FR2785140B1 - Dispositif de mise a disposition de billes ou de preformes pour la fabrication de connexions a billes - Google Patents

Dispositif de mise a disposition de billes ou de preformes pour la fabrication de connexions a billes

Info

Publication number
FR2785140B1
FR2785140B1 FR9813424A FR9813424A FR2785140B1 FR 2785140 B1 FR2785140 B1 FR 2785140B1 FR 9813424 A FR9813424 A FR 9813424A FR 9813424 A FR9813424 A FR 9813424A FR 2785140 B1 FR2785140 B1 FR 2785140B1
Authority
FR
France
Prior art keywords
preforms
manufacture
ball connections
providing balls
balls
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9813424A
Other languages
English (en)
Other versions
FR2785140A1 (fr
Inventor
Francis Bourrieres
Clement Kaiser
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Novatec SA
Original Assignee
Novatec SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to FR9813424A priority Critical patent/FR2785140B1/fr
Application filed by Novatec SA filed Critical Novatec SA
Priority to EP99950846A priority patent/EP1125325A1/fr
Priority to KR1020017005187A priority patent/KR20010080904A/ko
Priority to JP2000578846A priority patent/JP2002528912A/ja
Priority to AU63468/99A priority patent/AU6346899A/en
Priority to PCT/FR1999/002613 priority patent/WO2000025358A1/fr
Priority to CA002348724A priority patent/CA2348724A1/fr
Priority to US09/830,201 priority patent/US6533160B1/en
Publication of FR2785140A1 publication Critical patent/FR2785140A1/fr
Application granted granted Critical
Publication of FR2785140B1 publication Critical patent/FR2785140B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/11001—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
    • H01L2224/11003—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate for holding or transferring the bump preform
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
    • H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
    • H01L2224/11334—Manufacturing methods by local deposition of the material of the bump connector in solid form using preformed bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01073—Tantalum [Ta]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01094—Plutonium [Pu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0379—Stacked conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0557—Non-printed masks
FR9813424A 1998-10-27 1998-10-27 Dispositif de mise a disposition de billes ou de preformes pour la fabrication de connexions a billes Expired - Fee Related FR2785140B1 (fr)

Priority Applications (8)

Application Number Priority Date Filing Date Title
FR9813424A FR2785140B1 (fr) 1998-10-27 1998-10-27 Dispositif de mise a disposition de billes ou de preformes pour la fabrication de connexions a billes
KR1020017005187A KR20010080904A (ko) 1998-10-27 1999-10-27 플립 칩 결합을 형성하는 볼 또는 프리폼 공급장치
JP2000578846A JP2002528912A (ja) 1998-10-27 1999-10-27 フリップチップ接続を形成するためのボールまたはプリホームを供給する装置
AU63468/99A AU6346899A (en) 1998-10-27 1999-10-27 Device for providing balls or preforms for making flip-chip connections
EP99950846A EP1125325A1 (fr) 1998-10-27 1999-10-27 Dispositif de mise a disposition de billes ou de preformes pour la fabrication de connexions a billes
PCT/FR1999/002613 WO2000025358A1 (fr) 1998-10-27 1999-10-27 Dispositif de mise a disposition de billes ou de preformes pour la fabrication de connexions a billes
CA002348724A CA2348724A1 (fr) 1998-10-27 1999-10-27 Dispositif de mise a disposition de billes ou de preformes pour la fabrication de connexions a billes
US09/830,201 US6533160B1 (en) 1998-10-27 1999-10-27 Device for providing balls or preforms for making flip-chip connections

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9813424A FR2785140B1 (fr) 1998-10-27 1998-10-27 Dispositif de mise a disposition de billes ou de preformes pour la fabrication de connexions a billes

Publications (2)

Publication Number Publication Date
FR2785140A1 FR2785140A1 (fr) 2000-04-28
FR2785140B1 true FR2785140B1 (fr) 2007-04-20

Family

ID=9532013

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9813424A Expired - Fee Related FR2785140B1 (fr) 1998-10-27 1998-10-27 Dispositif de mise a disposition de billes ou de preformes pour la fabrication de connexions a billes

Country Status (8)

