TW200804617A - High flow GaCl3 delivery - Google Patents

High flow GaCl3 delivery Download PDF

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TW200804617A
TW200804617A TW096120592A TW96120592A TW200804617A TW 200804617 A TW200804617 A TW 200804617A TW 096120592 A TW096120592 A TW 096120592A TW 96120592 A TW96120592 A TW 96120592A TW 200804617 A TW200804617 A TW 200804617A
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carrier gas
gallium
hastelloy
valve
trichloride
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TW096120592A
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Thomas Andrew Steidl
Charles Michael Birtcher
Robert Daniel Clark
Lee Arthur Senecal
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Air Prod & Chem
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/448Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
    • C23C16/4481Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by evaporation using carrier gas in contact with the source material
    • C23C16/4482Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by evaporation using carrier gas in contact with the source material by bubbling of carrier gas through liquid source material
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    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4401Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
    • C23C16/4402Reduction of impurities in the source gas
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    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • C30B25/14Feed and outlet means for the gases; Modifying the flow of the reactive gases
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10Inorganic compounds or compositions
    • C30B29/40AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
    • C30B29/403AIII-nitrides
    • C30B29/406Gallium nitride
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10Inorganic compounds or compositions
    • C30B29/40AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
    • C30B29/42Gallium arsenide
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof

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Description

200804617 九、發明說明: 相關申請的交又參考 本發明申請要求享受於20〇6年6月9日申請的us臨 時專利申請系列號60/812560的權益。 發明所屬之技術領域 電子製造業對諸如含鎵膜的化合物半導體具有強烈的 興趣。以前,含鎵化合物已通過使用三曱基鎵而得到合成。 那種合成昂貴且慢。 先前技術 合成含鎵化合物的一個缺點是用於鎵源例如室溫下固 悲的三氯化鎵(GaCl3 )的輸送系統。由於GaCl3在其固態 柃的低蒸氣壓,用於固態前驅物的傳統蒸氣輸送系統不能 k供GaCl3的高流量和高純度輸送。 由於它們的低溫度容量,以及在更高的溫度下加速的 虱的化學性質 高腐蝕性,可輸送如此高流動速率的現 有的液態蒸氣輸送系統不適合熔融的(大於8〇〇c ) GaCl3。 由於大夕數固悲鈾驅物的低蒸氣壓,現有的固態化學 氣相輸送系統僅爲較低的流動速率而存在。Air Pr〇duets and Ch_cals inc· ’ Allent〇wn,pA,USA 已研發出在美國專 利申請公開Νο·2005-0039794Α1,10/902778中說明的 Schumacher牌産品一固體源蒸發器。 另種相關的液相氣相輸送系統是由Air Products and 200804617
Chemicals Inc·,Allentown,PA,USA 提供的 Gasguard BSGS 三氯矽烷起泡器模式(大約1999年3月)。 通過可使得用於電子應用的含鎵化合物得以經濟且高 純度的合成的本發明的三氯化鎵容器和輸送系統,現有技 術中容器和輸送系統的缺陷被克服。 發明内容 本發明是用於將氣相的高純三氯化鎵傳輸到用於生産 含鎵化合物的反應器的裝置,其包括:在高於大氣壓的升 高的壓力下的惰性載氣源;能從載氣除去水分下降至不超 過1〇份/十億(“ppb”)、優選爲5ppb的淨化器;能將載 氣加熱到至少8(TC、優選爲1HTC溫度的加熱器;具有耐 腐蝕内表面的容器,其具有三氯化鎵供應,用於载氣的閥 門控制的入口,其形成了具有低於三氯化鎵水平面的出口 的浸潰管,閥門控制的出口,用於除去載氣和在載氣中夾 帶的三氯化鎵;能加熱容器足以使三氯化鎵熔融的加熱 器;與閥門控制出口相連接的輸送管線,以運送載氣和夾 帶的三氯化鎵至用於將三氯化鎵轉變爲含鎵化合物的反應 區。 本發明也疋將氣相二氯化鎵輸送至反應區從而合成含 鎵化合物的方法,包括··在高於大氣壓·的壓力下提供選自 虱虱、氮氣、氦氣、氬氣及它們的混合物的載氣;使載氣 可選擇性除去水分到不大於lOppb、優選5Ppb的淨化 "貝以淨化載氣;將載氣加熱到至少80°C、優選地J i 〇 200804617 t:的溫度;將載氣注人炼融三氯化鎵浴中,從而在载氣中 夾帶三氯化鎵;從容器令除去載氣和夾帶的三氯化鎵,在 至少80 C、優選110。。的溫度下運送載氣和夾帶的三氯化 叙至反應區,從而合成含録膜。 實施方式 本lx明的裝置和方法在磊晶反應器中、使用高蒸氣壓 _ 蠢晶(HVPE)、通過將高流量和高純度GaCi3蒸氣輸送到 上述反應器中,確保進行鎵膜沈積的化學氣相沈積 (CVD)。 . 、 由於固態GaCls的低蒸氣壓,用於固態前驅物的傳統 氣相輸送系統不被提供用於高流量和高純度〇aC13的輸送。 由於它們的低溫度容量,以及在更高的溫度下加速的 氯的化學性質一一高腐蝕性,可輸送如此高流動速率的現 有的液相氣相輸送系統不適合熔融的(大於8(rc ) GaC^。 鲁如下描述本發明。GaCh固態前驅物被放置在316lss 起泡容器中,在其中它被加熱高於它的78。〇熔點。在此溫 度以及以上,它是液態的並可被以低流動速率起泡。 從其熔點(7 8 °C )到13 0 °C的額外加熱,,增加了液態 GaCU的蒸氣壓(130°C下GaCU的蒸氣壓爲90Torr ),足以 通過起泡以高流動速率(300至40Ogr/小時)輸送。在那些 更高的溫度下,5至1 5升/分鐘的載氣流動速率將得到所需 的高質量流動速率,但是所述的流動速率也要低至足以避 免液體的湍流,液體的湍流可引發液體以大滴氣溶膠的形 200804617 式從容ϋ出口喷出。