SI2567104T1 - Postopek za pobiranje in povezovanje lepilnega elementa s substratom - Google Patents
Postopek za pobiranje in povezovanje lepilnega elementa s substratomInfo
- Publication number
- SI2567104T1 SI2567104T1 SI201131100A SI201131100A SI2567104T1 SI 2567104 T1 SI2567104 T1 SI 2567104T1 SI 201131100 A SI201131100 A SI 201131100A SI 201131100 A SI201131100 A SI 201131100A SI 2567104 T1 SI2567104 T1 SI 2567104T1
- Authority
- SI
- Slovenia
- Prior art keywords
- pick
- attachment
- substrate
- adhesive element
- bond method
- Prior art date
Links
- 239000000853 adhesive Substances 0.000 title 1
- 230000001070 adhesive effect Effects 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G65/00—Loading or unloading
- B65G65/30—Methods or devices for filling or emptying bunkers, hoppers, tanks, or like containers, of interest apart from their use in particular chemical or physical processes or their application in particular machines, e.g. not covered by a single other subclass
- B65G65/34—Emptying devices
- B65G65/40—Devices for emptying otherwise than from the top
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/52—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive
- B29C65/54—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive between pre-assembled parts
- B29C65/544—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive between pre-assembled parts by suction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B11/00—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding
- F16B11/006—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding by gluing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/486—Via connections through the substrate with or without pins
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Standing Axle, Rod, Or Tube Structures Coupled By Welding, Adhesion, Or Deposition (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US33057710P | 2010-05-03 | 2010-05-03 | |
PCT/IB2011/001384 WO2011161514A2 (en) | 2010-05-03 | 2011-05-03 | Pick and bond method for attachment of adhesive element to substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
SI2567104T1 true SI2567104T1 (sl) | 2017-06-30 |
Family
ID=44511095
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SI201131100A SI2567104T1 (sl) | 2010-05-03 | 2011-05-03 | Postopek za pobiranje in povezovanje lepilnega elementa s substratom |
SI201131118A SI2567105T1 (sl) | 2010-05-03 | 2011-05-03 | Postopek za pobiranje in povezovanje ter naprava za prenašanje lepilnega elementa na substrat |
SI201131117A SI2567103T1 (sl) | 2010-05-03 | 2011-05-03 | Postopek in naprava za polaganje lepilnega elementa na matrico |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SI201131118A SI2567105T1 (sl) | 2010-05-03 | 2011-05-03 | Postopek za pobiranje in povezovanje ter naprava za prenašanje lepilnega elementa na substrat |
SI201131117A SI2567103T1 (sl) | 2010-05-03 | 2011-05-03 | Postopek in naprava za polaganje lepilnega elementa na matrico |
Country Status (9)
Country | Link |
---|---|
US (3) | US9592971B2 (sl) |
EP (3) | EP2567105B1 (sl) |
JP (3) | JP5997136B2 (sl) |
