WO2008114696A1 - 光導波路用接着剤組成物、これを用いた光導波路用接着フィルムおよび光導波路用粘接着シート、ならびにこれらを用いた光学装置 - Google Patents

光導波路用接着剤組成物、これを用いた光導波路用接着フィルムおよび光導波路用粘接着シート、ならびにこれらを用いた光学装置 Download PDF

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Publication number
WO2008114696A1
WO2008114696A1 PCT/JP2008/054650 JP2008054650W WO2008114696A1 WO 2008114696 A1 WO2008114696 A1 WO 2008114696A1 JP 2008054650 W JP2008054650 W JP 2008054650W WO 2008114696 A1 WO2008114696 A1 WO 2008114696A1
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WO
WIPO (PCT)
Prior art keywords
adhesive
optical waveguide
adhesive composition
optical
film
Prior art date
Application number
PCT/JP2008/054650
Other languages
English (en)
French (fr)
Inventor
Tomoaki Shibata
Atsushi Takahashi
Keisuke Ookubo
Tetsurou Iwakura
Original Assignee
Hitachi Chemical Company, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007323779A external-priority patent/JP2008260908A/ja
Priority claimed from JP2007323784A external-priority patent/JP2008262159A/ja
Application filed by Hitachi Chemical Company, Ltd. filed Critical Hitachi Chemical Company, Ltd.
Priority to CN2008800016869A priority Critical patent/CN101578344B/zh
Priority to KR1020097012344A priority patent/KR101101526B1/ko
Priority to US12/522,433 priority patent/US8200059B2/en
Priority to EP08722054A priority patent/EP2128213A1/en
Priority to AU2008227642A priority patent/AU2008227642A1/en
Publication of WO2008114696A1 publication Critical patent/WO2008114696A1/ja

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G02B6/1221—Basic optical elements, e.g. light-guiding paths made from organic materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/08—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols from phenol-aldehyde condensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
    • C09J161/04—Condensation polymers of aldehydes or ketones with phenols only
    • C09J161/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C09J163/10—Epoxy resins modified by unsaturated compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13—Integrated optical circuits characterised by the manufacturing method
    • G02B6/138—Integrated optical circuits characterised by the manufacturing method by using polymerisation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C08L2666/22—Macromolecular compounds not provided for in C08L2666/16 - C08L2666/20
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Epoxy Resins (AREA)

Abstract

　本発明は、（ａ）エポキシ樹脂、（ｂ）硬化剤、及び（ｃ）高分子化合物を含有してなる接着剤組成物であって、その硬化物の全光線透過率と波長７００～１６００ｎｍにおける光線透過率が８０％以上である、透明性と耐熱性を両立した光導波路用接着剤組成物、該接着剤組成物をフィルム状に形成してなる光導波路用接着フィルム、該接着剤組成物と支持基材からなる光導波路用粘接着シート、ならびにこれらを用いて製造した光学装置を提供する。
PCT/JP2008/054650 2007-03-16 2008-03-13 光導波路用接着剤組成物、これを用いた光導波路用接着フィルムおよび光導波路用粘接着シート、ならびにこれらを用いた光学装置 WO2008114696A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN2008800016869A CN101578344B (zh) 2007-03-16 2008-03-13 光波导用粘接剂组合物、使用其的光波导用粘接薄膜和光波导用粘附粘接片、以及使用它们的光学装置
KR1020097012344A KR101101526B1 (ko) 2007-03-16 2008-03-13 광도파로용 접착제 조성물, 이것을 이용한 광도파로용 접착 필름 및 광도파로용 점접착 시트, 및 이들을 이용한 광학장치
US12/522,433 US8200059B2 (en) 2007-03-16 2008-03-13 Adhesive composition for optical waveguide, adhesive film for optical waveguide and adhesive sheet for optical waveguide each using the same, and optical device using any of them
EP08722054A EP2128213A1 (en) 2007-03-16 2008-03-13 Adhesive composition for optical waveguide, adhesive film for optical waveguide and adhesive sheet for optical waveguide each using the same, and optical device using any of them
AU2008227642A AU2008227642A1 (en) 2007-03-16 2008-03-13 Adhesive composition for optical waveguide, adhesive film for optical waveguide and adhesive sheet for optical waveguide each using the same, and optical device using any of them

