CN104517927A - 半导体装置及其制造方法 - Google Patents
半导体装置及其制造方法 Download PDFInfo
- Publication number
- CN104517927A CN104517927A CN201410513520.2A CN201410513520A CN104517927A CN 104517927 A CN104517927 A CN 104517927A CN 201410513520 A CN201410513520 A CN 201410513520A CN 104517927 A CN104517927 A CN 104517927A
- Authority
- CN
- China
- Prior art keywords
- outer lead
- semiconductor device
- hole
- inclined plane
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 75
- 238000004519 manufacturing process Methods 0.000 title claims description 21
- 239000011347 resin Substances 0.000 claims abstract description 32
- 229920005989 resin Polymers 0.000 claims abstract description 32
- 238000007789 sealing Methods 0.000 claims description 29
- 229910000679 solder Inorganic materials 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 23
- 239000010410 layer Substances 0.000 claims description 16
- 238000007747 plating Methods 0.000 claims description 13
- 230000015572 biosynthetic process Effects 0.000 claims description 6
- 239000007888 film coating Substances 0.000 claims description 2
- 238000009501 film coating Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 abstract description 15
- 238000005520 cutting process Methods 0.000 abstract description 6
- 210000000981 epithelium Anatomy 0.000 description 7
- 238000005538 encapsulation Methods 0.000 description 6
- 238000009434 installation Methods 0.000 description 6
- 239000011247 coating layer Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 230000003321 amplification Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49517—Additional leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4825—Connection or disconnection of other leads to or from flat leads, e.g. wires, bumps, other flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
- H01L23/49582—Metallic layers on lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Geometry (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
Claims (7)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013206652A JP2015072947A (ja) | 2013-10-01 | 2013-10-01 | 半導体装置及びその製造方法 |
JP2013-206652 | 2013-10-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN104517927A true CN104517927A (zh) | 2015-04-15 |
Family
ID=52739294
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410513520.2A Pending CN104517927A (zh) | 2013-10-01 | 2014-09-29 | 半导体装置及其制造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9136208B2 (zh) |
JP (1) | JP2015072947A (zh) |
KR (1) | KR20150039105A (zh) |
CN (1) | CN104517927A (zh) |
TW (1) | TWI611539B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019047004A (ja) * | 2017-09-04 | 2019-03-22 | 大日本印刷株式会社 | リードフレーム、半導体装置、および半導体装置の製造方法 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10892211B2 (en) * | 2017-08-09 | 2021-01-12 | Semtech Corporation | Side-solderable leadless package |
JP7281267B2 (ja) * | 2017-11-06 | 2023-05-25 | ローム株式会社 | 半導体装置、半導体装置の製造方法 |
JP7210868B2 (ja) | 2018-09-05 | 2023-01-24 | ローム株式会社 | 半導体装置 |
TW202112188A (zh) * | 2019-09-12 | 2021-03-16 | 台灣半導體股份有限公司 | 具有終端凹槽之電子元件與電子元件製造方法 |
TWI712129B (zh) | 2020-01-21 | 2020-12-01 | 強茂股份有限公司 | 半導體封裝結構以及其製作方法 |
US11430720B2 (en) * | 2020-07-27 | 2022-08-30 | Texas Instruments Incorporated | Recess lead for a surface mount package |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4920074A (en) * | 1987-02-25 | 1990-04-24 | Hitachi, Ltd. | Surface mount plastic package semiconductor integrated circuit, manufacturing method thereof, as well as mounting method and mounted structure thereof |
JPH05343590A (ja) * | 1992-06-10 | 1993-12-24 | Nec Yamagata Ltd | 半導体装置用リードフレーム |
US20010052643A1 (en) * | 1998-06-04 | 2001-12-20 | Koichi Sugihara | Semiconductor device and method for manufacturing same |
JP2006019465A (ja) * | 2004-07-01 | 2006-01-19 | Mitsui Chemicals Inc | 半導体パッケージおよびその製造方法 |
CN101587879A (zh) * | 2005-05-10 | 2009-11-25 | 松下电器产业株式会社 | 引线框架及树脂密封型半导体器件 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4862246A (en) * | 1984-09-26 | 1989-08-29 | Hitachi, Ltd. | Semiconductor device lead frame with etched through holes |
JP2522399B2 (ja) * | 1989-07-27 | 1996-08-07 | 日本電気株式会社 | 表面実装用部品 |
US5391439A (en) * | 1990-09-27 | 1995-02-21 | Dai Nippon Printing Co., Ltd. | Leadframe adapted to support semiconductor elements |
JPH04333267A (ja) * | 1991-05-08 | 1992-11-20 | Nec Corp | 表面実装半導体装置の製造方法 |
JP2526846B2 (ja) * | 1993-05-10 | 1996-08-21 | 日本電気株式会社 | 樹脂封止型半導体装置のリ―ド切断方法 |
JPH07211838A (ja) * | 1994-01-12 | 1995-08-11 | Sony Corp | 半導体装置のリードカット装置 |
US6608366B1 (en) * | 2002-04-15 | 2003-08-19 | Harry J. Fogelson | Lead frame with plated end leads |
-
2013
- 2013-10-01 JP JP2013206652A patent/JP2015072947A/ja active Pending
-
2014
- 2014-09-17 TW TW103132066A patent/TWI611539B/zh not_active IP Right Cessation
- 2014-09-29 CN CN201410513520.2A patent/CN104517927A/zh active Pending
- 2014-09-29 US US14/499,802 patent/US9136208B2/en not_active Expired - Fee Related
- 2014-09-29 KR KR20140130367A patent/KR20150039105A/ko not_active Application Discontinuation
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4920074A (en) * | 1987-02-25 | 1990-04-24 | Hitachi, Ltd. | Surface mount plastic package semiconductor integrated circuit, manufacturing method thereof, as well as mounting method and mounted structure thereof |
JPH05343590A (ja) * | 1992-06-10 | 1993-12-24 | Nec Yamagata Ltd | 半導体装置用リードフレーム |
US20010052643A1 (en) * | 1998-06-04 | 2001-12-20 | Koichi Sugihara | Semiconductor device and method for manufacturing same |
JP2006019465A (ja) * | 2004-07-01 | 2006-01-19 | Mitsui Chemicals Inc | 半導体パッケージおよびその製造方法 |
CN101587879A (zh) * | 2005-05-10 | 2009-11-25 | 松下电器产业株式会社 | 引线框架及树脂密封型半导体器件 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019047004A (ja) * | 2017-09-04 | 2019-03-22 | 大日本印刷株式会社 | リードフレーム、半導体装置、および半導体装置の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
TW201526190A (zh) | 2015-07-01 |
US20150091144A1 (en) | 2015-04-02 |
JP2015072947A (ja) | 2015-04-16 |
US9136208B2 (en) | 2015-09-15 |
KR20150039105A (ko) | 2015-04-09 |
TWI611539B (zh) | 2018-01-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20160323 Address after: Chiba County, Japan Applicant after: SEIKO INSTR INC Address before: Chiba County, Japan Applicant before: Seiko Instruments Inc. |
|
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information |
Address after: Chiba County, Japan Applicant after: EPPs Lingke Co. Ltd. Address before: Chiba County, Japan Applicant before: SEIKO INSTR INC |
|
CB02 | Change of applicant information | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150415 |
|
WD01 | Invention patent application deemed withdrawn after publication |