TW200409381A - LED light engine for ac operation and methods of fabricating same - Google Patents

LED light engine for ac operation and methods of fabricating same Download PDF

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Publication number
TW200409381A
TW200409381A TW092117654A TW92117654A TW200409381A TW 200409381 A TW200409381 A TW 200409381A TW 092117654 A TW092117654 A TW 092117654A TW 92117654 A TW92117654 A TW 92117654A TW 200409381 A TW200409381 A TW 200409381A
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Taiwan
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light
substrate
emitting diode
electronic device
patent application
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TW092117654A
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English (en)
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David Charles Hall
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Cree Inc
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)

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玖、發明說明: 【發明所屬之技術領域】 本發明關於微電子裝置及其製造方法,及特指發光二極 體(發光二極體S)及其製造方法。 【先前技術】 發光二極體廣泛使用在消費及商業應用。習知本技藝者 白知 务光一極體一般包括一微電子基片上的一二極體 區域。該微電子基片可包含,例如,矽,砷化鎵,磷化鎵 ,矽碳化物及/或藍寶的合金。發光二極體的持續發展則導 致呵效率及機械光源使可含蓋可視光譜及以上。該等特性 ’耦合硬體設備的較長服務壽命,低成本運作,低熱,效 率曰加及其他優點可致使不同的新顯示應用,及可將發光 二極體置於一位置使與固定的白熾的螢光燈泡相比擬。 在特足應用,固態光以開始取代傳統白熾光。更值得注 思的,許多美國及國外的應用已經使用固態光擎取代傳統 白熾叉通訊號燈泡。雖然投入的初始成本比較高,發光二 極體基礎的交通訊號一般具有比傳統白熾燈泡一實質較長 的作動壽命及每流明較低成本。 、朝發光二極體基礎交通訊號(特別是紅光)已經由固態光 源2然地開始穿透入傳統的白熾及螢光市場。冑亮度紅光 只光及特別最近的綠光在過去十年價格也變得合理且已 在市琢銷f。最近’固態白光擎已發現有應用在汽車及手 機產業作為儀表板,開關及液晶顯示的背光。