CN (3) | CN103069177B (sl) |
BR (2) | BR112012028237A2 (sl) |
ES (3) | ES2614462T3 (sl) |
PL (3) | PL2567103T3 (sl) |
SI (3) | SI2567104T1 (sl) |
WO (3) | WO2011138684A2 (sl) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103863837B (zh) * | 2013-11-29 | 2016-06-15 | 山东汉菱电气有限公司 | 错位往复式排料装置和具有其的气化炉 |
US10446728B2 (en) * | 2014-10-31 | 2019-10-15 | eLux, Inc. | Pick-and remove system and method for emissive display repair |
DE102016104187A1 (de) * | 2016-03-08 | 2017-09-14 | Profil Verbindungstechnik Gmbh & Co. Kg | Funktionselement |
KR102126901B1 (ko) * | 2019-08-21 | 2020-06-25 | 문영진 | 지중 매립형 화목보일러 연소시스템 |
CN110694860B (zh) * | 2019-11-08 | 2021-08-24 | 中车青岛四方机车车辆股份有限公司 | 一种胶接工艺方法 |
Family Cites Families (44)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5564362A (en) * | 1978-11-10 | 1980-05-15 | Tokyo Shibaura Electric Co | Base adhesive for bulb |
JPS60257873A (ja) * | 1984-06-04 | 1985-12-19 | Kyoritsu Kikai Shoji Kk | 接着剤自動供給装置 |
DE4105949A1 (de) * | 1991-02-26 | 1992-08-27 | Uwe Dr Skurnia | Recyclingfaehiges verbundmaterial |
JP3092215B2 (ja) * | 1991-06-14 | 2000-09-25 | トヨタ自動車株式会社 | 接着装置 |
JPH05314700A (ja) * | 1992-05-06 | 1993-11-26 | Hitachi Ltd | 磁気ヘッドスライダ支持構造体の製造方法 |
JPH06130895A (ja) * | 1992-10-21 | 1994-05-13 | Nippon Telegr & Teleph Corp <Ntt> | 三次元立体模型の製造方法 |
JPH07212023A (ja) * | 1994-01-26 | 1995-08-11 | Matsushita Electric Works Ltd | 半田ボール供給方法及びその半田ボール供給方法に用いる半田ボール供給治具 |
US5531942A (en) * | 1994-06-16 | 1996-07-02 | Fry's Metals, Inc. | Method of making electroconductive adhesive particles for Z-axis application |
JP3419554B2 (ja) * | 1994-07-19 | 2003-06-23 | 株式会社日立製作所 | 半導体装置の製造方法および製造装置 |
JP3528264B2 (ja) * | 1994-08-19 | 2004-05-17 | ソニー株式会社 | ソルダーボールのマウント装置 |
US5497938A (en) * | 1994-09-01 | 1996-03-12 | Intel Corporation | Tape with solder forms and methods for transferring solder to chip assemblies |
JP3360435B2 (ja) * | 1994-10-14 | 2002-12-24 | 株式会社日立製作所 | 電子回路装置の製造方法 |
JP2926308B2 (ja) * | 1995-03-24 | 1999-07-28 | 澁谷工業株式会社 | ハンダボール供給方法 |
JPH08288291A (ja) * | 1995-04-18 | 1996-11-01 | Citizen Watch Co Ltd | 半導体装置 |
US5685477A (en) * | 1995-06-28 | 1997-11-11 | Intel Corporation | Method for attaching and handling conductive spheres to a substrate |
JP3214316B2 (ja) * | 1995-09-29 | 2001-10-02 | 松下電器産業株式会社 | 導電性ボールの搭載装置および搭載方法およびバンプの形成方法 |
JPH09213742A (ja) * | 1996-01-31 | 1997-08-15 | Toshiba Corp | 半導体装置の製造方法および製造装置 |
KR100268632B1 (ko) * | 1996-03-08 | 2000-10-16 | 야마구치 다케시 | 범프형성방법 및 장치 |
US5761048A (en) * | 1996-04-16 | 1998-06-02 | Lsi Logic Corp. | Conductive polymer ball attachment for grid array semiconductor packages |
JP3315871B2 (ja) * | 1996-09-03 | 2002-08-19 | 日本特殊陶業株式会社 | 半田バンプを有する配線基板及びその製造方法 |
DE19645000B4 (de) * | 1996-10-30 | 2005-04-07 | A. Raymond & Cie | Verfahren zum Beschichten der Klebeflächen von Befestigungselementen mit Schmelzklebstoffen |
JP3252748B2 (ja) * | 1997-04-25 | 2002-02-04 | 松下電器産業株式会社 | 導電性ボールの移載方法 |
JP2850901B2 (ja) * | 1997-06-02 | 1999-01-27 | 日本電気株式会社 | ボール配列治具及びその製造方法 |
JP3376875B2 (ja) * | 1997-09-08 | 2003-02-10 | 松下電器産業株式会社 | 導電性ボールの移載装置および移載方法 |
