TW200507220A - Semiconductor device and method of manufacturing thereof - Google Patents
Semiconductor device and method of manufacturing thereofInfo
- Publication number
- TW200507220A TW200507220A TW093113877A TW93113877A TW200507220A TW 200507220 A TW200507220 A TW 200507220A TW 093113877 A TW093113877 A TW 093113877A TW 93113877 A TW93113877 A TW 93113877A TW 200507220 A TW200507220 A TW 200507220A
- Authority
- TW
- Taiwan
- Prior art keywords
- resin portion
- sealing resin
- exposed
- lead
- exposed surface
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/3201—Structure
- H01L2224/32012—Structure relative to the bonding area, e.g. bond pad
- H01L2224/32014—Structure relative to the bonding area, e.g. bond pad the layer connector being smaller than the bonding area, e.g. bond pad
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01046—Palladium [Pd]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Geometry (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003286609A JP2005057067A (ja) | 2003-08-05 | 2003-08-05 | 半導体装置およびその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200507220A true TW200507220A (en) | 2005-02-16 |
Family
ID=34113960
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093113877A TW200507220A (en) | 2003-08-05 | 2004-05-17 | Semiconductor device and method of manufacturing thereof |
Country Status (4)
Country | Link |
---|---|
US (2) | US7348659B2 (zh) |
JP (1) | JP2005057067A (zh) |
KR (1) | KR20050016130A (zh) |
TW (1) | TW200507220A (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI775747B (zh) * | 2016-04-22 | 2022-09-01 | 日商瑞薩電子股份有限公司 | 半導體裝置之製造方法及半導體裝置 |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006066545A (ja) * | 2004-08-25 | 2006-03-09 | Mitsubishi Electric Corp | 電子部品パッケージ |
JP4545537B2 (ja) * | 2004-09-17 | 2010-09-15 | 富士通セミコンダクター株式会社 | 半導体装置及び半導体装置ユニット |
KR100740358B1 (ko) * | 2005-02-25 | 2007-07-16 | 야마하 가부시키가이샤 | 센서 및 센서 형성 방법 |
JP4624170B2 (ja) * | 2005-04-25 | 2011-02-02 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
EP1884335A4 (en) * | 2005-05-24 | 2010-01-13 | Murata Manufacturing Co | METHOD AND DEVICE FOR PRODUCING INSERTED PART |
JP4732138B2 (ja) * | 2005-11-11 | 2011-07-27 | ルネサスエレクトロニクス株式会社 | 半導体装置及びその製造方法 |
US20070176303A1 (en) * | 2005-12-27 | 2007-08-02 | Makoto Murai | Circuit device |
US7947534B2 (en) * | 2006-02-04 | 2011-05-24 | Stats Chippac Ltd. | Integrated circuit packaging system including a non-leaded package |
TWI286375B (en) * | 2006-03-24 | 2007-09-01 | Chipmos Technologies Inc | Leadless semiconductor package with electroplated layer embedded in encapsulant and the method for fabricating the same |
US20080054496A1 (en) * | 2006-08-30 | 2008-03-06 | Neill Thornton | High temperature operating package and circuit design |
CN101246893A (zh) * | 2007-02-13 | 2008-08-20 | 精材科技股份有限公司 | 具有高传导面积的集成电路封装体及其制作方法 |
US7796337B2 (en) * | 2007-03-13 | 2010-09-14 | Visera Technologies Company Limited | Optical microstructure plate and fabrication mold thereof |
US20090108418A1 (en) * | 2007-10-29 | 2009-04-30 | Wa-Hua Wu | Non-leaded semiconductor package structure |
TWI382503B (zh) * | 2009-02-27 | 2013-01-11 | Advanced Semiconductor Eng | 四方扁平無引腳封裝 |
US8680659B2 (en) | 2009-05-15 | 2014-03-25 | Rohm Co., Ltd. | Semiconductor device |
JP5183572B2 (ja) * | 2009-06-08 | 2013-04-17 | 株式会社三井ハイテック | リードフレーム及び半導体装置 |
JP5341679B2 (ja) * | 2009-08-31 | 2013-11-13 | 株式会社日立製作所 | 半導体装置 |
JP5569097B2 (ja) * | 2010-03-29 | 2014-08-13 | 富士通セミコンダクター株式会社 | 半導体装置及びリードフレーム |
