之本發明進行 修改。 【圖式簡單說明】 圖1私緣根據本發明之一實施例的微影裝置; 圖2a、圖2b、圖2〇說明根據一實施例的以繞射為基礎之 136498.doc •29· 200933316 疊對誤差量測; 圖3a、圖3b描繪分別在第一測量及第二測量期間根據本 發明之一實施例的以繞射為基礎之疊對誤差偵測系統; 圖4a說明負第一級繞射光束及第一級繞射光束之作為疊 對誤差之函數之強度的例示性測量; 圖4b說明負第一級繞射光束與第一級繞射光束之間作為 疊對誤差之函數的強度差;且
圖5描繪如根據本發明所判定之以影像為基礎之叠對誤 差與以繞射為基礎之疊對誤差之間的相關性。 【主要元件符號說明】 100 基板 110 第一光柵 111 主要光柵線/基板兴 112 次要光柵線 115 層 120 第二光栅 121 光栅線 122 渠溝 125 光阻層 200 疊對誤差偵測系統 AD 調整器 B 輻射光束 B0 繞射光束 BD 光束傳送系統 136498.doc 200933316 ⑩ 136498.doc B + 繞射光束 B- 繞射光束 C 目標部分 CO 聚光器 d 移位 D1 第一水平方向 D2 第二水平方向 DF 孔徑光闌 FI 焦距 F2 焦點 F3 焦點 IB 照明光束 IB1 第一照明光束 IB2 第二照明光束 ID 影像偵測器 IF 位置感測器 IL 照明器 IN 積光器 1+ 強度 I- 強度 L1 第一正透鏡 L2 第二正透鏡 L3 第三正透鏡 L4 第四正透鏡 doc -31 - 200933316
Ml 光罩對準標記 M2 光罩對準標記 ΜΑ 圖案化器件 MT 圖案化器件支撐件/光罩台 η 表面法線 OP 光轴 P 間距 P' 間距 PI 基板對準標記 P2 基板對準標記 PM 第一定位器 PS 投影系統 PW 第二定位器 Q 預定位置 so 輻射源 w 基板 WT 基板台 X 方向 XI 方向 Y 方向 β 第一斜入射角 -β 第二斜入射角 θ 繞射角 ε 疊對誤差 136498.doc -32-

Claims (1)

  1. 200933316 十、申請專利範圍: 1. 一種用於判定一基板之一表面上之一第一圖案與一疊置 於該第一圖案上之第二圖案之間的一疊對誤差之方法, 該第-圖案包含—第—光栅且該第二圖案包含一在該第 一光柵之頂部上之第二光栅’該第二光柵具有與該第一 光柵大體上相同之間距,該第1二光柵與該第一光栅形成 一複合光栅,該方法包含: 提供一用於在一入射角下照明至少該複合光柵之第一 照明光束,使得該第一照明光束沿著該基板之該表面沿 者一具有一沿著一第一水平方向之分量的方向而傳播, 該基板在一固定位置中; 自該複合光柵測量一第一級繞射光束之一第一強度; 提供一用於在該入射角下照明至少該複合光柵之第二 照明光束,使得該第二照明光束沿著該基板之該表面具 有一沿著一第二水平方向之分量,其中該第二水平方向 與該第一水平方向相反,該基板在該固定位置中;及 自該複合光柵測量一負第一級繞射光束之一第二強 度。 2. 如請求項丨之方法’其進—步包含· 判定該第一強度與該第二強度之間的—強度差,該強 度差係成比例於該第一光栅與該第二光柵之間的該疊對 誤差。 3·如凊求項丨之方法,其中該第一照明光束及該第二照明光 束為—共同照明光束之部分。 136498.doc 200933316 4.如請求項3之方法,其中該共同照明光束具有一環形橫載 面0 5·如凊求項1之方法’其中該入射角相對於該基板之該表面 為傾斜的,該第一繞射光束及該負第一繞射光束相對於 •該表面之法線的一繞射角小於該入射角。 • 6.如請求項1之方法,其中該入射角大體上垂直於該基板之 該表面’該方法包含: ❹ 將該第一照明光束用作該第二照明光束, 其中該自該複合光柵測量該第一級繞射光束之該第一 強度及該自該複合光柵測量該第一級繞射光束之該第二 強度係在提供該第一照明光束期間被連續地執行。 7·如請求項1之方法,其包含: 當提供該第一照明光束時’阻擋除了該第一繞射級以 外之繞射級之光束;及 當提供該第二照明光束時’阻擋除了該負第一繞射級 φ 以外之繞射級之光束。 8.如請求項丨之方法,其中自該複合光柵測量該第一級繞射 光束之該第一強度包含: 藉由圖案辨識來偵測該複合光栅之僅由該第一級繞射 光束所獲得之一影像,且 其中自該複合光柵測量該複合光栅之僅由該負第一級 繞射光束所獲得之該第二強度包含: 藉由圖案辨識來偵測該複合光栅之僅由該負第一級繞 射光束所獲得之一影像。 136498.doc • 2- 200933316 9. 如請求項1之方法,其進一步包含: 將一額外複合光柵提供於該基板上,該額外複合光柵 係由一在該第一圖案中之第三光柵及一在該第一光栅之 頂部上之第四光栅予以形成,該第三光柵及該第四光柵 • 具有一與該第一光柵及該第二光栅大體上相同之間距, - 其中該複合光栅在一沿著該光柵方向之移位方向上以一 第一移位而偏移,且該額外複合光柵在沿著該光栅方向 之該移位方向上以一第二移位而偏移,該第一移位與該 第二移位不同; 提供用於在該入射角下照明該額外複合光栅之該第一 照明光束,使得該第一照明光束沿著該基板之該表面沿 著一具有一沿著該第一水平方向之分量的方向而傳播, 該基板在該固定位置中; 自該第二複合光柵測量一第一級繞射光束之一第一強 度; 〇 提供用於在該入射角下照明該額外複合光柵之該第二 照明光束,使得該第二照明光束沿著該基板之該表面沿 著一具有一沿著該第二水平方向之分量的方向而傳 播;及 自S亥第二複合光柵測量一負第一級繞射光束之一第二 強度。 10. —種經組態以判定一基板之一表面上之一第一圖案與一 疊置於該第一圖案上之第二圖案之間的一疊對誤差之偵 測系統,該第一圖案包含一第—光柵且該第二圖案包含 136498.doc 200933316 一在該第一光柵之頂部上之第二光柵,該第二光柵具有 與該第一光栅大體上相同之間距,該第二光柵與該第一 光柵形成一複合光柵,該系統包含: 一照明源’該照明源經組態以:(a)形成一用於在一入 射角下照明該基板上之該複合光柵的第一照明光束,使 得該第一照明光束沿著該基板之該表面沿著—具有一沿 著一第一水平方向之分量的方向而傳播,該基板在基板 位置中;且(b)形成一用於在一入射角下照明該基板上之 該複合光栅的第二照明光束,使得該第二照明光束沿著 該基板之該表面沿著一具有一沿著一第二水平方向之分 量的方向而傳播,其中該第二水平方向與該第一水平方 向相反,該基板在一基板位置中; 一影像偵測器,該影像偵測器經組態以自該複合光栅 接收一負第一級繞射光束; 複數個透鏡,該複數個透鏡沿著該基板位置與該影像 偵測器之間的一光徑而配置;及 一孔徑光闌。 11 如請求項10之偵測系統’其中該影像偵測器經組態以藉 由一圖案辨識方法來偵測該複合光栅之僅使用第一級繞 射光束及該負第一級繞射光束之一影像。 12,如請求項10之偵測系統,其中該偵測系統之該孔徑光闌 經組態以當形成該第一照明光東時阻擋除了該第一繞射 級以外之繞射級之光束,且當形成該第二照明光束時阻 擔除了該負第一繞射級以外之繞射級之光束。 I36498.doc -4 - 200933316 13. 如請求項10之偵測系統,其中該複數個透鏡包含鄰近於 該基板之該表面之至少一接物鏡,及一鄰近於該影像偵 測器之投影透鏡,該孔徑光闌沿著該接物鏡與該投影透 鏡之間的該光徑而配置,且 • 其1ί7該接物鏡具有一第一數值孔徑值,且該孔徑光闌 . 具有一第二數值孔徑值,該第二數值孔徑值小於該第一 數值孔徑值。 14. 一種包含一經組態以判定一基板之一表面上之一第一圖 案與一疊置於該第一圖案上之第二圖案之間的一疊對誤 差之偵測系統之微影裝置’該第一圖案包含一第一光柵 且該第二圖案包含在該第一光栅之頂部上之第二光柵, 該第二光柵具有與該第一光柵大體上相同之間距,該第 二光栅與該第一光柵形成一複合光柵,該系統包含: 一照明源,該照明源經組態以:(a)形成一用於在一入 射角下照明該基板上之該複合光柵的第一照明光束,使 φ 得該第一照明光束沿著該基板之該表面沿著一具有一沿 著一第一水平方向之分量的方向而傳播,該基板在基板 位置中;且(b)形成一用於在一入射角下照明該基板上之 該複合光柵的第二照明光束’使得該第二照明光束沿著 該基板之該表面沿著一具有一沿著一第二水平方向之分 量的方向而傳播’其中該第二水平方向與該第一水平方 向相反’該基板在一基板位置中; 一影像偵測器,該影像偵測器經組態以自該複合光撕 接收一負第一級繞射光束; 136498.doc 200933316 複數個透鏡,該複數個透鏡沿著該基板位置與該影像 偵測器之間的一光徑而配置;及 一孔徑光闌。 15. e 16. 17. ❹ 18. 如請求項14之微影裝置,其進一步包含: 一照明系統,該照明系統經組態以調節一輻射光束; 一囷案化器件支撐件,該圖案化器件支撐件經組態以 固持一圖案化器件,該圖案化器件經組態以圖案化該輻 射光束以形成一經圖案化輻射光束; 一基板台’該基板台經組態以固持該基板;及 一投影系統,該投影系統經組態以將該經圖案化輻射 光束投影至該基板上。 如請求項14之微影裝置,其中該影像偵測器經組態以藉 由一圖案辨識方法來偵測該複合光柵之僅使用第一級繞 射光束及該負第一級繞射光束之一影像。 如凊求項14之微影裝置,其中該偵測系統之該孔徑光闌 經組態以當形成該第一照明光束時阻播除了該第一繞射 級以外之繞射級之光束’且當形成該第二照明光束時阻 擔除了該負第一繞射級以外之繞射級之光束。 如請求項14之微影裝置,其中該複數個透鏡包含鄰近於 該基板之該表面之至少一接物鏡,及一鄰近於該影像偵 測器之投影透鏡,該孔徑光闌沿著該接物鏡與該投影透 鏡之間的該光徑而配置,且 其中s亥接物鏡具有一第一數值孔徑值,且該孔徑光闌 具有一第二數值孔徑值’該第二數值孔徑值小於該第一 數值孔徑值。 136498.doc -6-
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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103201682A (zh) * 2010-11-12 2013-07-10 Asml荷兰有限公司 量测方法和设备、光刻系统和器件制造方法
TWI470215B (zh) * 2010-11-12 2015-01-21 Asml Netherlands Bv 度量衡方法及裝置、及元件製造方法
TWI564540B (zh) * 2011-08-15 2017-01-01 克萊譚克公司 利用光瞳相位資訊來量測疊對之方法及系統
TWI634325B (zh) * 2013-10-28 2018-09-01 克萊譚克公司 用於使用x射線度量術量測半導體器件疊加之方法及裝置
TWI649635B (zh) * 2017-01-24 2019-02-01 台灣積體電路製造股份有限公司 層疊誤差測量裝置及方法

Families Citing this family (639)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4943304B2 (ja) * 2006-12-05 2012-05-30 株式会社 Ngr パターン検査装置および方法
NL1036245A1 (nl) 2007-12-17 2009-06-18 Asml Netherlands Bv Diffraction based overlay metrology tool and method of diffraction based overlay metrology.
NL1036857A1 (nl) 2008-04-21 2009-10-22 Asml Netherlands Bv Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method.
JP5429869B2 (ja) 2008-12-22 2014-02-26 株式会社 Ngr パターン検査装置および方法
CN102498441B (zh) * 2009-07-31 2015-09-16 Asml荷兰有限公司 量测方法和设备、光刻系统以及光刻处理单元
EP2470960A1 (en) 2009-08-24 2012-07-04 ASML Netherlands BV Metrology method and apparatus, lithographic apparatus, lithographic processing cell and substrate comprising metrology targets
NL2005459A (en) * 2009-12-08 2011-06-09 Asml Netherlands Bv Inspection method and apparatus, and corresponding lithographic apparatus.
NL2007176A (en) 2010-08-18 2012-02-21 Asml Netherlands Bv Substrate for use in metrology, metrology method and device manufacturing method.
CN102540734A (zh) * 2010-12-08 2012-07-04 无锡华润上华科技有限公司 套刻测试方法
US9223227B2 (en) * 2011-02-11 2015-12-29 Asml Netherlands B.V. Inspection apparatus and method, lithographic apparatus, lithographic processing cell and device manufacturing method
NL2008317A (en) 2011-03-24 2012-09-25 Asml Netherlands Bv Substrate and patterning device for use in metrology, metrology method and device manufacturing method.