JP2925534B1 (ja) * | 1998-04-28 | 1999-07-28 | 株式会社日鉄マイクロメタル | 金属球配列方法及び配列装置 |
JPH11219975A (ja) * | 1998-01-30 | 1999-08-10 | Kyocera Corp | 半田ボールの整列方法 |
US6072233A (en) * | 1998-05-04 | 2000-06-06 | Micron Technology, Inc. | Stackable ball grid array package |
US6595408B1 (en) * | 1998-10-07 | 2003-07-22 | Micron Technology, Inc. | Method of attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux prior to placement |
FR2785140B1 (fr) * | 1998-10-27 | 2007-04-20 | Novatec Sa Soc | Dispositif de mise a disposition de billes ou de preformes pour la fabrication de connexions a billes |
US6426564B1 (en) * | 1999-02-24 | 2002-07-30 | Micron Technology, Inc. | Recessed tape and method for forming a BGA assembly |
JP4080635B2 (ja) * | 1999-05-24 | 2008-04-23 | 日立ビアメカニクス株式会社 | 導電性ボール搭載装置における導電性ボールの吸着方法 |
JP3346345B2 (ja) * | 1999-07-27 | 2002-11-18 | 日本電気株式会社 | 微細ボール供給装置 |
US6371174B1 (en) * | 2001-01-25 | 2002-04-16 | Illinois Tool Works, Inc. | Adhesive application system and method of use |
JP2003110234A (ja) * | 2001-09-28 | 2003-04-11 | Hitachi Via Mechanics Ltd | 導電性ボール搭載装置 |
DE10333152B3 (de) * | 2003-07-22 | 2005-01-20 | A. Raymond & Cie | Verfahren und Vorrichtung zum Beschichten der Klebeflächen von Befestigungselementen mit Schmelzklebstoff |
JP2005048042A (ja) * | 2003-07-28 | 2005-02-24 | Nec Corp | 接着による部品の搭載方法および構造 |
TWI306590B (en) * | 2003-10-20 | 2009-02-21 | Lg Display Co Ltd | Liquid crystal display device, substrate bonding apparatus, and method for fabricating liquid crystal display device using the same |
JP4749791B2 (ja) * | 2005-07-29 | 2011-08-17 | 新日鉄マテリアルズ株式会社 | はんだボールの製造方法 |
DE102006001885B4 (de) * | 2006-01-13 | 2010-03-04 | Siemens Ag | Detektormodul eines Detektors und Verwendung eines Schmelzklebstoffes zur Herstellung eines Detektormoduls |
JP4854481B2 (ja) * | 2006-11-22 | 2012-01-18 | ニスカ株式会社 | 製本装置に於ける接着剤塗布方法及び製本装置 |
CN101276759B (zh) * | 2007-03-26 | 2012-10-10 | 矽品精密工业股份有限公司 | 焊球植球设备及其撷取装置 |
CN101604641B (zh) * | 2008-06-13 | 2013-02-27 | 涩谷工业株式会社 | 导电性球的搭载方法及搭载装置 |
SG157985A1 (en) * | 2008-06-24 | 2010-01-29 | Rokko Ventures Pte Ltd | Method and apparatus for solder ball placement |
JP2010021445A (ja) * | 2008-07-11 | 2010-01-28 | Nippon Steel Materials Co Ltd | 微細ボール除去方法及び除去装置、並びに微細ボール一括搭載方法及び一括搭載装置 |
-
2011
- 2011-05-03 BR BR112012028237A patent/BR112012028237A2/pt not_active Application Discontinuation
- 2011-05-03 JP JP2013508579A patent/JP5997136B2/ja not_active Expired - Fee Related
- 2011-05-03 ES ES11738479.2T patent/ES2614462T3/es active Active
- 2011-05-03 SI SI201131100A patent/SI2567104T1/sl unknown
- 2011-05-03 JP JP2013508574A patent/JP5908893B2/ja active Active
- 2011-05-03 CN CN201180032654.7A patent/CN103069177B/zh active Active
- 2011-05-03 ES ES11740717.1T patent/ES2616919T3/es active Active
- 2011-05-03 CN CN201180032627.XA patent/CN103080568B/zh not_active Expired - Fee Related
- 2011-05-03 BR BR112012028236A patent/BR112012028236A2/pt active Search and Examination
- 2011-05-03 EP EP11740717.1A patent/EP2567105B1/en not_active Not-in-force
- 2011-05-03 US US13/695,910 patent/US9592971B2/en active Active
- 2011-05-03 EP EP11738478.4A patent/EP2567103B1/en active Active