US8390103B2 (en) * | 2010-07-12 | 2013-03-05 | Analog Devices, Inc. | Apparatus for integrated circuit packaging |
JP5204271B2 (ja) * | 2011-06-16 | 2013-06-05 | 株式会社東芝 | 内視鏡装置および基板 |
US20140131086A1 (en) * | 2011-09-06 | 2014-05-15 | Texas Instuments Incorporated | Lead Frame Strip with Half (1/2) Thickness Pull Out Tab |
JP5953703B2 (ja) * | 2011-10-31 | 2016-07-20 | ソニー株式会社 | リードフレームおよび半導体装置 |
US8890301B2 (en) * | 2012-08-01 | 2014-11-18 | Analog Devices, Inc. | Packaging and methods for packaging |
US9257306B2 (en) | 2013-04-18 | 2016-02-09 | Dai Nippon Printing Co., Ltd. | Lead frame, method for manufacturing lead frame, semiconductor device, and method for manufacturing semiconductor device |
JP6379448B2 (ja) * | 2013-04-18 | 2018-08-29 | 大日本印刷株式会社 | リードフレームおよびその製造方法、ならびに半導体装置およびその製造方法 |
JP6205816B2 (ja) * | 2013-04-18 | 2017-10-04 | 大日本印刷株式会社 | リードフレームおよびその製造方法、ならびに半導体装置およびその製造方法 |
JP5894209B2 (ja) * | 2014-04-03 | 2016-03-23 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP6807050B2 (ja) * | 2016-10-14 | 2021-01-06 | 大日本印刷株式会社 | リードフレームおよび半導体装置 |
JP2017076809A (ja) * | 2016-12-05 | 2017-04-20 | 大日本印刷株式会社 | 樹脂付リードフレーム、半導体装置、照明装置 |
US9978668B1 (en) * | 2017-01-17 | 2018-05-22 | Fairchild Semiconductor Corporation | Packaged semiconductor devices with laser grooved wettable flank and methods of manufacture |
JP6885250B2 (ja) * | 2017-07-31 | 2021-06-09 | 大日本印刷株式会社 | リードフレームおよび半導体装置 |
WO2019026917A1 (ja) * | 2017-07-31 | 2019-02-07 | 大日本印刷株式会社 | リードフレーム、半導体装置および半導体装置の製造方法 |
US10312198B2 (en) * | 2017-10-20 | 2019-06-04 | Advanced Semiconductor Engineering, Inc. | Semiconductor device package |
US11869831B2 (en) | 2020-10-08 | 2024-01-09 | Mediatek Inc. | Semiconductor package with improved board level reliability |
WO2023218941A1 (ja) * | 2022-05-13 | 2023-11-16 | ローム株式会社 | 半導体装置、および、半導体装置の製造方法 |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59168659A (ja) * | 1983-03-15 | 1984-09-22 | Furukawa Electric Co Ltd:The | 集積回路用リ−ドフレ−ム |
JPH0795580B2 (ja) * | 1984-11-27 | 1995-10-11 | 松下電子工業株式会社 | 半導体装置 |
JPH0814028B2 (ja) * | 1989-05-09 | 1996-02-14 | 凸版印刷株式会社 | 微細パターン構造体及びその製造方法 |
JPH03283645A (ja) * | 1990-03-30 | 1991-12-13 | Toppan Printing Co Ltd | リードフレームおよびその製造方法 |
JP3905208B2 (ja) * | 1997-02-27 | 2007-04-18 | 富士通株式会社 | 半導体装置及びその実装構造 |
JP3550875B2 (ja) * | 1996-05-14 | 2004-08-04 | ソニー株式会社 | リードフレームとこれを用いた半導体装置 |
KR100242994B1 (ko) * | 1996-12-28 | 2000-02-01 | 김영환 | 버텀리드프레임 및 그를 이용한 버텀리드 반도체 패키지 |
JPH1174404A (ja) * | 1997-08-28 | 1999-03-16 | Nec Corp | ボールグリッドアレイ型半導体装置 |
JPH11238840A (ja) * | 1998-02-19 | 1999-08-31 | Oki Electric Ind Co Ltd | リードフレーム |
US6281568B1 (en) * | 1998-10-21 | 2001-08-28 | Amkor Technology, Inc. | Plastic integrated circuit device package and leadframe having partially undercut leads and die pad |
JP3046024B1 (ja) * | 1999-04-23 | 2000-05-29 | 松下電子工業株式会社 | リ―ドフレ―ムおよびそれを用いた樹脂封止型半導体装置の製造方法 |
JP2000349222A (ja) * | 1999-06-07 | 2000-12-15 | Sony Corp | リードフレーム及び半導体パッケージ |
JP3430976B2 (ja) | 1999-07-09 | 2003-07-28 | 松下電器産業株式会社 | リードフレームとそれを用いた樹脂封止型半導体装置およびその製造方法 |
JP2001185567A (ja) * | 1999-12-22 | 2001-07-06 | Hitachi Ltd | 半導体装置およびその製造方法 |
JP3732987B2 (ja) * | 1999-12-28 | 2006-01-11 | 株式会社ルネサステクノロジ | 半導体装置 |
JP2002033432A (ja) * | 2000-07-14 | 2002-01-31 | Hitachi Ltd | 半導体装置の製造方法 |
JP3660861B2 (ja) * | 2000-08-18 | 2005-06-15 | 株式会社ルネサステクノロジ | 半導体装置の製造方法 |
JP4547086B2 (ja) * | 2000-12-25 | 2010-09-22 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP3895570B2 (ja) * | 2000-12-28 | 2007-03-22 | 株式会社ルネサステクノロジ | 半導体装置 |