NL2009001A (en) 2011-07-08 2013-01-09 Asml Netherlands Bv Methods and patterning devices for measuring phase aberration.
CN103748515A (zh) * 2011-08-23 2014-04-23 Asml荷兰有限公司 量测方法和设备以及器件制造方法
NL2009508A (en) 2011-10-24 2013-04-25 Asml Netherlands Bv Metrology method and apparatus, and device manufacturing method.
NL2010401A (en) 2012-03-27 2013-09-30 Asml Netherlands Bv Metrology method and apparatus, lithographic system and device manufacturing method.
NL2010458A (en) 2012-04-16 2013-10-17 Asml Netherlands Bv Lithographic apparatus, substrate and device manufacturing method background.
NL2010717A (en) 2012-05-21 2013-11-25 Asml Netherlands Bv Determining a structural parameter and correcting an asymmetry property.
NL2010734A (en) 2012-05-29 2013-12-02 Asml Netherlands Bv Metrology method and apparatus, substrate, lithographic system and device manufacturing method.
CN104380203B (zh) 2012-06-12 2017-09-08 Asml荷兰有限公司 光子源、检查设备、光刻系统以及器件制造方法
NL2010905A (en) 2012-06-22 2013-12-24 Asml Netherlands Bv Method of determining focus, inspection apparatus, patterning device, substrate and device manufacturing method.
JP6353831B2 (ja) 2012-06-26 2018-07-04 ケーエルエー−テンカー コーポレイション 角度分解反射率測定における走査および回折の光計測からのアルゴリズム的除去
US9714827B2 (en) 2012-07-05 2017-07-25 Asml Netherlands B.V. Metrology method and apparatus, lithographic system, device manufacturing method and substrate
JP6169176B2 (ja) 2012-07-23 2017-07-26 エーエスエムエル ネザーランズ ビー.ブイ. 検査方法及び装置、リソグラフィシステム並びにデバイス製造方法
CN103697817A (zh) * 2012-09-27 2014-04-02 中国航空工业第六一八研究所 一种基于复合光栅的新型光位移传感器及其位移补偿方法
NL2011816A (en) 2012-11-30 2014-06-04 Asml Netherlands Bv Method of determining dose and focus, inspection apparatus, patterning device, substrate and device manufacturing method.
WO2014138522A1 (en) * 2013-03-08 2014-09-12 Kla-Tencor Corporation Pupil plane calibration for scatterometry overlay measurement
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US10331043B2 (en) 2014-02-21 2019-06-25 Asml Netherlands B.V. Optimization of target arrangement and associated target
JP6412163B2 (ja) 2014-05-13 2018-10-24 エーエスエムエル ネザーランズ ビー.ブイ. メトロロジーに用いられる基板及びパターニングデバイス、メトロロジー方法、及びデバイス製造方法
SG11201609566VA (en) 2014-06-02 2016-12-29 Asml Netherlands Bv Method of designing metrology targets, substrates having metrology targets, method of measuring overlay, and device manufacturing method
WO2016000914A1 (en) 2014-06-30 2016-01-07 Asml Netherlands B.V. Method of determining dose, inspection apparatus, patterning device, substrate and device manufacturing method
KR101948912B1 (ko) 2014-07-09 2019-02-15 에이에스엠엘 네델란즈 비.브이. 검사 장치, 검사 방법 및 디바이스 제조 방법
NL2015160A (en) 2014-07-28 2016-07-07 Asml Netherlands Bv Illumination system, inspection apparatus including such an illumination system, inspection method and manufacturing method.
KR102246872B1 (ko) * 2014-07-29 2021-04-30 삼성전자 주식회사 포커스 계측 마크를 포함하는 포토마스크, 포커스 모니터 패턴을 포함하는 계측용 기판 타겟, 노광 공정 계측 방법, 및 집적회로 소자의 제조 방법
WO2016030205A1 (en) 2014-08-28 2016-03-03 Vrije Universiteit Amsterdam Inspection apparatus, inspection method and manufacturing method
US10948421B2 (en) 2014-08-28 2021-03-16 Asml Netherlands B.V. Laser-driven photon source and inspection apparatus including such a laser-driven photon source
KR101986258B1 (ko) * 2014-08-29 2019-06-07 에이에스엠엘 네델란즈 비.브이. 메트롤로지 방법, 타겟 및 기판
WO2016030227A1 (en) 2014-08-29 2016-03-03 Asml Netherlands B.V. Method for controlling a distance between two objects, inspection apparatus and method
CN107077079B (zh) 2014-09-01 2018-12-14 Asml荷兰有限公司 测量目标结构的属性的方法、检查设备、光刻系统和器件制造方法
WO2016045945A1 (en) 2014-09-26 2016-03-31 Asml Netherlands B.V. Inspection apparatus and device manufacturing method
WO2016050453A1 (en) 2014-10-03 2016-04-07 Asml Netherlands B.V. Focus monitoring arrangement and inspection apparatus including such an arragnement
WO2016078862A1 (en) 2014-11-21 2016-05-26 Asml Netherlands B.V. Metrology method and apparatus
US10430719B2 (en) 2014-11-25 2019-10-01 Stream Mosaic, Inc. Process control techniques for semiconductor manufacturing processes
WO2016086138A1 (en) 2014-11-25 2016-06-02 Stream Mosaic, Inc. Improved process control techniques for semiconductor manufacturing processes
KR102355347B1 (ko) 2014-11-26 2022-01-24 에이에스엠엘 네델란즈 비.브이. 계측 방법, 컴퓨터 제품 및 시스템
WO2016096524A1 (en) 2014-12-19 2016-06-23 Asml Netherlands B.V. Method of measuring asymmetry, inspection apparatus, lithographic system and device manufacturing method
US9847242B2 (en) * 2014-12-24 2017-12-19 Industrial Technology Research Institute Apparatus and method for aligning two plates during transmission small angle X-ray scattering measurements
CN105807573B (zh) 2014-12-31 2017-12-29 上海微电子装备(集团)股份有限公司 用于套刻误差检测的装置和方法
WO2016124345A1 (en) 2015-02-04 2016-08-11 Asml Netherlands B.V. Metrology method, metrology apparatus and device manufacturing method
WO2016124393A1 (en) 2015-02-04 2016-08-11 Asml Netherlands B.V. Metrology method and apparatus, computer program and lithographic system
NL2016121A (en) 2015-02-06 2016-09-29 Asml Netherlands Bv A method and apparatus for improving measurement accuracy
CN104614955B (zh) * 2015-03-06 2017-01-11 中国科学院光电技术研究所 一种复合光栅纳米光刻自动对准系统
WO2016156360A1 (en) 2015-04-03 2016-10-06 Asml Netherlands B.V. Inspection apparatus for measuring properties of a target structure
CN107771271B (zh) 2015-04-21 2020-11-06 Asml荷兰有限公司 量测方法和设备、计算机程序及光刻系统
CN107533020B (zh) * 2015-04-28 2020-08-14 科磊股份有限公司 计算上高效的基于x射线的叠盖测量系统与方法
US10545104B2 (en) 2015-04-28 2020-01-28 Kla-Tencor Corporation Computationally efficient X-ray based overlay measurement
KR102344379B1 (ko) 2015-05-13 2021-12-28 삼성전자주식회사 실딩 패턴을 갖는 반도체 소자
NL2016864A (en) 2015-06-12 2016-12-12 Asml Netherlands Bv Inspection apparatus, inspection method, lithographic apparatus, patterning device and manufacturing method
KR102162234B1 (ko) 2015-06-17 2020-10-07 에이에스엠엘 네델란즈 비.브이. 레시피간 일치도에 기초한 레시피 선택
NL2016925A (en) 2015-06-18 2016-12-22 Asml Netherlands Bv Method of metrology, inspection apparatus, lithographic system and device manufacturing method
WO2017016839A1 (en) 2015-07-24 2017-02-02 Asml Netherlands B.V. Inspection apparatus, inspection method, lithographic apparatus and manufacturing method
US10216096B2 (en) 2015-08-14 2019-02-26 Kla-Tencor Corporation Process-sensitive metrology systems and methods
WO2017029110A1 (en) 2015-08-20 2017-02-23 Asml Netherlands B.V. Metrology method and apparatus, substrates for use in such methods, lithographic system and device manufacturing method
NL2017300A (en) 2015-08-27 2017-03-01 Asml Netherlands Bv Method and apparatus for measuring a parameter of a lithographic process, substrate and patterning devices for use in the method
NL2017466A (en) 2015-09-30 2017-04-05 Asml Netherlands Bv Metrology method, target and substrate
KR102104843B1 (ko) 2015-10-02 2020-04-28 에이에스엠엘 네델란즈 비.브이. 계측 방법 및 장치, 컴퓨터 프로그램 및 리소그래피 시스템
DE102016213925A1 (de) 2016-07-28 2018-02-01 Carl Zeiss Smt Gmbh Verfahren und Vorrichtung zur Charakterisierung eines durch wenigstens einen Lithographieschritt strukturierten Wafers
DE102015221772A1 (de) 2015-11-05 2017-05-11 Carl Zeiss Smt Gmbh Verfahren und Vorrichtung zur Charakterisierung eines durch wenigstens einen Lithographieschritt strukturierten Wafers
DE102015221773A1 (de) 2015-11-05 2017-05-11 Carl Zeiss Smt Gmbh Verfahren und Vorrichtung zur Charakterisierung eines durch wenigstens einen Lithographieschritt strukturierten Wafers
EP3371657B9 (de) 2015-11-05 2021-12-15 Carl Zeiss SMT GmbH Verfahren und vorrichtung zur charakterisierung eines durch wenigstens einen lithographieschritt strukturierten wafers
WO2017089105A1 (en) 2015-11-27 2017-06-01 Asml Netherlands B.V. Metrology target, method and apparatus, computer program and lithographic system
WO2017099843A1 (en) 2015-12-08 2017-06-15 Kla-Tencor Corporation Control of amplitude and phase of diffraction orders using polarizing targets and polarized illumination
NL2017766A (en) 2015-12-09 2017-06-14 Asml Holding Nv A flexible illuminator
US11016397B2 (en) 2015-12-17 2021-05-25 Asml Netherlands B.V. Source separation from metrology data
WO2017102428A1 (en) 2015-12-18 2017-06-22 Asml Netherlands B.V. Focus monitoring arrangement and inspection apparatus including such an arrangement
WO2017108395A1 (en) 2015-12-21 2017-06-29 Asml Netherlands B.V. Methods and patterning devices and apparatuses for measuring focus performance of a lithographic apparatus, device manufacturing method
NL2017844A (en) 2015-12-22 2017-06-28 Asml Netherlands Bv Focus control arrangement and method
CN108431692B (zh) 2015-12-23 2021-06-18 Asml荷兰有限公司 量测方法、量测设备和器件制造方法
NL2017949A (en) 2015-12-23 2017-06-28 Asml Netherlands Bv Metrology method, target and substrate
JP6742413B2 (ja) 2015-12-31 2020-08-19 エーエスエムエル ホールディング エヌ.ブイ. 検査システムの焦点合わせ方法及び装置
WO2017114672A1 (en) 2015-12-31 2017-07-06 Asml Netherlands B.V. Metrology by reconstruction
KR102563921B1 (ko) 2016-02-02 2023-08-04 삼성전자 주식회사 반도체 소자
WO2017140528A1 (en) 2016-02-19 2017-08-24 Asml Netherlands B.V. Method of measuring a structure, inspection apparatus, lithographic system, device manufacturing method and wavelength-selective filter for use therein
CN108700829B (zh) 2016-02-26 2021-05-18 Asml荷兰有限公司 测量结构的方法、检查设备、光刻系统、器件制造方法
US10546790B2 (en) 2016-03-01 2020-01-28 Asml Netherlands B.V. Method and apparatus to determine a patterning process parameter
WO2017148665A1 (en) 2016-03-01 2017-09-08 Asml Netherlands B.V. Metrology apparatus, method of measuring a structure and lithographic apparatus
US10831111B2 (en) 2016-03-03 2020-11-10 Asml Netherlands B.V. Metrology method and lithographic method, lithographic cell and computer program
WO2017148759A1 (en) 2016-03-04 2017-09-08 Asml Netherlands B.V. Method for characterizing distortions in a lithographic process, lithographic apparatus, lithographic cell and computer program
KR102169436B1 (ko) 2016-03-07 2020-10-26 에이에스엠엘 네델란즈 비.브이. 조명 시스템 및 계측 시스템
US11022896B2 (en) 2016-03-11 2021-06-01 Asml Netherlands B.V. Mark position determination method
US10504759B2 (en) 2016-04-04 2019-12-10 Kla-Tencor Corporation Semiconductor metrology with information from multiple processing steps
WO2017178220A1 (en) * 2016-04-11 2017-10-19 Asml Netherlands B.V. Metrology target, method and apparatus, target design method, computer program and lithographic system
WO2017178285A1 (en) 2016-04-15 2017-10-19 Asml Netherlands B.V. Method for adjusting actuation of a lithographic apparatus
CN109073992B (zh) 2016-04-22 2021-09-28 Asml荷兰有限公司 堆叠差异的确定和使用堆叠差异的校正
CN109073568B (zh) 2016-04-29 2022-01-11 Asml荷兰有限公司 用于确定结构的特性的方法和装置、器件制造方法
WO2017198422A1 (en) 2016-05-17 2017-11-23 Asml Netherlands B.V. Metrology robustness based on through-wavelength similarity
US10983440B2 (en) 2016-05-23 2021-04-20 Asml Netherlands B.V. Selection of substrate measurement recipes
WO2017211545A1 (en) 2016-06-09 2017-12-14 Asml Netherlands B.V. Metrology apparatus
KR102640173B1 (ko) * 2016-06-14 2024-02-26 삼성전자주식회사 회절 기반 오버레이 마크 및 오버레이 계측방법
