CN1981237B - 光固化性·热固化性树脂组合物和使用其的干膜、及其固化物 - Google Patents
光固化性·热固化性树脂组合物和使用其的干膜、及其固化物 Download PDFInfo
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- CN1981237B CN1981237B CN2005800226929A CN200580022692A CN1981237B CN 1981237 B CN1981237 B CN 1981237B CN 2005800226929 A CN2005800226929 A CN 2005800226929A CN 200580022692 A CN200580022692 A CN 200580022692A CN 1981237 B CN1981237 B CN 1981237B
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- 229910000162 sodium phosphate Inorganic materials 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 229910052911 sodium silicate Inorganic materials 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000010189 synthetic method Methods 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 150000003557 thiazoles Chemical class 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 150000003852 triazoles Chemical class 0.000 description 1
- 229950004616 tribromoethanol Drugs 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
- H05K3/4676—Single layer compositions
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/106—Binder containing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/114—Initiator containing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/146—Laser beam
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/151—Matting or other surface reflectivity altering material
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Materials For Photolithography (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Polymerisation Methods In General (AREA)
Abstract
Description
Claims (12)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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JP200961/2004 | 2004-07-07 | ||
JP2004200961 | 2004-07-07 | ||
PCT/JP2005/012494 WO2006004158A1 (ja) | 2004-07-07 | 2005-07-06 | 光硬化性・熱硬化性樹脂組成物とそれを用いたドライフィルム、及びその硬化物 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1981237A CN1981237A (zh) | 2007-06-13 |
CN1981237B true CN1981237B (zh) | 2010-05-05 |
Family
ID=35782959
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN2005800226929A Active CN1981237B (zh) | 2004-07-07 | 2005-07-06 | 光固化性·热固化性树脂组合物和使用其的干膜、及其固化物 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7585611B2 (zh) |
JP (1) | JPWO2006004158A1 (zh) |
KR (1) | KR100845657B1 (zh) |
CN (1) | CN1981237B (zh) |
TW (1) | TW200613910A (zh) |
WO (1) | WO2006004158A1 (zh) |
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TW200710572A (en) * | 2005-05-31 | 2007-03-16 | Taiyo Ink Mfg Co Ltd | Photocuring/thermosetting resin composition, curing/setting product thereof and printed wiring board obtained using the same |
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KR20080044193A (ko) * | 2006-11-15 | 2008-05-20 | 다이요 잉키 세이조 가부시키가이샤 | 솔더 레지스트막 형성 방법 및 감광성 조성물 |
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WO2009076255A2 (en) | 2007-12-06 | 2009-06-18 | Saint-Gobain Abrasives, Inc. | Abrasive articles and methods for making same |
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JP6054012B2 (ja) | 2009-03-31 | 2016-12-27 | 太陽ホールディングス株式会社 | 硬化性樹脂組成物およびそれを用いたプリント配線板と反射板 |
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JP5583941B2 (ja) * | 2009-09-30 | 2014-09-03 | 太陽ホールディングス株式会社 | 光硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板 |
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JP5661293B2 (ja) * | 2010-02-08 | 2015-01-28 | 太陽ホールディングス株式会社 | 光硬化性樹脂組成物、ドライフィルム、硬化物及びプリント配線板 |
WO2011118939A2 (ko) * | 2010-03-22 | 2011-09-29 | 주식회사 엘지화학 | 광경화성 및 열경화성을 갖는 수지 조성물과, 드라이 필름 솔더 레지스트 |
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JP5647910B2 (ja) * | 2011-01-31 | 2015-01-07 | 富士フイルム株式会社 | 感光性組成物、パターン形成材料、並びに、これを用いた感光性膜、パターン形成方法、パターン膜、低屈折率膜、光学デバイス、及び、固体撮像素子 |
US9822088B2 (en) | 2011-03-30 | 2017-11-21 | The United States Of America As Represented By The Administrator Of Nasa | Anisotropic copoly(imide oxetane) coatings and articles of manufacture, copoly(imide oxetane)s containing pendant fluorocarbon moieties, oligomers and processes therefor |
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WO2012141124A1 (ja) * | 2011-04-13 | 2012-10-18 | 太陽インキ製造株式会社 | 硬化性樹脂組成物、その硬化物及びそれらを用いたプリント配線板 |
KR101946646B1 (ko) * | 2011-05-30 | 2019-02-11 | 스미또모 가가꾸 가부시끼가이샤 | 경화성 수지 조성물 |
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KR101629942B1 (ko) * | 2013-06-12 | 2016-06-13 | 주식회사 엘지화학 | 광경화성 및 열경화성을 갖는 수지 조성물, 및 드라이 필름 솔더 레지스트 |
JP5639697B1 (ja) * | 2013-08-08 | 2014-12-10 | 東海神栄電子工業株式会社 | 識別文字・記号及び絵等の視認が可能な回路基板の製造方法 |
CN105467753B (zh) * | 2014-07-31 | 2020-01-14 | 太阳油墨(苏州)有限公司 | 光固化性热固化性树脂组合物、干膜、固化物、及印刷电路板 |
JP6723788B2 (ja) * | 2016-03-31 | 2020-07-15 | 太陽インキ製造株式会社 | 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板 |
KR20210065928A (ko) | 2018-07-19 | 2021-06-04 | 린트필드 리미티드 | 티오크산톤 유도체 및 이를 포함하는 조성물 및 상기 조성물을 포함하는 패턴 형성 방법{Thioxanthone derivatives, composition comprising the same and pattern forming method comprising said composition} |
JP6963047B2 (ja) * | 2019-02-22 | 2021-11-05 | 株式会社タムラ製作所 | 青色感光性樹脂組成物 |
TW202102938A (zh) * | 2019-03-29 | 2021-01-16 | 日商太陽油墨製造股份有限公司 | 光阻組成物及其硬化物 |
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US7585611B2 (en) | 2009-09-08 |
JPWO2006004158A1 (ja) | 2008-04-24 |
KR100845657B1 (ko) | 2008-07-10 |
WO2006004158A1 (ja) | 2006-01-12 |
KR20070039531A (ko) | 2007-04-12 |
CN1981237A (zh) | 2007-06-13 |
TWI376572B (zh) | 2012-11-11 |
TW200613910A (en) | 2006-05-01 |
US20070122742A1 (en) | 2007-05-31 |
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