_然技術仍 在嬰兒時期,目態白光發光二極體可能已被製造好幾年了 86207 :提供固態白光的技術—般則落在三 波長轉換及結合混光及波長轉換的混合方式 色彩混合則包括補償色彩 J尤/原結合 < 白光的合成,其 :二白光(例如,紅’綠和藍發光二極體,或藍和 二;㈣混合的範例如美國專利案號6,132,072 在此用做參考。波長轉換則 ,^ u、便用罘波長作激磁訊號 弟一波長(通常是一蹲或螢材料)。例如,-UV光源 =讀勵—可發射紅,綠和藍光的磷。該磷的最後光輸 6,084,250 〇 心現白光。參閱美國專利案號 白光也可由色彩混合和波長轉換的混合方法來產生。例 如’-白光發射器可經由塗佈—具有可在與藍光激勵後發 射黃光的•之藍色發光二極體來製造。磷和白光的範例則 在吴國專利案號5,998,925,M66,⑻及Ml3,i99裡可見, 其是在此結合為參考。其他產生固態白光的方法也可能。 、除了固'白光源以外’大量白光應用市場(如家庭及辦公 至照明)則比較未開發。部份的原因是色發光二極體則典型 不直接與既有電源分佈網路共容。 既有的電源分佈網路則以交流電流形式提供高壓(丨丨〇v 或220乂)低私泥電源至家庭及企業。“交流”表示所提供電流 的極性是隨每個週期變動的。對標準6〇以的電源供給,此 表示電流極性每秒變動12〇次。 相反地,發光二極體為低電壓,高電流裝置係經由其自 然容許的單向電流流動則考量為直流(DC)裝置。因此,可 86207 2仏應喬光二極體基礎的發光系統之變壓系統的有效電源 分配則對進入傳統白光市場相當有利。事實上,一個固態 白光的粗略的技術路程表顯示具9 5 %效率轉換1 〇 〇伏特(交 a )為2 5伏特(直流)的電源供給和驅動電子應該是固態照明 產業的一目的以獲致高度市場穿透。請參閱了上⑽所編輯的 般照明的發光二極體11 ”(最後版本2002年7月26日)。 已&有嘗試可以使用一交流電源的發光二極體發光的系 、”先叹片。例如,美國專例案號5,936,599揭露一使用在交通 號w顯示的叉流電源發光二極體陣列電路,及用於相似多 個先兩技蟄電路。特別地,該5 9 9專利描述一具有多個反平 打方式連接的發光二極體對的電路以容許電流流經交流週 期的上下兩週波。發光二極體的反平行組態是為大家所習 知的。無論如何,本組態的封裝發光二極體的連接典型假 定一過多的空間。此外,系統設計者可能需要設計複雜相 互連接於照明内以發光二極體技術執行本設計。一更具彈 性的嘗試則是設計交流應用的固態光源。 【發明内容】 本發明的具體例提供一光擎包括一對發光二極體主動元 件士t在具有第一和第二端子的一共同導管上。第一端子 則連接至第一發光二極體主動元件的陰極及第二發光二極 體主動元件的陽極,同時第二端子則連接至第一發光二極 體主動元件的陽極及第二發光二極體主動元件的陰極。發 光二極體主動元件可提供在一共同基片,分離基片及/或共 同基片和分離基片的組合。 86207 緣其他具體例則提供一光擎包含一單絕緣或半絕 多:成在各別具卜和n-型接點形成-陰極和一陽極的 又光一極體主動元件。該裝置 if ^ ^ T t表在 復日曰組怨以 先輸出及可能減少接線熔接。 ”其他具體例’—導管具有—對導線以使得至 I:f固發先二極體主動元件可以覆晶安裝在第-發光二杨 :王^件的陽極及第二發光二極體主動元件的陰極連接 二^時卜,光二極體主動元件的陰極及第二發光 “王力兀件的陽極連接另—接線。此外,該導管可被 採用以容許-具有多個主動元件的基片安裝於其上。 、本1月的另具體例則提供基片具有形狀或組織特性以改 艮光取出效率及磷光塗佈以執行波長轉換。 、本發明的其他具體例提供製造發光二極體光擎的方法如 述。 【實施方式】 本發明現將參考所示附圖 發明的具體例。本發明應不 例係使所揭露的更完整及詳 傳達本發明的範圍。相同的 該等圖的不同層及區域則以 予以向度評價,因為本發明 予以說明。