WO2017215944A1 (en) 2016-06-15 2017-12-21 Asml Netherlands B.V. Substrate measurement recipe configuration to improve device matching
WO2018001751A1 (en) 2016-06-30 2018-01-04 Asml Holding N.V. Method and device for pupil illumination in overlay and critical dimension sensors
WO2018001747A1 (en) 2016-07-01 2018-01-04 Asml Netherlands B.V. Illumination system for a lithographic or inspection apparatus
CN113552779A (zh) 2016-07-15 2021-10-26 Asml荷兰有限公司 用于量测目标场的设计的方法和设备
JP6716779B2 (ja) 2016-07-21 2020-07-01 エーエスエムエル ネザーランズ ビー.ブイ. ターゲットの測定方法、基板、計測装置およびリソグラフィ装置
EP3279736A1 (en) 2016-08-01 2018-02-07 ASML Netherlands B.V. Device and method for processing a radiation beam with coherence
WO2018028971A1 (en) 2016-08-11 2018-02-15 Asml Holding N.V. Variable corrector of a wave front
WO2018033342A1 (en) 2016-08-17 2018-02-22 Asml Netherlands B.V. Substrate measurement recipe design of, or for, a target including a latent image
KR102221714B1 (ko) 2016-08-23 2021-03-03 에이에스엠엘 네델란즈 비.브이. 리소그래피 공정에 의해 기판 상에 형성된 구조체를 측정하는 메트롤로지 장치, 리소그래피 시스템, 및 리소그래피 공정에 의해 기판 상에 형성된 구조체를 측정하는 방법
WO2018041550A1 (en) 2016-09-01 2018-03-08 Asml Netherlands B.V. Automatic selection of metrology target measurement recipes
EP3290911A1 (en) 2016-09-02 2018-03-07 ASML Netherlands B.V. Method and system to monitor a process apparatus
WO2018046278A1 (en) 2016-09-06 2018-03-15 Asml Holding N.V. Method and device for focusing in an inspection system
EP3291008A1 (en) 2016-09-06 2018-03-07 ASML Netherlands B.V. Method and apparatus to monitor a process apparatus
EP3293574A1 (en) 2016-09-09 2018-03-14 ASML Netherlands B.V. Metrology method, apparatus and computer program
EP3293575A1 (en) 2016-09-12 2018-03-14 ASML Netherlands B.V. Differential target design and method for process metrology
IL265585B (en) 2016-09-27 2022-09-01 Asml Netherlands Bv Choosing a metrological recipe
EP3299890A1 (en) 2016-09-27 2018-03-28 ASML Netherlands B.V. Metrology recipe selection
EP3309616A1 (en) 2016-10-14 2018-04-18 ASML Netherlands B.V. Method of inspecting a substrate, metrology apparatus, and lithographic system
DE102016221243A1 (de) 2016-10-27 2017-11-09 Carl Zeiss Smt Gmbh Verfahren und Vorrichtung zur Charakterisierung eines durch wenigstens einen Lithographieschritt strukturierten Wafers
EP3321737A1 (en) 2016-11-10 2018-05-16 ASML Netherlands B.V. Method for determining an optimized set of measurement locations for measurement of a parameter of a lithographic process, metrology system
EP3321738A1 (en) 2016-11-10 2018-05-16 ASML Netherlands B.V. Method of measuring a parameter of a device manufacturing process, metrology apparatus, substrate, target, device manufacturing system, and device manufacturing method
WO2018087207A1 (en) 2016-11-10 2018-05-17 Asml Netherlands B.V. Design and correction using stack difference
EP3321736A1 (en) 2016-11-10 2018-05-16 ASML Netherlands B.V. Measurement system, lithographic system, and method of measuring a target
EP3333632A1 (en) 2016-12-08 2018-06-13 ASML Netherlands B.V. Metrology apparatus
EP3333633A1 (en) 2016-12-09 2018-06-13 ASML Netherlands B.V. Methods and apparatus for predicting performance of a measurement method, measurement method and apparatus
US10983005B2 (en) 2016-12-15 2021-04-20 Taiwan Semiconductor Manufacturing Co., Ltd. Spectroscopic overlay metrology
EP3336605A1 (en) 2016-12-15 2018-06-20 ASML Netherlands B.V. Method of measuring a structure, inspection apparatus, lithographic system and device manufacturing method
EP3336607A1 (en) 2016-12-16 2018-06-20 ASML Netherlands B.V. Method of measuring a property of a substrate, inspection apparatus, lithographic system and device manufacturing method
EP3336606A1 (en) 2016-12-16 2018-06-20 ASML Netherlands B.V. Method for monitoring a characteristic of illumination from a metrology apparatus
EP3796088A1 (en) 2019-09-23 2021-03-24 ASML Netherlands B.V. Method and apparatus for lithographic process performance determination
EP3343294A1 (en) 2016-12-30 2018-07-04 ASML Netherlands B.V. Lithographic process & apparatus and inspection process and apparatus
CN108345177B (zh) * 2017-01-24 2020-06-30 台湾积体电路制造股份有限公司 层迭误差测量装置及方法
US10409171B2 (en) * 2017-01-25 2019-09-10 Kla-Tencor Corporation Overlay control with non-zero offset prediction
EP3358413A1 (en) 2017-02-02 2018-08-08 ASML Netherlands B.V. Metrology method, apparatus and computer program
CN110249268B (zh) 2017-02-02 2021-08-24 Asml荷兰有限公司 量测方法和设备以及关联的计算机产品
EP3361315A1 (en) 2017-02-09 2018-08-15 ASML Netherlands B.V. Inspection apparatus and method of inspecting structures
KR102370339B1 (ko) 2017-02-22 2022-03-04 에이에스엠엘 네델란즈 비.브이. 전산 계측
WO2018172027A1 (en) 2017-03-23 2018-09-27 Asml Netherlands B.V. Asymmetry monitoring of a structure
JP6933725B2 (ja) 2017-04-14 2021-09-08 エーエスエムエル ネザーランズ ビー.ブイ. 測定方法、デバイス製造方法、計測装置およびリソグラフィシステム
EP3388896A1 (en) 2017-04-14 2018-10-17 ASML Netherlands B.V. Method of measuring
IL270171B2 (en) 2017-04-28 2023-12-01 Asml Netherlands Bv Method and apparatus for metrology and related computer software
WO2018202388A1 (en) 2017-05-03 2018-11-08 Asml Netherlands B.V. Metrology parameter determination and metrology recipe selection
US11016396B2 (en) 2017-05-04 2021-05-25 Asml Holding N.V Method, substrate and apparatus to measure performance of optical metrology
EP3399371A1 (en) 2017-05-05 2018-11-07 ASML Netherlands B.V. Method of measuring a parameter of interest, device manufacturing method, metrology apparatus, and lithographic system
JP2020519928A (ja) 2017-05-08 2020-07-02 エーエスエムエル ネザーランズ ビー.ブイ. 構造を測定する方法、検査装置、リソグラフィシステム、及びデバイス製造方法
EP3401733A1 (en) 2017-05-08 2018-11-14 ASML Netherlands B.V. Method of measuring a structure, inspection apparatus, lithographic system and device manufacturing method
EP3404488A1 (en) 2017-05-19 2018-11-21 ASML Netherlands B.V. Method of measuring a target, metrology apparatus, lithographic cell, and target
WO2018215177A1 (en) 2017-05-24 2018-11-29 Asml Netherlands B.V. Method of measuring a parameter of interest, inspection apparatus, lithographic system and device manufacturing method
CN108962776B (zh) * 2017-05-26 2021-05-18 台湾积体电路制造股份有限公司 半导体装置及其制造方法和覆盖误差的测量方法
US11029673B2 (en) 2017-06-13 2021-06-08 Pdf Solutions, Inc. Generating robust machine learning predictions for semiconductor manufacturing processes
KR102340174B1 (ko) 2017-06-20 2021-12-16 에이에스엠엘 네델란즈 비.브이. 엣지 러프니스 파라미터 결정
EP3467589A1 (en) 2017-10-06 2019-04-10 ASML Netherlands B.V. Determining edge roughness parameters
EP3422103A1 (en) 2017-06-26 2019-01-02 ASML Netherlands B.V. Method of determining a performance parameter of a process
EP3422102A1 (en) 2017-06-26 2019-01-02 ASML Netherlands B.V. Methods and patterning devices and apparatuses for measuring focus performance of a lithographic apparatus, device manufacturing method
US10663633B2 (en) * 2017-06-29 2020-05-26 Taiwan Semiconductor Manufacturing Co., Ltd. Aperture design and methods thereof
EP3422105A1 (en) 2017-06-30 2019-01-02 ASML Netherlands B.V. Metrology parameter determination and metrology recipe selection
US10817999B2 (en) * 2017-07-18 2020-10-27 Kla Corporation Image-based overlay metrology and monitoring using through-focus imaging
WO2019015995A1 (en) 2017-07-18 2019-01-24 Asml Netherlands B.V. METHODS AND APPARATUS FOR MEASURING A PARAMETER OF A CHARACTERISTIC MANUFACTURED ON A SEMICONDUCTOR SUBSTRATE
EP3432072A1 (en) 2017-07-18 2019-01-23 ASML Netherlands B.V. Methods and apparatus for measurement of a parameter of a feature fabricated on a semiconductor substrate
WO2019020484A1 (en) 2017-07-25 2019-01-31 Asml Netherlands B.V. METHOD FOR DETERMINING PARAMETERS AND ASSOCIATED APPARATUS
EP3435162A1 (en) 2017-07-28 2019-01-30 ASML Netherlands B.V. Metrology method and apparatus and computer program
EP3441819A1 (en) 2017-08-07 2019-02-13 ASML Netherlands B.V. Computational metrology
US11067902B2 (en) 2017-08-07 2021-07-20 Asml Netherlands B.V. Computational metrology
EP3441820A1 (en) 2017-08-11 2019-02-13 ASML Netherlands B.V. Methods and apparatus for determining the position of a spot of radiation and inspection apparatus
EP3444674A1 (en) 2017-08-14 2019-02-20 ASML Netherlands B.V. Method and apparatus to determine a patterning process parameter
EP3444676A1 (en) 2017-08-15 2019-02-20 ASML Netherlands B.V. Metrology method, apparatus and computer program
EP3447580A1 (en) 2017-08-21 2019-02-27 ASML Netherlands B.V. Method of calibrating focus measurements, measurement method and metrology apparatus, lithographic system and device manufacturing method
WO2019038054A1 (en) 2017-08-23 2019-02-28 Asml Netherlands B.V. METHOD FOR DETERMINING A PARAMETER OF A PATTERN TRANSFER PROCESS, DEVICE MANUFACTURING METHOD
US11022642B2 (en) 2017-08-25 2021-06-01 Pdf Solutions, Inc. Semiconductor yield prediction
EP3451060A1 (en) 2017-08-28 2019-03-06 ASML Netherlands B.V. Substrate, metrology apparatus and associated methods for a lithographic process
CN111066096A (zh) 2017-09-01 2020-04-24 Asml荷兰有限公司 光学系统、量测装置及相关联的方法
EP3451061A1 (en) 2017-09-04 2019-03-06 ASML Netherlands B.V. Method for monitoring a manufacturing process
EP3454123A1 (en) 2017-09-06 2019-03-13 ASML Netherlands B.V. Metrology method and apparatus
EP3454129A1 (en) 2017-09-07 2019-03-13 ASML Netherlands B.V. Beat patterns for alignment on small metrology targets
EP3454124A1 (en) 2017-09-07 2019-03-13 ASML Netherlands B.V. Method to determine a patterning process parameter
EP3454126A1 (en) 2017-09-08 2019-03-13 ASML Netherlands B.V. Method for estimating overlay
EP3454127A1 (en) 2017-09-11 2019-03-13 ASML Netherlands B.V. Methods and patterning devices and apparatuses for measuring focus performance of a lithographic apparatus, device manufacturing method
EP3462239A1 (en) 2017-09-27 2019-04-03 ASML Netherlands B.V. Metrology in lithographic processes
IL273145B2 (en) 2017-09-11 2024-03-01 Asml Netherlands Bv Lithographic processes in meteorology
IL273110B2 (en) 2017-09-11 2024-03-01 Asml Netherlands Bv Patterning methods and devices and devices for measuring focus performance of a lithographic device, method of device manufacture
EP3457211A1 (en) 2017-09-13 2019-03-20 ASML Netherlands B.V. A method of aligning a pair of complementary diffraction patterns and associated metrology method and apparatus
EP3457212A1 (en) 2017-09-18 2019-03-20 ASML Netherlands B.V. Method of controlling a patterning process, device manufacturing method
EP3460574A1 (en) 2017-09-22 2019-03-27 ASML Netherlands B.V. Method to determine a patterning process parameter
WO2019057578A1 (en) 2017-09-22 2019-03-28 Asml Netherlands B.V. METHOD FOR DETERMINING A PARAMETER OF PATTERN CREATION PROCESS
CN111149062B (zh) 2017-09-28 2022-11-04 Asml控股股份有限公司 量测方法和装置
EP3480554A1 (en) 2017-11-02 2019-05-08 ASML Netherlands B.V. Metrology apparatus and method for determining a characteristic of one or more structures on a substrate
JP7124071B2 (ja) * 2017-10-05 2022-08-23 エーエスエムエル ネザーランズ ビー.ブイ. 基板上の1つ又は複数の構造の特性を決定するためのメトロロジシステムおよび方法
TW201923332A (zh) 2017-10-10 2019-06-16 荷蘭商Asml荷蘭公司 度量衡方法和設備、電腦程式及微影系統