- 2011-05-03 US US13/695,896 patent/US9266689B2/en active Active
- 2011-05-03 CN CN201180032452.2A patent/CN103069176B/zh active Active
- 2011-05-03 SI SI201131118A patent/SI2567105T1/sl unknown
- 2011-05-03 WO PCT/IB2011/001423 patent/WO2011138684A2/en active Application Filing
- 2011-05-03 PL PL11738478T patent/PL2567103T3/pl unknown
- 2011-05-03 US US13/695,905 patent/US9284134B2/en active Active
- 2011-05-03 SI SI201131117A patent/SI2567103T1/sl unknown
- 2011-05-03 PL PL11738479T patent/PL2567104T3/pl unknown
- 2011-05-03 PL PL11740717T patent/PL2567105T3/pl unknown
- 2011-05-03 ES ES11738478.4T patent/ES2617302T3/es active Active
- 2011-05-03 WO PCT/IB2011/001349 patent/WO2011138674A2/en active Application Filing
- 2011-05-03 WO PCT/IB2011/001384 patent/WO2011161514A2/en active Application Filing
- 2011-05-03 EP EP11738479.2A patent/EP2567104B1/en active Active
-
2015
- 2015-10-07 JP JP2015199474A patent/JP6130461B2/ja active Active
Also Published As
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP2567257A4 (en) | ADHESIVE BONDING COMPOSITION AND METHOD OF USE | |
IL220518A (en) | Connected Substrates and Methods for Connecting Substrates | |
EP2522704A4 (en) | ADHESIVE AND BINDING PROCESS WITH THIS | |
PL2552992T3 (pl) | Epoksydowe kompozycje klejące zawierające polepszacz przyczepności | |
EP2574218A4 (en) | PROTECTIVE FOIL, METHOD FOR ADHESING THE PROTECTIVE WRAP TO A DEVICE AND APPARATUS WITH A PROTECTIVE FOIL | |
EP2435526A4 (en) | POLYOLEFINIC ADHESIVE COMPOSITIONS AND PROCESS FOR PRODUCING THE SAME | |
PL2638118T3 (pl) | Przyczepna masa klejąca i metoda uszczelniania układu elektronicznego | |
PL2403918T3 (pl) | Przyczepna masa klejowa | |
EP2271723A4 (en) | METHOD FOR PRODUCING ADHESIVES | |
PL2649642T3 (pl) | Masa klejąca i metoda hermetyzacji układu elektronicznego | |
HK1184842A1 (zh) | 將製備好的粘合劑連接至粘結部件的方法和所用粘結工具 | |
IL225467A0 (en) | Adhesive tape and method for producing adhesive tape | |
EP2525634A4 (en) | SUBSTRATE AND METHOD FOR MANUFACTURING THE SUBSTRATE | |
EP2285570A4 (en) | ADHESIVE COMPOSITION AND METHOD FOR ATTACHING A COMPONENT TO A SUBSTRATE | |
PL2537818T3 (pl) | Cementowe kleje do płytek i sposób ich nanoszenia na podłoże w postaci płytki | |
EP2744460A4 (en) | SURFACE MODIFICATION OF MEDICAL DEVICES TO IMPROVE ENDOTHELIAL ADHESION AND COVERAGE | |
EP2594262A4 (en) | SUBSTRATE WITH A TRIPLE STRUCTURE AND A WATERPROOF HEAT PAVER THEREWITH | |
EP2623213A4 (en) | Adhesive coating device according to absorbent article and adhesive coating method | |
EP2788192A4 (en) | METHOD OF BINDING POLYESTER SUBSTRATES | |
SI2567104T1 (sl) | Postopek za pobiranje in povezovanje lepilnega elementa s substratom | |
GB201011552D0 (en) | Adhesive and a method of delivery | |
EP2482774A4 (en) | METHOD OF ATTACHING GRINDING POCKETS TO THE SUPPORTING LAYER OF A FILM ASSOCIATION | |
GB2467365B (en) | Method of applying items to a substrate | |
EP2540864B8 (en) | Inspection of a component comprising a cladding layer bonded to a substrate | |
EP2603325A4 (en) | METHOD AND SYSTEM FOR THE APPLICATION OF BARRIER MATERIALS FOR TESTING SUBSTRATES |