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2007-068421 2007-03-16
JP2007068420 2007-03-16
JP2007-068420 2007-03-16
JP2007068421 2007-03-16
JP2007323779A JP2008260908A (ja) 2007-03-16 2007-12-14 光導波路用接着剤組成物およびこれを用いた光導波路用接着フィルム、ならびにこれらを用いた光学装置
JP2007-323784 2007-12-14
JP2007-323779 2007-12-14
JP2007323784A JP2008262159A (ja) 2007-03-16 2007-12-14 光導波路用粘接着剤樹脂組成物およびこれを用いた光導波路用粘接着シート、ならびにこれらを用いた光学装置

Publications (1)

Publication Number Publication Date
WO2008114696A1 true WO2008114696A1 (ja) 2008-09-25

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PCT/JP2008/054650 WO2008114696A1 (ja) 2007-03-16 2008-03-13 光導波路用接着剤組成物、これを用いた光導波路用接着フィルムおよび光導波路用粘接着シート、ならびにこれらを用いた光学装置

Country Status (7)

Country Link
US (1) US8200059B2 (ja)
EP (1) EP2128213A1 (ja)
KR (1) KR101101526B1 (ja)
CN (1) CN101578344B (ja)
AU (1) AU2008227642A1 (ja)
TW (1) TWI433905B (ja)
WO (1) WO2008114696A1 (ja)

Cited By (4)

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JP2010138370A (ja) * 2008-06-06 2010-06-24 Nitto Denko Corp 光硬化型粘接着剤組成物、光硬化型粘接着剤層、および光硬化型粘接着シート
WO2010140442A1 (ja) * 2009-06-01 2010-12-09 日東電工株式会社 光硬化型粘接着剤組成物、光硬化型粘接着剤層、および光硬化型粘接着シート
JP2012082264A (ja) * 2010-10-07 2012-04-26 Dainippon Printing Co Ltd 粘接着剤組成物及び粘接着シート
JP2013107957A (ja) * 2011-11-18 2013-06-06 Dainippon Printing Co Ltd 接着剤組成物およびそれを用いた接着シート

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JP2009058923A (ja) * 2007-04-27 2009-03-19 Hitachi Chem Co Ltd 光電気複合基板の製造方法、これによって製造される光電気複合基板、及びこれを用いた光電気複合モジュール
DE102007043559B4 (de) * 2007-09-13 2012-05-31 Carl Zeiss Vision Gmbh Verwendung eines lichthärtenden thermoplastischen Epoxidharzklebstoffs zum Blocken oder Kleben von optischen Bauelementen
US8692394B2 (en) * 2009-09-30 2014-04-08 Sekisui Chemical Co., Ltd. Adhesive for semiconductor bonding, adhesive film for semiconductor bonding, method for mounting semiconductor chip, and semiconductor device
TWI509043B (zh) * 2010-09-09 2015-11-21 Hitachi Chemical Co Ltd Adhesive composition, method for manufacturing connection of circuit member and semiconductor device
TWI425066B (zh) * 2010-09-09 2014-02-01 Hitachi Chemical Co Ltd Preparation method of adhesive composition, circuit board for connecting circuit member, and manufacturing method of semiconductor device
TWI498617B (zh) * 2010-10-01 2015-09-01 Sumitomo Bakelite Co 光導波路構造體及電子機器
WO2012070871A2 (ko) 2010-11-23 2012-05-31 주식회사 엘지화학 접착제 조성물
CN102344772A (zh) * 2011-08-03 2012-02-08 华烁科技股份有限公司 一种高导热绝缘环氧树脂胶及其在led用挠性铝基覆铜板上的应用
CN104169383B (zh) * 2012-03-08 2016-11-09 日立化成株式会社 粘接片材及半导体装置的制造方法
KR20130139134A (ko) * 2012-06-12 2013-12-20 제일모직주식회사 접착제 조성물, 이를 이용한 편광판, 그 제조 방법 및 이를 포함하는 광학 부재
WO2014021450A1 (ja) 2012-08-02 2014-02-06 リンテック株式会社 フィルム状接着剤、半導体接合用接着シート、および半導体装置の製造方法
JP6080155B2 (ja) * 2012-11-08 2017-02-15 日東電工株式会社 光電気混載基板
JP6090655B2 (ja) * 2013-02-12 2017-03-08 パナソニックＩｐマネジメント株式会社 光導波路用ドライフィルム、それを用いた光導波路及び光電気複合配線板、並びに光電気複合配線板の製造方法
JP5890795B2 (ja) * 2013-03-18 2016-03-22 日本碍子株式会社 半導体製造装置用部材
GB2526150B (en) 2014-05-16 2016-07-13 Xyratex Tech Ltd An optical printed circuit board and a method of mounting a component onto an optical printed circuit board
JP6694180B2 (ja) * 2016-01-29 2020-05-13 日東電工株式会社 光導波路形成用感光性エポキシ樹脂組成物および光導波路形成用感光性フィルム、ならびにそれを用いた光導波路、光・電気伝送用混載フレキシブルプリント配線板
CN110643286B (zh) * 2018-06-27 2021-11-19 3M创新有限公司 Uv固化组合物及包含该组合物的胶膜、胶带和粘结构件
CN111045145B (zh) * 2019-12-25 2023-12-15 易锐光电科技(安徽)有限公司 薄膜光波导及其制备方法

