TW200613910A - Photocurable/thermosetting resin composition, dry film using same, and cured product thereof - Google Patents

Photocurable/thermosetting resin composition, dry film using same, and cured product thereof

Info

Publication number
TW200613910A
TW200613910A TW094123010A TW94123010A TW200613910A TW 200613910 A TW200613910 A TW 200613910A TW 094123010 A TW094123010 A TW 094123010A TW 94123010 A TW94123010 A TW 94123010A TW 200613910 A TW200613910 A TW 200613910A
Authority
TW
Taiwan
Prior art keywords
resin composition
photocurable
thermosetting resin
cured product
dry film
Prior art date
Application number
TW094123010A
Other languages
English (en)
Other versions
TWI376572B (zh
Inventor
Kenji Kato
Gen Itokawa
Original Assignee
Taiyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Publication of TW200613910A publication Critical patent/TW200613910A/zh
Application granted granted Critical
Publication of TWI376572B publication Critical patent/TWI376572B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/106—Binder containing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/114—Initiator containing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/146—Laser beam
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/151—Matting or other surface reflectivity altering material

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Polymerisation Methods In General (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
TW094123010A 2004-07-07 2005-07-07 Photocurable/thermosetting resin composition, dry film using same, and cured product thereof TW200613910A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004200961 2004-07-07

Publications (2)

Publication Number Publication Date
TW200613910A true TW200613910A (en) 2006-05-01
TWI376572B TWI376572B (zh) 2012-11-11

Family

ID=35782959

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094123010A TW200613910A (en) 2004-07-07 2005-07-07 Photocurable/thermosetting resin composition, dry film using same, and cured product thereof

Country Status (6)

Country Link
US (1) US7585611B2 (zh)
JP (1) JPWO2006004158A1 (zh)
KR (1) KR100845657B1 (zh)
CN (1) CN1981237B (zh)
TW (1) TW200613910A (zh)
WO (1) WO2006004158A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI584070B (zh) * 2012-04-23 2017-05-21 日立化成股份有限公司 感光性樹脂組成物、感光性膜、永久遮罩抗蝕劑及永久遮罩抗蝕劑的製造方法