EP3470923A1 (en) 2017-10-10 2019-04-17 ASML Netherlands B.V. Metrology method
EP3470924A1 (en) 2017-10-11 2019-04-17 ASML Netherlands B.V. Method of optimizing the position and/or size of a measurement illumination spot relative to a target on a substrate, and associated apparatus
EP3470926A1 (en) * 2017-10-16 2019-04-17 ASML Netherlands B.V. Metrology apparatus, lithographic system, and method of measuring a structure
EP3474074A1 (en) 2017-10-17 2019-04-24 ASML Netherlands B.V. Scatterometer and method of scatterometry using acoustic radiation
CN111279268B (zh) 2017-10-26 2022-04-01 Asml荷兰有限公司 确定所关注的参数的值的方法、清除包含关于所关注的参数的信息的信号的方法
EP3477391A1 (en) 2017-10-26 2019-05-01 ASML Netherlands B.V. Method of determining a value of a parameter of interest, method of cleaning a signal containing information about a parameter of interest
EP3477392A1 (en) 2017-10-31 2019-05-01 ASML Netherlands B.V. Metrology apparatus, method of measuring a structure, device manufacturing method
WO2019086221A1 (en) 2017-10-31 2019-05-09 Asml Netherlands B.V. Metrology apparatus, method of measuring a structure, device manufacturing method
EP3480659A1 (en) 2017-11-01 2019-05-08 ASML Netherlands B.V. Estimation of data in metrology
KR102408786B1 (ko) 2017-11-07 2022-06-13 에이에스엠엘 네델란즈 비.브이. 관심 특성을 결정하는 계측 장치 및 방법
EP3499312A1 (en) 2017-12-15 2019-06-19 ASML Netherlands B.V. Metrology apparatus and a method of determining a characteristic of interest
EP3489756A1 (en) 2017-11-23 2019-05-29 ASML Netherlands B.V. Method and apparatus to determine a patterning process parameter
WO2019110211A1 (en) 2017-12-04 2019-06-13 Asml Netherlands B.V. Measurement method, patterning device and device manufacturing method
EP3492984A1 (en) 2017-12-04 2019-06-05 ASML Netherlands B.V. Measurement method, inspection apparatus, patterning device, lithographic system and device manufacturing method
EP3492985A1 (en) 2017-12-04 2019-06-05 ASML Netherlands B.V. Method of determining information about a patterning process, method of reducing error in measurement data, method of calibrating a metrology process, method of selecting metrology targets
US10310281B1 (en) * 2017-12-05 2019-06-04 K Laser Technology, Inc. Optical projector with off-axis diffractive element
EP3495888A1 (en) 2017-12-06 2019-06-12 ASML Netherlands B.V. Method for controlling a lithographic apparatus and associated apparatuses
EP3495889A1 (en) 2017-12-07 2019-06-12 ASML Netherlands B.V. Method for controlling a manufacturing apparatus and associated apparatuses
US10473460B2 (en) * 2017-12-11 2019-11-12 Kla-Tencor Corporation Overlay measurements of overlapping target structures based on symmetry of scanning electron beam signals
CN111480113A (zh) 2017-12-12 2020-07-31 Asml荷兰有限公司 用于确定与表膜相关的状态的设备和方法
EP3499311A1 (en) 2017-12-14 2019-06-19 ASML Netherlands B.V. Method for controlling a manufacturing apparatus and associated aparatuses
JP2021508078A (ja) 2017-12-19 2021-02-25 エーエスエムエル ネザーランズ ビー.ブイ. 計算メトロロジに基づく補正および制御
WO2019121486A1 (en) 2017-12-22 2019-06-27 Asml Netherlands B.V. Process window based on defect probability
EP3528048A1 (en) 2018-02-15 2019-08-21 ASML Netherlands B.V. A metrology apparatus for and a method of determining a characteristic of interest of a structure on a substrate
CN111542783A (zh) 2017-12-28 2020-08-14 Asml荷兰有限公司 用于确定衬底上的结构的感兴趣的特性的量测设备与方法
CN111512238B (zh) 2017-12-28 2024-01-30 Asml荷兰有限公司 从设备部件中移除污染物颗粒的设备和方法
EP3506011A1 (en) 2017-12-28 2019-07-03 ASML Netherlands B.V. Apparatus for and a method of removing contaminant particles from a component of a metrology apparatus
WO2019129485A1 (en) 2017-12-29 2019-07-04 Asml Netherlands B.V. Method and device for determining adjustments to sensitivity parameters
WO2019129468A1 (en) 2017-12-29 2019-07-04 Asml Netherlands B.V. Method of processing data, method of obtaining calibration data
CN111615667A (zh) 2018-01-17 2020-09-01 Asml荷兰有限公司 测量目标的方法和量测设备
EP3514628A1 (en) 2018-01-18 2019-07-24 ASML Netherlands B.V. Method of measuring a target, and metrology apparatus
WO2019145092A1 (en) 2018-01-24 2019-08-01 Asml Netherlands B.V. Computational metrology based sampling scheme
EP3518040A1 (en) 2018-01-30 2019-07-31 ASML Netherlands B.V. A measurement apparatus and a method for determining a substrate grid
WO2019149586A1 (en) 2018-01-30 2019-08-08 Asml Netherlands B.V. Method of patterning at least a layer of a semiconductor device
EP3521930A1 (en) 2018-02-02 2019-08-07 ASML Netherlands B.V. Method of optimizing a metrology process
EP3521929A1 (en) 2018-02-02 2019-08-07 ASML Netherlands B.V. Method of determining an optimal focus height for a metrology apparatus
EP3528047A1 (en) 2018-02-14 2019-08-21 ASML Netherlands B.V. Method and apparatus for measuring a parameter of interest using image plane detection techniques
EP3531205A1 (en) 2018-02-22 2019-08-28 ASML Netherlands B.V. Control based on probability density function of parameter
WO2019162280A1 (en) 2018-02-23 2019-08-29 Asml Netherlands B.V. Guided patterning device inspection
US11379970B2 (en) 2018-02-23 2022-07-05 Asml Netherlands B.V. Deep learning for semantic segmentation of pattern
WO2019166190A1 (en) 2018-02-27 2019-09-06 Stichting Vu Metrology apparatus and method for determining a characteristic of one or more structures on a substrate
EP3531191A1 (en) 2018-02-27 2019-08-28 Stichting VU Metrology apparatus and method for determining a characteristic of one or more structures on a substrate
US11775714B2 (en) 2018-03-09 2023-10-03 Pdf Solutions, Inc. Rational decision-making tool for semiconductor processes
US11029359B2 (en) 2018-03-09 2021-06-08 Pdf Solutions, Inc. Failure detection and classsification using sensor data and/or measurement data
US10777470B2 (en) 2018-03-27 2020-09-15 Pdf Solutions, Inc. Selective inclusion/exclusion of semiconductor chips in accelerated failure tests
EP3547031A1 (en) 2018-03-29 2019-10-02 ASML Netherlands B.V. Method for evaluating control strategies in a semicondcutor manufacturing process
EP3547030A1 (en) 2018-03-29 2019-10-02 ASML Netherlands B.V. Method for evaluating control strategies in a semicondcutor manufacturing process
EP3547029A1 (en) 2018-03-29 2019-10-02 ASML Netherlands B.V. Control method for a scanning exposure apparatus
WO2019185230A1 (en) 2018-03-29 2019-10-03 Asml Netherlands B.V. Control method for a scanning exposure apparatus
EP3553602A1 (en) 2018-04-09 2019-10-16 ASML Netherlands B.V. Model based reconstruction of semiconductor structures
NL2021848A (en) 2018-04-09 2018-11-06 Stichting Vu Holographic metrology apparatus.
US11054250B2 (en) 2018-04-11 2021-07-06 International Business Machines Corporation Multi-channel overlay metrology
EP3553603A1 (en) 2018-04-13 2019-10-16 ASML Netherlands B.V. Metrology method and apparatus, computer program and lithographic system
EP3557327A1 (en) 2018-04-18 2019-10-23 ASML Netherlands B.V. Method of determining a value of a parameter of interest of a target formed by a patterning process
EP3570109A1 (en) 2018-05-14 2019-11-20 ASML Netherlands B.V. Illumination source for an inspection apparatus, inspection apparatus and inspection method
TWI791196B (zh) 2018-05-24 2023-02-01 荷蘭商Asml荷蘭公司 判定基板之堆疊組態之方法及其相關非暫時性電腦可讀媒體
EP3575874A1 (en) 2018-05-29 2019-12-04 ASML Netherlands B.V. Metrology method, apparatus and computer program
JP7182904B2 (ja) * 2018-05-31 2022-12-05 キヤノン株式会社 検出装置、インプリント装置、平坦化装置、検出方法及び物品製造方法
EP3575875A1 (en) 2018-05-31 2019-12-04 ASML Netherlands B.V. Measurement apparatus and method of measuring a target
EP3579052A1 (en) 2018-06-08 2019-12-11 ASML Netherlands B.V. Metrology apparatus and method for determining a characteristic of one or more structures on a substrate
CN116758012A (zh) 2018-06-08 2023-09-15 Asml荷兰有限公司 确定与在衬底上的结构相关的感兴趣的特性的方法、掩模版、衬底
CN112262345B (zh) 2018-06-13 2024-03-12 Asml荷兰有限公司 量测设备
EP3614207A1 (en) 2018-08-21 2020-02-26 ASML Netherlands B.V. Metrology apparatus
EP3582009A1 (en) 2018-06-15 2019-12-18 ASML Netherlands B.V. Reflector and method of manufacturing a reflector
KR20210013605A (ko) 2018-06-19 2021-02-04 에이에스엠엘 네델란즈 비.브이. 제조 장치 및 연계된 장치를 제어하는 방법
EP3584637A1 (en) 2018-06-19 2019-12-25 ASML Netherlands B.V. Method for controlling a manufacturing apparatus and associated apparatuses
EP3588190A1 (en) 2018-06-25 2020-01-01 ASML Netherlands B.V. Method for performing a manufacturing process and associated apparatuses
KR102463503B1 (ko) * 2018-07-11 2022-11-03 현대자동차주식회사 터보차저 엔진의 부스트압 제어 시스템
EP3598235A1 (en) 2018-07-18 2020-01-22 ASML Netherlands B.V. Metrology apparatus and method for determining a characteristic relating to one or more structures on a substrate
WO2020020759A1 (en) 2018-07-26 2020-01-30 Asml Netherlands B.V. Method for determining an etch profile of a layer of a wafer for a simulation system
EP3605230A1 (en) 2018-08-01 2020-02-05 Stichting VU Metrology apparatus and method for determining a characteristic of one or more structures on a substrate
NL2021852A (en) * 2018-08-01 2018-11-09 Asml Netherlands Bv Metrology apparatus and method for determining a characteristic of one or more structures on a substrate
EP3611569A1 (en) 2018-08-16 2020-02-19 ASML Netherlands B.V. Metrology apparatus and photonic crystal fiber
EP3611570A1 (en) 2018-08-16 2020-02-19 ASML Netherlands B.V. Method for controlling a manufacturing process and associated apparatuses
TWI824334B (zh) 2018-08-17 2023-12-01 荷蘭商Asml荷蘭公司 非暫時性電腦可讀媒體
EP3614194A1 (en) 2018-08-24 2020-02-26 ASML Netherlands B.V. Matching pupil determination
EP3620857A1 (en) 2018-09-04 2020-03-11 ASML Netherlands B.V. Metrology apparatus
CN112639622B (zh) 2018-09-04 2024-03-19 Asml荷兰有限公司 量测设备
EP3623868A1 (en) 2018-09-12 2020-03-18 ASML Netherlands B.V. Metrology apparatus and method for determining a characteristic of one or more structures on a substrate
EP3623869A1 (en) 2018-09-14 2020-03-18 ASML Netherlands B.V. Method for measuring a parameter of a structure formed using a lithographic process
WO2020057900A1 (en) 2018-09-19 2020-03-26 Asml Netherlands B.V. Metrology sensor for position metrology
WO2020058388A1 (en) 2018-09-19 2020-03-26 Asml Netherlands B.V. Metrology method and apparatus thereof
EP3627226A1 (en) 2018-09-20 2020-03-25 ASML Netherlands B.V. Optical system, metrology apparatus and associated method
EP3629086A1 (en) 2018-09-25 2020-04-01 ASML Netherlands B.V. Method and apparatus for determining a radiation beam intensity profile
EP3629087A1 (en) 2018-09-26 2020-04-01 ASML Netherlands B.V. Method of manufacturing devices
US11087065B2 (en) 2018-09-26 2021-08-10 Asml Netherlands B.V. Method of manufacturing devices
TW202020577A (zh) 2018-09-28 2020-06-01 荷蘭商Asml荷蘭公司 基於晶圓量測判定熱點排序
EP3629088A1 (en) 2018-09-28 2020-04-01 ASML Netherlands B.V. Providing a trained neural network and determining a characteristic of a physical system
US10996570B2 (en) 2018-10-08 2021-05-04 Asml Netherlands B.V. Metrology method, patterning device, apparatus and computer program