當起泡時’只接受飽和蒸氣以維持一 致的貝里傳遞並且避免通常由氣溶膠滴引起的顆粒問題。 本發明方法使用經淨化的載氣(H2、Ar、He或Ν2) 來使GaCU起泡。超高純度(UHp)淨化器除去水分至低於十 份/十億(PPb)、優選爲五份/十億,從而防止水分與氯(在 GaCl3中)反應生成HC1。 從載氣中的除去水分可控制HCi侵蝕金屬起泡器的濕 潤表面,這可提供金屬雜質到GaCl3前驅物中而引起侵蝕 缺陷。金屬雜質會干擾含鎵膜的磊晶晶體生長。 HC1在焉溫下增長的侵蝕速率已導致本發明的另一可 透特徵的加入。含氟聚合物、氟化乙烯_丙烯c‘FEP,,)、聚四 氟乙烯(“ETFE”)或PFA (聚四氟乙烯的共聚物或衍生物, 在下文中共同地爲聚四氟乙烯)的保護塗層可被模塑到上 述金屬或合金即不銹鋼(SS )起泡器内側的濕潤表面上, 從而更好防止由SS濕潤表面産生的金屬雜質。假如意外地 引入了水分,上述塗層也可阻止對於金屬或合金容器的腐 餘。 容器、閥、管道系統和零件優選地爲電解拋光的316L 不銹鋼(“SS”)。316L不銹鋼SS閥優選使用特殊的PFA座, 從而支援高溫操作並抵抗氯侵蝕。這些元件還可以是 Hastelloy,例如 Hastelloy B-2 合金、Hastelloy B-3 合金、 例如Hastelloy c_22合金、Nickel(鎳)或Monel(蒙乃爾高強 度耐蝕鎳銅合金)。HastelloyB-3合金具有的組成以重量% 計爲:Ni-65%、Mo-28.5%、Cr-1.5%、Fe-1.5%、Co-3%、 200804617 W-3%、Mn-3%、Α1·0·5%、Τί»·〇·2%、si-0.1%和 C-0.01%。 Hastelloy C-22合金具有的組成以重量%計爲:Ni_56〇/〇、
Mo-13%、Cr_22%、Fe-3%、Co-2.5%、W-3%、Μη-0·5%、 ¥-0.3 5%、8丨-0.08%和(:-0.01°/。。可選地,塗覆有氧化石夕(“石夕 石)的金屬可被用於減小侵鍅。石夕石可以是無定形石夕石, 例如得自於 Restek of Bellefonte,PA,USA 的 Siltek。無定 形石夕石塗層優選被施塗到316L電解拋光的不銹鋼 φ Hastelloy B-2、Hastelloy B-3 或 Hastelloy C-22。另一矽耐 餘塗層是熔融矽石,被再施塗到諸如3丨6L s S的金屬上。 表1顯不了相關的耐腐餘合金的組成。 表1 元 素 Elgiloy 316LSS Nickel200 Hastelloy C-22 Hastelloy B-2 Hastelloy B-3 % % % % % % Cr 19-21 16-18 22 最大1 1.5 Co 39-41 - 最大2.5 最大1 最大3 Cu - 最大0.25 最大0.5 最大0.5 最大0 2 Fe 16 bal(〜66%) 最大0.40 3 最大2 1.5 Μη 1.5-2.5 最大2.0 最大0.35 最大0.5 最大1 最大3 Mo 6-8 2.0 〜3.0 13 28 28.5 Ni 14-16 10·0 〜14·0 最小99.0 56 69 65 Si - 最大0.75 最大0.35 最大0.08 最大0.1 最大0 1 V - - 最大0.35 w - - 3 碳 最大0.15 最大0.03 最大0.15 最大0.01 最大0.01 最大0.01 Be 敢大0.1 Nb Ti 最大0·2 A1 最大Ω S S 最大0.01 J:__1_ .lZZ: 9 200804617 對構成容器、進口、出、 a 出閥和輸达管線的材料的各 ^金進行了試驗:將所述合金暴露於三氯化鎵。所得結 ^於:面的表2中,其顯示HasteUGy c_22表現爲最低 、:測量的侵蝕。如下方式收集資料:比較與三氯化鎵接 觸:後的合金樣片(樣品)^量,不但分析暴露於樣片的 一 2化銾、而且分析在暴露於三氯化鎵之後與樣片相接觸 的清潔水。而Hastell〇yB_2和Hastell〇yB-3合金産生最少 的揮發性侵蝕副産物,因此被預期可製造具有較少金屬性 雜質的鎵膜。所有副産品的比較示於圖2中,其爲下述副 産ua的組合·在與一定合金樣片接觸後在氣相三氯化鎵中 發現的侵餘副産物,以及在所述樣片暴露於三氯化鎵後、 在與一定合金樣片相接觸的清潔水中發現的侵蝕副産物。 表2 通過重量和金屬分析的合金侵蝕速率對照 評估基於: 樣片重量變化 提取的金屬* * 分級 ---- 說明 avg mil/yr avg mil/yr —1 C-22 0.028 .026** 2 B-2 0.044 0.028* —3 Inc-686 0.054 0.033* _4 Inc-600 0.074 0.050* 5 316SS 0.065 .060** 6 鎳 0.106 • 086“ 一 7 Elgiloy 0.217 .183** 200804617 表 3