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JPH0759620A (ja) 1993-08-30 1995-03-07 Aoki Corp 荷物台及びロッカー
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JPH0764911A (ja) 1993-08-31 1995-03-10 Sharp Corp 個人認証システム
JPH0768327A (ja) 1992-12-16 1995-03-14 Mercedes Benz Ag プレスにおける押出し過程の自動反復プロセス最適化方法
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JP2004069824A (ja) * 2002-08-02 2004-03-04 Toppan Printing Co Ltd 光配線基板
WO2005112091A1 (ja) * 2004-05-18 2005-11-24 Hitachi Chemical Co., Ltd. 粘接着シート並びにそれを用いた半導体装置及びその製造方法

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JPH0759620A (ja) 1993-08-30 1995-03-07 Aoki Corp 荷物台及びロッカー
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JPH0759617A (ja) 1993-09-07 1995-03-07 Kyushu Hitachi Maxell Ltd ヘアードライヤ
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WO2005112091A1 (ja) * 2004-05-18 2005-11-24 Hitachi Chemical Co., Ltd. 粘接着シート並びにそれを用いた半導体装置及びその製造方法

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Cited By (8)

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JP2010138370A (ja) * 2008-06-06 2010-06-24 Nitto Denko Corp 光硬化型粘接着剤組成物、光硬化型粘接着剤層、および光硬化型粘接着シート
US9109142B2 (en) 2008-06-06 2015-08-18 Nitto Denko Corporation Photocurable adhesive composition, photocurable adhesive layer, and photocurable adhesive sheet
WO2010140442A1 (ja) * 2009-06-01 2010-12-09 日東電工株式会社 光硬化型粘接着剤組成物、光硬化型粘接着剤層、および光硬化型粘接着シート
CN102449093A (zh) * 2009-06-01 2012-05-09 日东电工株式会社 光固化型粘合粘接剂组合物、光固化型粘合粘接剂层、和光固化型粘合粘接片
CN102449093B (zh) * 2009-06-01 2014-08-20 日东电工株式会社 光固化型粘合粘接剂组合物、光固化型粘合粘接剂层、和光固化型粘合粘接片
TWI491694B (zh) * 2009-06-01 2015-07-11 Nitto Denko Corp A photohardenable adhesive composition, a photohardenable adhesive layer, and a photohardenable adhesive sheet
JP2012082264A (ja) * 2010-10-07 2012-04-26 Dainippon Printing Co Ltd 粘接着剤組成物及び粘接着シート
JP2013107957A (ja) * 2011-11-18 2013-06-06 Dainippon Printing Co Ltd 接着剤組成物およびそれを用いた接着シート

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TW200904928A (en) 2009-02-01
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AU2008227642A1 (en) 2008-09-25
EP2128213A1 (en) 2009-12-02
US20100129045A1 (en) 2010-05-27
US8200059B2 (en) 2012-06-12
CN101578344A (zh) 2009-11-11
KR20090096458A (ko) 2009-09-10
TWI433905B (zh) 2014-04-11

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