EP3637186A1 (en) 2018-10-09 2020-04-15 ASML Netherlands B.V. Method of calibrating a plurality of metrology apparatuses, method of determining a parameter of interest, and metrology apparatus
EP3637187A1 (en) 2018-10-12 2020-04-15 ASML Netherlands B.V. Method for measuring focus performance of a lithographic apparatus
US11118903B2 (en) * 2018-10-17 2021-09-14 Kla Corporation Efficient illumination shaping for scatterometry overlay
SG11202103803QA (en) 2018-10-24 2021-05-28 Asml Netherlands Bv Optical fibers and production methods therefor
EP3647874A1 (en) 2018-11-05 2020-05-06 ASML Netherlands B.V. Optical fibers and production methods therefor
EP3647871A1 (en) 2018-10-31 2020-05-06 ASML Netherlands B.V. Method of determing a value of a parameter of interest of a patterning process, device manufacturing method
WO2020094385A1 (en) 2018-11-08 2020-05-14 Asml Netherlands B.V. Prediction of out of specification based on spatial characteristic of process variability
EP3650941A1 (en) 2018-11-12 2020-05-13 ASML Netherlands B.V. Method of determining the contribution of a processing apparatus to a substrate parameter
EP3654103A1 (en) 2018-11-14 2020-05-20 ASML Netherlands B.V. Method for obtaining training data for training a model of a semicondcutor manufacturing process
EP3654104A1 (en) 2018-11-16 2020-05-20 ASML Netherlands B.V. Method for monitoring lithographic apparatus
WO2020099050A1 (en) 2018-11-16 2020-05-22 Asml Netherlands B.V. Method for monitoring lithographic apparatus
EP3657256A1 (en) 2018-11-20 2020-05-27 ASML Netherlands B.V. Methods and patterning devices and apparatuses for measuring focus performance of a lithographic apparatus, device manufacturing method
EP3657257A1 (en) 2018-11-26 2020-05-27 ASML Netherlands B.V. Method for of measuring a focus parameter relating to a structure formed using a lithographic process
WO2020114684A1 (en) 2018-12-03 2020-06-11 Asml Netherlands B.V. Method of manufacturing devices
CN113168119B (zh) 2018-12-04 2024-05-14 Asml荷兰有限公司 用于测量光刻过程的参数的目标
EP3663856A1 (en) 2018-12-07 2020-06-10 ASML Netherlands B.V. Method for adjusting a target feature in a model of a patterning process based on local electric fields
KR20200072311A (ko) 2018-12-12 2020-06-22 삼성전자주식회사 반도체 소자 제조 방법
US20220028052A1 (en) 2018-12-14 2022-01-27 Asml Netherlands B.V. Apparatus and method for grouping image patterns to determine wafer behavior in a patterning process
EP3671346A1 (en) 2018-12-18 2020-06-24 ASML Netherlands B.V. Method of measuring a parameter of a patterning process, metrology apparatus, target
WO2020126266A1 (en) 2018-12-18 2020-06-25 Asml Netherlands B.V. Method of measuring a parameter of a patterning process, metrology apparatus, target
CN113196177B (zh) 2018-12-20 2024-04-30 Asml荷兰有限公司 量测传感器、照射系统、和产生具有能够配置的照射斑直径的测量照射的方法
CN113227907A (zh) 2018-12-28 2021-08-06 Asml荷兰有限公司 基于来自经印刷的衬底的测量反馈确定图案分级
WO2020141050A1 (en) 2018-12-31 2020-07-09 Asml Netherlands B.V. Position metrology apparatus and associated optical elements
KR20210096659A (ko) 2018-12-31 2021-08-05 에이에스엠엘 네델란즈 비.브이. 계측 방법
WO2020141049A1 (en) 2018-12-31 2020-07-09 Asml Netherlands B.V. Method for metrology optimization
EP3715951A1 (en) 2019-03-28 2020-09-30 ASML Netherlands B.V. Position metrology apparatus and associated optical elements
WO2020141085A1 (en) 2018-12-31 2020-07-09 Asml Netherlands B.V. Method for overlay metrology and apparatus thereof
US11892776B2 (en) 2018-12-31 2024-02-06 Asml Netherlands B.V. Imaging via zeroth order suppression
US11733615B2 (en) 2019-01-03 2023-08-22 Asml Netherlands B.V. Methods and patterning devices and apparatuses for measuring focus performance of a lithographic apparatus, device manufacturing method
EP3696606A1 (en) 2019-02-15 2020-08-19 ASML Netherlands B.V. A metrology apparatus with radiation source having multiple broadband outputs
EP3703114A1 (en) 2019-02-26 2020-09-02 ASML Netherlands B.V. Reflector manufacturing method and associated reflector
EP3702840A1 (en) 2019-03-01 2020-09-02 ASML Netherlands B.V. Alignment method and associated metrology device
EP3705942A1 (en) 2019-03-04 2020-09-09 ASML Netherlands B.V. Hollow-core photonic crystal fiber based optical component for broadband radiation generation
EP3705945A1 (en) 2019-03-08 2020-09-09 ASML Netherlands B.V. Methods and apparatus for estimating substrate shape
EP3764164A1 (en) 2019-07-11 2021-01-13 ASML Netherlands B.V. Method for controlling a lithographic apparatus and associated apparatuses
US20220146946A1 (en) 2019-03-22 2022-05-12 Asml Netherlands B.V. Method for controlling a lithographic apparatus and associated apparatuses
JP7281553B2 (ja) 2019-03-25 2023-05-25 エーエスエムエル ネザーランズ ビー.ブイ. 周波数拡大装置及び方法
EP3715944A1 (en) 2019-03-25 2020-09-30 ASML Netherlands B.V. Frequency broadening apparatus and method
EP3719545A1 (en) 2019-04-03 2020-10-07 ASML Netherlands B.V. Manufacturing a reflective diffraction grating
EP3948373A1 (en) 2019-04-03 2022-02-09 ASML Netherlands B.V. Optical fiber
EP3719551A1 (en) 2019-04-03 2020-10-07 ASML Netherlands B.V. Optical fiber
EP3734366A1 (en) 2019-05-03 2020-11-04 ASML Netherlands B.V. Sub-field control of a lithographic process and associated apparatus
JP7288974B2 (ja) 2019-04-04 2023-06-08 エーエスエムエル ネザーランズ ビー.ブイ. リソグラフィプロセスのサブフィールド制御および関連する装置
EP3731018A1 (en) 2019-04-23 2020-10-28 ASML Netherlands B.V. A method for re-imaging an image and associated metrology apparatus
WO2020224882A1 (en) 2019-05-06 2020-11-12 Asml Netherlands B.V. Dark field microscope
EP3742230A1 (en) 2019-05-23 2020-11-25 ASML Netherlands B.V. Detection apparatus for simultaneous acquisition of multiple diverse images of an object
WO2020229049A1 (en) 2019-05-13 2020-11-19 Asml Netherlands B.V. Detection apparatus for simultaneous acquisition of multiple diverse images of an object
EP3739389A1 (en) 2019-05-17 2020-11-18 ASML Netherlands B.V. Metrology tools comprising aplanatic objective singlet
EP3751342A1 (en) 2019-06-13 2020-12-16 Stichting VU Metrology method and method for training a data structure for use in metrology
CN114008531A (zh) 2019-06-17 2022-02-01 Asml荷兰有限公司 用于确定复值场的量测方法和装置
EP3754427A1 (en) 2019-06-17 2020-12-23 ASML Netherlands B.V. Metrology method and apparatus for of determining a complex-valued field
CN114008533A (zh) 2019-06-20 2022-02-01 Asml荷兰有限公司 用于图案化过程建模的方法
KR20220008912A (ko) 2019-06-21 2022-01-21 에이에스엠엘 네델란즈 비.브이. 장착된 중공 코어 섬유 배열체
EP3767347A1 (en) 2019-07-17 2021-01-20 ASML Netherlands B.V. Mounted hollow-core fibre arrangement
EP3758168A1 (en) 2019-06-25 2020-12-30 ASML Netherlands B.V. Hollow-core photonic crystal fiber based optical component for broadband radiation generation
US11635682B2 (en) 2019-06-26 2023-04-25 Kla Corporation Systems and methods for feedforward process control in the manufacture of semiconductor devices
WO2021001102A1 (en) 2019-07-02 2021-01-07 Asml Netherlands B.V. Metrology method and associated metrology and lithographic apparatuses
EP3994526A1 (en) 2019-07-03 2022-05-11 ASML Netherlands B.V. Method for applying a deposition model in a semiconductor manufacturing process
EP3767391A1 (en) 2019-07-17 2021-01-20 ASML Netherlands B.V. Sub-field control of a lithographic process and associated apparatus
US20220244649A1 (en) 2019-07-04 2022-08-04 Asml Netherlands B.V. Sub-field control of a lithographic process and associated apparatus
CN114080536A (zh) 2019-07-08 2022-02-22 Asml荷兰有限公司 量测方法和相关的计算机产品
EP3786712A1 (en) 2019-08-28 2021-03-03 ASML Netherlands B.V. Light sources and methods of controlling; devices and methods for use in measurement applications
CN114008530B (zh) 2019-07-16 2024-05-31 Asml荷兰有限公司 光源及控制方法;用于测量应用的装置和方法
EP3767375A1 (en) 2019-07-19 2021-01-20 ASML Netherlands B.V. A light source and a method for use in metrology applications
EP3611567A3 (en) 2019-07-23 2020-05-13 ASML Netherlands B.V. Improvements in metrology targets
EP3796080A1 (en) 2019-09-18 2021-03-24 ASML Netherlands B.V. Radiation source
KR20220024908A (ko) 2019-07-24 2022-03-03 에이에스엠엘 네델란즈 비.브이. 방사선 소스
EP3770682A1 (en) 2019-07-25 2021-01-27 ASML Netherlands B.V. Method and system for determining information about a target structure
US20220283122A1 (en) 2019-08-14 2022-09-08 Asml Netherlands B.V. Method and metrology tool for determining information about a target structure, and cantilever probe
EP3779600A1 (en) 2019-08-14 2021-02-17 ASML Netherlands B.V. Method and metrology tool for determining information about a target structure, and cantilever probe
EP3783436A1 (en) 2019-08-19 2021-02-24 ASML Netherlands B.V. Illumination and detection apparatus for a metrology apparatus
EP3783439A1 (en) 2019-08-22 2021-02-24 ASML Netherlands B.V. Metrology device and detection apparatus therefor
KR20220039793A (ko) 2019-08-29 2022-03-29 에이에스엠엘 네델란즈 비.브이. 광원에 대한 단부 패싯 보호 및 계측 응용들에서 사용하기 위한 방법
EP3786700A1 (en) 2019-08-29 2021-03-03 ASML Netherlands B.V. End facet protection for a light source and a method for use in metrology applications
EP3812836A1 (en) 2019-10-21 2021-04-28 ASML Netherlands B.V. End facet protection for a light source and a method for use in metrology applications
CN114341739A (zh) 2019-08-30 2022-04-12 Asml控股股份有限公司 计量系统和方法
EP3786702A1 (en) 2019-09-02 2021-03-03 ASML Netherlands B.V. Mode control of photonic crystal fiber based broadband light sources
EP3786713A1 (en) 2019-09-02 2021-03-03 ASML Netherlands B.V. Metrology method and device for determining a complex-valued field
CN114430875A (zh) 2019-09-02 2022-05-03 Asml荷兰有限公司 基于光子晶体光纤的宽带光源的模式控制
CN114303102B (zh) 2019-09-03 2024-06-11 Asml荷兰有限公司 用于准直宽带辐射的组件
EP3792673A1 (en) 2019-09-16 2021-03-17 ASML Netherlands B.V. Assembly for collimating broadband radiation
EP3790364A1 (en) 2019-09-05 2021-03-10 ASML Netherlands B.V. An improved high harmonic generation apparatus
US20220326152A1 (en) 2019-09-05 2022-10-13 Asml Netherlands B.V. An improved high harmonic generation apparatus
US11359916B2 (en) * 2019-09-09 2022-06-14 Kla Corporation Darkfield imaging of grating target structures for overlay measurement
EP3792693A1 (en) 2019-09-16 2021-03-17 ASML Netherlands B.V. Sub-field control of a lithographic process and associated apparatus
EP3805857A1 (en) 2019-10-09 2021-04-14 ASML Netherlands B.V. Improved broadband radiation generation in hollow-core fibres
EP3796089A1 (en) 2019-09-18 2021-03-24 ASML Holding N.V. A method for filtering an image and associated metrology apparatus
CN114514465A (zh) 2019-09-18 2022-05-17 Asml荷兰有限公司 中空芯部光纤中的改进的宽带辐射生成
EP3798729A1 (en) 2019-09-26 2021-03-31 ASML Netherlands B.V. Method for inferring a processing parameter such as focus and associated appratuses and manufacturing method
CN114450638A (zh) 2019-09-27 2022-05-06 Asml控股股份有限公司 量测系统和相控阵列照射源
WO2021063728A1 (en) 2019-10-02 2021-04-08 Asml Netherlands B.V. Process monitoring and tuning using prediction models
EP3809190A1 (en) 2019-10-14 2021-04-21 ASML Netherlands B.V. Method and apparatus for coherence scrambling in metrology applications
EP3809203A1 (en) 2019-10-17 2021-04-21 ASML Netherlands B.V. Methods of fitting measurement data to a model and modeling a performance parameter distribution and associated apparatuses