相關金屬氯化物揮發物 金屬 金屬氯化物 BP-°C 鉻 CrCl2 947(s) CrCl3 1300 Cr02Cl2 117 始 CoCl2 1087 銅 CuCl 1212 CuCl2 d>300 鐵 FeCl2 1024 FeCl3 315 钥 MoC12 d530 MoC13 (mp 1037 ) M0CI4 407 M0CI5 264 MoC16 254 ( s) 鎳 NiCl2 970 ( s) 鎢 WC12 d 5 89 WC14 d 498 WC15 288 WC16 341 wcuo 220 WCl2〇2 260 ( s) 鋅 ZnCl2 732 11 200804617 起泡器被提供有可選的模塑的pFA内襯,用於可能需 要更多的保護以防止金屬污染的應用。在這種情況下,所 有的閥應當由3 1 6LSS轉換成全部的全氟聚合物的閥,諸如 Telflon PFA (本體和座)閥。 將參考附圖進一步描述本發明。在高於大氣壓的升高 的壓力下,在載氣供應10中提供包括氬氣、氦氣、氲氣、 氮氣或它們的混合物的高純度惰性氣體。載氣以5至丨5升 • /分鐘的流動速率經過閥丨2、淨化器14和過濾器16被分 配,淨化器14除去任何水分至低於1〇ppb、優選5ppb,過 濾器16除去顆粒、特別是可能在淨化器14中無意中産生 的顆粒。載氣如果足夠純則可流經任何淨化器或過濾器, 可逛地可通過流量控制器丨8來測量和計量載氣流量。 士載氣通過管線20被輸送到包含三氯化鎵容器26的絕 熱殼24中。載氣管線被構造通過一個或多個正弦彎曲22, 2而形成可分開加熱或如附圖所示的熱交換表面,從用於 籲 容器26的加熱器40帶走熱量。 被加熱的載氣經過閥3 6被輸送,然後經過作爲容器 26的裝閥門的進口的浸潰管32進入容器26中。浸潰管的 在熔嘁二氯化鎵28的表面下,通過可環繞容器26的 愛…、:—4〇加熱另外的室溫固體至高於三氯化鎵的78。(:熔 點’二氯化鎵被保持爲液態。 八4 °° 26也可稱爲“起泡器”,因爲從浸潰管出口 32 夾嫌^载氣政泡上升通過熔融液態三氯化鎵從而在氣相中 “帶三氯化鎵,以通過由閥38控制的裝閥門的出口 34除 12 200804617 去。加熱器40受傳統的加熱控制42控制。 經二氣化鎵飽和的載氣從容器2 6中被除去至輸送管 線44中,輸送管線44是共軸管線,具有運送三氯化鎵的 内官線46 ’外官線44與内管線46 —起形成環狀空間48, 環狀空間48允許受熱的氣氛(優選爲惰性的氮氣)佔據所 述壞形空間並維持升尚溫度的載氣和三氯化鎵,其從容器 26通過閥50分配到含鎵化合物反應器52以在靶54上形 成含鎵化合物產品。 所述的裝置和方法使得三氯化鎵可在i 1〇c>c至14〇(>c 下、以300至400克/小時的流動速率被輸送到在反應器52 中的含鎵化合物反應區,這是經濟的生産高純度含鎵化合 物所希望的。 已結合數個示例性的實施方案描述了本發明,但本發 明的全部範圍將由下述的申請專利範圍所確定。 圖式簡單說明 圖1是本發明的一個實施方案爲了合成含鎵氮化物而 以高純度和高流動速率輸送GaCl3的示意圖; 圖2疋各種金屬合金暴露於三氯化鎵以及隨後用水沖 洗的侵蝕副産物總量的曲線圖。 主要元件符號說明 1〇..載軋供應;12、36、38、50·•閥;14.·淨化器; 16··過濾器;18··流量控制器;2〇••管線;22·.正弦彎g 13 200804617 24··絕熱殼;26·.容器;28..三氣化鎵 3 4 ·.出口 ; 4 0 · ·加熱器;4 2 ·.加熱控制 46··内管線;48·.環狀空間;52.·反應· 32..浸潰管; 44、.輸送管線; ;54..I&
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Claims (1)