因此本發明並未 。此外,該等圖的特定特徵 以放大尺寸展示之。 予以詳細說明,其中會展示本 受限於該等具體例,該等具體 細’且對習知本技藝者將完全 元件代號表示相同元件。此外 示意展示。習知本技藝者也將 將參考半導體晶圓及切割晶片 受限於附圖所示之尺寸及大小 貝1J為了清析及簡易說明起見將 86207 本發明的具體例現將參考碳化矽基礎的氮化鎵基礎之發 光二極體予以說明。無論如何,該等習知本技藝者可使用 不同組合的基片和延伸層。例如,組合可包括AlGainp二極 體於Gap基片上;inGaAs二極體於GaAsA片上;A1GaAs二 極體於GaAs基片上;SiC二極體於SlC或藍寶(Al2〇3)基片上 ,及/或一氮基礎二極體於氮化鎵,氮化矽,氮化鋁,藍寶 ,氧化鋅及/或其他基片上。 本發明的具體例包括一可使用交流電源有效發光的一發 光二極體光擎。在特定具體例,該光擎包含一對發光二= 體安裝在具有第-和第二端子的—導管。第—端子則連接 至第一發光二極體的陰極及第二發光二極體的陽極,同時 第二端子則連接至第一發光二極體的陽極及第二發光二極 體的陰極。該I光二極體可以—epi_up組態或_基片上(覆 晶)組態安裝。 < 在其他具體例,該光擎包 1八 q 土 y两個含j 呈和η型接點形成一陰極和陽極的發光二極體主動元件。 1置可以覆晶組態安裝以增加光輸出及減少接線溶接 心需求。 在本發明的其他具體例 加政, 巧饮咪以便得运 :,光,極體(其可以是唯一的)可以是飛晶安裝並具以 =光-極體的陽極和第二發光二極體的陰極接觸一接έ, 觸:時第一發光二極體的陰極和第二發光二極體的陽極; -接線。另外具體例則容許單導管上 或發光二極體主動元件接觸及相互連接。外部電 86207 E S D保缦,電源轉換,電、^ ^ 原稿合或其他目的可以安裝在沿著 發光二極體的導管以為更 1尺有效及淨性的系統整合。 如圖1所示的本發明的4土 的特別具體例,其展示一導管或接線 框20在其上發光一極體i和2則以覆晶方式安裝其中該裝置 則與基片安裝在離料管的侧邊且該沿伸區域則相鄰該導 管。 不靶發光一極體結構則如圖⑶和冗所示。如圖2β所示, 本毛月的不範發光二極體可包含一基片4於其上形成一 延伸區域包含1型接觸層5,-主動區域6及一?型接觸層7 所咕的在其上並非僅表示直接實質接觸。相反地,其表 丁的疋層可以在另層上即使該等層並非直接接觸。 基片4可包含所有前述基片材料但在特定例則包含6H矽 又化物《外延伸區域可包含氣化錄基礎的半導體層。主 動區域6可包含—同層’單異層’雙異層或單或多量井結構 ,、他層(未不)也可主現在裝置上。歐姆接點I]和Μ則形成 fp型和η型接觸層7和5上以形成陽極和陰極接點。圖冗則 疋圖2Β tf範發光二極體晶片的俯視圖展示陽極和陰極接 點12和14的一可能組態。氮化鎵基礎發光二極體的延伸層 的設計和製造及歐姆接點也是技藝内為大家所習知的。例 如,本發明的具體例可適合使用在發光二極體及/或雷射於 美國專利號碼 6,2G1,262, 6,187,6G6, 6,12G,6GG,5,912,477, 5,739,554,5,631,19G,5,6()45135,5,523,589,5,416,342, 5,393,993, 5,338,944, 5,2 iQ,Q51,5,Q27,168, 4,96M62及/或 4,9 1 8,497,該等揭露在此結合作為參考。