SI2567104T1 - Postopek za pobiranje in povezovanje lepilnega elementa s substratom - Google Patents

Postopek za pobiranje in povezovanje lepilnega elementa s substratom

Info

Publication number
SI2567104T1
SI2567104T1 SI201131100A SI201131100A SI2567104T1 SI 2567104 T1 SI2567104 T1 SI 2567104T1 SI 201131100 A SI201131100 A SI 201131100A SI 201131100 A SI201131100 A SI 201131100A SI 2567104 T1 SI2567104 T1 SI 2567104T1
Authority
SI
Slovenia
Prior art keywords
pick
attachment
substrate
adhesive element
bond method
Prior art date
Application number
SI201131100A
Other languages
English (en)
Inventor
Mathias Hansel
Frederic Laure
Olivier Daverio
Original Assignee
A. Raymond Et Cie
Haensel Mathias
Frederic Laure
Olivier Daverio
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by A. Raymond Et Cie, Haensel Mathias, Frederic Laure, Olivier Daverio filed Critical A. Raymond Et Cie
Publication of SI2567104T1 publication Critical patent/SI2567104T1/sl

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G65/00Loading or unloading
    • B65G65/30Methods or devices for filling or emptying bunkers, hoppers, tanks, or like containers, of interest apart from their use in particular chemical or physical processes or their application in particular machines, e.g. not covered by a single other subclass
    • B65G65/34Emptying devices
    • B65G65/40Devices for emptying otherwise than from the top
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/52Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive
    • B29C65/54Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive between pre-assembled parts
    • B29C65/544Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive between pre-assembled parts by suction
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16BDEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
    • F16B11/00Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding
    • F16B11/006Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding by gluing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814Conductive parts
    • H01L21/4846Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/486Via connections through the substrate with or without pins
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17Surface bonding means and/or assemblymeans with work feeding or handling means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Standing Axle, Rod, Or Tube Structures Coupled By Welding, Adhesion, Or Deposition (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
SI201131100A 2010-05-03 2011-05-03 Postopek za pobiranje in povezovanje lepilnega elementa s substratom SI2567104T1 (sl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US33057710P 2010-05-03 2010-05-03
PCT/IB2011/001384 WO2011161514A2 (en) 2010-05-03 2011-05-03 Pick and bond method for attachment of adhesive element to substrate

Publications (1)

Publication Number Publication Date
SI2567104T1 true SI2567104T1 (sl) 2017-06-30

Family

ID=44511095

Family Applications (3)

Application Number Title Priority Date Filing Date
SI201131100A SI2567104T1 (sl) 2010-05-03 2011-05-03 Postopek za pobiranje in povezovanje lepilnega elementa s substratom
SI201131118A SI2567105T1 (sl) 2010-05-03 2011-05-03 Postopek za pobiranje in povezovanje ter naprava za prenašanje lepilnega elementa na substrat
SI201131117A SI2567103T1 (sl) 2010-05-03 2011-05-03 Postopek in naprava za polaganje lepilnega elementa na matrico

Family Applications After (2)

Application Number Title Priority Date Filing Date
SI201131118A SI2567105T1 (sl) 2010-05-03 2011-05-03 Postopek za pobiranje in povezovanje ter naprava za prenašanje lepilnega elementa na substrat
SI201131117A SI2567103T1 (sl) 2010-05-03 2011-05-03 Postopek in naprava za polaganje lepilnega elementa na matrico

Country Status (9)

Country Link
US (3) US9592971B2 (sl)
EP (3) EP2567105B1 (sl)
JP (3) JP5997136B2 (sl)
CN (3) CN103069177B (sl)
BR (2) BR112012028237A2 (sl)
ES (3) ES2614462T3 (sl)
PL (3) PL2567103T3 (sl)
SI (3) SI2567104T1 (sl)
WO (3) WO2011138684A2 (sl)

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CN103863837B (zh) * 2013-11-29 2016-06-15 山东汉菱电气有限公司 错位往复式排料装置和具有其的气化炉
US10446728B2 (en) * 2014-10-31 2019-10-15 eLux, Inc. Pick-and remove system and method for emissive display repair
DE102016104187A1 (de) * 2016-03-08 2017-09-14 Profil Verbindungstechnik Gmbh & Co. Kg Funktionselement
KR102126901B1 (ko) * 2019-08-21 2020-06-25 문영진 지중 매립형 화목보일러 연소시스템
CN110694860B (zh) * 2019-11-08 2021-08-24 中车青岛四方机车车辆股份有限公司 一种胶接工艺方法

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Also Published As

Publication number Publication date
EP2567105B1 (en) 2016-11-30
JP2016026120A (ja) 2016-02-12
US9266689B2 (en) 2016-02-23
WO2011161514A3 (en) 2012-03-15
SI2567105T1 (sl) 2017-06-30
US20130200096A1 (en) 2013-08-08
US20130112351A1 (en) 2013-05-09
ES2614462T3 (es) 2017-05-31
US9592971B2 (en) 2017-03-14
CN103080568A (zh) 2013-05-01
JP5997136B2 (ja) 2016-09-28
WO2011138684A4 (en) 2012-07-12
CN103069177B (zh) 2015-09-16
US20130133817A1 (en) 2013-05-30
WO2011161514A2 (en) 2011-12-29
PL2567103T3 (pl) 2017-07-31
JP5908893B2 (ja) 2016-04-26
WO2011138684A3 (en) 2012-03-22
ES2616919T3 (es) 2017-06-14
CN103069176B (zh) 2015-09-30
CN103069176A (zh) 2013-04-24
PL2567105T3 (pl) 2017-07-31
JP2013535092A (ja) 2013-09-09
EP2567104A2 (en) 2013-03-13
WO2011138684A2 (en) 2011-11-10
JP2013537488A (ja) 2013-10-03
PL2567104T3 (pl) 2017-08-31
EP2567103B1 (en) 2016-11-30
EP2567105A2 (en) 2013-03-13
JP6130461B2 (ja) 2017-05-17
EP2567103A2 (en) 2013-03-13
US9284134B2 (en) 2016-03-15
BR112012028236A2 (pt) 2017-03-14
SI2567103T1 (sl) 2017-07-31
CN103069177A (zh) 2013-04-24
WO2011138674A3 (en) 2012-03-22
BR112012028237A2 (pt) 2017-08-01
WO2011138674A2 (en) 2011-11-10
ES2617302T3 (es) 2017-06-16
EP2567104B1 (en) 2016-11-09
CN103080568B (zh) 2015-05-20

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