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7566377B2 (en) * 2002-09-19 2009-07-28 Mitsui Chemicals, Inc. Liquid crystal sealing agent composition and manufacturing method of liquid crystal display panel using the same
KR101411346B1 (ko) * 2004-07-14 2014-06-25 아사히 가세이 이-매터리얼즈 가부시키가이샤 감광성 조성물, 패턴형성재료, 감광성 적층체, 및 패턴형성장치 및 패턴형성방법
TW200710572A (en) * 2005-05-31 2007-03-16 Taiyo Ink Mfg Co Ltd Photocuring/thermosetting resin composition, curing/setting product thereof and printed wiring board obtained using the same
US7723404B2 (en) * 2006-04-06 2010-05-25 Ppg Industries Ohio, Inc. Abrasion resistant coating compositions and coated articles
US7838197B2 (en) * 2006-11-15 2010-11-23 Taiyo Ink Mfg. Co., Ltd. Photosensitive composition
TW200846823A (en) 2006-11-15 2008-12-01 Taiyo Ink Mfg Co Ltd Photosensitive composition
JP5276832B2 (ja) * 2006-11-15 2013-08-28 太陽ホールディングス株式会社 ソルダーレジスト膜形成方法および感光性組成物
KR100979436B1 (ko) * 2007-03-02 2010-09-02 삼성전자주식회사 광대역 무선 접속 시스템에서 멀티캐스트 및 브로드캐스트 서비스 방송 채널에 대한 채널 전환 장치 및 방법
KR100889774B1 (ko) 2007-03-06 2009-03-24 삼성에스디아이 주식회사 감광성 페이스트 조성물, 이를 이용하여 제조된 플라즈마디스플레이 패널의 격벽 및 이를 포함하는 플라즈마디스플레이 패널
TW200903160A (en) * 2007-04-27 2009-01-16 Sumitomo Chemical Co Photosensitive resin composition
JP5298653B2 (ja) * 2007-07-06 2013-09-25 Ｊｓｒ株式会社 着色層形成用感放射線性組成物、カラーフィルタおよびカラー液晶表示素子
WO2009014112A1 (ja) * 2007-07-26 2009-01-29 Nippon Steel Chemical Co., Ltd. 体積位相型ホログラム記録材料及びそれを用いた光情報記録媒体
WO2009076255A2 (en) 2007-12-06 2009-06-18 Saint-Gobain Abrasives, Inc. Abrasive articles and methods for making same
US8273681B2 (en) * 2008-09-02 2012-09-25 Nissan Motor Co., Ltd. Exhaust gas purifying catalyst and method for manufacturing the same
JP5377021B2 (ja) * 2009-03-23 2013-12-25 太陽ホールディングス株式会社 硬化性樹脂組成物、それを用いたドライフィルム及びプリント配線板
JP6054012B2 (ja) 2009-03-31 2016-12-27 太陽ホールディングス株式会社 硬化性樹脂組成物およびそれを用いたプリント配線板と反射板
WO2011030580A1 (ja) * 2009-09-10 2011-03-17 積水化学工業株式会社 感光性組成物及びプリント配線板
JP5583941B2 (ja) * 2009-09-30 2014-09-03 太陽ホールディングス株式会社 光硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
GB2476976A (en) 2010-01-18 2011-07-20 Lintfield Ltd Protected aryl ketones and their use as photoinitiators
JP5661293B2 (ja) * 2010-02-08 2015-01-28 太陽ホールディングス株式会社 光硬化性樹脂組成物、ドライフィルム、硬化物及びプリント配線板
CN102804066B (zh) * 2010-03-22 2015-04-01 株式会社Lg化学 光固化和热固化树脂组合物及防焊干膜
JP5285648B2 (ja) * 2010-03-31 2013-09-11 太陽ホールディングス株式会社 光硬化性樹脂組成物、それを用いたドライフィルム及びプリント配線板
JP5647910B2 (ja) * 2011-01-31 2015-01-07 富士フイルム株式会社 感光性組成物、パターン形成材料、並びに、これを用いた感光性膜、パターン形成方法、パターン膜、低屈折率膜、光学デバイス、及び、固体撮像素子
US9822088B2 (en) * 2011-03-30 2017-11-21 The United States Of America As Represented By The Administrator Of Nasa Anisotropic copoly(imide oxetane) coatings and articles of manufacture, copoly(imide oxetane)s containing pendant fluorocarbon moieties, oligomers and processes therefor
WO2012137838A1 (ja) * 2011-04-08 2012-10-11 太陽インキ製造株式会社 感光性組成物、その硬化皮膜及びそれらを用いたプリント配線板
KR101493640B1 (ko) * 2011-04-13 2015-02-13 다이요 잉키 세이조 가부시키가이샤 경화성 수지 조성물, 그의 경화물 및 그것들을 사용한 인쇄 배선판
KR101946646B1 (ko) * 2011-05-30 2019-02-11 스미또모 가가꾸 가부시끼가이샤 경화성 수지 조성물
WO2013094606A1 (ja) * 2011-12-22 2013-06-27 太陽インキ製造株式会社 ドライフィルム及びそれを用いたプリント配線板、プリント配線板の製造方法、及びフリップチップ実装基板
KR101545724B1 (ko) * 2012-08-01 2015-08-19 주식회사 엘지화학 광경화성 및 열경화성을 갖는 수지 조성물과, 드라이 필름 솔더 레지스트
WO2014084190A1 (ja) * 2012-11-27 2014-06-05 富士フイルム株式会社 光硬化性組成物、転写材料、硬化物及びその製造方法、樹脂パターン製造方法、硬化膜、液晶表示装置、有機ｅｌ表示装置並びにタッチパネル表示装置
KR101629942B1 (ko) * 2013-06-12 2016-06-13 주식회사 엘지화학 광경화성 및 열경화성을 갖는 수지 조성물, 및 드라이 필름 솔더 레지스트
JP5639697B1 (ja) * 2013-08-08 2014-12-10 東海神栄電子工業株式会社 識別文字・記号及び絵等の視認が可能な回路基板の製造方法
CN105467753B (zh) * 2014-07-31 2020-01-14 太阳油墨（苏州）有限公司 光固化性热固化性树脂组合物、干膜、固化物、及印刷电路板
JP6723788B2 (ja) * 2016-03-31 2020-07-15 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP2021532179A (ja) 2018-07-19 2021-11-25 リントフィールド リミテッド 光開始剤
JP6963047B2 (ja) * 2019-02-22 2021-11-05 株式会社タムラ製作所 青色感光性樹脂組成物
CN113646698B (zh) * 2019-03-29 2024-05-10 太阳控股株式会社 光致抗蚀剂组合物及其固化物
GB202000736D0 (en) 2020-01-17 2020-03-04 Lintfield Ltd Modified thioxanthone photoinitators
KR20240123972A (ko) * 2023-02-08 2024-08-16 주식회사 케이씨씨 솔더 레지스트용 수지 조성물