其他適合的發光 86207 -10- 二極體及/或雷射則美國臨時專利申請序號60,294,378名稱 為“具多量井及超級栅格結構的發光二極體”及美國專利臨 時編號60/294,445名稱為‘‘多量發光二極體結構,,及美國專 利臨時編號60,294,308名稱為“具超級柵格結構的發光二極 體結構,’,以上皆是在2001年5月30日所申請,美國專利申請 序號10/140,796名稱為“具氮化基礎量井及超級柵格的群組 III氣化物基礎發光二極體結構,群組m氮化物基礎量井結 構及群組III氮化物基超級柵格結構,,,其係於2〇〇2年5月7日 申請的,及美國專利臨時專利申請序號1〇/〇57,82名稱為“發 光二極體包括基片改良用於光取得及其製造方法,,係於2〇〇1 年7月23日申凊及美國專利申請序號1〇/〇57,82申請於 年1月25日名%為發光二極體包括基片改良用於光選取及 製造方法”該等揭露在此結合為參考。此外,磷光塗佈發光 二極體如美國專利臨時申請序號__(律師案件目錄 53 08-245PR)名稱為“磷光塗佈發光二極體包括開孔侧壁及 其製造方法,係於2002年9月19日所申請,所揭露的在此作 為參考,及適合用在本發明的具體例。 回到圖1,導管20包括傳導接線24,26及28,具有接線24 和28及彼此電氣連接。發光二極體丨則安裝以使得其陰極 1 2A則與接線24電氣連接同時其陽極14A則與接線26電氣連 接。發光二極體2則安裝以使得其陰極12B與接線%電氣連 接,同時其陽極14B則與接線28電氣連接。因為接線28則與 接線24電氣連接,發光二極體丨的陰極則與發光二極體2的 陽極電氣連接。接線24作動為如圖2八所示的共同節點⑴而 86207 -11 - I線26則是當做結點N2。如此所使用,“電氣接觸,,表示以 -種万式答許電氣流通的直接接觸或間接接觸經由本身為 電氣傳導的介入元件。 發光二極體1和2可經由焊接或熱熔接,其範例如美國專 利申請序號10/185,350於2002年6月27日所申請名稱“焊接 具形狀基片的發光二極體及套筒炫接具形狀基片的發光二 極體,,美國專利申請案號1〇/丨85,252號於2〇〇2年S月Η日所 ^名稱為,,發光二極體之覆晶炫接及適合用於覆晶溶接之 a先—極體裝置,,及/或美國專利申請序號i 〇/2 ^:月22曰所"青名稱為“發光二極體包括改良用於副安; 二接及其製造万法”,每個皆在此結合為參考。在本且體例 ^發光二極體1和2具有陰極和陽極於晶片之同側:、他們 可建構在傳導基片及/或絕緣或半絕緣基片上
SiC或藍寶。 7干、、、巴、,家 -種由發光二極體所產生的圖示電路則如圖Μ所示,豆 :::個發光二極體的反平行連接。發光二極體“: ==2的陽,連接至節點A同樣的,發光二極體-2的 施於橫跨節點川和⑽,發 儿兒源 波被激勵。 纟先-枉及2在叉流波形的交替 /為發光二極體具有非零持續性,其將出現在保Μ難 …兩個發光二極體是即時“啟動,,若 田: 此使用,發光二極體的“持績性,,關於·^7的心如在 ,走或反I後,發光二極體持續發光的時間量。 ^ /甘圖3所示,—導管2〇具有―對接線以使得兩個發光1 體(其可能是相同的)可以飛晶安裝且第 桎 ^尤一極體的陽 86207 極和第二發光二極體的陰極連接一接線1時第一笋光二 極體的陰極和第二發光:極體的陽極連接另—接線1此 接點24和第二接點26提供一相互數位或相互閉鎖接 點’母個皆重疊在一區域其中發光二極體丨接觸導管2〇及一 區域其中發光二極體2接觸導管2〇則吏得—單接點區域可 以輕易地接觸發光二極體】和發光二極體2。短小突出物A和 B可用以焊接或電氣連接該裝置至外部電路。 此外,,用以提供ESD保護,電源轉換,電源耦合或其他目 ::外部電路元件(未示)可沿著發光二極體安裝在導管及 ,氣連接至該等導線使可更有效率及彈性的系統整合。該 寺電路元件包括被動元件如電阻’電感及電容或主動元件 如電晶體。 圖4是如圖3所示之安裝在該導管上的一對發光二極體 和2。 圖4描繪出介於陰極14A與接線24之間的連接,及介於陰 極14B與接線26之間的連接。 圖5描繪本發明另一項具體實施例。 