  1. 200804617 十、申請專利範圍: 1 ·一種用於將高純度氣相三氯化鎵輪送到用於生産含 鎵産品的反應器的裝置,其包括·· 在高於大氣壓的升高的壓力下的惰性载氣源·, 能將載氣加熱到至少8(^c溫度的加熱器; 具有耐腐蝕内表面的容器,其具有三氯化鎵供應;用 於載氣的閥門控制的進口,其形成具有低於三氯化嫁水平 • ®的出α的浸潰管;和用於除去所述载氣和在載氣甲爽帶 的二氯化鎵的閥門控制的出口; 能加熱所述容器足以使三氯化鎵熔融的加熱器; 、與閥門控制的出口相連接的輸送管線,用於運送所述 载氣和夾帶的三氯化鎵至反應區,所述反應區用於將三氯 化鎵轉變爲含鎵産品。 、2如申叫專利範圍第1項所述的裝置,其包括能從所 _ 述载氣中除去水分下降至不多於10份/十億的淨化器。 、、3如申明專利fe圍第1項所述的裝置,其中能加熱所 述載氣的所述加㉟器與能加熱所述容器的所述加#器是一 個加熱器。 、4如申1專利範圍第丨項所述的裝置,其中所述載氣 源包括質量流量控制器。 、 15 200804617 其中所述載氣 其中所述容器 5 ·如申請專利範圍第2項所述的裝置 源具有在所述淨化器下游的過濾器。 6 ·如申請專利範圍第1項所述的裝置 位於絕熱外殼内。 7.如申料難圍第1項料的m巾所述載氣 源包括載氣管線’其被構造成正弦彎曲,從而提供足夠的 熱交換表面,以加熱緊鄰該能加熱所述載氣的加熱器的載 —8.如申請專利範圍第i項所述的裝置,其中所述輸送 官=絲管線,具有運送所述載氣和夾㈣三氣化鎵的 内。P S線,和外部共軸管線,以提供含有加熱介質的環形 空間。
    9 ·如申請專利範圍第1項所述的裴置,其中所述容器 由 k 自不錄鋼、Hasteii〇y、Hastelloy B-2、Hastelloy B-3、 Hastelloy C_22、鎳、M〇nel、inconei 686 及它們的混合物 所組成群組的金屬所構成。 10如申睛專利範圍第1項所述的裝置,其中所述輸 达官線由選自不銹鋼、Hastelloy、Hastelloy B-2、Hastelloy Hastelloy C-22、鎳、Monel、Inconel 686 和它們的混 200804617 合物所組成群組的金屬所構成。 u •如申請專利範圍第1項所述的裝置,其中所述裝閥 門的進口、裝閥門的出口和該進口和出口中的閥由選自不 錄鋼 Hastelloy、Hastelloy Β·2、Hastelloy B-3、Hastelloy 2錄M〇nel、Inconel 686和它們的混合物所組成群 組的金屬所構成。 u·如申請專利範圍f u項所述的裝置,其中所述閥 具有含氟聚合物底座。 ” 纟中1專利1&圍第1項所述的裝置,其中所述容 口口具有含氟聚合物的内襯。 14 如申睛專利範圍第1 j舊所补,μ # ^ . 弟1員所述的裝置,其中所述容 时和所述輸送管線具有盥三負 声&日 ,、虱匕鎵相接觸的内表面,那# 又/、有金屬氯化物的鈍化層。 15 ·如申凊專利範圍第u項所 閥fl Μ、# ^ 义的羞置,其中所述崩 門的進口、裝閥門的出口和在所 那些表面具有金屬I 閥具有盍二氣化铉進口和出口中的所讀 -、一乳化鍊相接觸的内表面, 化物的鈍化層。 16.如中請專利範圍第1項所述的裝置,其中所述溶 17 200804617 内表面,那些 :和所述輪送管線具有與三氯化鎵相接觸的 面具有含石夕化合物的鈍化層。 17 ·如申請專利範圍第 閥門的進口、I閥門的出1= 閥具有與三氯化鎵相接觸备 合物的鈍化層。 11項所述的裝置,其中所述裝 和在所述進口和出口中的所述 内表面,那些表面具有含矽化
    化鎵輸送至用於合成含鎵産品的 · —種將氣相三氯 反應區的方法,其包括: 在高於大氣壓的壓力下接供撰白气A 卜产 … 刀卜杈仏砥自虱乳、氮氣、氦氣、 鼠氣及匕們的混合物所組成群組的載氣; 將所述載氣加熱到至少80°c的溫度;
    將所述载乳注入在容器中的熔融三氯化嫁浴中,從而 在載氣中夾帶三氯化鎵; 仗今益中除去載氣和夾帶的三氯化鎵,在至少8〇。〇的 溫度下通過輸送管線輸送所述載氣和夾帶的三氯化鎵至合 成含鎵産品的反應區。 19 ·如申請專利範圍第18項所述的方法,其包括使所 述載氣通過選擇性除去水分到不大於1 0份/十億的淨化介 質從而淨化所述載氣的步驟。 2〇 ·如申請專利範圍第18項所述的方法,其中所述載 18 200804617 氣以5-15升/分鐘的速率流動。 2 1 ·如申請專利範圍第1 8項所述的方法,其今 蘇以300-400克/小時的速率被輸送至反應區。 22 ·如申請專利範圍第〗8項所述的方法,其中 中的三氯化鎵被加熱至^它至14〇〇c的溫度。 I 23 ·如申請專利範圍第i8項所述的方法,其中 -和所述輪达官線具有與三氯化鎵相接觸的内表面 k j f的二氯化鎵之前通過將氣化氣體流經所述容 送管線將那些表面鈍化。 r三氯化 在容器 所述容 ,在輸 器和輸
    19
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