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0288615A (ja) * 1988-09-27 1990-03-28 Mitsubishi Rayon Co Ltd 難燃性液状感光性樹脂組成物
US5639546A (en) * 1991-09-03 1997-06-17 Minnesota Mining And Manufacturing Company Coated article having improved adhesion to organic coatings
JP3580429B2 (ja) * 1994-10-05 2004-10-20 互応化学工業株式会社 フォトソルダーレジストインク、プリント回路基板及びその製造方法
DE69607569T3 (de) * 1995-06-12 2004-11-04 Toray Industries, Inc. Benutzung einer fotoempfindlichen paste, verfahren zur herstellung einer plasmaanzeigetafel, sowie plasmaanzeigetafel, welche nach diesem verfahren herstellbar ist
JPH10333324A (ja) * 1997-04-03 1998-12-18 Toray Ind Inc 感光性ペースト
MY121423A (en) * 1998-06-26 2006-01-28 Ciba Sc Holding Ag Photopolymerizable thermosetting resin compositions
TW494276B (en) * 1999-05-06 2002-07-11 Solar Blak Water Co Ltd Solder resist ink composition
JP2001013682A (ja) 1999-06-30 2001-01-19 Hitachi Chem Co Ltd 感光性エレメント及びこれを用いたカラーフィルタの製造法
CN1193056C (zh) * 2000-01-18 2005-03-16 太阳油墨制造株式会社 多核环氧化合物,由其所得的活性能线固化性树脂及使用其所得的光固化性·热固化性树脂组合物
JP3723036B2 (ja) * 2000-03-29 2005-12-07 太陽インキ製造株式会社 活性エネルギー線硬化性樹脂及びこれを用いた光硬化性・熱硬化性樹脂組成物
TWI278448B (en) * 2000-01-27 2007-04-11 Univ Kanagawa Unsaturated monocarboxylic ester compound, process for producing the same, and composition curable with actinic energy ray
KR100634341B1 (ko) * 2000-02-14 2006-10-16 타이요 잉크 메뉴펙츄어링 컴퍼니, 리미티드 윤기를 없앤 피막 형성용 광경화성·열경화성 조성물
CN100454142C (zh) * 2000-03-29 2009-01-21 学校法人神奈川大学 光固化性和热固化性树脂组合物、其感光性干薄膜及使用其的图案形成方法
KR100633794B1 (ko) * 2000-03-29 2006-10-16 각고우호우진 가나가와 다이가쿠 활성 에너지선 경화성 수지, 그 제조 방법 및광경화성·열경화성 수지 조성물
JP2001302871A (ja) * 2000-04-25 2001-10-31 Taiyo Ink Mfg Ltd 光硬化性・熱硬化性樹脂組成物とこれを用いて形成したソルダーレジスト皮膜や樹脂絶縁層を有するプリント配線板
JP2002062661A (ja) * 2000-08-18 2002-02-28 Teijin Ltd ドライフィルムレジスト用ポリエステルフィルム
JP4382978B2 (ja) * 2000-12-04 2009-12-16 学校法人神奈川大学 光硬化性・熱硬化性樹脂組成物
WO2002064662A1 (fr) * 2001-02-15 2002-08-22 Kanagawa University Compose de polyester insature, resine durcissable aux radiations actiniques, procedes de production de ces derniers et composition durcissable
JP4335466B2 (ja) * 2001-02-15 2009-09-30 学校法人神奈川大学 活性エネルギー線硬化性樹脂、その製造方法及び活性エネルギー線硬化性樹脂組成物
CN1498236A (zh) * 2001-03-23 2004-05-19 太阳油墨制造株式会社 活性能量线固化树脂和含其的光固化·热固性树脂组合物
JP4161683B2 (ja) * 2001-11-01 2008-10-08 東レ株式会社 感光性セラミックス組成物
JP3996802B2 (ja) * 2002-05-15 2007-10-24 太陽インキ製造株式会社 低放射線性の光硬化性・熱硬化性樹脂組成物及びその硬化被膜
JP2004125836A (ja) * 2002-09-30 2004-04-22 Fuji Photo Film Co Ltd 光重合型平版印刷版及び平版印刷版の製版方法
US7232650B2 (en) 2002-10-02 2007-06-19 3M Innovative Properties Company Planar inorganic device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI584070B (zh) * 2012-04-23 2017-05-21 日立化成股份有限公司 感光性樹脂組成物、感光性膜、永久遮罩抗蝕劑及永久遮罩抗蝕劑的製造方法