在圖5所示具體例,一具有多個主動元件31和32的發光二 極體3則製造在一單基片15上。基片15可以是半絕緣或絕緣 以防止該等裝置的陰極短路。元件3 1及3 2皆包含一 n型接觸 層5,一主動區域ό及一 p型接觸層7,且歐姆接點丨2和1 4各 刈至p型和η型接觸層7和5。圖6展示安裝在一導管2〇上的裝 置3的俯視圖。 在圖5和6所示的具體例,裝置3可以澱積適切的延伸層在 〜基片1 5上來製造,使用一蝕刻罩覆成型該等層,及蝕刻 廷伸層的一蜂以形成主動元件3 1及3 2如隔離平頂區域於基 δ62〇7 -13 - 粒可接者依期望般切割及分離。其他裝置 、製以〜+閱關中請序號刚58,369名稱為“發光二 封裝,,,於2。。2年⑽曰申請,及/或美國臨時 專利申請序號麵8,753於勒年7月26日中請名稱為“控 制-+導體晶粒切割的方法,系統及電腦程式產 也在此結合為參考。 巾冯 為改良光輸出,該基片15可以如美國專利申請案號·mu 所述般塑形,其是在年1月Μ日申請名稱為“包括光取得 之基片改艮的發光二極體及其製造方法,,其也授權予本發明 及在此作為參考。一個可能的形狀是如圖7所示,其中基片 15被提供著許多傾斜側壁18和通道19以作為增加可攜^性 其中照射基片表面的-既有光線將避開。該基片的表面可 以比較㈣’結構化或其他具微光特徵型態來改良光取效 率。 此外,1¾基片可以壓縮封裝或塗佈以場螢光材料以上述 万式協助發出白光或其他色彩光或增加發光二極體的持婧 性。例如,該基片可以美國專利臨時申請序號60/355,349所 述來塗佈磷螢材料,其是在2〇〇1年1〇月31日申請名稱為“廣 光瑨發光二極體裝置及方法,及用以製造的系統,,其也在此 結合為參考。 在其他具體例,兩個以上主動元件可以形成在單基片上 及相互連結以形成一期望的組態如圖5和6所述。例如,圖8 是一裝置的俯視圖包含一導管20在其上形成接點A,b和c (如π橫跨閘門)。一種發光二極體包含—基片35其具有四個 主動tl件36Α,36Β,37Α和37Β則安裝在導管2〇上以使得元 86207 件37A的陰極和元件37B的陽極連接至接點A,元件37a和 36B的節點則沿著元件36A*37B的陰極連接至接點c,及元 件37B的陽極和元件36B的陰極則連接至接點b。該等特別具 體例之等效電路則如圖9所示。如圖9所示,此電路包含兩 對串聯的發光二極體中每對包含兩個以反平行组態連 接的發光二極體。 其他組態可簡單地實現。例如圖丨〇展示一更複雜的電路 具有三個反平行發光二極體的兩個平行鏈。此電路可以圖u 的組態執行其包含一導管20在其上一發光二極體包含一具 有十二個主動元件41A至41F及42A至42F的基片45。為簡化 起見,導管20的接點在說明未示但由示意線46來表示。 因為發光二極體的主動元件的相互連接係經由導管2〇上 接點設計來完成,大量組態可僅需改變導管2〇上的接點設 計及配置即可簡單地實現。此提供系統設計者在設計光擎 的電氣特性來符合期望應用有相當彈性。 根據本發明的方法可經由圖5來瞭解。根據本發明一種製 造發光裝置的方法包含提供一半絕緣或絕緣基片丨5 ;形成 一延伸區域25於該基片上,其中該外延區域包含至少型 接觸層5於基片15上,一主動區域6於η型接觸層5上,及一 型接觸層7於主動區域6上。一第一蝕刻罩覆則應用於延伸 區域25,及該延伸區域25則被選擇地蝕刻以呈現出多個接 觸區域於η型接觸層5上。多個主動元件31,32則隔離在延 伸區域25内以使得每個主動元件包括11型接觸層5的至少一 浮現的接觸區域27。該隔離可以經由一第二蝕刻步驟 86207 -15 - 由熟知的隔離技術來執行。陽極12和陰極丨4歐姆接點則形 成在每個王動兀件31,32的p型接觸層7上及該11型接觸層5。 