CN114830026A (zh) 2019-10-17 2022-07-29 Asml荷兰有限公司 照射源和相关的量测设备
US20240118629A1 (en) 2019-10-17 2024-04-11 Asml Netherlands B.V. Methods of fitting measurement data to a model and modeling a performance parameter distribution and associated apparatuses
EP3839621A1 (en) 2019-12-16 2021-06-23 ASML Netherlands B.V. An illumination source and associated metrology apparatus
WO2021078690A1 (en) 2019-10-24 2021-04-29 Asml Netherlands B.V. Hollow-core photonic crystal fiber based optical component for broadband radiation generation
EP3839586A1 (en) 2019-12-18 2021-06-23 ASML Netherlands B.V. Hollow-core photonic crystal fiber based optical component for broadband radiation generation
EP3816721A1 (en) 2019-10-29 2021-05-05 ASML Netherlands B.V. Method and apparatus for efficient high harmonic generation
KR20220065872A (ko) 2019-11-01 2022-05-20 에이에스엠엘 네델란즈 비.브이. 계측 방법 및 리소그래피 장치
CN114651214A (zh) 2019-11-05 2022-06-21 Asml荷兰有限公司 测量方法和测量设备
EP3869270A1 (en) 2020-02-18 2021-08-25 ASML Netherlands B.V. Assemblies and methods for guiding radiation
CN114641459B (zh) 2019-11-07 2024-05-03 Asml荷兰有限公司 制造用于空芯光子晶体光纤的毛细管的方法
JP7357151B2 (ja) 2019-11-07 2023-10-05 エーエスエムエル ホールディング エヌ.ブイ. リソグラフィ装置の一部を洗浄するためのシステム
EP3819266A1 (en) 2019-11-07 2021-05-12 ASML Netherlands B.V. Method of manufacture of a capillary for a hollow-core photonic crystal fiber
KR20220079662A (ko) 2019-11-11 2022-06-13 에이에스엠엘 네델란즈 비.브이. 리소그래피 시스템을 위한 교정 방법
EP3828632A1 (en) 2019-11-29 2021-06-02 ASML Netherlands B.V. Method and system for predicting electric field images with a parameterized model
US20230004096A1 (en) 2019-11-29 2023-01-05 Asml Netherlands B.V. Method and system for predicting process information with a parameterized model
US11762305B2 (en) 2019-12-05 2023-09-19 Asml Netherlands B.V. Alignment method
CN114830039A (zh) 2019-12-12 2022-07-29 Asml荷兰有限公司 对准方法以及相关对准和光刻设备
CN114868084A (zh) 2019-12-16 2022-08-05 Asml荷兰有限公司 量测方法和相关联的量测和光刻设备
EP3839635A1 (en) 2019-12-17 2021-06-23 ASML Netherlands B.V. Dark field digital holographic microscope and associated metrology method
CN114830043A (zh) 2019-12-17 2022-07-29 Asml荷兰有限公司 暗场数字全息显微镜和相关联的量测方法
WO2021121906A1 (en) 2019-12-18 2021-06-24 Asml Netherlands B.V. Method for correcting measurements in the manufacture of integrated circuits and associated apparatuses
EP3851915A1 (en) 2020-01-14 2021-07-21 ASML Netherlands B.V. Method for correcting measurements in the manufacture of integrated circuits and associated apparatuses
WO2021123135A1 (en) 2019-12-19 2021-06-24 Asml Netherlands B.V. Scatterometer and method of scatterometry using acoustic radiation
KR20220093360A (ko) 2019-12-19 2022-07-05 에이에스엠엘 네델란즈 비.브이. 구조체 내에서 서로 상이한 층에 있는 금속성 피처 사이의 전기적 접촉을 광학적으로 결정하는 방법
EP3839631A1 (en) 2019-12-19 2021-06-23 ASML Netherlands B.V. Determining relative positions of different layers in a structure
EP3839632A1 (en) 2019-12-20 2021-06-23 ASML Netherlands B.V. Method for determining a measurement recipe and associated apparatuses
WO2021130315A1 (en) 2019-12-24 2021-07-01 Asml Netherlands B.V. Method of determining a value of a parameter of interest of a target formed by a patterning process
IL279727A (en) 2019-12-24 2021-06-30 Asml Netherlands Bv Method of determining information about pattern procedure, method of error reduction in measurement data, metrology process calibration method, method of selecting metrology targets
EP3865931A1 (en) 2020-02-12 2021-08-18 ASML Netherlands B.V. Method, assembly, and apparatus for improved control of broadband radiation generation
IL293985B1 (en) 2020-01-15 2024-06-01 Asml Netherlands Bv Method, assembly and device for improved control of broadband radiation generation
WO2021151565A1 (en) 2020-01-28 2021-08-05 Asml Netherlands B.V. Metrology method and associated metrology and lithographic apparatuses
KR20220122743A (ko) 2020-01-29 2022-09-02 에이에스엠엘 네델란즈 비.브이. 기판 상의 주기적 구조체를 측정하는 메트롤로지 방법 및 디바이스
EP3876037A1 (en) 2020-03-06 2021-09-08 ASML Netherlands B.V. Metrology method and device for measuring a periodic structure on a substrate
CN115023654A (zh) 2020-02-07 2022-09-06 Asml荷兰有限公司 工作台系统、工作台系统操作方法、检查工具、光刻设备、校准方法和装置制造方法
EP3869271A1 (en) 2020-02-20 2021-08-25 ASML Netherlands B.V. Method for controlling a manufacturing process and associated apparatuses
EP4104018B1 (en) 2020-02-12 2023-10-25 ASML Netherlands B.V. Computer-implemented method for controlling a manufacturing process
US20230076218A1 (en) 2020-02-21 2023-03-09 Asml Netherlands B.V. Method for calibrating simulation process based on defect-based process window
EP3872567A1 (en) 2020-02-25 2021-09-01 ASML Netherlands B.V. Systems and methods for process metric aware process control
US11852981B2 (en) * 2020-02-27 2023-12-26 Taiwan Semiconductor Manufacturing Company, Ltd. Frequency-picked methodology for diffraction based overlay measurement
US10990023B1 (en) * 2020-02-27 2021-04-27 Taiwan Semiconductor Manufacturing Co., Ltd. Method and apparatus for diffraction-based overlay measurement
EP3879342A1 (en) 2020-03-10 2021-09-15 ASML Netherlands B.V. Method for inferring a local uniformity metric and associated appratuses
WO2021175521A1 (en) 2020-03-02 2021-09-10 Asml Netherlands B.V. Method for inferring a local uniformity metric
EP3882701A1 (en) 2020-03-19 2021-09-22 ASML Netherlands B.V. Method for controlling a manufacturing process and associated apparatuses
CN115244467A (zh) 2020-03-03 2022-10-25 Asml荷兰有限公司 用于控制制造过程的方法和相关联的设备
EP3876036A1 (en) 2020-03-04 2021-09-08 ASML Netherlands B.V. Vibration isolation system and associated applications in lithography
EP3879343A1 (en) 2020-03-11 2021-09-15 ASML Netherlands B.V. Metrology measurement method and apparatus
EP3889681A1 (en) 2020-03-31 2021-10-06 ASML Netherlands B.V. An assembly including a non-linear element and a method of use thereof
CN115552221A (zh) 2020-05-07 2022-12-30 Asml荷兰有限公司 包括目标布置的衬底和相关联的至少一个图案形成装置、光刻方法和量测方法
EP3913429A1 (en) 2020-05-19 2021-11-24 ASML Netherlands B.V. A supercontinuum radiation source and associated metrology devices
WO2021239334A1 (en) 2020-05-26 2021-12-02 Asml Netherlands B.V. Method for optimizing a sampling scheme and associated apparatuses
TW202331426A (zh) 2020-06-01 2023-08-01 荷蘭商Asml控股公司 用於清潔微影設備之一部分之清潔工具及方法
US20230236515A1 (en) 2020-06-09 2023-07-27 Asml Netherlands B.V. A target for measuring a parameter of a lithographic process
WO2021249711A1 (en) 2020-06-10 2021-12-16 Asml Netherlands B.V. Metrology method, metrology apparatus and lithographic apparatus
US20230259042A1 (en) 2020-06-24 2023-08-17 Asml Netherlands B.V. Metrology method and associated metrology and lithographic apparatuses
WO2022002599A1 (en) 2020-07-03 2022-01-06 Asml Netherlands B.V. Process window based on failure rate
KR20230035034A (ko) 2020-07-06 2023-03-10 에이에스엠엘 네델란즈 비.브이. 조명 장치 및 연관된 계측 및 리소그래피 장치
KR20220005361A (ko) 2020-07-06 2022-01-13 삼성전자주식회사 경사 조명을 이용한 회절 기반 계측 장치 및 방법, 그 방법을 이용한 반도체 소자 제조방법
CN115769140A (zh) 2020-07-08 2023-03-07 Asml荷兰有限公司 具有延长的光纤使用寿命的基于空芯光纤的宽带辐射产生器
EP3936936A1 (en) 2020-07-08 2022-01-12 ASML Netherlands B.V. Hollow-core photonic crystal fiber based broadband radiation generator with extended fiber lifetime
EP3944020A1 (en) 2020-07-20 2022-01-26 ASML Netherlands B.V. Method for adjusting a patterning process
JP7511033B2 (ja) 2020-07-09 2024-07-04 エーエスエムエル ネザーランズ ビー.ブイ. メトロロジ方法及び装置並びにコンピュータプログラム
KR20230022237A (ko) 2020-07-09 2023-02-14 에이에스엠엘 네델란즈 비.브이. 인공 신경망을 이용한 동작 제어
WO2022008174A1 (en) 2020-07-09 2022-01-13 Asml Netherlands B.V. Method for adjusting a patterning process
EP3945548A1 (en) 2020-07-30 2022-02-02 ASML Netherlands B.V. Method for classifying semiconductor wafers
CN116134972A (zh) 2020-07-21 2023-05-16 Asml荷兰有限公司 照射源和相关联的量测设备
EP3962241A1 (en) 2020-08-26 2022-03-02 ASML Netherlands B.V. An illumination source and associated metrology apparatus
EP3945367A1 (en) 2020-07-31 2022-02-02 ASML Netherlands B.V. Method for controlling a manufacturing process and associated apparatuses
WO2022017705A1 (en) 2020-07-22 2022-01-27 Asml Netherlands B.V. Method for controlling a manufacturing process and associated apparatuses
WO2022022949A1 (en) 2020-07-28 2022-02-03 Asml Netherlands B.V. Methods and patterning devices and apparatuses for measuring focus performance of a lithographic apparatus, device manufacturing method
CN116113874A (zh) 2020-08-03 2023-05-12 Asml荷兰有限公司 用于产生宽带辐射的方法以及相关联的宽带源和量测装置
EP3974899A1 (en) 2020-09-28 2022-03-30 ASML Netherlands B.V. Method for generating broadband radiation and associated broadband source and metrology device
US20230296829A1 (en) 2020-08-06 2023-09-21 Asml Netherlands B.V. Hollow core fiber light source and a method for manufacturing a hollow core fiber
EP4001976A1 (en) 2020-11-13 2022-05-25 ASML Netherlands B.V. Hollow core fiber light source and a method for manufacturing a hollow core fiber
EP3961303A1 (en) 2020-08-27 2022-03-02 ASML Netherlands B.V. Method and apparatus for identifying contamination in a semiconductor fab
WO2022033793A1 (en) 2020-08-11 2022-02-17 Asml Netherlands B.V. Method and apparatus for identifying contamination in a semiconductor fab
EP3958052A1 (en) 2020-08-20 2022-02-23 ASML Netherlands B.V. Metrology method for measuring an exposed pattern and associated metrology apparatus
EP3961304A1 (en) 2020-08-31 2022-03-02 ASML Netherlands B.V. Mapping metrics between manufacturing systems
EP3964809A1 (en) 2020-09-02 2022-03-09 Stichting VU Wavefront metrology sensor and mask therefor, method for optimizing a mask and associated apparatuses
EP3964892A1 (en) 2020-09-02 2022-03-09 Stichting VU Illumination arrangement and associated dark field digital holographic microscope
EP3968090A1 (en) 2020-09-11 2022-03-16 ASML Netherlands B.V. Radiation source arrangement and metrology device
IL300587A (en) 2020-09-03 2023-04-01 Asml Netherlands Bv Photonic crystal radiation generator based on broadband hollow crystal fibers
EP3988996A1 (en) 2020-10-20 2022-04-27 ASML Netherlands B.V. Hollow-core photonic crystal fiber based broadband radiation generator
EP3971555A1 (en) 2020-09-16 2022-03-23 ASML Netherlands B.V. Method of performing metrology
US20230280662A1 (en) 2020-09-16 2023-09-07 Asml Netherlands B.V. Method of performing metrology, method of training a machine learning model, method of providing a layer comprising a two-dimensional material, metrology apparatus
CN116209958A (zh) 2020-09-28 2023-06-02 Asml荷兰有限公司 目标结构以及相关联的方法和设备
US20230359127A1 (en) 2020-09-28 2023-11-09 Asml Netherlands B.V. Metrology tool with position control of projection system
EP3978964A1 (en) 2020-10-01 2022-04-06 ASML Netherlands B.V. Achromatic optical relay arrangement
KR20220056726A (ko) 2020-10-28 2022-05-06 삼성전자주식회사 디포커스 계측방법과 보정방법, 및 그 보정방법을 포함한 반도체 소자 제조방법
EP4002015A1 (en) 2020-11-16 2022-05-25 ASML Netherlands B.V. Dark field digital holographic microscope and associated metrology method
KR20230104889A (ko) 2020-11-17 2023-07-11 에이에스엠엘 네델란즈 비.브이. 계측 시스템 및 리소그래피 시스템