Also Published As

Publication number Publication date
WO2006004158A1 (ja) 2006-01-12
KR20070039531A (ko) 2007-04-12
US20070122742A1 (en) 2007-05-31
US7585611B2 (en) 2009-09-08
TWI376572B (zh) 2012-11-11
JPWO2006004158A1 (ja) 2008-04-24
CN1981237A (zh) 2007-06-13
CN1981237B (zh) 2010-05-05
KR100845657B1 (ko) 2008-07-10

Similar Documents

Publication Publication Date Title
TW200613910A (en) Photocurable/thermosetting resin composition, dry film using same, and cured product thereof
DE60017470D1 (de) Phot0- oder wärmehärtende zusammensetzungen zur herstellung matter filme
ATE513250T1 (de) Prägeform, imprint lithographieverfahren, und verfahren für chipherstellung
TW200728379A (en) Resin composition, cured product of the same, and printed circuit board made of the same
DE60226876D1 (de) Amphotere polymerharze, die die geschwindigkeit der leimungsentwicklung erhöhen
EP1327642A4 (en) CARBOXYLATED PHOTOSENSITIVE RESIN, THIS CONTAINING, ALKALI DEVELOPABLE, LIGHT-CURABLE / HEAT-CURABLE COMPOSITION, AND THEREOF HARDENED ARTICLE
WO2008114696A1 (ja) 光導波路用接着剤組成物、これを用いた光導波路用接着フィルムおよび光導波路用粘接着シート、ならびにこれらを用いた光学装置
EP3674333A3 (en) Liquid composition and device
WO2011156309A3 (en) Optical fiber with photoacid coating
JP3985821B2 (ja) 硬化性含フッ素樹脂組成物およびそれを硬化してなる光学部材
TW200643040A (en) Liquid curable composition, cured film, and antistatic layered product
DE602004006668D1 (de) Formgebungsverfahren eines UV-härtenden Harzes
CN108250838A (zh) 一种用于直写法3d打印硅酮结构的墨水组合物
US9930749B2 (en) Lighting structure with patterns
WO2009017197A1 (ja) 反射防止基材の製造方法及び反射防止基材
TW200730571A (en) Organic-inorganic hybrid composition, method for producing the same, molding and optical component
JPH0290109A (ja) 光回路板およびその製造法
KR930016514A (ko) 점착성이 우수한 자외선 경화성 수지 조성물
TW200738771A (en) Alkali developable curable composition and cured product thereof
MX2021010937A (es) Pelicula intermedia para vidrio laminado y vidrio laminado.
JP2016199425A (ja) 高屈折ガラスの表面処理方法
JP2007072129A (ja) 光導波路及びその製造方法
JP2007145930A (ja) 光硬化型接着剤の硬化方法および接着剤硬化用光照射装置
CN110437748A (zh) 封装胶及其制备方法、封装体及其制备方法
TW201525083A (zh) 反射膜及該反射膜的製作方法