雖然一裝置具有如圖5所示兩個主動元件31,32,其可以 L伸上述万法至製造一具有多個主動元件的裝置,如圖11 所示的裝置。 具有多個主動元件31,32形成在其上的裝置3可安裝在一 導管20,如上述,具有傳導接線以使得多個主動元件的每 個陽極和陰極接點為至少與一接線電氣連接。此外,基片 可以成型以改良上述的絲。|片"可以塗佈—波長轉 換材料以上途万式產生白或其他顏色光,或整個裝置可以 含波長轉換材料密封。 、在附圖和特性,所揭露之本發明具體例,雖然使用特別 之用語,但其是屬於通稱及說明目的而非限制的。 【圖式簡單說明】 圖1是本發明特定具體例之側視圖。 圖2A是圖1的具體例之一等效電路。 圖2B和咖是可以使用以連接本發明特定具體例之―於 光二極體的側視圖及俯視圖。 ^ 圖則於本發明的具體例之一示範導管的俯視圖。 勺:據本發明的具體例之一示範導管的-俯視圖且 匕a—對%光二極體安裝於其上。 圖5是本發明的另具體例之一側視圖。 圖6是根據本私日日 、 …闽的具體例《一示範導管的-俯視圖且 σ圖5所TF安裝於其上的裝置。 86207 -16 - 圖7是本發明另個具體例之一侧視圖。 圖8是根據本發明的具體例之一示範導管的一俯視圖且 包含一具有四個主動元件安裝於其上的發光二極體裝置。 圖9是如圖8所示具體例之一等效電路。 圖1 0是圖11所示的具體例之一等效電路。 圖11是根據本發明的具體例之一示範導管的部份示意圖 且包含一具有十二個主動元件安裝於其上的發光二極體裝 置。 【圖式代表符號說明】 1 發光二極體 2 發光二極體 4 基片 5 N型接觸層 6 主動區域 7 P型接觸層 12 歐姆接點 12A 陰極 12B 陰極 14 歐姆接點 14A 陽極 14B 陽極 15 基片 18 側壁 19 通道 86207 - 17- 20 導管 24 接線 25 延伸區域 26 接線 27 接觸面積 28 接線 31 主動元件 32 主動元件 36A 主動元件 36B 主動元件 37A 主動元件 37B 主動元件 41A-41F 主動元件 42A-42F 主動元件 45 基片 46 示意線 N1 共同節點 N2 節點 A 接點 B 接點 C 接點 86207 . 18

Claims (1)

  1. 拾、申請專利範圍: 1 —種電子裝置,包含: 一導管; 第及第一發光二極體包含一基片,一延伸區域,及 各別的陽極和陰極電氣接點’該第一及第二發光二極體 以覆晶組態安裝在該導管上;及 _其中m導管係組態以一反平行組態電氣連接第一及 第二發光二極體。 2 如申凊專利範圍第1項之電子裝置,另包含: 第一及第二傳導接線形成在該導管上;及 其中第一發光二極體的陽極和第二發光二極體的陰 2 ϋ第一冑導接線電氣連接而第-1蒼光二體的陰極 與罘二發光二極體的陽極則與第二傳導接線電氣連接。 3·如申請專利範圍第2項之電子裝置,其中第一·及第二發 光一極體則以熱骨(thermosonically)焊接至傳導接線。 4’如申請專利範圍第2項之電子裝置,其中第一及第二發 光二極體則焊接至傳導接線。 5. 如申請專利範圍第2項之電子裝置,其中第一發光二極 月豆的基片和第二發光二極體的基片包含6H_SlC。 6. 如申請專利範圍第2項之電子裝置,其中該第一發光二 極姐的基片和第二發光二極體的基片包含絕緣材料或 半絕緣材料。 7 ·如申請專利範圍第2項之電子裝置,另包含至少一電路 兀件置於該導管上及電氣連接至少第一傳導接線及/或 86207 弟一傳導接線之一上。 8 ·如申請專利範圍第2項之電子裝置,並中 ” τ罘一發光二極 骨豆的基片及/或第二發光二極體的基片則塑形成加強: 取(light extraction) 〇 9.如申請專利範圍第2項之電子裝置,其中第一發光一柘 的基片及/或第二發光二極體的基片則塗佈一: 轉換材料。 