EP4252073A1 (en) 2020-11-24 2023-10-04 ASML Netherlands B.V. Method of determining mark structure for overlay fingerprints
EP4006640A1 (en) 2020-11-26 2022-06-01 Stichting Nederlandse Wetenschappelijk Onderzoek Instituten Metrology apparatus and metrology methods based on high harmonic generation from a diffractive structure
US20240012342A1 (en) 2020-11-27 2024-01-11 Asml Netherlands B.V. Metrology method and associated metrology and lithographic apparatuses
US20240004312A1 (en) 2020-11-30 2024-01-04 Asml Netherlands B.V. Metrology apparatus based on high harmonic generation and associated method
EP4006641A1 (en) 2020-11-30 2022-06-01 Stichting Nederlandse Wetenschappelijk Onderzoek Instituten Metrology apparatus based on high harmonic generation and associated method
EP4009107A1 (en) 2020-12-01 2022-06-08 ASML Netherlands B.V. Method and apparatus for imaging nonstationary object
JP2023551776A (ja) 2020-12-08 2023-12-13 エーエスエムエル ネザーランズ ビー.ブイ. メトロロジの方法及び関連装置
EP4012492A1 (en) 2020-12-10 2022-06-15 ASML Netherlands B.V. Hollow-core photonic crystal fiber based broadband radiation generator
JP2023553078A (ja) 2020-12-10 2023-12-20 エーエスエムエル ネザーランズ ビー.ブイ. 中空コアフォトニック結晶ファイバに基づく広帯域放射生成器
KR20220088538A (ko) 2020-12-18 2022-06-28 삼성전자주식회사 반도체 소자의 제조방법
EP4016186A1 (en) 2020-12-18 2022-06-22 ASML Netherlands B.V. Metrology method for measuring an etched trench and associated metrology apparatus
KR20230121053A (ko) 2020-12-21 2023-08-17 에이에스엠엘 네델란즈 비.브이. 리소그래피 공정을 모니터링하는 방법
EP4017221A1 (en) 2020-12-21 2022-06-22 ASML Netherlands B.V. Methods and apparatus for controlling electron density distributions
EP4030236A1 (en) 2021-01-18 2022-07-20 ASML Netherlands B.V. A method of monitoring a lithographic process and associated apparatuses
EP4020084A1 (en) 2020-12-22 2022-06-29 ASML Netherlands B.V. Metrology method
EP4030230A1 (en) 2021-01-18 2022-07-20 ASML Netherlands B.V. Methods and apparatus for providing a broadband light source
IL303950A (en) 2020-12-23 2023-08-01 Asml Netherlands Bv Methods and devices for providing a broadband light source
KR20230125793A (ko) 2020-12-30 2023-08-29 에이에스엠엘 네델란즈 비.브이. 제조 프로세스 파라미터 추정을 위한 모듈식 오토인코더모델
EP4075341A1 (en) 2021-04-18 2022-10-19 ASML Netherlands B.V. Modular autoencoder model for manufacturing process parameter estimation
EP4075340A1 (en) 2021-04-15 2022-10-19 ASML Netherlands B.V. Modular autoencoder model for manufacturing process parameter estimation
EP4075339A1 (en) 2021-04-15 2022-10-19 ASML Netherlands B.V. Modular autoencoder model for manufacturing process parameter estimation
EP4030237A1 (en) 2021-01-19 2022-07-20 ASML Netherlands B.V. Metrology method and system and lithographic system
WO2022161703A1 (en) 2021-01-27 2022-08-04 Asml Netherlands B.V. Hollow-core photonic crystal fiber
EP4036619A1 (en) 2021-01-27 2022-08-03 ASML Netherlands B.V. Hollow-core photonic crystal fiber
EP4036646A1 (en) 2021-01-29 2022-08-03 ASML Netherlands B.V. Metrology methods and appratuses
EP4040233A1 (en) 2021-02-03 2022-08-10 ASML Netherlands B.V. A method of determining a measurement recipe and associated metrology methods and appratuses
US20240134182A1 (en) 2021-02-04 2024-04-25 Asml Netherlands B.V. Methods and apparatuses for spatially filtering optical pulses
EP4067968A1 (en) 2021-03-29 2022-10-05 ASML Netherlands B.V. Methods and apparatuses for spatially filtering optical pulses
KR20230146536A (ko) 2021-02-17 2023-10-19 에이에스엠엘 네델란즈 비.브이. 원거리 필드에서 방사선을 분리하기 위한 어셈블리
EP4047400A1 (en) 2021-02-17 2022-08-24 ASML Netherlands B.V. Assembly for separating radiation in the far field
EP4057069A1 (en) 2021-03-11 2022-09-14 ASML Netherlands B.V. Methods and apparatus for characterizing a semiconductor manufacturing process
EP4060408A1 (en) 2021-03-16 2022-09-21 ASML Netherlands B.V. Method and system for predicting process information with a parameterized model
EP4086698A1 (en) 2021-05-06 2022-11-09 ASML Netherlands B.V. Hollow-core optical fiber based radiation source
IL305428A (en) 2021-03-16 2023-10-01 Asml Netherlands Bv A radiation source based on hollow-core optical fibers
EP4060403A1 (en) 2021-03-16 2022-09-21 ASML Netherlands B.V. Hollow-core photonic crystal fiber based multiple wavelength light source device
EP4063971A1 (en) 2021-03-22 2022-09-28 ASML Netherlands B.V. Digital holographic microscope and associated metrology method
KR20230159438A (ko) 2021-03-22 2023-11-21 에이에스엠엘 네델란즈 비.브이. 디지털 홀로그래픽 현미경 및 연관된 계측 방법
EP4071553A1 (en) 2021-04-07 2022-10-12 ASML Netherlands B.V. Method of determining at least a target layout and associated metrology apparatus
JP2024514054A (ja) 2021-04-19 2024-03-28 エーエスエムエル ネザーランズ ビー.ブイ. メトロロジツール較正方法及び関連するメトロロジツール
EP4080284A1 (en) 2021-04-19 2022-10-26 ASML Netherlands B.V. Metrology tool calibration method and associated metrology tool
EP4330768A1 (en) 2021-04-26 2024-03-06 ASML Netherlands B.V. A cleaning method and associated illumination source metrology apparatus
EP4170421A1 (en) 2021-10-25 2023-04-26 ASML Netherlands B.V. A cleaning method and associated illumination source metrology apparatus
EP4105696A1 (en) 2021-06-15 2022-12-21 ASML Netherlands B.V. Optical element for generation of broadband radiation
EP4334766A1 (en) 2021-05-03 2024-03-13 ASML Netherlands B.V. Optical element for generation of broadband radiation
JP2024519281A (ja) 2021-05-04 2024-05-10 エーエスエムエル ネザーランズ ビー.ブイ. 計測装置およびリソグラフィ装置
EP4089484A1 (en) 2021-05-12 2022-11-16 ASML Netherlands B.V. System and method to ensure parameter measurement matching across metrology tools
EP4187321A1 (en) 2021-11-24 2023-05-31 ASML Netherlands B.V. Metrology method and associated metrology tool
KR20240016967A (ko) 2021-05-31 2024-02-06 에이에스엠엘 네델란즈 비.브이. 메트롤로지 방법 및 연관된 메트롤로지 툴
KR20240016285A (ko) 2021-05-31 2024-02-06 에이에스엠엘 네델란즈 비.브이. 계측 측정 방법 및 장치
KR20240007276A (ko) 2021-06-14 2024-01-16 에이에스엠엘 네델란즈 비.브이. 조명 소스 및 연관된 방법, 장치
EP4134734A1 (en) 2021-08-11 2023-02-15 ASML Netherlands B.V. An illumination source and associated method apparatus
EP4124909A1 (en) 2021-07-28 2023-02-01 ASML Netherlands B.V. Metrology method and device
KR20240023593A (ko) 2021-06-18 2024-02-22 에이에스엠엘 네델란즈 비.브이. 계측 방법 및 디바이스
EP4112572A1 (en) 2021-06-28 2023-01-04 ASML Netherlands B.V. Method of producing photonic crystal fibers
EP4113210A1 (en) 2021-07-01 2023-01-04 ASML Netherlands B.V. A method of monitoring a measurement recipe and associated metrology methods and apparatuses
US11669079B2 (en) * 2021-07-12 2023-06-06 Tokyo Electron Limited Tool health monitoring and classifications with virtual metrology and incoming wafer monitoring enhancements
WO2023285322A1 (en) 2021-07-16 2023-01-19 Asml Netherlands B.V. Metrology method and apparatus
EP4130880A1 (en) 2021-08-03 2023-02-08 ASML Netherlands B.V. Methods of data mapping for low dimensional data analysis
EP4374226A1 (en) 2021-07-20 2024-05-29 ASML Netherlands B.V. Methods and computer programs for data mapping for low dimensional data analysis
WO2023001448A1 (en) 2021-07-23 2023-01-26 Asml Netherlands B.V. Metrology method and metrology device
EP4124911A1 (en) 2021-07-29 2023-02-01 ASML Netherlands B.V. Metrology method and metrology device
WO2023011905A1 (en) 2021-08-02 2023-02-09 Asml Netherlands B.V. Optical element for use in metrology systems
WO2023012338A1 (en) 2021-08-06 2023-02-09 Asml Netherlands B.V. Metrology target, patterning device and metrology method
WO2023020856A1 (en) 2021-08-18 2023-02-23 Universiteit Van Amsterdam Metrology method and apparatus
IL309622A (en) 2021-08-25 2024-02-01 Asml Netherlands Bv Improving broadband radiation generation in photonic crystal or nonlinear fibers
EP4163715A1 (en) 2021-10-05 2023-04-12 ASML Netherlands B.V. Improved broadband radiation generation in photonic crystal or highly non-linear fibres
IL310738A (en) 2021-08-26 2024-04-01 Asml Netherlands Bv A method for determining a measuring recipe and related devices
EP4194952A1 (en) 2021-12-13 2023-06-14 ASML Netherlands B.V. Method for determing a measurement recipe and associated apparatuses
WO2023036526A1 (en) 2021-09-07 2023-03-16 Asml Netherlands B.V. A method of monitoring a lithographic process and associated apparatuses
EP4191337A1 (en) 2021-12-01 2023-06-07 ASML Netherlands B.V. A method of monitoring a lithographic process and associated apparatuses
CN117999517A (zh) 2021-09-08 2024-05-07 Asml荷兰有限公司 量测方法以及相关联的量测和光刻设备
WO2023041274A1 (en) 2021-09-14 2023-03-23 Asml Netherlands B.V. Metrology method and device
EP4184426A1 (en) 2021-11-22 2023-05-24 ASML Netherlands B.V. Metrology method and device
IL311255A (en) 2021-09-15 2024-05-01 Asml Netherlands Bv Separation of sources from metrology data
CN117980829A (zh) 2021-09-22 2024-05-03 Asml荷兰有限公司 源选择模块以及相关联的量测和光刻设备
EP4155821A1 (en) 2021-09-27 2023-03-29 ASML Netherlands B.V. Method for focus metrology and associated apparatuses
EP4155822A1 (en) 2021-09-28 2023-03-29 ASML Netherlands B.V. Metrology method and system and lithographic system
EP4160314A1 (en) 2021-10-04 2023-04-05 ASML Netherlands B.V. Method for measuring at least one target on a substrate
EP4163687A1 (en) 2021-10-06 2023-04-12 ASML Netherlands B.V. Fiber alignment monitoring tool and associated fiber alignment method
EP4167031A1 (en) 2021-10-18 2023-04-19 ASML Netherlands B.V. Method of determining a measurement recipe in a metrology method
EP4170429A1 (en) 2021-10-19 2023-04-26 ASML Netherlands B.V. Out-of-band leakage correction method and metrology apparatus
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FR3128779B1 (fr) 2021-11-02 2024-03-01 Commissariat Energie Atomique Structure de metrologie
EP4181018A1 (en) 2021-11-12 2023-05-17 ASML Netherlands B.V. Latent space synchronization of machine learning models for in-device metrology inference
EP4184250A1 (en) 2021-11-23 2023-05-24 ASML Netherlands B.V. Obtaining a parameter characterizing a fabrication process
EP4191338A1 (en) 2021-12-03 2023-06-07 ASML Netherlands B.V. Metrology calibration method
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WO2023110318A1 (en) 2021-12-17 2023-06-22 Asml Netherlands B.V. Machine learning model for asymmetry-induced overlay error correction
EP4202550A1 (en) 2021-12-22 2023-06-28 ASML Netherlands B.V. Substrate comprising a target arrangement, associated patterning device, lithographic method and metrology method
WO2023126300A1 (en) 2021-12-28 2023-07-06 Asml Netherlands B.V. Element of an afm tool
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WO2023138916A1 (en) 2022-01-21 2023-07-27 Asml Netherlands B.V. Systems and methods for inspecting a portion of a lithography apparatus
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EP4242744A1 (en) 2022-03-09 2023-09-13 ASML Netherlands B.V. Method for correcting measurements in the manufacture of integrated circuits and associated apparatuses
EP4246231A1 (en) 2022-03-18 2023-09-20 Stichting VU A method for determining a vertical position of a structure on a substrate and associated apparatuses