Country Link
US (1) US6533160B1 (fr)
EP (1) EP1125325A1 (fr)
JP (1) JP2002528912A (fr)
KR (1) KR20010080904A (fr)
AU (1) AU6346899A (fr)
CA (1) CA2348724A1 (fr)
FR (1) FR2785140B1 (fr)
WO (1) WO2000025358A1 (fr)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6268275B1 (en) 1998-10-08 2001-07-31 Micron Technology, Inc. Method of locating conductive spheres utilizing screen and hopper of solder balls
FR2789541B1 (fr) * 1999-02-05 2001-03-16 Novatec Sa Soc Procede de realisation de modules electroniques a connecteur a billes ou a preformes integre brasables sur circuit imprime et dispositif de mise en oeuvre
JP3803556B2 (ja) * 2001-03-26 2006-08-02 日本電気株式会社 ボール転写装置およびボール整列装置
FR2844733B1 (fr) * 2002-09-25 2005-05-06 Novatec Sa Soc Procede de mise a disposition de billes ou preformes en vue de leur prehension et depose de facon individuelle
KR100683450B1 (ko) * 2005-03-29 2007-02-20 치엔 흐신-펭 전자 부품을 파지하기 위한 파지 장치
JP4560682B2 (ja) * 2005-04-28 2010-10-13 澁谷工業株式会社 導電性ボール搭載装置
US7946470B2 (en) * 2005-12-30 2011-05-24 Semx Corporation Method for depositing solder material on an electronic component part using separators
JP4503053B2 (ja) * 2007-07-24 2010-07-14 新光電気工業株式会社 導電性ボールの搭載装置および搭載方法
JP2010212659A (ja) * 2009-02-10 2010-09-24 Hioki Ee Corp 球状体吸着装置、球状体搭載装置、球状体吸着方法、球状体搭載方法、球状体搭載済基板および電子部品搭載済基板
PL2567104T3 (pl) * 2010-05-03 2017-08-31 A. Raymond Et Cie Sposób mocowania elementu adhezyjnego do podłoża w rodzaju weź i połącz
US8955735B2 (en) * 2013-05-17 2015-02-17 Zen Voce Corporation Method for enhancing the yield rate of ball implanting of a substrate of an integrated circuit
US9120170B2 (en) * 2013-11-01 2015-09-01 Zen Voce Corporation Apparatus and method for placing and mounting solder balls on an integrated circuit substrate
CN104174956B (zh) * 2014-06-26 2016-04-20 京东方科技集团股份有限公司 一种电子器件焊接过程中的对位机构及焊接装置
JP6567290B2 (ja) * 2015-02-20 2019-08-28 Ａｉメカテック株式会社 基板処理装置、基板処理システム、及び基板処理方法
US10369648B2 (en) * 2017-01-13 2019-08-06 Horng Terng Automation Co., Ltd. Guiding board for a ball placement machine
SG10201701738VA (en) * 2017-03-03 2018-10-30 Aurigin Tech Pte Ltd Apparatus And Method For Filling A Ball Grid Array
CN107601050B (zh) * 2017-10-10 2023-06-23 深圳孔雀科技开发有限公司 一种用于真空玻璃支撑柱定位排布的装置及方法
CN110534451A (zh) * 2018-05-25 2019-12-03 唐虞企业股份有限公司 一种导电端子置件设备及其导电端子置件方法
KR20210101357A (ko) * 2020-02-07 2021-08-19 삼성전자주식회사 볼 배치 시스템 및 기판 상에 볼을 배치하는 방법

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH067254A (ja) 1992-06-23 1994-01-18 Murata:Kk 連続焼物器の温度制御装置
EP0588609B1 (fr) * 1992-09-15 1997-07-23 Texas Instruments Incorporated Contact à billes pour dispositifs à puces inversées
JPH0828583B2 (ja) 1992-12-23 1996-03-21 インターナショナル・ビジネス・マシーンズ・コーポレイション 多層プリント回路基板およびその製作方法、およびボール・ディスペンサ
JPH07212023A (ja) 1994-01-26 1995-08-11 Matsushita Electric Works Ltd 半田ボール供給方法及びその半田ボール供給方法に用いる半田ボール供給治具
JP3214316B2 (ja) * 1995-09-29 2001-10-02 松下電器産業株式会社 導電性ボールの搭載装置および搭載方法およびバンプの形成方法
WO1998043307A2 (fr) * 1997-03-21 1998-10-01 Siemens Aktiengesellschaft Dispositif permettant d'implanter des composants bga par des globules de brasage
US6253992B1 (en) * 1998-03-18 2001-07-03 Tessera, Inc. Solder ball placement fixtures and methods
US6325272B1 (en) * 1998-10-09 2001-12-04 Robotic Vision Systems, Inc. Apparatus and method for filling a ball grid array
JP3283026B2 (ja) * 1999-04-30 2002-05-20 新光電気工業株式会社 ボール状端子の吸着装置及びボール状端子の搭載方法

Also Published As

Publication number Publication date
JP2002528912A (ja) 2002-09-03
KR20010080904A (ko) 2001-08-25
FR2785140A1 (fr) 2000-04-28
US6533160B1 (en) 2003-03-18
CA2348724A1 (fr) 2000-05-04
WO2000025358A1 (fr) 2000-05-04
EP1125325A1 (fr) 2001-08-22
AU6346899A (en) 2000-05-15

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