JP3500362B2 (ja) * | 2001-02-14 | 2004-02-23 | 松下電器産業株式会社 | 樹脂封止型半導体装置及びその製造方法 |
JP4109995B2 (ja) * | 2001-02-28 | 2008-07-02 | 株式会社ルネサステクノロジ | 半導体装置 |
JP2003007954A (ja) * | 2001-06-27 | 2003-01-10 | Matsushita Electric Ind Co Ltd | 樹脂封止型半導体装置の製造方法 |
JP2003007953A (ja) * | 2001-06-27 | 2003-01-10 | Matsushita Electric Ind Co Ltd | 樹脂封止型半導体装置およびその製造方法 |
US20030006055A1 (en) * | 2001-07-05 | 2003-01-09 | Walsin Advanced Electronics Ltd | Semiconductor package for fixed surface mounting |
US8129222B2 (en) * | 2002-11-27 | 2012-03-06 | United Test And Assembly Test Center Ltd. | High density chip scale leadframe package and method of manufacturing the package |
US7109570B2 (en) * | 2003-09-08 | 2006-09-19 | United Test And Assembly Test Center Ltd. | Integrated circuit package with leadframe enhancement and method of manufacturing the same |
US7495321B2 (en) * | 2006-07-24 | 2009-02-24 | Stats Chippac, Ltd. | Leaded stacked packages having elevated die paddle |
-
2003
- 2003-08-05 JP JP2003286609A patent/JP2005057067A/ja active Pending
-
2004
- 2004-05-17 TW TW093113877A patent/TW200507220A/zh unknown
- 2004-06-29 US US10/878,226 patent/US7348659B2/en not_active Expired - Fee Related
- 2004-08-04 KR KR1020040061330A patent/KR20050016130A/ko not_active Application Discontinuation
-
2008
- 2008-02-07 US US12/027,730 patent/US7579674B2/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI775747B (zh) * | 2016-04-22 | 2022-09-01 | 日商瑞薩電子股份有限公司 | 半導體裝置之製造方法及半導體裝置 |
Also Published As
Publication number | Publication date |
---|---|
US20080211069A1 (en) | 2008-09-04 |
JP2005057067A (ja) | 2005-03-03 |
US7579674B2 (en) | 2009-08-25 |
KR20050016130A (ko) | 2005-02-21 |
US20050029640A1 (en) | 2005-02-10 |
US7348659B2 (en) | 2008-03-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW200507220A (en) | Semiconductor device and method of manufacturing thereof | |
CN104103603B (zh) | 半导体装置以及半导体模块 | |
US6157074A (en) | Lead frame adapted for variable sized devices, semiconductor package with such lead frame and method for using same | |
WO2005050699A3 (en) | Method of forming a semiconductor package and structure thereof | |
CN104934404B (zh) | 半导体装置及其制造方法 | |
TW429570B (en) | Plastic integrated circuit device package and micro-leadframe and method for making the package | |
CN105206596B (zh) | 具有弯折引线的封装集成电路器件 | |
KR102402841B1 (ko) | 리드 프레임, 반도체 장치, 및 리드 프레임의 제조 방법 | |
US10109561B2 (en) | Semiconductor device having plated outer leads exposed from encapsulating resin | |
TW200515557A (en) | Semiconductor package, method for manufacturing the same and lead frame for use in the same | |
US9685351B2 (en) | Wire bond mold lock method and structure | |
WO2005060450A3 (en) | Land grid array packaged device and method of forming same | |
JP2008532277A (ja) | 改良したボンディングパッド接続部を備える集積回路パッケージ装置、リードフレームおよび電子装置 | |
JP4530863B2 (ja) | 樹脂封止型半導体装置 | |
TW201330189A (zh) | 封裝結構及其製造方法 | |
CN104517927A (zh) | 半导体装置及其制造方法 | |
JP5278037B2 (ja) | 樹脂封止型半導体装置 | |
US9553068B2 (en) | Integrated circuit (“IC”) assembly includes an IC die with a top metallization layer and a conductive epoxy layer applied to the top metallization layer | |
CN105097749A (zh) | 组合的qfn和qfp半导体封装 | |
JP2005150647A5 (zh) | ||
TW200625562A (en) | Semiconductor package and fabrication method thereof | |
JP6345608B2 (ja) | 半導体装置 | |
TW200504900A (en) | A semiconductor device and the manufacturing method thereof | |
SG140601A1 (en) | Wire sweep resistant semiconductor package and manufacturing method thereof | |
US20110062569A1 (en) | Semiconductor device package with down-set leads |