WO2023174648A1 (en) 2022-03-18 2023-09-21 Stichting Vu Illumination arrangement for a metrology device and associated method
EP4246232A1 (en) 2022-03-18 2023-09-20 Stichting VU Illumination arrangement for a metrology device and associated method
EP4254068A1 (en) 2022-03-28 2023-10-04 ASML Netherlands B.V. Method for determining a spatial distribution of a parameter of interest over at least one substrate or portion thereof
EP4254266A1 (en) 2022-03-29 2023-10-04 ASML Netherlands B.V. Methods related to an autoencoder model or similar for manufacturing process parameter estimation
EP4296780A1 (en) 2022-06-24 2023-12-27 ASML Netherlands B.V. Imaging method and metrology device
WO2023194036A1 (en) 2022-04-05 2023-10-12 Asml Netherlands B.V. Imaging method and metrology device
EP4273622A1 (en) 2022-05-02 2023-11-08 ASML Netherlands B.V. Hollow-core optical fiber based radiation source
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WO2023222328A1 (en) 2022-05-20 2023-11-23 Asml Netherlands B.V. Illumination module and associated methods and metrology apparatus
WO2023222342A1 (en) 2022-05-20 2023-11-23 Asml Netherlands B.V. Measurement of fabrication parameters based on moiré interference pattern components
EP4279994A1 (en) 2022-05-20 2023-11-22 ASML Netherlands B.V. Illumination module and associated methods and metrology apparatus
WO2023222349A1 (en) 2022-05-20 2023-11-23 Asml Netherlands B.V. Single pad overlay measurement
WO2023232360A1 (en) 2022-05-31 2023-12-07 Asml Netherlands B.V. Method for determining a failure event on a lithography system and associated failure detection module
WO2023232408A1 (en) 2022-05-31 2023-12-07 Asml Netherlands B.V. A membrane and associated method and apparatus
EP4303655A1 (en) 2022-07-04 2024-01-10 ASML Netherlands B.V. A membrane and associated method and apparatus
EP4328670A1 (en) 2022-08-23 2024-02-28 ASML Netherlands B.V. Method for parameter reconstruction of a metrology device and associated metrology device
WO2023232397A1 (en) 2022-06-02 2023-12-07 Asml Netherlands B.V. Method for aligning an illumination-detection system of a metrology device and associated metrology device
EP4296779A1 (en) 2022-06-21 2023-12-27 ASML Netherlands B.V. Method for aligning an illumination-detection system of a metrology device and associated metrology device
WO2023232478A1 (en) 2022-06-02 2023-12-07 Asml Netherlands B.V. Method for parameter reconstruction of a metrology device and associated metrology device
EP4289798A1 (en) 2022-06-07 2023-12-13 ASML Netherlands B.V. Method of producing photonic crystal fibers
EP4300193A1 (en) 2022-06-27 2024-01-03 ASML Netherlands B.V. Focus measurment and control in metrology and associated wedge arrangement
EP4300183A1 (en) 2022-06-30 2024-01-03 ASML Netherlands B.V. Apparatus for broadband radiation generation
EP4303658A1 (en) 2022-07-05 2024-01-10 ASML Netherlands B.V. Method of correction metrology signal data
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EP4312079A1 (en) 2022-07-29 2024-01-31 ASML Netherlands B.V. Methods of mitigating crosstalk in metrology images
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EP4318131A1 (en) 2022-08-01 2024-02-07 ASML Netherlands B.V. Sensor module, illuminator, metrology device and associated metrology method
WO2024033036A1 (en) 2022-08-08 2024-02-15 Asml Netherlands B.V. Metrology method and associated metrology device
WO2024033005A1 (en) 2022-08-09 2024-02-15 Asml Netherlands B.V. Inference model training
EP4321933A1 (en) 2022-08-09 2024-02-14 ASML Netherlands B.V. A radiation source
EP4361726A1 (en) 2022-10-24 2024-05-01 ASML Netherlands B.V. Inference model training
WO2024033035A1 (en) 2022-08-10 2024-02-15 Asml Netherlands B.V. Metrology method and associated metrology device
EP4332678A1 (en) 2022-09-05 2024-03-06 ASML Netherlands B.V. Holographic metrology apparatus and method
WO2024052057A1 (en) 2022-09-06 2024-03-14 Asml Netherlands B.V. Method for monitoring proper functioning of one or more components of a lithography system
WO2024052012A1 (en) 2022-09-07 2024-03-14 Asml Netherlands B.V. Metrology method and associated metrology device
EP4336262A1 (en) 2022-09-07 2024-03-13 ASML Netherlands B.V. Metrology method and associated metrology device
EP4336251A1 (en) 2022-09-12 2024-03-13 ASML Netherlands B.V. A multi-pass radiation device
WO2024056296A1 (en) 2022-09-13 2024-03-21 Asml Netherlands B.V. Metrology method and associated metrology device
WO2024078813A1 (en) 2022-10-11 2024-04-18 Asml Netherlands B.V. An aberration correction optical system
EP4354200A1 (en) 2022-10-11 2024-04-17 ASML Netherlands B.V. An aberration correction optical system
EP4354224A1 (en) 2022-10-11 2024-04-17 ASML Netherlands B.V. Method for operating a detection system of a metrology device and associated metrology device
EP4357853A1 (en) 2022-10-17 2024-04-24 ASML Netherlands B.V. Apparatus and methods for filtering measurement radiation
WO2024083559A1 (en) 2022-10-17 2024-04-25 Asml Netherlands B.V. Apparatus and methods for filtering measurement radiation
EP4361703A1 (en) 2022-10-27 2024-05-01 ASML Netherlands B.V. An illumination module for a metrology device
EP4372462A1 (en) 2022-11-16 2024-05-22 ASML Netherlands B.V. A broadband radiation source
EP4371951A1 (en) 2022-11-17 2024-05-22 ASML Netherlands B.V. A method of producing photonic crystal fibers
EP4371949A1 (en) 2022-11-17 2024-05-22 ASML Netherlands B.V. A fiber manufacturing intermediate product and method of producing photonic crystal fibers
EP4372463A1 (en) 2022-11-21 2024-05-22 ASML Netherlands B.V. Method and source modul for generating broadband radiation
EP4375744A1 (en) 2022-11-24 2024-05-29 ASML Netherlands B.V. Photonic integrated circuit for generating broadband radiation
WO2024115048A1 (en) 2022-12-02 2024-06-06 Asml Netherlands B.V. Method for labeling time series data relating to one or more machines
WO2024120709A1 (en) 2022-12-07 2024-06-13 Asml Netherlands B.V. Supercontinuum radiation source

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4332473A (en) * 1979-01-31 1982-06-01 Tokyo Shibaura Denki Kabushiki Kaisha Apparatus for detecting a mutual positional relationship of two sample members
US4999014A (en) 1989-05-04 1991-03-12 Therma-Wave, Inc. Method and apparatus for measuring thickness of thin films
US5689339A (en) * 1991-10-23 1997-11-18 Nikon Corporation Alignment apparatus
US6153886A (en) * 1993-02-19 2000-11-28 Nikon Corporation Alignment apparatus in projection exposure apparatus
US6034378A (en) * 1995-02-01 2000-03-07 Nikon Corporation Method of detecting position of mark on substrate, position detection apparatus using this method, and exposure apparatus using this position detection apparatus
US5808742A (en) 1995-05-31 1998-09-15 Massachusetts Institute Of Technology Optical alignment apparatus having multiple parallel alignment marks
US5805290A (en) * 1996-05-02 1998-09-08 International Business Machines Corporation Method of optical metrology of unresolved pattern arrays
JPH11121351A (ja) * 1997-10-09 1999-04-30 Nikon Corp 焦点位置検出装置のビーム調整法
AU2076699A (en) 1998-02-02 1999-08-16 Nikon Corporation Surface position sensor and position sensor
US7317531B2 (en) * 2002-12-05 2008-01-08 Kla-Tencor Technologies Corporation Apparatus and methods for detecting overlay errors using scatterometry
US7009704B1 (en) 2000-10-26 2006-03-07 Kla-Tencor Technologies Corporation Overlay error detection
WO2002065545A2 (en) 2001-02-12 2002-08-22 Sensys Instruments Corporation Overlay alignment metrology using diffraction gratings
US6699624B2 (en) * 2001-02-27 2004-03-02 Timbre Technologies, Inc. Grating test patterns and methods for overlay metrology
US6856408B2 (en) 2001-03-02 2005-02-15 Accent Optical Technologies, Inc. Line profile asymmetry measurement using scatterometry
US20030002043A1 (en) * 2001-04-10 2003-01-02 Kla-Tencor Corporation Periodic patterns and technique to control misalignment
US6458605B1 (en) * 2001-06-28 2002-10-01 Advanced Micro Devices, Inc. Method and apparatus for controlling photolithography overlay registration
US7193715B2 (en) 2002-11-14 2007-03-20 Tokyo Electron Limited Measurement of overlay using diffraction gratings when overlay exceeds the grating period
US7230703B2 (en) 2003-07-17 2007-06-12 Tokyo Electron Limited Apparatus and method for measuring overlay by diffraction gratings
US7271921B2 (en) * 2003-07-23 2007-09-18 Kla-Tencor Technologies Corporation Method and apparatus for determining surface layer thickness using continuous multi-wavelength surface scanning
WO2005069082A1 (en) * 2003-12-19 2005-07-28 International Business Machines Corporation Differential critical dimension and overlay metrology apparatus and measurement method
TWI288307B (en) * 2004-04-30 2007-10-11 United Microelectronics Corp Method of measuring the overlay accuracy of a multi-exposure process
US7791727B2 (en) * 2004-08-16 2010-09-07 Asml Netherlands B.V. Method and apparatus for angular-resolved spectroscopic lithography characterization
US20060117293A1 (en) 2004-11-30 2006-06-01 Nigel Smith Method for designing an overlay mark
JP2006165371A (ja) 2004-12-09 2006-06-22 Canon Inc 転写装置およびデバイス製造方法
US7528953B2 (en) 2005-03-01 2009-05-05 Kla-Tencor Technologies Corp. Target acquisition and overlay metrology based on two diffracted orders imaging
TWI286196B (en) * 2006-02-22 2007-09-01 Ind Tech Res Inst Methods and systems for determining overlay error based on target image symmetry
US7561282B1 (en) * 2006-03-27 2009-07-14 Kla-Tencor Technologies Corporation Techniques for determining overlay and critical dimension using a single metrology tool
US7415319B2 (en) 2006-04-04 2008-08-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7528941B2 (en) 2006-06-01 2009-05-05 Kla-Tencor Technolgies Corporation Order selected overlay metrology
US7564554B2 (en) * 2006-06-30 2009-07-21 Intel Corporation Wafer-based optical pattern recognition targets using regions of gratings
US20080018897A1 (en) * 2006-07-20 2008-01-24 Nanometrics Incorporated Methods and apparatuses for assessing overlay error on workpieces
JP4293223B2 (ja) 2006-10-16 2009-07-08 日本電気株式会社 プログラム並列化装置及びその方法並びにプログラム
US7599064B2 (en) * 2007-03-07 2009-10-06 Asml Netherlands B.V. Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method, substrate for use in the methods
NL1036245A1 (nl) 2007-12-17 2009-06-18 Asml Netherlands Bv Diffraction based overlay metrology tool and method of diffraction based overlay metrology.

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103201682A (zh) * 2010-11-12 2013-07-10 Asml荷兰有限公司 量测方法和设备、光刻系统和器件制造方法
TWI470215B (zh) * 2010-11-12 2015-01-21 Asml Netherlands Bv 度量衡方法及裝置、及元件製造方法
CN103201682B (zh) * 2010-11-12 2015-06-17 Asml荷兰有限公司 量测方法和设备、光刻系统和器件制造方法
TWI564540B (zh) * 2011-08-15 2017-01-01 克萊譚克公司 利用光瞳相位資訊來量測疊對之方法及系統
TWI634325B (zh) * 2013-10-28 2018-09-01 克萊譚克公司 用於使用x射線度量術量測半導體器件疊加之方法及裝置
TWI649635B (zh) * 2017-01-24 2019-02-01 台灣積體電路製造股份有限公司 層疊誤差測量裝置及方法

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