皮長 10.如申請專利範圍第9項之電子裝置,其中該波長轉換材 料包含一鱗。 Π· —種電子裝置,包含: 一導管具有第一及第二傳導接線形成在其上;及 一種發光二極體包含一基片及第一和第二主動元件 在該基片上,其中每個第一和第二主動元件包含一延伸 區域及各別的陽極和陰極電氣接點,該發光二極體以覆 晶組態安裝在該導管上以接觸第一和第二傳導接線以 反平行配置電氣連接第一和第二主動元件。 1 2.如申請專利範圍第丨丨項之電子裝置,其中該發光二極體 係以熱音焊接至傳導接線。 如申μ專利範圍第11項之電子裝置,其中該發光二極體 係焊接至傳導接線。 1 4.如申請專利範圍第1 1項之電子裝置,其中該基片包含 6H-SiC。 1 5 ·如申請專利範圍第11項之電子裝置,其中該基片包含絕 緣材料或半絕緣材料。 86207 16.如申請專利範圍第n項之電子裝置,另包含至少—兩互 元件置於该導管上及電氣連接至ψ、帛 狡土 乂 ^ —傳導接線及/十 第二傳導接線之一上。 久/或 其中該基片則塑形 其中該基片則塗伟 其中該波長轉換材 1 7 ·如申請專利範圍第11項之電子裝置 成加強光取。 1 8.如申請專利範圍第丨丨項之電子裝置 予一波長轉換材料。 19·如申請專利範圍第18項之電子裝置 料包含一鱗。 2 0.種製造一發光二極體的方法,包含·· &供一半絕緣或絕緣基片,· 形成一延伸區域在該基片上,該延伸區域包含至少一 η型接點在該基片上,一主重产摅 王勁£域在孩η型接觸層上,及 一 Ρ型接觸層在該主動區域上; 選擇地蝕刻延伸區域以浮現η型接 土妖卿層的多個接觸區 隔離延伸區域内的多個主動元件,每個主動元件包括 至少一浮現的η型接觸層的接觸面積;及 形成陽極和陰極歐姆接點在每個主動元件上 21. =料利範圍第2G項之方法,其中多個主動元件包括 蝕刻夕個延伸區域内的裝置以界定隔離主動元件。 22. 如t請專利範圍第2〇項之方法,另包含: 以覆晶方式安裝該裝置在一導管上,嗦 傳導接線,其令每個主動元件的陽極和陰^^^ 86207 23. 24. 25. 26. 27. 28. 29. 30. 個傳導接線的至少_個電氣連接。 如申請專利範圍第2〇項之方法,另包含塑形該基片以改 良光取。 如申請專利範圍第2〇項之方法,另包含塗佈該基片以一 波長轉換材料。 如申請專利範圍第20項之方法,另包含密封該裝置予一 包括波長材料的密封器。 如申印專利範圍第25項之方法,其中該波長轉換材料包 含一鱗。 如申請專利範圍第24項之方法,其中該波長轉換材料包 含一構。 一種電子裝置,包含·· 一導管; 多個發光二極體主動元件以覆晶方式安裝在該導管 上;及 其中該導管則組態以反平行方式電氣連接多個主動 元件的每對。 如申請專利範圍第27項之電子裝置,其中多個發光二極 體王動元件包含一發光二極體以覆晶方式安裝在該導 官上,孩發光二極體包含一基片及多個主動元件在該基 片上其中母個多個主動元件包含一延伸區域,及各別 的陽極和陰極電氣接點。 如申請專利範圍第27項之電子裝置,其中多個發光二極 體王動7C件包含多個獨立發光二極體,每個多個獨立發 86207 光二極體則以覆晶組態安裝在該導管上。 3 1.如申請專利範圍第28項之電子裝置,其中該導管則另組 態以反平行方式連接串聯電氣連接每對多個主動元件。 32.如申請專利範圍第30項之電子裝置,其中該導管則另組 態以反平行方式連接平行電氣連接串聯電氣連接的每 對多個主動元件。 3 3.如申請專利範圍第28項之電子裝置,其中該導管包含傳 導接線澱積以接觸相鄰的多個主動元件之一以使得至 少兩個傳導接線置於每個多個主動元件和導管的一基 片之間。 86207
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